Erbium spectroscopy and 1.5-/spl mu/m emission in KGd(WO/sub 4/)/sub 2/: Er,Yb single crystals

We grew good-optical-quality KGd(WO/sub 4/)/sub 2/ single crystals doped with erbium and ytterbium ions at several concentrations of dopants using the top-seeded-solution growth slow-cooling method (TSSG). We performed the spectroscopic characterization of this material related to the 1.5-mm infrared emission of erbium which is interesting for laser applications. To do this, we carried out polarized optical absorption at room temperature (RT) and at low temperature (6 K) and performed luminescence studies of the emission and lifetime. We obtained the 1.5-mm emission of erbium after selective laser pump excitation of the ytterbium ion and energy transfer between the two ions. The maximum emission cross section for 1.5 mm was about 2.56/spl times/10/sup -20/ cm/sup 2/ for the polarization of light with the electric field parallel to the N/sub m/ principal optical direction. This value was higher than for other erbium-doped materials with application in solid-state lasers such as LiYF/sub 4/:Er(YLF:Er), Y/sub 3/Al/sub 5/O/sub 12/:Er(YAG:Er), YAlO/sub 3/:Er, and Al/sub 2/O/sub 3/:Er.     

Low-frequency noise in submicrometer MOSFETs with HfO/sub 2/, HfO/sub 2//Al/sub 2/O/sub 3/ and HfAlO/sub x/ gate stacks

Low-frequency noise measurements were performed on p- and n-channel MOSFETs with HfO/sub 2/, HfAlO/sub x/ and HfO/sub 2//Al/sub 2/O/sub 3/ as the gate dielectric materials. The gate length varied from 0.135 to 0.36 /spl mu/m with 10.02 /spl mu/m gate width. The equivalent oxide thicknesses were: HfO/sub 2/ 23 /spl Aring/, HfAlO/sub x/ 28.5 /spl Aring/ and HfO/sub 2//Al/sub 2/O/sub 3/ 33 /spl Aring/. In addition to the core structures with only about 10 /spl Aring/ of oxide between the high-/spl kappa/ dielectric and silicon substrate, there were "double-gate oxide" structures where an interfacial oxide layer of 40 /spl Aring/ was grown between the high-/spl kappa/ dielectric and Si. DC analysis showed low gate leakage currents in the order of 10/sup -12/A(2-5/spl times/10/sup -5/ A/cm/sup 2/) for the devices and, in general, yielded higher threshold voltages and lower mobility values when compared to the corresponding SiO/sub 2/ devices. The unified number-mobility fluctuation model was used to account for the observed 1/f noise and to extract the oxide trap density, which ranged from 1.8/spl times/10/sup 17/ cm/sup -3/eV/sup -1/ to 1.3/spl times/10/sup 19/ cm/sup -3/eV/sup -1/, somewhat higher compared to conventional SiO/sub 2/ MOSFETs with the similar device dimensions. There was no evidence of single electron switching events or random telegraph signals. The aim of this paper is to present a general discussion on low-frequency noise characteristics of the three different high-/spl kappa//gate stacks, relative comparison among them and to the Si--SiO/sub 2/ system.     

Low-frequency noise in submicrometer MOSFETs with HfO/sub 2/, HfO/sub 2//Al/sub 2/O/sub 3/ and HfAlO/sub x/ gate stacks

Low-frequency noise measurements were performed on p- and n-channel MOSFETs with HfO/sub 2/, HfAlO/sub x/ and HfO/sub 2//Al/sub 2/O/sub 3/ as the gate dielectric materials. The gate length varied from 0.135 to 0.36 /spl mu/m with 10.02 /spl mu/m gate width. The equivalent oxide thicknesses were: HfO/sub 2/ 23 /spl Aring/, HfAlO/sub x/ 28.5 /spl Aring/ and HfO/sub 2//Al/sub 2/O/sub 3/ 33 /spl Aring/. In addition to the core structures with only about 10 /spl Aring/ of oxide between the high-K dielectric and silicon substrate, there were "double-gate oxide" structures where an interfacial oxide layer of 40 /spl Aring/ was grown between the high-K dielectric and Si. DC analysis showed low gate leakage currents in the order of 10/sup -12/ A(2-5 /spl times/ 10/sup -5/ A/cm/sup 2/) for the devices and, in general, yielded higher threshold voltages and lower mobility values when compared to the corresponding SiO/sub 2/ devices. The unified number-mobility fluctuation model was used to account for the observed 1/f noise and to extract the oxide trap density, which ranged from 1.8 /spl times/ 10/sup 17/ cm/sup -3/ eV/sup -1/ to 1, 3 /spl times/ 10/sup 19/ cm/sup -3/ eV/sup -1/ somewhat higher compared to conventional SiO/sub 2/ MOSFETs with the similar device dimensions. There was no evidence of single electron switching events or random telegraph signals. The aim of this paper is to present a general discussion on low-frequency noise characteristics of the three different high-K/gate stacks, relative comparison among them and to the Si-SiO/sub 2/ system.     

