Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

Eleetroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath.The effects ofpH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu-P deposition were studied.The electroless Ni-Cu-P deposits were characterized by a scanning electron microscope, a transmission electron microscope, an en-ergy dispersive X-ray spectroscope, and an X-ray diffractometer.The results showed that the pH value of the plating bath had no ob- vious effect on the morphology and composition of electroless Ni-Cu-P deposits.However, the composition of the metal source, Ni and Cu, in the plating bath had great effect on the kinetics of electroless Ni-Cu-P deposition.     

高分子材料表面化学镀银工艺的研究

研究了高分子材料表面化学镀银工艺 ,筛选出沉积速度高 ,稳定性好的工艺配方。用此配方在用高分子材料制成的球囊表面镀银 ,可获得具有临床使用价值的介入疗法球囊电极     

Growth behavior of electroless copper on silicon substrate

The growth behavior containing deposit morphology, growth rate, activation energy, and growth mechanism of copper on silicon substrate, especially at the initial stage, in the electroless plating process was studied. Copper was deposited on the surface of the silicon substrate in an electloless plating bath containing formalin （CH2O 37vol%） as a reducing agent at a pH value of 12.5 and a temperature of 50-75℃. The copper deposit was characterized using a field emission scanning electron microscope and transmission electron microscope. The results showed that after the activation process, nanoscale Pd particles were distributed evenly on the surface of the silicon; in the deposition process, copper first nucleated at locations not only near the Pd particles but also between the Pd particles; the growth rate of electroless Cu ranged from 0.517 nm/s at 50℃ to 1.929 nm/s at 75℃. The activation energy of electroless Cu on Si was 52.97 kJ/mol.     

Ni-P-纳米TiO2化学复合镀层的制备

采用化学复合镀在40CrNi钢基体上制备Ni-P-纳米TiO2复合镀层,研究了乳酸,柠檬酸、乙酸钠以及表面活性剂对镀层的沉积速度和显微硬度的影响,并通过正交试验,优化了工艺参数。结果表明:当乳酸的体积分数为3%、柠檬酸的质量浓度为25 g/L、乙酸钠的质量浓度为20 g/L、表面活性剂为阴离子型时,镀层具有优良的性能,镀速达到了11.55μm/h,镀层镀态显微硬度为550 HV。     

Ni—P-纳米TiO2化学复合镀层的制备

采用化学复合镀在40CrNi钢基体上制备Ni—P-纳米TiO2复合镀层,研究了乳酸,柠檬酸、乙酸钠以及表面活性剂对镀层的沉积速度和显微硬度的影响,并通过正交试验,优化了工艺参数。结果表明：当乳酸的体积分数为3％、柠檬酸的质量浓度为25g/L、乙酸钠的质量浓度为20g／L、表面活性剂为阴离子型时,镀层具有优良的性能,镀速达到了11．55μm／h,镀层镀态显微硬度为550HV。     

玻璃表面化学镀纳米铜膜

利用化学镀铜工艺,以十二烷基苯磺酸钠(SDBS)作为镀液添加剂,在未经刻蚀的玻璃表面制备了纳米铜膜。采用FESEM、SEM和XRD等技术对铜膜表面、断面形貌及晶体结构进行了表征。结果表明,铜膜内团簇尺寸非常细小,晶粒尺寸约为15.5~28.3 nm,且存在较强的〈111〉织构。采用四探针法测量铜膜的电阻率,并讨论了电阻率随沉积时间增加而逐渐下降的原因。     

镁合金化学镀及其添加剂研究

精选镁合金化学镀的前处理工艺和镀镍液配方,根据该工艺得到的镀层试验检测表明:该合金具有耐腐蚀性强、硬度高、结构致密、光泽性好,且有一定延展性;并通过实验比较了4种添加剂对镁合金化学镀镀速及镀液稳定性的影响,实验结果表明,钇和铕对镀液的稳定性影响较大,氟化铵和碳酸钠对镀速的影响较为显著,尤其是添加的Y3 浓度为0.02 g/L时,镀液的稳定性提高最多,而碳酸钠在19 g/L左右时加速作用最为明显.文中并分析了它们的影响机理.     

Electroless copper plating process of N, N, N, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl)ethylenediamine(THPED) chelating agent was researched comprehensively. The results indicate that plating rate decreases with the 3H2O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases plating rate and improves deposits quality, but decreases plating rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75,bath temperature is 30 ℃. Plating rate reaches 9.54 μm/h plating for 30 min in the bath. The SEM images demonstrate that the surface of copper film is smooth and the crystal is fine.     

