SiC/Al2O3界面结构的同步辐射X射线掠入射衍射研究

采用固源分子束外延技术,以Al2O3为衬底,在1100℃下制备SiC薄膜。利用同步辐射X射线掠入射(GID)实验技术对生长的样品的界面结构进行了研究。结果表明,薄膜面内存在压应变,同时发现薄膜晶体质量在远离薄膜和衬底界面区会逐渐变好。GID和X射线衍射的摇摆曲线结果表明薄膜中镶嵌块的扭转大于倾斜,说明SiC薄膜在垂直方向的晶格排列要比面内更加有序。     

Si(111)衬底上3C-SiC的固源MBE异质外延生长

国内首次利用固源分子束外延(MBE)技术,在衬底温度为1100℃时,以Si(111)为衬底成功地外延生长出了3C-SiC单晶薄膜。通过X射线衍射(XRD)、拉曼光谱(Raman)以及原位反射高能电子衍射(RHEED)等手段研究了外延薄膜的晶型、结晶质量、外延膜与衬底的外延取向关系,并考察了薄膜制备过程中衬底的碳化对薄膜质量的影响。结果表明,外延膜与衬底晶格取向完全一致;碳化可以减小SiC和衬底Si之间的晶格失配、释放应力、引入成核中心,有利于薄膜单晶质量的提高;碳化温度存在最佳值,这一现象与成核过程有关。     

ZnO薄膜的同质外延生长及其结构表征

利用等离子体辅助分子束外延的方法在ZnO单晶衬底上制备了ZnO薄膜。利用X射线衍射(XRD)、同步辐射掠入射XRD和φ扫描等实验技术研究了ZnO薄膜的结构。XRD和φ扫描的结果显示同质外延的ZnO薄膜已经达到单晶水平。掠入射XRD结果表明ZnO薄膜内部不同深度处a方向的晶格弛豫是不一致的,从接近衬底界面处到薄膜的中间部分再到薄膜的表面处,a方向的晶格常数分别为0.3249,0.3258和0.3242 nm。计算得到ZnO薄膜的泊松比为0.156,同质外延的ZnO薄膜与衬底在a轴方向的晶格失配度为-0.123%。     

6H-SiC单晶表面ZnO薄膜的制备及其结构表征

利用脉冲激光淀积(PLD)技术在6H-SiC单晶衬底上制备了ZnO薄膜. 利用X射线衍射(XRD), 反射式高能电子衍射(RHEED)和同步辐射掠入射X射线衍射(SRGID)φ扫描等实验技术研究了ZnO薄膜的结构. 结果表明:在单晶6H-SiC衬底上制备的ZnO薄膜已经达到单晶水平, 不同入射角的SRGID结果, 显示了ZnO薄膜内部不同深度处a方向的晶格弛豫是不一致的, 从接近衬底界面处到薄膜的中间部分再到薄膜的表面处, a方向的晶格常数分别为0.3264、0.3272和0.3223nm. 通过计算得到ZnO薄膜的泊松比为0.504, ZnO薄膜与单晶6H-SiC衬底在平行于衬底表面a轴方向的实际晶格失配度为5.84%.     

基于InP衬底的应变和应变补偿的InGaAs／InAlAs材料的高分辨X射线衍射分析

高分辨率X射线衍射技术被用来分析基于InP衬底的应变的InGaAs和InAlAs单层材料和应变补偿的InGaAs/InAlAs超晶格材料.通过倒空间mapping得到的单层材料的错向角大约为10-3度,可以忽略不计.通过摇摆曲线得到了单层材料的组分和体失配度,接着单层材料的结果被用来分析在相同的条件下利用MBE技术生长的超晶格材料.利用倒空间mapping精确得到了超晶格的平均垂直失配度和各层的厚度,通过X射线模拟软件得到的超晶格材料的模拟曲线和实测曲线吻合的很好.     

