Low-power compact composite field AES S-Box/Inv S-Box design in 65 nm CMOS using Novel XOR Gate

The Substitution box (S-Box) forms the core building block of any hardware implementation of the Advanced Encryption Standard (AES) algorithm as it is a non-linear structure requiring multiplicative inversion. This paper presents a full custom CMOS design of S-Box/Inversion S-Box (Inv S-Box) with low power GF (2⁸) Galois Field inversions based on polynomial basis, using composite field arithmetic. The S-Box/Inv S-Box utilizes a novel low power 2-input XOR gate with only six devices to achieve a compact module implemented in 65 nm IBM CMOS technology. The area of the core circuit is only about 288 μm² as a result of this transistor level optimization. The hardware cost of the S-Box/Inv S-Box is about 158 logic gates equivalent to 948 transistors with a critical path propagation delay of 7.322 ns enabling a throughput of 130 Mega-SubBytes per second. This design indicates a power dissipation of only around 0.09 μW using a 0.8 V supply voltage, and, is suitable for applications such as RFID tags and smart cards which require low power consumption with a small silicon die. The proposed implementation compares favorably with other existing S-Box designs.     

Evaluation of layered tunnel barrier charge trapping devices for embedded non-volatile memories

This paper presents experimental results on band gap engineered charge trapping devices for embedded non-volatile memories. Different material systems with high-k dielectrics and metal gates were fabricated using 193 nm lithography and the electrical evaluation was performed on 256 bits mini-arrays. The structure relies essentially on a layered tunnel ONO (oxide-nitride-oxide) barrier that replaces the tunnel oxide in conventional SONOS devices. In addition, we have implemented high-k dielectrics, metal gates and sealing layer in order to achieve low programming voltage and improve the data retention especially at elevated temperature. Whereas, high-k and metal gate systems allow low programme/erase voltages attractive for embedded non-volatile memories, the conventional band gap engineered SONOS (BE-SONOS) offers better high-temperature data retention. However, compared to a SONOS device with a standard “thick” tunnel oxide of 6 nm close to the EOT of the layered tunnel ONO barrier, it appears that BE-SONOS memories suffer from charge loss toward the channel and therefore we believe that the band gap engineered feature of the ONO barrier requires alternative materials.     

Designing leakage tolerant, low power wide-OR dominos for sub-130 nm CMOS technologies

In this paper, we discuss the design of leakage tolerant wide-OR domino gates for deep submicron (DSM), bulk CMOS technologies. Technology scaling is resulting in a 3×-5× increase in transistor I_OFF/μm per generation causing 15-30% degradation in the noise margin of high performance domino gates. We investigate several techniques that can improve the noise margin of domino logic gates and thereby ensure their reliable operation for sub-130 nm technologies. Our results indicate that, selective usage of dual V_TH transistors shows acceptable energy-delay tradeoffs for the 90 nm technology. However, techniques like supply voltage (V_cc) reduction or using non-minimum L_e transistors are required in order to ensure robust and low power operation of wide-OR domino designs for the 70 nm generation.     

Gentle FUSI NiSi metal gate process for high-k dielectric screening

In this paper, a process flow well suited for screening of novel high-k dielectrics is presented. In vacuo silicon capping of the dielectrics excludes process and handling induced influences especially if hygroscopic materials are investigated. A gentle, low thermal budget process is demonstrated to form metal gate electrodes by turning the silicon capping into a fully silicided nickel silicide. This process enables the investigation of rare earth oxide based high-k dielectrics and specifically their intrinsic material properties using metal oxide semiconductor (MOS) capacitors. We demonstrate the formation of nickel monosilicide electrodes which show smooth interfaces to the lanthanum- and gadolinium-based high-k oxide films. The dielectrics have equivalent oxide thicknesses of EOT = 0.95 nm (lanthanum silicate) and EOT = 0.6 nm (epitaxial gadolinium oxide).     

Impacts of NBTI/PBTI on performance of domino logic circuits with high-k metal-gate devices in nanoscale CMOS

Negative-bias temperature instability (NBTI) and positive-bias temperature instability (PBTI) weaken PFETs and high-k metal-gate NFETs, respectively. This paper provides comprehensive analyses on the impacts of NBTI and PBTI on wide fan-in domino gates with high-k metal-gate devices. The delay degradation and power dissipation of domino logic, as well as the Unity Noise Gain (UNG) are analyzed in the presence of NBTI/PBTI degradation. It has been shown that the main concern is the degradation impact on delay which can increase up to 16.2% in a lifetime of 3 years. We have also proposed a degradation tolerant technique to compensate for the NBTI/PBTI-induced delay degradation in domino gates with a negligible impact on UNG and power.     

