提高导电胶性能的研究进展

导电胶作为一种新型的绿色微电子封装互连材料,其应用范围越来越广,并且其代替传统的Pb-Sn焊料已成为必然趋势。介绍了导电胶的研究应用现状,总结了导电胶的优点及存在的问题。综述了近几年来在提高导电胶的电导率、接触电阻稳定性以及力学性能等方面的研究进展,并展望了导电胶未来的发展方向。     

各向异性导电胶研究进展

随着微电子产业的不断发展,电子产品微型化和集成化趋势日益显著,新型电子封装材料也呈快速发展态势,其中各向异性导电胶(ACA)已成为新一代封装材料的主流。对近年来ACA的研究进展进行了综述,并对其今后的发展方向作了展望。     

导电胶的研究进展

随着现代科学技术的高速发展,电子仪器正在向小型化、微型化、高集成化方向迈进,导电胶作为一种新兴的绿色环保微电子封装材料,广泛应用于电子产品中。本文介绍了导电胶的组成,从宏观和微观角度对导电机理进行了概述,并对国内外最新成果进行了综述,最后对各向异性导电胶的发展前景作了展望。     

微电子封装用各向异性导电胶的研究进展

随着现代科学技术的高速发展,电子仪器正在向小型化、微型化、高集成化方向迈进。各向异性导电胶作为一种新兴的绿色环保微电子封装互连材料,广泛应用于电子产品中。介绍了各向异性导电胶的组成、分类、结构特点和导电机理,以及影响它的粘接可靠性因素,如粘接工艺参数、导电颗粒的粒径分布、各向异性导电胶的弹性模量、环境干扰等,并对国内外最新文献报道的最新研制成果进行了综述。最后,对各向异性导电胶的发展前景作了展望。     

铜粉导电胶研制成功

近些年来,导电胶粘剂在微电子封装、组装行业中得到了广泛应用,目前仍以添加型导电胶占据主导地位。在各种导电胶中金粉导电胶性能最佳,但价格昂贵,应用受限;银粉导电胶效果很好,不过存在着电迁移等弊端,价也很高;铜粉导电胶的导电性能基本接近银粉导电胶,价格便宜,却因铜粉极易氧化而影响导电性能。东北大学材料与冶金学院采用硅烷偶联剂（KH-550）对铜粉进行改性处理,提高了其在导电胶中的分散性、使用过程中的抗氧化性和粘接强度。还将甲醛作为还原剂加入到树脂中,     

微电子互连用导电胶研究进展

导电胶具备无铅、分辨率高、柔韧性好、加工工艺简单、低温操作等优点而使其成为替代传统Sn/Pb钎料的理想的微电子互连材料。本文对微电子互连用导电胶的组成、分类、机理和研究现状等进行了综述。为进一步研究开发新型性/价比高的微电子互连用导电胶提供思路。     

各向异性导电胶的研究与应用现状

随着微电子工业的发展,导电胶替代传统的锡铅焊料已经成为一种发展趋势,本文介绍了各向异性导电胶(ACA)的组成和分类、3种导电机理及国内外导电胶的研究现状和发展方向,特别是在各向异性导电胶填料表面功能化处理方面的研究现状和在液晶显示屏(LCD)、发光二极管(LED)组装应用上的进展。     

环氧导电银胶在LED上的应用现状

作为无铅材料的一种,环氧导电银胶广泛应用于电子元器件的封装,如用于LED固晶。文章介绍了LED封装用导电银胶的市场情况、目前所用导电胶的性能及应用前景和研发方向。     

高纯超细球形化硅微粉研制成功

一项用于微电子工业的封装材料———高纯超细球形化硅微粉研究成果 ,近日在湖北武汉通过了省级鉴定。这项成果在微电子工业填充材料生产工艺和技术方面取得了重大突破 ,将打破国外高档硅微粉垄断国内市场的局面。超细硅微粉材料是近年来逐渐发展起来的新材料 .已广泛应用于电子、电器基板及封装、高级石英玻璃、光导纤维、橡胶、化工填料等领域。随着我国微电子工业的迅猛发展 ,大规模、超大规模集成电路对封装材料的要求也越来越高 ,不仅要求其超细 ,而且要求高纯度 ,特别是对于颗粒形状提出球形化要求。球形化能增加填充量 ,硅微粉的填充…     

电子封装用导电胶的研究现状及展望

导电胶在电子封装领域虽受到广泛关注,但由于导电胶性能的一些限制,仍不能完全用导电胶代替焊料。这主要与导电胶的可靠性有关,例如不稳定的接触电阻、有限的抗冲击性、低附着力和导电性。本文介绍了导电胶的分类、各类导电填料以及导电胶可靠性的研究现状,旨在阐述导电胶的综合性能,展望未来导电胶的发展趋势。     