Spectroscopic and stimulated emission Characteristics of Nd/sup 3+/ in transparent YAG ceramics

Nd: YAG ceramic materials have been synthesized using vacuum sintering technique with the raw materials prepared by the nano-crystalline methods. The spectroscopic studies suggest overall improvement in absorption and emission and reduction in scattering loss. Judd-Ofelt analysis has been employed to compute the relevant spectroscopic and radiative parameters of the material. The SEM and TEM measurements reveal the excellent optical quality of the ceramic with low pore volume and narrow grain boundary. Fluorescence and Raman measurements reveal that the Nd/sup 3+/-doped YAG ceramic is almost equivalent to its single-crystal counterpart in its radiative and nonradiative properties. Individual Stark levels for /sup 2s+1/L/sub J/ manifolds are obtained from the absorption and fluorescence spectra and are analyzed to identify the stimulated emission channels possible in the Nd: YAG ceramic. Laser performance studies favor the use of high-concentration Nd: YAG ceramics in the design of an efficient microchip laser. With 4 at% Nd: YAG ceramic acting as a microchip laser, we obtained a slope efficiency of 40%. High-power laser experiments yield an optical-to-optical conversion efficiency of 30% for Nd (0.6 at%):YAG ceramic as compared to 34% for an Nd (0.6 at%):YAG single crystal. The oscillation experiments at 1.3 mm gives a slope efficiency of 35%. Optical gain measurements conducted in these materials also show values comparable to single crystal, supporting that these materials could be suitable substitutes to single crystals in solid-state laser applications.     

Evidence of enhanced hypersensitive transition in erbium-doped fibers with different Al/sub 2/O/sub 3/ content

Precise spectroscopic absorption measurements of erbium-doped aluminosilicate fibers with different Al/sub 2/O/sub 3/ content were performed with the Judd-Ofelt analysis. From the Judd-Ofelt analysis, the /spl Omega//sub 2/ parameters of Er/sup 3+/ ions in these fibers were found to be about three times as large as those in aluminosilicate bulk glasses. The enhancement of the /spl Omega//sub 2/ parameters led to much stronger line strength of hypersensitive transitions in a fiber form than in a bulk glass form. This indicates that the distortion of the ligand field around the Er/sup 3+/ ions are more enhanced in a fiber form than in a bulk glass form. Furthermore, the /spl Omega//sub 6/ and the /spl Omega//sub 2/ parameters increased with an increase of q content up to 20 000 ppm. This Al/sub 2/O/sub 3/-content dependence of the /spl Omega//sub 6/ parameter was consistent with that of the line strength and the spontaneous emission probabilities of the transition corresponding to the /sup 4/I/sub 13/2//spl rarr//sup 4/I/sub 15/2/.     

Evidence and understanding of ALD HfO/sub 2/-Al/sub 2/O/sub 3/ laminate MIM capacitors outperforming sandwich counterparts

Metal-insulator-metal capacitors with atomic-layer-deposited HfO/sub 2/-Al/sub 2/O/sub 3/ laminated and sandwiched dielectrics have been compared, for the first time, for analog circuit applications. The experimental results indicate that significant improvements can be obtained using the laminated dielectrics, including an extremely low leakage current of 1/spl times/10/sup -9/ A/cm/sup 2/ at 3.3V and 125/spl deg/C, a high breakdown electric field of /spl sim/3.3MV/cm at 125/spl deg/C, good polarity-independent electrical characteristics, while retaining relatively high capacitance density of 3.13 fF//spl mu/m/sup 2/ as well as voltage coefficients of capacitance as low as -80 ppm/V and 100 ppm/V/sup 2/ at 100 kHz. The underlying mechanism is likely due to alternate insertions of Al/sub 2/O/sub 3/ layers that reduce the thickness of each HfO/sub 2/ layer, hereby efficiently inhibiting HfO/sub 2/ crystallization, and blocking extensions of grain boundary channels from top to bottom as well as to achieve good interfacial quality.     