Novel hybrid D/A structures for high-resolution SAR ADCs—analysis, modeling and realization

An intermittent-sleeping C-R hybrid D/A structure, a resistor-reusing R-C hybrid D/A structure and an R-C-R combined D/A structure are researched with theoretical analysis and Matlab modeling in this paper. The switching power and passive components' matching requirement of these D/A structures are discussed in detail. Three SAR ADCs with these three novel structures are realized based on SMIC 0.18 μm CMOS, SMIC 90 nm CMOS and UMC 90 nm CMOS, respectively. The theoretical analysis, modeling verification and circuit realization proves the applicability of these three D/A conversion networks to high-resolution SAR ADCs.     

Characterization of high-K/metal gate using picosecond ultrasonics

Transition from oxide gates to replacement metal gates is well underway and performance benefits have been demonstrated in state-of-the-art microprocessors. High-K/metal gate combination is important for all emerging new applications that require high-performance and low gate-leakage including all silicon and non-silicon nanoelectronic transistors. Picosecond ultrasonic measurements are used as checkpoints during various stages of development and integration of high-K/metal gate. The small spot, non-destructive nature of this technology allows for measurements directly on product wafers and on various line array structures in small measurement sites (30 μm × 30 μm). The technique has shown excellent correlation with cross-section TEM, demonstrating capability for monitoring advanced gate stacks. Picosecond ultrasonics provides high-throughput and can be used for in-line monitoring after the process is transferred to high volume manufacturing.     

High-k dielectrics for future generation memory devices (Invited Paper)

The requirements and development of high-k dielectric films for application in storage cells of future generation flash and Dynamic Random Access Memory (DRAM) devices are reviewed. Dielectrics with k-value in the 9–30 range are studied as insulators between charge storage layers and control gates in flash devices. For this application, large band gaps (>6 eV) and band offsets are required, as well as low trap densities. Materials studied include aluminates and scandates. For DRAM metal–insulator–metal (MIM) capacitors, aggressive scaling of the equivalent oxide thickness (with targets down to 0.3 nm) drives the research towards dielectrics with k-values >50. Due to the high aspect ratio of MIMCap structures, highly conformal deposition techniques are needed, triggering a substantial effort to develop Atomic Layer Deposition (ALD) processes for the deposition of metal gates and high-k dielectrics. Materials studied include Sr- and Ba-based perovskites, with SrTiO₃ as one of the most promising candidates, as well as tantalates, titanates and niobates.     

Microstructure and stress in high-k Hf-Y-O thin films

We investigated the microstructure and the stress of high-k Hf-Y-O thin films deposited by atomic layer deposition (ALD). These hafnium oxide based films with a thickness of 5-60 nm stabilized in crystal structure with yttrium oxide by alternating the Hf- or Y-containing metal precursor during deposition. The microstructure was investigated by XRD and TEM in dependence of substrate and deposition temperature. The film stress was monitored during thermal cycles up to 500 °C using the substrate curvature method on (1 0 0)-Si wafer material with or without 10 nm TiN bottom electrode as well as on fused silica. It was observed that crystallinity and phases are depending on deposition temperature and film thickness. During thermal treatment the films crystallize depending on deposition temperature, yttrium content and substrate material at different temperatures. Crystallization of the films depends strongly on yttrium content. The highest reduction of 720 MPa was observed for films deposited with a Hf:Y cycle ratio of 10:1 where 6.2% of all metal atoms are replaced by yttrium. These Hf-Y-O films also show the highest k-value of 29 and have the smallest thermal expansion coefficient mismatch to TiN electrodes. Therefore we conclude that Hf-Y-O films are candidates for application in next generations of microelectronic MIM-capacitor devices or metal gate transistor technology.     

A new inverter-based charge pump circuit with high conversion ratio and high power efficiency

The current paper presents a new inverter-based charge pump circuit with high conversion ratio and high power efficiency. The proposed charge pump, which consists of a PMOS pass transistor, inverter-based switching transistors, and capacitors, can improve output voltage and conversion ratio of the circuit. The proposed charge pump was fabricated with TSMC 0.35 μm 2P4M CMOS technology. The chip area without pads is only 0.87 mm×0.65 mm. The measured results show that the output voltage of the four-stage charge pump circuit with 1.8 V power supply voltage (V_DD=1.8 V) can be pumped up to 8.2 V. The proposed charge pump circuit achieves efficiency of 60% at 80 μA.     

