Nanogrinding of multi-layered thin film amorphous Si solar panels

Nanogrinding was performed on the cross-sections of amorphous Si thin film solar panels, which are nanoscale multi-layer structures consisting of hard and brittle materials. The deformed structures of the panel cross-sectional surfaces after grinding were investigated using electron and atomic force microscopy. The nanogrinding results were compared with those obtained from polishing and nanoscratching, demonstrating that the three processes had produced consistent surface characteristics. Though nanogrinding produced nanometric surface roughness with ductile material removal, but could cause cracking, edge chipping and delamination at thin film interfaces. The results of this work are of value for developing the efficient machining process for thin film solar panels and other brittle multi-layer materials.     

Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter

Sapphire, widely used in high-speed integrated-circuit chips, thin-film substrates, and various electronic components, is regarded as one of the most difficult to cut materials owing to its great hardness and low fracture toughness. Ultrasonic vibration-assisted machining (UVAM) is an effective processing method for hard and brittle materials that has been explored in many experimental and theoretical investigations. To expose the material removal mechanism in the UVAM of sapphire, the deformation features of (0001) C-plane sapphire in ultrasonic vibration-assisted scratch (UVAS) tests were compared with those in traditional scratch tests. A self-designed and manufactured spherical diamond indenter was employed. The scratch loads (i.e., the normal forces and tangential forces) were measured with a Kistler dynamometer. The plastic and brittle deformation characteristics were observed by scanning electron microscopy. Raman spectroscopy was employed to reveal the residual stress features of deformation zones in the scratch grooves. The experimental results revealed that the UVAS process can reduce scratch loads, effectively inhibit microcrack propagation, and improve the plastic removal proportion, which was rationalized with elastic and residual stress field calculations. With increasing scratch depth, the distribution of residual stress changes from tensile stress to compressive stress as indicated by the Raman-peak shift.     

Micro-scratch study of a magnetron-sputtered Zr-based metallic-glass film

Using the micro-scratch technique, the tribological behavior of ZrCuAlNi metallic-glass films on 316L stainless steel was studied. With the application of ramping load, the critical load of about 110 mN was determined, at which the coefficient of friction increased sharply and the indenter penetration depth reached the film thickness. No clear evidence of film debonding was found, which, together with the observation of multiple shear bands, indicated good adhesion and ductility of the metallic-glass film. When subjected to constant loads, the coefficient of friction increased rapidly once the critical load was passed. The scratch results and the scanning-electron microscopy observations demonstrated good adhesion between the film and the substrate, which may be due to the good interfacial bonding and low residual stress in the film.     

涂、镀层的结合强度评定

涂、镀层与基体的结合强度是评价其质量的重要性能指标．常用的结合强度评定方法：厚涂层采用粘结拉伸法;薄膜镀层用划痕法。本文指出了这两种方法存在的问题。我们自行设计制造的涂层压入仪．采用楔压法测得热喷涂层的结合强度．当结合强度高于粘胶强度时仍有效。采用正压法测定气相沉积薄膜的结合强度并与划痕法作了比较。我们提出用接触疲劳试验测定硬质薄膜的界面疲劳强度评定结合力。这种方法接近于工具服役状况,其破坏形式是界面剥落．只对界面状态敏感。不受非界面因素影响,因而可作为动态结合强度的判据。     

高体积分数SiCp/Al复合材料超声辅助划切微观去除机理

目的 揭示高体积分数SiC_p/Al复合材料在超声辅助加工条件下的材料去除机理。方法 采用SiC_p/Al复合材料的超声辅助划切试验,探究划切参数变化对超声振幅、划切力及摩擦因数的影响规律,并通过扫描电子显微镜和激光共聚焦显微镜对划痕表面微观形貌进行观察,分析单点金刚石磨粒工具超声辅助划切材料去除的特点。结果 随着划切深度从0.01 mm增加到0.05 mm,电流值逐渐降低,电流值变化量从12 mA增加到25m A,超声振幅逐渐衰减,金刚石压头的轴向冲击作用减弱。划切深度和划切速度的增加使切向挤压切削作用增强,划切力和摩擦因数增大。在材料去除过程中,碳化硅颗粒存在破碎成小颗粒、剪切断裂破碎和拔出等多种去除形式,铝基体出现明显的塑性流动和涂覆现象,并形成切削沟槽外侧堆积。结论 当切削深度和进给速度较小时,材料去除主要是在轴向的高频振动冲击作用下完成,材料表面加工质量较好;当切削深度和进给速度逐渐增大时,材料去除是在轴向冲击破碎和切向挤压切削共同作用下完成,材料表面加工质量逐渐降低。     