Si(111)衬底上生长的立方MgxZn1-xO晶体薄膜

在国际上第一次采用电子束反应蒸发法在Si(111)衬底上生长了MgxZn1-xO晶体薄膜.能量色散X射线(EDX)特征能谱及X射线衍射(XRD)分析表明薄膜呈立方结构,薄膜的晶面取向依赖于生长温度,在200C温度下生长得到高度(200)取向的立方MgxZn1-xO薄膜,温度过高时得到多晶薄膜.对高度(200)取向的立方MgxZn1-xO薄膜的光荧光激发谱(PLE)分析表明其光学带隙为4.20eV,相对于MgO的带隙红移量为3.50eV.XRD分析还表明立方MgxZn1-xO薄膜与MgO衬底之间的晶格失配仅为0.16%.这使得高质量立方MgxZn1-xO/MgO多量子阱材料的制备成为可能.     

氧离子束辅助激光淀积生长ZnO/Si的研究

利用X射线衍射(XRD),X射线摇摆曲线(XRC)和X射线光电子能谱(XPS)分析方法对氧离子束辅助激光淀积生长的ZnO/Si异质结薄膜进行了分析.结果表明:用该法可生长出高度c轴单一取向ZnO薄膜,XRC的半高宽度(FWHM)仅为2.918°.表明此生长方法经优化,可生长出单晶质量很好的ZnO/Si薄膜.     

Si(111)衬底上生长的立方MgxZn1-x晶体薄膜

在国际上第一次采用电子束反应蒸发法在Si(111)衬底上生长了MgxZn1-xO晶体薄膜。能量色散X射线(EDX)特征能谱及X射线衍射(XRD)分析表明薄膜呈立方结构，薄膜的晶面取向依赖于生长温度，在200℃温度下生长得到高度(200)取向的立方MgxZn1-xO薄膜，温度过高时得到多晶薄膜。对高度(200)取向的立方MgxZn1-xO薄膜的光荧光激发谱(PLE)分析表明其光学带隙为4．20eV，相对于MgO的带隙红移量为3．50eV。XRD分析还表明立方MgxZn1-xO薄膜与MgO衬底之间的晶格失配仅为0．16％。这使得高质量立方MgxZn1-xO多量子阱材料的制备成为可能。     

锗/石墨/硅薄膜结构的制备及其性质分析

利用磁控溅射技术在单晶硅衬底上制备出具有Ge/石墨/Si结构的薄膜样品,然后把其放入快速热退火(RTA)炉中退火。扫描电子显微镜(SEM)测试表明,石墨过渡层的引入缓解了Si、Ge之间的晶格失配和热失配。X射线衍射(XRD)分析表明450℃是Ge薄膜晶化的临界衬底温度,750℃是使Ge薄膜RTA晶化程度明显提高的临界退火温度,30s是最佳退火时间。     

衬底温度对Si(111)衬底上MBE异质外延3C-SiC薄膜的影响

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上异质外延生长3C-SiC单晶薄膜, 通过RHEED、XRD、AFM、XPS等实验方法研究了衬底温度对薄膜结构、形貌和化学组分的影响. 研究结果表明, 1000℃生长的样品具有好的结晶质量和单晶性. 在更高的衬底温度下生长, 会导致大的孔洞形成, 衬底和薄膜间大的热失配使降温过程中薄膜内形成更多位错, 从而使晶体质量变差. 在低衬底温度下生长, 由于偏离理想的化学配比也会导致薄膜的晶体质量降低.     