Design of self-bias tail transistor technique for low phase noise CMOS VCO with harmonic suppression using capacitance ground

This paper presents a low phase noise wideband CMOS VCO based on the self-bias tail transistor technique and harmonic suppression using a capacitance ground. This VCO utilizes switching capacitor arrays in which four channels are able to be selected for multi-band application. Moreover, the design of CMOS VCO makes good use of the self-bias tail transistor and capacitance ground filter technique to reduce the phase noise. The MOS varactors are used as fine tuning for wideband operating application. The fully integrated VCO provides excellent performance with high FOM −193 dBc/Hz. The bandwidth of the frequency is 1.1 GHz and the tuning range is 13.8%. The power dissipation of the core circuit is 8.28 mW under a 1.8 V supply and phase noise is measured as low as −123.6 dBc/Hz at 1 MHz offset under 8.5 GHz oscillation frequencies. This VCO was made by the TSMC 0.18 μm 1P6M CMOS standard process and the chip area is 0.75×0.69 (mm²).     

Pentacene thin-film transistors with sol-gel derived amorphous Ba0.6Sr0.4TiO3 gate dielectric

An amorphous Ba_0.6Sr_0.4TiO₃ (BST) film with the thickness of 200 nm was deposited on indium-tin-oxide (ITO)-coated glass substrate through sol-gel route and post-annealing at 500 °C. The dielectric constant of the BST film was determined to be 20.6 at 100 kHz by measuring the Ag/BST/ITO parallel plate capacitor, and no dielectric tunability was observed with the bias voltage varying from −5 to 5 V. The BST film shows a dense and uniform microstructure as well as a smooth surface with the root-mean-square (RMS) roughness of about 1.4 nm. The leakage current density was found to be 3.5 × 10⁻⁸ A/cm² at an applied voltage of −5 V. The transmittance of the BST/ITO/glass structure is more than 70% in the visible region. Pentacene based transistor using the as-prepared BST film as gate insulator exhibits a low threshold voltage of −1.3 V, the saturation field-effect mobility of 0.68 cm²/Vs, and the current on/off ratio of 3.6 × 10⁵. The results indicate that the sol-gel derived BST film is a promising high-k gate dielectric for large-area transparent organic transistor arrays on glass substrate.     

Compact modeling of CMOS transistors under variable uniaxial stress

This paper presents a novel implementation of variable uniaxial mechanical stress model to be used with DC circuit simulation, e.g. using BSIM3v3 transistor model. Based on transistor measurements under various uniaxial stress conditions two stress-dependent parameters are identified, namely the carriers mobility and to a lesser extend the carrier saturation velocity. The effect of the parasitic source/drain resistance on the piezoresistive coefficient determination is addressed in detail. Using the fundamental piezoresistive coefficients, the model has implemented a general relation to calculate the coefficients for arbitrary directions of current and stress in the (0 0 1) silicon (Si) plane. The extended transistor model allows for simulating the effect of uniaxial stress on any MOSFET geometry, under different operation conditions and for any combination of the drain current and stress orientations in the (0 0 1) silicon (Si) plane. The method proposed in this paper is validated by static and dynamic stress-dependent simulations and comparison with experimental data. The method is simulator-independent and can be adapted to other bulk CMOS technologies including SOI processes.     

Studies on dielectric relaxation and defect generation for reliability assessments in ultrathin high-k gate dielectrics on Ge

In this work, we present the results of dielectric relaxation and defect generation kinetics towards reliability assessments for Zr-based high-k gate dielectrics on p-Ge (1 0 0). Zirconium tetratert butoxide (ZTB) was used as an organometallic source for the deposition of ultra thin (∼14 nm) ZrO₂ films on p-Ge (1 0 0) substrates. It is observed that the presence of an ultra thin lossy GeO_x interfacial layer between the deposited high-k film and the substrate, results in frequency dependent capacitance-voltage (C-V) characteristics and a high interface state density (∼10¹² cm⁻² eV⁻¹). Use of nitrogen engineering to convert the lossy GeO_x interfacial layer to its oxynitride is found to improve the electrical properties. Magnetic resonance studies have been performed to study the chemical nature of electrically active defects responsible for trapping and reliability concerns in high-k/Ge systems. The effect of transient response and dielectric relaxation in nitridation processes has been investigated under high voltage pulse stressing. The stress-induced trap charge density and its spatial distribution are reported. Charge trapping/detrapping of stacked layers under dynamic current stresses was studied under different fluences (−10 mA cm⁻² to −50 mA cm⁻²). Charge trapping characteristics of MIS structures (Al/ZrO₂/GeO_x/Ge and Al/ZrO₂/GeO_xN_y/Ge) have been investigated by applying pulsed unipolar (peak value - 10 V) stress having 50% duty-cycle square voltage wave (1 Hz-10 kHz) to the gate electrode.     