无铅电子组装材料——导电胶的研究进展

电子产品小型化、便携化、集成化的趋势和人类环保意识的增强,使传统的电子组装材料已不能满足现实的需要。导电胶作为一种无铅、绿色、环境友好的新型电子组装材料,正日益成为电子工业中组装材料的主流。该文对导电胶的组成、分类、导电机理、导电胶的导电填料、聚合物粘料、添加剂等基本组成材料和导电胶性能研究进展作了综述。引用文献43篇。     

Electroconductive Adhesives: Comparison of Three Different Polymer Matrices. Epoxy, Polyimide and Silicone

Electrically conductive organic adhesives are used in the microelectronics manufacturing industry for the attachment of silicon dies. These adhesives are composite materials which owe their conductivity to the incorporation of silver flakes. Several polymers have been formulated into electrically-conductive adhesives to meet different applications in the microelectronics industry; these are an epoxy resin, a polyimide and a silicone polymer. The purpose of this paper is to examine properties of these die-bonding adhesives in order to determine the advantages or disadvantages of these materials. This study offers a comparison of hardening chemistry, chemical purity, processing, electrical, thermal, and mechanical properties of three conductive adhesives based on an epoxy, a polyimide and a silicone polymer. We discuss correlation of composite properties with the structure of each matrix. The results indicate that the choice of the matrix is dictated by the application for which the electronic grade conductive adhesive is to be used and the desired properties for best reliability and performance.     

Electroconductive Adhesives: Comparison of Three Different Polymer Matrices. Epoxy,Polyimide and Silicone

Electrically conductive organic adhesives are used in the microelectronics manufacturing industry for the attachment of silicon dies. These adhesives are composite materials which owe their conductivity to the incorporation of silver flakes. Several polymers have been formulated into electrically-conductive adhesives to meet different applications in the microelectronics industry; these are an epoxy resin, a polyimide and a silicone polymer. The purpose of this paper is to examine properties of these die-bonding adhesives in order to determine the advantages or disadvantages of these materials. This study offers a comparison of hardening chemistry, chemical purity, processing, electrical, thermal, and mechanical properties of three conductive adhesives based on an epoxy, a polyimide and a silicone polymer. We discuss correlation of composite properties with the structure of each matrix. The results indicate that the choice of the matrix is dictated by the application for which the electronic grade conductive adhesive is to be used and the desired properties for best reliability and performance.     

高热导率银粉导电胶在LED照明中的应用及前景

高热导率银粉导电胶是近几年为适合大功率高亮度LED封装用而研发的新型产品。介绍了高热导率银粉导电胶在LED照明中的应用现状及市场情况,以及影响银粉导电胶导热性能的主要因素、提高其导热性的途径,并对导热银粉导电胶的发展前景进行了展望。     

Development of Polyaniline/Epoxy Composite as a Prospective Solder Replacement Material

In this paper we present a novel application of a conducting polymer, polyaniline, as a conductive filler for the development of isotropically conductive adhesives. We have developed isotropically conductive adhesives using protonic acid-doped polyaniline as the conducting filler in an anhydride-cured epoxy system. Fundamental material characterization like DSC, TGA and SEM of the samples was conducted to study their properties. Conductivity of these materials was measured by the four probe method while impact properties were studied by lap shear and drop tests. Samples were aged at 85°C/～100% RH for more than 500 h and the effects of aging were studied. Conductivity value of 10^?3 S/cm was obtained at 25% PANI filler concentration. These results demonstrate the potential of such systems to function as isotropically conductive adhesives.     

Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review

The development of new polymer-based conductive adhesives with specific performances and improved conductivity are increasingly critical for thermally interface material (TIM). Epoxy resins have been widely used as a common interface material for conductive adhesives due to its well-known ability to accept wide range of fillers possibly derived from carbon, metallic or ceramic sources. These conductive fillers with high inherent thermal conductivity, together with a possibility to characterize and manipulate the system, leads to the production of thermally conductive adhesives with higher knowledge content for a number of electronics applications.     

金导电胶

金导电胶是适应电子元器件向小型化和高可靠性发展的需要的新材料。本文介绍金导电胶的基本组成、导电机理、可靠性等方面的研究。     

功能性压敏胶的研究进展

综述了功能性压敏胶的研究进展,分别介绍了医用压敏胶、阻燃压敏胶、导电压敏胶和防腐压敏胶的研究概况,并对压敏胶功能材料的发展作了展望。