A novel strained Si/sub 0.7/Ge/sub 0.3/ surface-channel pMOSFET with an ALD TiN/Al/sub 2/O/sub 3//HfAlO/sub x//Al/sub 2/O/sub 3/ gate stack

Proof-of-concept pMOSFETs with a strained-Si/sub 0.7/Ge/sub 0.3/ surface-channel deposited by selective epitaxy and a TiN/Al/sub 2/O/sub 3//HfAlO/sub x//Al/sub 2/O/sub 3/ gate stack grown by atomic layer chemical vapor deposition (ALD) techniques were fabricated. The Si/sub 0.7/Ge/sub 0.3/ pMOSFETs exhibited more than 30% higher current drive and peak transconductance than reference Si pMOSFETs with the same gate stack. The effective mobility for the Si reference coincided with the universal hole mobility curve for Si. The presence of a relatively low density of interface states, determined as 3.3 /spl times/ 10/sup 11/ cm/sup -2/ eV/sup -1/, yielded a subthreshold slope of 75 mV/dec. for the Si reference. For the Si/sub 0.7/Ge/sub 0.3/ pMOSFETs, these values were 1.6 /spl times/ 10/sup 12/ cm/sup -2/ eV/sup -1/ and 110 mV/dec., respectively.     

Blue energy upconversion emission in thulium-doped-SiO/sub 2/-P/sub 2/O/sub 5/ channel waveguides excited at 1.064 /spl mu/m

Blue energy upconversion emission in Tm/sup 3+/-doped SiO/sub 2/-P/sub 2/O/sub 5/ channel waveguides off-resonance pumped by infrared radiation is reported. The waveguide samples were excited by a single continuous-wave laser source at 1.064 /spl mu/m. Two distinct blue emission signals around 450 and 480 nm, in addition to red at 660 nm and near-infrared at 800-nm less intense emissions were observed. The upconversion excitation mechanism was assigned to stepwise multiphoton absorption processes followed by nonradiative multiphonon-assisted relaxation processes. Infrared-to-blue conversion efficiencies with respect to the absorbed pump power of /spl sim/6.0/spl times/10/sup -7/ for this off-resonance pumping scheme was measured. The dependence of the infrared-to-blue upconversion mechanism upon the excitation power and thulium content is also examined.     

Fully silicided NiSi gate on La/sub 2/O/sub 3/ MOSFETs

We have fabricated the fully silicided NiSi on La/sub 2/O/sub 3/ for n- and p-MOSFETs. For 900/spl deg/C fully silicided CoSi/sub 2/ on La/sub 2/O/sub 3/ gate dielectric with 1.5 nm EOT, the gate dielectric has large leakage current by possible excess Co diffusion at high silicidation temperature. In sharp contrast, very low gate leakage current density of 2/spl times/10/sup -4/ A/cm/sup 2/ at 1 V is measured for 400/spl deg/C formed fully silicided NiSi and comparable with Al gate. The extracted work function of NiSi was 4.42 eV, and the corresponding threshold voltages are 0.12 and -0.70 V for respective n- and p-MOSFETs. Electron and hole mobilities of 156 and 44 cm/sup 2//V-s are obtained for respective n- and p-MOSFETs, which are comparable with the HfO/sub 2/ MOSFETs without using H/sub 2/ annealing.     

Very high density RF MIM capacitors (17 fF//spl mu/m/sup 2/) using high-/spl kappa/ Al/sub 2/O/sub 3/ doped Ta/sub 2/O/sub 5/ dielectrics

Using high-/spl kappa/ Al/sub 2/O/sub 3/ doped Ta/sub 2/O/sub 5/ dielectric, we have obtained record high MIM capacitance density of 17 fF//spl mu/m/sup 2/ at 100 kHz, small 5% capacitance reduction to RF frequency range, and low leakage current density of 8.9/spl times/10/sup -7/ A/cm/sup 2/. In combination of both high capacitor density and low leakage current density, a very low leakage current of 5.2/spl times/10/sup -12/ A is calculated for a typical large 10 pF capacitor used in RF IC that is even smaller than that of a deep sub-/spl mu/m MOSFET. This very high capacitance density with good MIM capacitor characteristics can significantly reduce the chip size of RF ICs.     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.     