Large deformation of thin films and layered flat panels: effects of gravity

A general theory is presented for the large deformation of thin films and layered flat panels in which gravitational forces have a marked influence on the evolution of curvature, shape and instability. Isotropic, linear elastic deformation is considered with small strains and moderate rotations. The thermomechanical properties of the layered material are allowed to vary through the panel thickness so as to derive a general result for multilayers and graded materials. Explicit analytical expressions are derived for the critical curvature and the critical “effective load” at which curvature bifurcation occurs. The analysis considers square, circular and rectangular panels that are simply supported at three points, with the thin film on the panel facing either up or down. A boundary layer analysis is presented for rectangular panels specifically to examine the effect of panel shape on curvature evolution and geometric stability. Computational simulations involving full three-dimensional hyperelastic formulations with large rotations and two-dimensional hyper elastic formulations with moderate rotations were used to assess the validity of the analytical results. Systematic experiments on the large deformation characteristics of flat glass panels with and without silicon nitride thin film deposits were carried out to check the predictive capabilities of the theory. The trends predicted by the theory and its quantitative predictions of bifurcation with and without thin film deposits on the panels were found to be in reasonable agreements with experiments. The limits of the solutions of the present theory for the special case of thin films on substrates with only mismatch strains are shown to converge to prior analytical results. Furthermore, the theory is shown to capture the experimental trends observed during large deformation in thin-film/substrate systems in the absence of gravitational effects.     

金属薄膜结合性能的评价方法研究

针对Al2O3基体上磁控溅射沉积的Au／NiCr／Ta多层金属薄膜，用压痕法、滚动接触疲劳法、摩擦力和声发射两种模式同时监测的划痕法，对比研究了金属薄膜与基体的结合性能。结果表明：压痕试验从压痕形貌上很难判断薄膜与基体是否发生剥离，压入过程中也没有诱发裂纹的产生，更无法分辨薄膜层间的分离；由于金属薄膜的塑性变形，滚动接触疲劳法很难应用于金属薄膜结合性能的表征：划痕法可应用于多层金属薄膜的特异划擦行为研究，其中摩擦力模式能反映压头进入不同金属膜层时的变化，层间声发射信号的灵敏度不如摩擦力信号，对应试验条件，摩擦力曲线存在若干以拐点为特征的载荷，摩擦力曲线上出现的拐点及拐点特征载荷值可以在一定程度上反映多层膜的层数和层厚，并可刻划出该膜／基体系承受压入载荷而不发生剥落的能力。     

Au/NiCr/Ta和Au/NiCr多层金属膜的划痕特征载荷

采用摩擦力和声发射两种模式同时监测的划痕法研究了Au/NiCr/Ta和Au/NiCr多层金属薄膜的临界载荷Lc，并与TiN硬质薄膜进行了对比。实验结果表明：摩擦力和声发射模式均能反映出压头进入不同金属膜层时的变化，在单一金属薄膜层中两者均无大的变化，对应实验范围内不同的沉积温度，拐点特征载荷值基本不受其影响，而主要取决于多层膜的层厚和层数。     

不同摩擦副材料对TC4合金摩擦磨损性能的影响

利用TRB³摩擦试验机采用球/平面接触形式探究TC4合金摩擦磨损性能，使用TC4合金球、GCr15钢球以及Si₃N₄陶瓷球作为对摩副探究TC4合金在不同法向载荷作用下摩擦划痕和磨损特性；通过3D激光共聚焦显微镜测量摩擦划痕形貌，建立能量磨损模型探究磨损过程中接触状态的变化机制，预测磨损进程。结果表明：随着上试样硬度的逐渐降低，球/平面的接触状态向微平面/平面的接触状态转变，摩擦划痕状态受到钛合金在压头前端位错墙和压头后端黏着颗粒的影响，划痕长度和宽度随载荷的增加线性增长，划痕深度出现“锯齿”状波动；“切削与塑性比”f_cp分布于f_cp=0.5两侧说明压头对TC4合金的损伤以微犁耕和微切削2种机制交互作用，说明划痕表面加工硬化现象对表面的保护作用，划痕硬度和表面粗糙度的关系可以预测材料变形过程中的损伤情况。     

