PZT薄膜驱动的全光纤相位调制器数学模型

提出了一种简单、高效的PZT压电陶瓷薄膜覆膜驱动的全光纤相位调制器数学模型,该模型计入了PZT压电陶瓷薄膜侧向压电常数d₃₁对相位调制效率的影响,结果表明,对于PZT压电陶瓷薄膜覆膜驱动的全光纤相位调制器,这种影响是不能忽略的,由侧向压电常数d₃₁引起的相位调制相当于由压电常数d₃₃引起的相位调制的15%。应用此模型计算了PZT压电陶瓷薄膜、内电极以及外电极的机械与压电性能等参数对于全光纤相位器的相位调制效率的影响。该模型可应用于全光纤相位调制器的设计与优化。     

厚度效应对Pb(Zr0.53Ti0.47)O3薄膜微结构、铁电、介电性能的影响

用改进的溶胶-凝胶法在Pt(111)/Ti/SiO₂/Si(100)衬底上制备了不同厚度的高度(111)取向的Pb(Zr_0.53Ti_0.47)O₃薄膜.运用X射线衍射(XRD)和原子力显微镜(AFM)分析了薄膜的微结构,原子力显微镜表明厚度为0.3μm和0.56μm的PZT薄膜的晶粒尺寸和表面粗糙度分别为0.2～0.3μm、2～3μm和0.92nm、34nm.0.3μm和0.56μm PZT薄膜的剩余极化(Pr)和矫顽场(Ec)分别为32.2μC/²、79.9kV/cm, 27.7μC/cm²、54.4kV/cm;在频率100KHz时,薄膜的介电常数和介电损耗分别为539、0.066,821、0.029.     

PT/PZT/PT薄膜微力传感器

提出了一种基于PT/PZT/PT压电薄膜微悬臂梁结构的微力传感器.运用Sol-Gel(溶胶-凝胶)法制作了PT和PZT薄膜,采用X射线衍射技术表征了PZT和PT/PZT/PT两种薄膜的成相特征,用阻抗分析仪测试了PZT和PT/PZT/PT薄膜的介电常数.结果表明,在PZT薄膜退火温度同为600℃时,PZT和PT/PZT/PT薄膜均为完整的钙钛矿结构,而且PT/PZT/PT薄膜沿(100)晶向强烈取向;在测试频率为1 kHz时,经600℃热处理条件下制备的PZT和PT/PZT/PT薄膜的相对介电常数分别为525和981.最后应用MEMS工艺制作了基于PT/PZT/PT压电薄膜微悬臂梁结构的微力传感器.在静态和准静态下对微力传感器的传感特性进行了测试.测试结果表明,力与位移或电荷具有良好的线性关系.两种尺寸微力传感器的灵敏度分别为0.045 mV/μN和0.007 mV/μN,力分辨率分别为3.7 μN和16.9μN,满足了微牛顿量级微小力的测量.     

PZT铁电薄膜介电性能的数字锁相测试技术

在DSP上实现的数字锁相测试系统,采用数字锁相算法来完成对信号的锁相测试。基于该系统开发出了简单、可靠、可调性好并具有较高精度的PZT铁电薄膜介电性能测试系统。实验表明,使用该系统测得的样品介电常数的相对误差小于1 %,能够满足PZT铁电薄膜制备技术以及微机电系统中器件设计对薄膜性能测试的要求。     

压电传感器材料的铁电特性研究

本文采用溶胶-凝胶工艺制备了不同Mn离子掺杂浓度的PZT薄膜.研究了不同掺杂浓度对压电传感器薄膜铁电特性的影响.试验结果表明当Mn离子含量较少时,Mn在PZT中主要表现施主掺杂特性,薄膜铁电性能提高;而当浓度增大时,薄膜性能降低.     

压电PZT薄膜上超细电极的制备

压电PZT薄膜具有横向压电系数大,与MEMS工艺兼容性高等优点,在制作以压电PZT薄膜为核心的MEMS器件,如压电应力光开关时,需要将电极宽度缩小至10μm,甚至5μm,但长度仍需保持在8000μm,电极长宽比达1600:1.针对目前MEMS器件应用需求,提出使用双层光刻胶剥离法来实现超细电极的制备,使用溶胶凝胶法制备压电PZT薄膜作为电极沉积衬底,研究了电极剥离的工艺流程并对电极进行性能测试.结果表明,双层光刻胶剥离法可以在溶胶凝胶法制备的压电PZT薄膜上制备长8000μm、宽5μm的电极,电极剥离完全,图形完整,可以实现双端导通.     

压电PZT薄膜上超细电极的制备

压电PZT薄膜具有横向压电系数大,与MEMS工艺兼容性高等优点,在制作以压电PZT薄膜为核心的MEMS器件,如压电应力光开关时,需要将电极宽度缩小至10μm,甚至5μm,但长度仍需保持在8000μm,电极长宽比达1600:1.针对目前MEMS器件应用需求,提出使用双层光刻胶剥离法来实现超细电极的制备,使用溶胶凝胶法制备压电PZT薄膜作为电极沉积衬底,研究了电极剥离的工艺流程并对电极进行性能测试.结果表明,双层光刻胶剥离法可以在溶胶凝胶法制备的压电PZT薄膜上制备长8000μm、宽5μm的电极,电极剥离完全,图形完整,可以实现双端导通.     