Electroless Ni-P deposition on magnesium alloy from a sulfate bath

A technology for electroless Ni-P deposition on AZ91D from a low cost plating bath containing sulfate nickel was proposed. The seal pretreatment was employed before the electroless Ni-P deposition for the sake of occluding the micro holes of the cast magnesium alloy and interdicting the bubble formation in the Ni-P coating during plating process. And pickling pretreatment can provide a better adhesion between the Ni-P deposition and AZ91D substrate. The deposition speed of the Ni-P coating is 29 μm/h. The technology is employed to AZ91D magnesium alloy automobile parts and can provide high hardness and high wear-resistant. The weight losses of Ni-P plated and heat-treated Ni-P plated magnesium alloy specimen are only about 1/6 and 1/10 that of bare magnesium alloy specimen after 10 min abrasion wear, respectively. The hardness of the electroless Ni-P plated brake pedal support brackets is 674.1 VHN and 935.7 VHN after 2 hours heat treatments at 180 C. The adhesion of Ni-P coatings on magnesium alloy substrates meets the demands of ISO Standards 2819. The technology is environment friendly and cannot cause hazard to environment because of absence of chromate in the whole process.     

电镀镍磷合金老化镀液资源化利用的研究

电镀老化液中含有重金属,属于危险废液。文章提出了一种处理电镀镍磷合金老化镀液的新方法,该方法可将电镀老化液转化为可用的化学镀液。研究了转化镀液的镍离子浓度对沉积速度及稳定性的影响,确定了转化镀液的优化配比,测试了镀层的结合力及镀层断面不同测点的显微硬度,观察了镀层表面及断面的微观形貌。结果表明,镀层具有合格的结合强度和中等的硬度,致密平滑,磷含量稳定。     

化学镀法制备钴包覆碳化硅复合粉末的研究

采用化学镀法制备钴包覆碳化硅复合粉末,通过研究化学镀过程中钴盐浓度、还原剂浓度、络合剂浓度、缓冲剂浓度、温度以及pH值等因素对沉积速率的影响规律,得到化学镀钴的优化条件。利用XRD、SEM和EDAX等测试手段对该复合粉末的组分及形貌进行了表征。实验和表征结果表明,当硫酸钴浓度为30～50g/L,次磷酸钠浓度为40g/L,柠檬酸钠浓度为60～70g/L,控制温度为50～70℃以及调节pH值等于8时,镀层沉积速度较快,所得粉体表面被钴均匀包覆。     

硫脲对Ni-P镀层腐蚀行为的影响

在镀液中添加硫脲,分析了硫脲对Ni-P镀层沉积速度、表面形貌、孔隙率等的影响,并通过极化曲线和交流阻抗测试了硫脲对Ni-P镀层腐蚀性的影响。结果表明,当镀液中添加1 mg/L硫脲时,镀层的沉积速率加快,腐蚀速率增大。这主要是因为镀液添加硫脲后,镀层的孔隙率加大,促进了腐蚀介质渗入到基体表面,增加了腐蚀微电池的数量,形成了大阴极(镀层)-小阳极（基体）腐蚀微电池,使自腐蚀电流密度增大,电荷转移电阻减小。当镀液中添加硫脲质量浓度大于3 mg/L时,镀液被毒化,无法施镀。     

Purification and Regeneration of Spent Electroless Nickel Plating Baths by Electrodialysis

OINTRoDUCTIONExistingmethodsfortreatingspentelectrolessnickelplatingbathsfallintothreegeneralcategoriesl"'1f(l)Precipitation.(2)Electrolysis.(3)IonExchange-Precipitationtreatmentoffersasimpleandconvenientmethodfornickelremoval,raisingpHofplatingbaths,andthenprecipitatingnickelionsasnickelhydroxide.Thepre-cipitantsemployedinthismethodincludelime,ferroussulfide,insolublestarchxanthate,etc.Precipitationmethodmayge-neratea1argeamountofnickelandphosphitesludges,whichbringaboutasecondaryenvir…     

阴极脉冲电流作用下的Ni－P合金化学镀过程

研究了Ｍｉ－Ｐ合金脉冲化学镀过程，找出了镀层Ｐ含量，镀速和脉冲电流参数，温度的关系。由于脉冲电流的作用，可以减缓镀液中亚磷酸盐的积累，并且Ｐ的化学沉积过程也得到加速。     