Multiwavelength diode-cladding-pumped Nd/sup 3+/-doped germano-aluminosilicate fiber laser

Simultaneous multiwavelength oscillation at 1060 and 1090 nm has been produced from a free-running Nd/sup 3+/-doped multicomponent silica fiber laser. As a result of co-doping with both Al/sub 2/O/sub 3/ and GeO/sub 2/, the Nd/sup 3+/ ions are situated at separate sites relating to either Al/sup 3+/-rich or Ge/sup 4+/-rich regions of the germano-aluminosilicate glass. The slope efficiency of the combined /spl sim/1-/spl mu/m output was /spl sim/52% (56%) with respect to the launched (absorbed) pump power. The 1060-nm emission reaches threshold first because of the greater number of Nd/sup 3+/ ions that are located at Al/sup 3+/-rich sites. On chopping the pump light the relaxation oscillations relating to the 1090-nm emission are antiphase with the oscillations observed with the 1060-nm emission. A degree of spectral overlap exists between the fluorescence emitted from Nd/sup 3+/ ions located at each site. Power equalization (to /spl sim/1 W each) of the 1060- and 1090-nm emissions was carried out by way of Raman amplification that occurred either internally or externally to the Nd/sup 3+/-doped silica fiber laser.     

Spectroscopic analysis and diode-pumped laser results of Nd:BaY/sub 2/F/sub 8/

Single crystals of monoclinic BaY/sub 2/F/sub 8/, doped with different Nd/sup 3+/ concentrations, were successfully grown by means of the Czochralski method. Here, we present a polarized infrared (IR) spectroscopic investigation and diode-pumped continuous-wave laser results in the 1 /spl mu/m wavelength region. Moreover for the first time 1.3 /spl mu/m laser emission has been characterized. Q-switching results in the 1-/spl mu/m region are also presented.     

Long-wavelength In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As large-area avalanche photodiodes and arrays

Large-area (500-/spl mu/m diameter) mesa-structure In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiodes (APDs) are reported. The dark current density was /spl sim/2.5/spl times/10/sup -2/ nA//spl mu/m/sup 2/ at 90% of breakdown; low surface leakage current density (/spl sim/4.2 pA//spl mu/m) was achieved with wet chemical etching and SiO/sub 2/ passivation. An 18 /spl times/ 18 APD array with uniform distributions of breakdown voltage, dark current, and multiplication gain has also been demonstrated. The APDs in the array achieved 3-dB bandwidth of /spl sim/8 GHz at low gain and a gain-bandwidth product of /spl sim/120 GHz.     

A novel InGaP/Al/sub x/Ga/sub 1-x/As/GaAs CEHBT

A new and interesting InGaP/Al/sub x/Ga/sub 1-x/As/GaAs composite-emitter heterojunction bipolar transistor (CEHBT) is fabricated and studied. Based on the insertion of a compositionally linear graded Al/sub x/Ga/sub 1-x/As layer, a near-continuous conduction band structure between the InGaP emitter and the GaAs base is developed. Simulation results reveal that a potential spike at the emitter/base heterointerface is completely eliminated. Experimental results show that the CEHBT exhibits good dc performances with dc current gain of 280 and greater than unity at collector current densities of J/sub C/=21kA/cm/sup 2/ and 2.70/spl times/10/sup -5/ A/cm/sup 2/, respectively. A small collector/emitter offset voltage /spl Delta/V/sub CE/ of 80 meV is also obtained. The studied CEHBT exhibits transistor action under an extremely low collector current density (2.7/spl times/10/sup -5/ A/cm/sup 2/) and useful current gains over nine decades of magnitude of collector current density. In microwave characteristics, the unity current gain cutoff frequency f/sub T/=43.2GHz and the maximum oscillation frequency f/sub max/=35.1GHz are achieved for a 3/spl times/20 /spl mu/m/sup 2/ device. Consequently, the studied device shows promise for low supply voltage and low-power circuit applications.     

RF, DC, and reliability characteristics of ALD HfO/sub 2/-Al/sub 2/O/sub 3/ laminate MIM capacitors for Si RF IC applications

High-performance metal-insulator-metal capacitors using atomic layer-deposited HfO/sub 2/-Al/sub 2/O/sub 3/ laminate are fabricated and characterized for RF and mixed-signal applications. The laminate capacitor can offer high capacitance density (12.8 fF//spl mu/m/sup 2/) up to 20 GHz, low leakage current of 4.9/spl times/10/sup -8/ A/cm/sup 2/ at 2 V and 125/spl deg/C, and small linear voltage coefficient of capacitance of 211 ppm/V at 1 MHz, which can easily satisfy RF capacitor requirements for year 2007 according to the International Technology Roadmap for Semiconductors. In addition, effects of constant voltage stress and temperature on leakage current and voltage linearity are comprehensively investigated, and dependences of quadratic voltage coefficient of capacitance (/spl alpha/) on frequency and thickness are also demonstrated. Meanwhile, the underlying mechanisms are also discussed.     