压电PZT薄膜上超细电极的制备

压电PZT薄膜具有横向压电系数大,与MEMS工艺兼容性高等优点,在制作以压电PZT薄膜为核心的MEMS器件,如压电应力光开关时,需要将电极宽度缩小至10μm,甚至5μm,但长度仍需保持在8000μm,电极长宽比达1600:1.针对目前MEMS器件应用需求,提出使用双层光刻胶剥离法来实现超细电极的制备,使用溶胶凝胶法制备压电PZT薄膜作为电极沉积衬底,研究了电极剥离的工艺流程并对电极进行性能测试.结果表明,双层光刻胶剥离法可以在溶胶凝胶法制备的压电PZT薄膜上制备长8000μm、宽5μm的电极,电极剥离完全,图形完整,可以实现双端导通.     

基于石英基底的PZT薄膜制备研究

研究了在石英基底上制备PZT薄膜,通过在石英基底上制备氮化硅沉积层来改善PZT薄膜质量。运用PECVD技术在石英基底上制备氮化硅沉积层,使用溶胶-凝胶法在沉积层上制备锆钛酸铅(PZT)薄膜,并对PZT薄膜的性能进行了表征。氮化硅沉积层的厚度选为500 nm,PZT薄膜的制备厚度选为1μm,对PZT薄膜的晶向、漏电流、介电性能和铁电性能进行了表征,结果表明在拥有氮化硅沉积层的石英基底上能够制备出性能优良的PZT薄膜。     

退火制度对PZT铁电薄膜性能的影响

铁电薄膜的性质对于硅基MEMS器件有重要的影响,鉴于此本文尝试通过改善退火工艺以提高PZT薄膜的铁电和压电性质.采用溶胶凝胶法,在Si/SiO2/Ti/Pt衬底上制备了PZT铁电薄膜.实验中,采用一次退火工艺和每层退火工艺制备了两种PZT薄膜,采用XRD对薄膜的晶体结构进行分析,通过C-V和I-V特性的研究发现,每层退火工艺有助于提高PZT薄膜的C-V性质,并降低漏导电流.     

硅基PZT压电功能结构研究

PZT压电薄（厚）膜是制备MEMS传感元件和执行元件重要的功能材料,对近年PZT薄（厚）膜在MEMS领域的研究现状进行了分析,提出了一种新型的双杯PZT/Si膜片式功能结构;采用有限元方法对双杯PZT/Si膜片进行了结构优化,得到PZT和上、下硅杯的结构优化值为DPZT: D1:D2 =0.75:1.1:1;一阶模态谐振频率为13.2KHz;以氧化、双面光刻、各向异性刻蚀,以及PZT厚膜丝网印刷等工艺技术制作了双杯硅基PZT压电厚膜膜片,该膜片具有压电驱动功能。双杯PZT/Si膜片式功能结构的MEMS技术兼容性好,对芯片内其它元件或电路的影响小,适合作为MEMS片内执行元件的驱动机构。     

Design and implementation of a versatile and variable-frequency piezoelectric coefficient measurement system

We present a simple but versatile piezoelectric coefficient measurement system, which can measure the longitudinal and transverse piezoelectric coefficients in the pressing and bending modes, respectively, at different applied forces and a wide range of frequencies. The functionality of this measurement system has been demonstrated on three samples, including a PbZr(0.52)Ti(0.48)O(3) (PZT) piezoelectric ceramic bulk, a ZnO thin film, and a laminated piezoelectric film sensor. The static longitudinal piezoelectric coefficients of the PZT bulk and the ZnO film are estimated to be around 210 and 8.1 pC∕N, respectively. The static transverse piezoelectric coefficients of the ZnO film and the piezoelectric film sensor are determined to be, respectively, -0.284 and -0.031 C∕m(2).     

Development of RF magnetron sputtering method to fabricate PZT thin film actuator

PZT piezoelectric very thin films suitable for a microactuator have been deposited onto Invar alloy substrate using a high-temperature RF magnetron sputtering technique. PZT thin films must be deposited onto conductive substrate for a monomorph or a bimorph actuator. The chemical composition and the crystalline structure of these films were measured by ESCA and XRD, respectively. The chemical composition of PZT deposited stoichiometrically was almost the same as commercially-produced bulk PZT. Crystal planes (1 1 0) and (1 1 1) of PZT perovskite structure were observed in XRD analysis. When the substrate was heated to above 600 °C, SEM revealed only a very small number of pinholes on the surface. A thin (500 nm) film actuator has been characterized by measuring the piezoelectric property using a Laser Doppler Vibrograph. It was confirmed that the piezoelectric property has a linear relationship with the grain size, which also increased with the substrate temperature. The piezoelectric property of deposited PZT thin films showed a good agreement with a quoted value of bulk PZT, when the substrates were heated to 600 °C.     