Optimization of the Scratch Test for specific coating designs

The proper design of wear resistant coatings applied to cutting tools comprises the optimization of the mechanical properties (Young's modulus, yield strength, adhesion, intrinsic stresses, fracture, fretting etc.) of the coating-tool system. The goal is to find material and structural solutions which keep the resulting stress-strain field under typical application conditions below the stability limits of the system. Based on nanoindentation measurements obtained from the coating-tool system which should be optimized, a scratch test is dimensioned with respect to load range and indenter geometry. The measured data from this “Physical Scratch Test” are used to simulate spatial stress profiles and to calculate the von Mises stress characteristics and the maximum normal stresses in the scratch direction. In a further step, the simulations are used to suggest scratch parameters for a “Fine Tuned Scratch Test” which increase the sensitivity of the test for specific depth regions in the coating-tool architecture and allow improved and more sensitive investigations of critical interfaces, transition layers and surface-near substrate regions. The tests were performed at PVD coated inserts (nitrides and oxides) and compared with the results obtained from cutting tests.     

基于纳米划刻实验的单晶锗切削机理的研究

本文选用 Berkovich 压头,使用纳米压痕仪对单晶锗进行了变载荷纳米刻划试验,利用SEM观测了刻划过程中沟槽表面形貌特征,将划刻过程中材料的去除机制分为延性域、脆塑转变域和脆性域三个阶段,并分析了在各个阶段的力学特征。根据断裂力学理论,以切向力的首次下降作为脆塑转变发生点,由此获得单晶锗脆塑转变的临界载荷及临界深度,并分析了裂纹的产生与扩展过程。对于纳米划刻过程中法向力、切向力、摩擦因数与划刻深度的函数关系进行非线性拟合,由相关系数的计算结果表明,划刻力与划刻深度之间存在强相关性。基于赫兹接触理论计算单晶锗划刻过程中临界弹塑转变深度,其大小为1.33 nm。基于脆朔转变临界载荷,建立了表征单晶锗材料脆塑转变临界深度的表达式,结果表明其脆塑转变临界深度为561 nm。由此对于单晶锗划刻过程中不同阶段确立了量化区分方法。     

钨合金的磨削加工去除机理

目的 解决钨合金磨削加工去除机理不明晰的问题。方法 基于单磨粒刻划有限元仿真、单磨粒刻划和磨削加工实验，探究钨合金的磨削加工去除机理。结果 在刻划过程中，划痕的不同位置材料的去除特性存在显著差异。在单颗粒刻划切入端，材料依次发生了塑性变形、隆起、微裂纹，再到钨相与黏结相的混杂交融。在划痕中段以材料去除为主，出现了材料微卷起和材料卷起现象，沿着刻划方向卷起现象越来越严重。在划痕切出端，划痕边缘和尾部均出现了“飞边”现象，且相较于切入端，切出端的形貌较差，实验与仿真吻合。此外，在不同相位处，材料的去除特性也存在一定不同。在钨相区域，同时存在脆性特征和塑性特征。在黏结相区域，刻划深度较浅时主要呈现塑性变形、塑性流动等特征，刻划中端深度较大时主要呈现与钨相的混杂和交融。在钨相与黏结相的相界处，相邻钨颗粒呈现不同的损伤或去除特征，且相界会阻断特征形貌的传递。最后，磨削后的钨合金表面存在单颗粒刻划痕上出现的所有去除特征，与单颗粒划痕的去除特征吻合。不同的是，磨削后划痕底部出现了区域性和放射状的裂纹。结论 钨合金的两相特性使得磨削表面的去除特征较复杂，存在塑性变形、微裂纹、微卷起、卷起、裂纹和两相交...     