MIM capacitors using atomic-layer-deposited high-/spl kappa/ (HfO/sub 2/)/sub 1-x/(Al/sub 2/O/sub 3/)/sub x/ dielectrics

Metal-insulator-metal (MIM) capacitors with (HfO/sub 2/)/sub 1-x/(Al/sub 2/O/sub 3/)/sub x/ high-/spl kappa/ dielectric films were investigated for the first time. The results show that both the capacitance density and voltage/temperature coefficients of capacitance (VCC/TCC) values decrease with increasing Al/sub 2/O/sub 3/ mole fraction. It was demonstrated that the (HfO/sub 2/)/sub 1-x/(Al/sub 2/O/sub 3/)/sub x/ MIM capacitor with an Al/sub 2/O/sub 3/ mole fraction of 0.14 is optimized. It provides a high capacitance density (3.5 fF//spl mu/m/sup 2/) and low VCC values (/spl sim/140 ppm/V/sup 2/) at the same time. In addition, small frequency dependence, low loss tangent, and low leakage current are obtained. Also, no electrical degradation was observed for (HfO/sub 2/)/sub 1-x/(Al/sub 2/O/sub 3/)/sub x/ MIM capacitors after N/sub 2/ annealing at 400/spl deg/C. These results show that the (HfO/sub 2/)/sub 0.86/(Al/sub 2/O/sub 3/)/sub 0.14/ MIM capacitor is very suitable for capacitor applications within the thermal budget of the back end of line process.     

DRAM plate electrode bias optimization for reducing leakage current in UV-O/sub 3/ and O/sub 2/ annealed CVD deposited Ta/sub 2/O/sub 5/ dielectric films

A new plate biasing scheme is described which allowed the use of 65% higher supply voltage without increasing the leakage current for the UV-O/sub 3/ and O/sub 2/ annealed chemical-vapor-deposited tantalum pentaoxide dielectric film capacitors in stacked DRAM cells. Dielectric leakage was reduced by biasing the capacitor plate electrode to a voltage lower than the conventionally used value of V/sub cc//2. Ta/sub 2/O/sub 5/ films with 3.9 nm effective gate oxide, 8.5 fF//spl mu/m/sup 2/ capacitance and <0.3 /spl mu/A/cm/sup 2/ leakage at 100/spl deg/C and 3.3 V supply are demonstrated.<>     

Characteristics of Al/sub 2/O/sub 3//TiO/sub 2/ nanolaminates and AlTiO thin films on Si

This letter reports a metal-insulator-semiconductor structure based on Al/sub 2/O/sub 3//TiO/sub 2/ nanolaminates and AlTiO films evaporated on an unheated p-Si substrate. The structure exhibits a low hysteresis in the capacitance-voltage characteristics, a larger dielectric constant leading to a quantum mechanically corrected effective oxide thickness of 1.35-2.1 nm, good stability of the electrical characteristics to thermal processes, a large breakdown electric field of 7.5 MV/cm, and a leakage current density below 5/spl times/10/sup -7/ A/cm/sup 2/ at an electric field of 2 MV/cm.     

Limitation of DC currents by YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta//-Au superconducting films

The limitation of dc fault currents is one of the issues for the development of dc networks or links. This paper shows for the first time the high potential of YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta//-Au bilayers for the design of dc current limiters. Such devices are based on the transition into the normal state of the superconducting YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// films above a current I/sup */>I/sub c/, where I/sub c/ is the critical current at the onset of dissipation. The study of the transition under current pulses shows that a thermally driven transition into the normal state can occur after a delay t/sub trans/. This duration is defined by the amplitude of the current pulse. For I/sup *//spl ap/3I/sub c/, this delay is less than 10 /spl mu/s. The abrupt transition into the normal state allows an efficient current limitation. A recovery of the superconducting state can also occur under current. This property can be extremely interesting for autonomous operation of a current limiter in an electrical network in case of transient over-currents coming from the starting of high-power devices.