Patterned crack-free PZT thick films for micro-electromechanical system applications

The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS).     

Electrostatic force microscopy study on the domain switching properties of the Pb(Zr0.2Ti0.8)O3 thin films with different crystallographic orientations for the probe-based data storage

The domain switching properties of the ferroelectric Pb(Zr(0.2)Ti(0.8))O(3) (PZT) thin films with two types of crystallographic orientations were investigated by electrostatic force microscopy (EFM). The crystallographic orientations of the PZT thin films were random on the (111)Pt/MgO(100) and c-axis preferred on the (100)Pt/MgO(100), respectively. When dc bias was applied to the films for writing in micro-scale area, electrostatic force images showed that the domain switching was hard in the PZT thin films with random orientation, while the pattern could clearly be written in the PZT films with c-axis orientation. The differences in the domain switching properties of each PZT thin film were investigated in the crystallographic orientations point of view, and the domain switching dynamics were also measured by investigating the nano-sized dot switching behavior with respect to the width of the applied voltage pulse.     

Read/write mechanisms and data storage system using atomic force microscopy and MEMS technology

Information storage system that has a potentially ultrahigh storage density based on the principles of atomic force microscopy (AFM) has been developed. Micro-electro-mechanical systems (MEMS) technology plays a major role in integration and miniaturization of the standard AFM. Its potential application for ultrahigh storage density has been demonstrated by AFM with a piezoresponse mode to write and read information bits in ferroelectric Pb(Zr(x)Ti(1 - x))O3 films. With this technique, bits as small as 40 nm in diameter have been achieved, resulting in a data storage density of simply more than 200 Gb/in2. Retention loss phenomenon has also been observed and investigated by AFM in the piezoresponse mode. Finally, local piezoelectric measurements of PZT films by different processing technologies are discussed in detail.     

Vibration control efficiency of piezoelectric shunt damping system

The piezoelectric shunt damping technique based on the direct piezoelectric effect has been known as a simple, low-lost, lightweight, and easy to implement method for passive damping control of structural vibration. In this technique, a piezoelectric material is used to transform mechanical energy to electrical energy. When applying the piezoelectric shunt damping technique to passively control structural vibration, the piezoelectric materials must be bonded on or embedded in host structure where large strain is induced during vibration, thus to ensure vibrational mechanical energy to be transformed into electrical energy as much as possible. In this paper, the concept of vibration control efficiency of a piezoelectric shunt damping system is proposed and studied theoretically and experimentally. In the study, PZT patches are used as energy converter, and the vibration control efficiency is expressed by the vibration reduction rate per area of the PZT patches. Emphasis is laid on the effect of the generalized electromechanical coupling coefficient K₃₁ on the vibration control efficiency. Four PZT patches with different sizes are bonded on the geometrical central area of four similar clamped aluminum plates, respectively, and vibration control experiments are conducted for these plates using the R-L shunt circuit. The results indicate that the bigger the coupling coefficient K₃₁, the larger the rate of vibration reduction, and hence, the higher the vibration control efficiency. It also shows that the vibration responses of the first mode of the plates bonded with different PZT patches can be reduced by about 30.5%，48.58%，85.47%, and 89.91%, respectively. It comes to a conclusion that the vibration control efficiency of the piezoelectric shunt damping system decreases with the increase of the area of the PZT patch, whereas the vibration reduction of the plate increases with the area of the PZT patch. Therefore, it is necessary to make topology optimization for the PZT patch in the vibration control utilizing the piezoelectric shunt damping technique.     

Quantitative measurement of piezoelectric coefficient of thin film using a scanning evanescent microwave microscope

This article describes a new approach to quantitatively measure the piezoelectric coefficients of thin films at the microscopic level using a scanning evanescent microwave microscope. This technique can resolve 10 pm deformation caused by the piezoelectric effect and has the advantages of high scanning speed, large scanning area, submicron spatial resolution, and a simultaneous accessibility to many other related properties. Results from the test measurements on the longitudinal piezoelectric coefficient of PZT thin film agree well with those from other techniques listed in literatures.     

Residual strain measurement of piezoelectric multilayers by spiral structure

A new structure is described to measure the residual strain of thin film of piezoelectric multi-layers. The spiral shaped structure consists of the four fixed-guided beams. Piezoelectric multilayers consisting of SiOx/Pt/PZT/Pt on SiNx substrate are used to evaluate the suggested structure. Finite element analysis predicts that the out-of-plane displacement of the spiral structure by residual stress depends linearly on the beam length, but there is little difference depending on the beam width. PZT is prepared by sol-gel method and multilayered spiral structures are released by microfabrication technique. Sensitivity analysis of the spiral structure with various layer stack shows that the high displacement of piezoelectric multilayers can be decreased by the application of SiOx layer with compressive stress over the piezoelectric multilayers.