Al薄膜纳米压痕过程的多尺度模拟

采用多尺度准连续介质法分别模拟无缺陷和具有初始缺陷两种状态下,单晶Al薄膜纳米压痕初始塑性变形过程,得到载荷-位移响应曲线和应变能-位移变化曲线.研究了初始缺陷对纳米压痕过程中位错形核与发射、Peierls应力以及位错发射.临界载荷的影响.结果表明,在整个纳米压痕过程中出现了多次位错形核与发射现象,初始缺陷对第1和第3对位错的形核与发射影响较小,而对第2对位错的形核与发射具有明显的推迟作用,并伴随有裂纹扩展现象;由于初始缺陷引起薄膜材料内部严重的晶格畸变,导致系统应变能和位错运动的Peierls应力增加;裂纹扩展前,发射第2对位错需要的临界载荷增加,裂纹失稳后,位错发射需要的临界载荷下降.模拟获得的纳米硬度和Peierls应力与实验结果吻合.     

Modeling of nanoscale friction using molecular dynamics simulation

利用分子动力学方法模拟了刚性金刚石压头在Ni单晶体上的滑动过程, 讨论了压入深度对 摩擦力的影响(压入深度对滑动过程中压头下方的微结构演化(能否发射位错环)有很大影响). 结 合摩擦过程中的塑性行为和能量耗散机制, 解释了产生摩擦力锯齿形曲线的原因, 证实了位错的形 核及湮灭是黏--滑机制的原因之一. 不同滑动速度对摩擦力影响的模拟表明, 压头的滑动速度决定 了压头下方位错环的运动和演化形式: 在高速滑动下, 形成的位错环依次沿着滑移面很快向Ni单晶 基体内扩展; 在低速滑动下, 压头下方产生的位错环互相发生作用, 在材料的亚表面形成较低能量的 大位错环, 由此产生的塑性变形主要集中在材料的亚表面.     

Nanoscale near-surface deformation in polymer nanocomposites

The objective of the study is to understand the nanoscale near-surface deformation response of two polymer nanocomposite systems with significant differences in ductility during nanoscratching with a Berkovich indenter using a load of 1 mN and a scratch velocity of 1 μm s⁻¹. An accompanying objective is to investigate the commonality in surface deformation behavior between nano- and microscale deformation to reinforce the underlying fundamental principles governing surface deformation. An understanding of surface deformation response is accomplished through determination of physical and mechanical properties, structural characterization and electron microscopy analysis of surface deformation tracks and residual plastically deformed structures. The study suggests for the first time that the understanding derived from microscale surface deformation studies can be extended to nanoscale surface deformation. The microscale response in a polypropylene-based system is characterized by periodic multiple ripple-type deformation tracks that form via a mechanism identical to the periodic single-ripple-type tracks during nanoscale deformation. Similarly, in a less ductile polyethylene-based system, the periodic parabolic tracks and ironing mode of deformation during microscale deformation tend to be significantly reduced in intensity, with ironing being the primary deformation mechanism at the nanoscale. The surface deformation topography suggests that both micro- and nanoscale response is material specific. Additionally, the study suggests that reinforcement of polymers with nanoclay is a viable route to significantly decrease the susceptibility of polymeric materials to micro- and nanoscale deformation and can be discussed in terms of physical and mechanical properties of materials notably percentage crystallinity and elastic recovery.     

基于FIB/SEM双束系统的原位、实时观测三点弯曲薄膜测试方法

目的 需要直接测量薄膜的极限形变这一关键参数,来评价某种薄膜在一定服役载荷下的某种基体表面是否能胜任。方法 借助聚焦离子束显微镜/扫描电子显微镜(FIB/SEM)双束显微分析测试系统,提出了一种在微米尺度下、原位进行三点弯曲薄膜测试的方法,同时可以进行实时观测与分析记录。之后,使用磁控溅射技术制备了具有强择优晶体生长取向的CrN薄膜和Cr/CrN多层薄膜,并使用上述三点弯曲测试方法对这两种薄膜进行了弯曲测试。结果 CrN薄膜的极限形变量为(1.8±0.1)%,且其在原位三点弯曲试验中断裂前的变形类型为纯弹性形变,而不是塑性形变或者弹性/塑性混合形变。而Cr/CrN多层薄膜的极限形变达到了9.1%,是纯CrN薄膜的5倍,且对“预裂纹”等缺陷不敏感。结论 将此测试方法与在微米尺度使用FIB测量薄膜残余应力的方法相结合,将可以有效地评估多种薄膜的形变能力及形变特性。所获得的薄膜相关性能数据,对于针对不同基体、不同使用工况(如不同的表面受力状态、变形状态等)的薄膜体系或结构的选择与设计,具有很好的指导意义。     