A fully integrated 23.2 dBm P1 dB CMOS power amplifier for the IEEE 802.11a with 29% PAE

A two-stage fully integrated power amplifier (PA) for the 802.11a standard is presented. The PA has been fabricated using UMC 0.18 μm CMOS technology. Measurement results show a power gain of 21.1 dB, a P_1 dB of 23.2 dBm and a P_SAT of 26.8 dBm. The PAE is 29% and it is kept high by means of several integrated inductors. These inductors present low-DC resistance and high Q characteristics. The inductors must include extra design considerations in order to withstand the high-current levels flowing through them, so that they have been called power inductors.     

NBTI reliability on high-k metal-gate SiGe transistor and circuit performances

Negative-bias temperature instability (NBTI) on high-k metal-gate SiGe p-channel MOSFETs has been examined. SiGe p-MOSFETs shows reduced interface states and enhanced NBTI reliability compared to their Si p-channel control devices as evidenced by experimental data. Impact of NBTI reliability on digital and RF circuits has been also examined using extracted fresh and stressed BSIM4 model parameters in circuit simulation. High-k metal-gate SiGe pMOSFETs demonstrate less inverter pull-up delay, smaller noise figure of a cascode low-noise amplifier, and larger output power and power-added efficiency than their Si counterparts when subject to NBTI stress.     

MOCVD fluorine free WSix metal gate electrode on high-k dielectric for NMOS technology

We report material and electrical properties of tungsten silicide metal gate deposited on 12 in. wafers by chemical vapor deposition (CVD) using a fluorine free organo-metallic (MO) precursor. We show that this MOCVD WSi_x thin film deposited on a high-k dielectric (HfSiO:N) shows a N+ like behavior (i.e. metal workfunction progressing toward silicon conduction band). We obtained a high-k/WSi_x/polysilicon “gate first” stack (i.e. high thermal budget) providing stable equivalent oxide thickness (EOT) of ∼1.2 nm, and a reduction of two decades in leakage current as compared to SiO₂/polysilicon standard stack. Additionally, we obtained a metal gate with an equivalent workfunction (EWF) value of ∼4.4 eV which matches with the +0.2 eV above Si midgap criterion for NMOS in ultra-thin body devices.     

Electrical transport properties in electroless-etched Si nanowire field-effect transistors

We report the electrical transport of the Si nanowires in a field-effect transistor (FET) configuration, which were synthesized from B-doped p-type Si(1 1 1) wafer by an aqueous electroless etching method based on the galvanic displacement of Si by the reduction of Ag⁺ ions on the wafer surface. The FET performance of the as-synthesized Si nanowires was investigated and compared with Ag-nanoparticles-removed Si nanowires. In addition, high-k HfO₂ gate dielectric was applied to the Si nanowires FETs, leading to the enhanced performance such as higher drain current and lower subthreshold swing.     

Implementation of high-k and metal gate materials for the 45 nm node and beyond: gate patterning development

We report on gate patterning development for the 45 nm node and beyond. Both poly-Si and different metal gates in combination with medium-k and high-k dielectrics have been defined. Source/drain silicon recess has been characterized for different stacks, yielding optimised processes for all investigated. Using hardmask based etching allowed us to produce sub-20 nm poly-Si and metal gates. Implementation of advanced metal gate patterning in already developed multi-gate field effect transistors (MuGFET) devices has been demonstrated.     

The structural and electrical properties of the SrTa2O6/In0.53Ga0.47As/InP system

The structural and electrical properties of SrTa₂O₆(SrTaO)/n-In_0.53GaAs_0.47(InGaAs)/InP structures where the SrTaO was grown by atomic vapor deposition, were investigated. Transmission electron microscopy revealed a uniform, amorphous SrTaO film having an atomically flat interface with the InGaAs substrate with a SrTaO film thickness of 11.2 nm. The amorphous SrTaO films (11.2 nm) exhibit a dielectric constant of ∼20, and a breakdown field of >8 MV/cm. A capacitance equivalent thickness of ∼1 nm is obtained for a SrTaO thickness of 3.4 nm, demonstrating the scaling potential of the SrTaO/InGaAs MOS system. Thinner SrTaO films (3.4 nm) exhibited increased non-uniformity in thickness. From the capacitance-voltage response of the SrTaO (3.4 nm)/n-InGaAs/InP structure, prior to any post deposition annealing, a peak interface state density of ∼2.3 × 10¹³ cm⁻² eV⁻¹ is obtained located at ∼0.28 eV (±0.05 eV) above the valence band energy (E_v) and the integrated interface state density in range E_v + 0.2 to E_v + 0.7 eV is 6.8 × 10¹² cm⁻². The peak energy position (0.28 ± 0.05 eV) and the energy distribution of the interface states are similar to other high-k layers on InGaAs, such as Al₂O₃ and LaAlO₃, providing further evidence that the interface defects in the high-k/InGaAs system are intrinsic defects related to the InGaAs surface.