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl) ethylenediamine (THPED) chelating agent was researched comprehensively. The results indicate that plating rate decreases with the increase of concentration for THPED, CuSO₄ · 5H₂O and HCHO, pH value and bath temperature. The additive of K₄[Fe(CN)₆] · 3H₂O, 2, 2′-dipyridyl and polyethylene glycol(PEG) decrease plating rate and K₄[Fe(CN)₆] · 3H₂O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases plating rate and improves deposits quality, but decreases plating rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless copper plating process are that the concentration of THPED, HCHO, CuSO₄ · 5H₂O, PEG, 2, 2′-dipyridyl and 2-MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75, bath temperature is 30 °C. Plating rate reaches 9.54 μm/h plating for 30 min in the bath. The SEM images demonstrate that the surface of copper film is smooth and the crystal is fine. Foundation item: Project supported by Hubei Daye Nonferrous Metal Corporation of China     

The effect and mechanism of Nano-Cu lubricating additives on the electroless deposited Ni-W-P coating

The coating and deposition process with excellent anti wear and suitable for industrial application were developed, and the optimum bath composition and process were obtained by studying the influence of the bath composition, temperature and pH value on the deposition rate and the plating solution stability. Moreover, the tribological properties of nano-Cu lubricating additives and electroless deposited Ni-W-P coating as well as their synergistic effect are researched using ring-block abrasion testing machine and energy dispersive spectrometer. Research results show that Ni-W-P alloy coating and nano-Cu lubricating additive have excellent synergistic effect, e g, the wear resistance of Ni-W-P alloy coating (with heat treatment and the oil with nano-Cu additives) has increased hundreds times than 45 steel as the metal substrate with the basic oil, and zero wear is achieved, which breaks through the bottleneck of previous separate research of the above-mentioned two aspects.     

Electroless copper-phosphorus coatings with the addition of silicon carbide （SiC） particles

Cu-P-silicon carbide(SiC)composite coatings were deposited by means of electroless plating.The effects ofpH values,temperature,and different concentrations of sodium hypophosphite(NaH2PO2·H2O),nickel sulfate(NiSO4·6H2O),sodium citrate(C6H5Na3O7·2H2O)and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis(EDX).The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows:pH 9; temperature,90℃; NaH2PO2·H2O concentration,125 g/L; NiSO4·6H2O concentration,3.125 g/L; SiC concentration,5 g/L; and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy(SEM)shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.     

酸性化学镀Ni－P合金

介绍了一种稳定性高、沉积速度较快的酸性化学镀Ｎｉ－Ｐ合金工艺．讨论了镀液组成及工艺条件对镀层沉积速度的影响，提出了化学镀Ｎｉ－Ｐ合金的最佳镀液组成和工艺条件．     

电解化学镀镍液钛离子的转化定量分析方法

为了解决化学反应中有色价态离子转化的快速定量分析问题,开展了化学镀镍液中钛离子的电解转化研究.在化学镀镍过程中还原剂Ti Cl3的Ti3+因被氧化为Ti4+而失去还原作用.采用电解法对以Ti Cl3为还原剂的化学镀镍产生的镀液进行再生处理,利用分光光度法定量测定镀液Ti3+的质量浓度,计算得到离子转化率,并通过采集电解过程镀液图像,分析其RGB色度值,建立色度相对值与Ti3+的质量浓度拟合关系式.研究结果表明:电解可以将Ti4+还原为Ti3+,其转化率η为94.16%;图像比色法可用于判断电解离子转化进程;溶液色度相对值U与Ti3+的质量浓度经拟合可得相关系数R为0.976 03的关系式.     

Removal of nickel from spent electroless nickel-plating bath with nickel foam cathode

0　ＩＮＴＲＯＤＵＣＴＩＯＮＥｌｅｃｔｒｏｌｅｓｓｎｉｃｋｅｌ ｐｌａｔｉｎｇｔｅｃｈｎｏｌｏｇｙｗａｓａｍｅｔｈｏｄｏｆｄｅｐｏｓｉｔｉｎｇｎｉｃｋｅｌｉｏｎｓｏｎｔｈｅｓｕｒｆａｃｅｏｆｍｅｔａｌｍａｔｅｒｉａｌｓｗｉｔｈｄｉｆｆｅｒｅｎｔｓｈａｐｅｓ .Ｔｈｉｓｐｒｏｃｅｓｓｈａｄｓｐｅｃｉａｌａｄｖａｎｔａｇｅｓ ,ａｎｄｗａｓｔｈｅｒｅｆｏｒｅｗｉｄｅｌｙａｐ ｐｌｉｅｄｉｎａｅｒｏｓｐａｃｅ ,ｅｌｅｃｔｒｏｎｉｃｓ ,ｐｅｔｒｏｃｈｅｍｉｓｔｒｙ ,ｆｏｏｄｉｎｄｕｓｔｒｉｅｓａｎｄｓｏｏｎ[1]…