Effect of strengthening friction treatment on the chemical composition,structure, and tribological properties of a high-carbon steel

The structure and chemical composition of nanocrystalline layers formed on the surface of a steel U8 with 0.83 wt % C (quenched, as well as quenched and tempered at 200°C) under the conditions of frictional loading by a hard-alloy indenter in different media (gaseous and liquid nitrogen, air) have been investigated by the methods of transmission electron microscopy, X-ray diffraction analysis, nuclear reactions, Rutherford back scattering, and wave- and energy-dispersive microanalyses. Maximum levels of defectiveness (high density of dislocations and point defects) and microhardness of the nanocrystalline structure have been attained upon friction treatment of the low-temperature tempered steel in a liquid-nitrogen medium because of deformation localization in a thin surface layer, intensification of deformation-induced dissolution of the ɛ carbide phase, and saturation of the layer with nitrogen and oxygen atoms, the latter dissolved in the liquid nitrogen as an impurity. A comparative analysis of the in-depth distribution of microhardness in frictionally strengthened surface layers has been performed for the steel with initial structures of tetragonal (untempered) and low-tempered (tempered at 200°C) martensite. A markedly larger depth of strain hardening has been attained upon friction treatment in the quenched untempered steel due to effective development of deformation-induced dynamic aging of high-carbon martensite even at small deformations. It has been established that the strengthening upon deformation of the surface by a sliding indenter exerts a positive influence on the tribological properties (wear rate and friction coefficient) of the steel under the conditions of frictional heating of different intensity.     

纳米压痕过程的多尺度模拟与Rice-Thomson位错模型分析

采用多尺度准连续介质法（简称QC方法）对单晶Ag薄膜纳米压痕过程进行模拟,研究压头宽度对纳米压痕过程中接触应力分布、位错形核临界载荷以及纳米硬度的影响,并用Rice-Thomson位错模型（简称R-T位错模型）进行分析。结果表明,纳米压痕获得的载荷-位移曲线呈现出的不连续性与位错之间的协同作用密切相关;压头尺寸对纳米压痕过程中接触应力分布、位错形核临界载荷以及纳米硬度具有明显的影响：随着压头宽度的增加,法向和切向接触应力以及纳米硬度值递减,呈现出明显的压头尺寸效应;而压头下方薄膜内位错形核临界载荷却递增,且与压头半宽度的平方根成正比。模拟结果与相应实验结果以及R-T位错模型计算结果吻合     

The effect of film composition on the structure and mechanical properties of NiTi shape memory thin films

Shape memory NiTi-based thin films approximately 2 μm thick were deposited onto Si (100) substrates at room temperature by simultaneous DC magnetron sputter deposition from separate elemental Ni and Ti targets. The effect of composition on film structure, surface morphology, transformation temperature and mechanical behavior was studied using variable temperature X-ray diffraction, atomic force microscopy, electrical resistivity, and nanoindentation. The films showed the expected shape memory and superelasticity behavior corresponding to the different film compositions, comparable with bulk properties. The transformation from the low temperature martensitic phase to the high temperature parent phase takes place above room temperature in Ti-rich and near-equiatomic films, and below room temperature in Ni-rich films. Mechanical properties of films investigated at room temperature by a series of nanoindentations at mN loads (indentation depth < 200 nm) with a spherical indenter demonstrate superelasticity in Ni-rich material and martensitic deformation for Ti-rich and near-equiatomic compositions.     

单晶硅裂纹萌生的刻划深度研究

单晶硅作为典型的脆性材料,实现其塑性域去除加工的关键是使切削深度小于裂纹萌生切削深度.采用断裂强度理论,建立单晶硅刻划加工时的径向裂纹、中位裂纹和横向裂纹萌生刻划深度计算方法,计算得到裂纹萌生的刻划深度和划痕深度.设计高速刻划单晶硅的玻氏压头试验装置,并进行单晶硅片刻划试验,实测其径向裂纹萌生的划痕深度,其划痕深度计算...