Growth of 3C-SiC on Si(111) using the four-step non-cooling process

A modified four-step method was applied to grow a 3C-SiC thin film of high quality on the off-axis 1.5° Si(111) substrate in a mixed gas of C₃H₈, SiH₄ and H₂ using low pressure chemical vapor deposition. The modified four-step method adds a diffusion step after the carburization step and removes the cooling from the traditional three-step method (clean, carburization, and growth). The X-ray intensity of the 3C-SiC(111) peak is enhanced from 5 × 10⁴ counts/s (the modified three steps) to 1.1 × 10⁵ counts/s (the modified four steps). The better crystal quality of 3C-SiC is confirmed by the X-ray rocking curves of 3C-SiC(111). 3C-SiC is epitaxially grown on Si(111) supported by the selected area electron diffraction patterns taken at the 3C-SiC/Si(111) interface. Some {111} stacking faults and twins appear inside the 3C-SiC, which may result from the stress induced in the 3C-SiC thin film due to lattice mismatch. The diffusion step plays roles in enhancing the formation of Si-C bonds and in reducing the void density at the 3C-SiC/Si(111) interface.     

硅碳比对Si(111)表面SSMBE异质外延SiC薄膜的影响

利用固源分子束外延(SSMBE)生长技术, 在不同的硅碳蒸发速率比(Si/C)条件下, 在Si(111)衬底上生长SiC单晶薄膜. 利用反射式高能电子衍射(RHEED)、X射线衍射(XRD)、原子力显微镜(AFM)和傅立叶变换红外光谱(FTIR)等实验技术, 对生长的样品形貌和结构进行了研究. 结果表明, 在Si/C比(1.1:1.0)下生长的薄膜样品, XRDω扫描得到半高宽为2.1°; RHEED结果表明薄膜具有微弱的衍射环, 有孪晶斑点. 在Si/C比(2.3:1.0)下生长的薄膜, XRDω扫描得到的半高宽为1.5°, RHEED显示具有Si的斑点和SiC的孪晶斑点. AFM显示在这两个Si/C比下生长的样品表面都有孔洞或者凹坑, 表面比较粗糙. 从红外光谱得出 薄膜存在着比较大的应力. 但在Si/C比(1.5:1.0)下生长的薄膜样品, XRDω 扫描得到的半高宽仅为1.1°; RHEED显示出清晰的SiC的衍射条纹, 并可看到SiC的3×3表面重构, 无孪晶斑点; AFM图像表明, 没有明显的空洞, 表面比较平整. FTIR谱的位置显示, 在此Si/C比下生长的薄膜内应力比较小. 因此可以认为, 存在着一个优化的Si/C比(1.5:1.0), 在这个Si/C比下, 生长的薄膜质量较好.     

The epitaxial growth of (1 1 1) oriented monocrystalline Si film based on a 4:5 Si-to-SiC atomic lattice matching interface

Due to a huge lattice mismatch of about 20% theoretically existing between SiC and Si, it is difficult for growing monocrystalline Si/SiC heterojunction to realize the light control of SiC devices. However, based on a 4:5 Si-to-SiC atomic lattice matching interface structure, the monocrystalline Si films were epitaxially prepared on the 6H-SiC (0 0 0 1) substrate by hot-wall chemical vapor deposition in our work. The film was characterized by X-ray diffraction analysis with only (1 1 1) orientation occurring. The X-ray rocking curves illustrated good symmetry with a full width at half maximum of 0.4339° omega. A 4:5 Si-to-SiC atomic matching structure of the Si/6H-SiC interface clearly observed by the transmission electron microscope revealed the essence of growing the monocrystalline Si film on the SiC substrate.     

Structural and optical properties of high quality ZnO thin film on Si with SiC buffer layer

ZnO thin films are grown on Si substrates with SiC buffer layer using ion plasma high frequency magnetron sputtering. These substrates are fabricated using a technique of solid phase epitaxy. With this technique SiC layer of thickness 20-200 nm had been grown on Si substrates consisting pores of sizes 0.5-5 μm at SiC and Si interface. Due to mismatching in lattice constants as well as thermal expansion coefficients, elastic stresses have been developed in ZnO film. Pores at the interface of SiC and Si are acting as the elastic stress reliever of the ZnO films making them strain free epitaxial. ZnO film grown on this especially fabricated Si substrate with SiC buffer layer exhibits excellent crystalline quality as characterized using X-ray diffraction. Surface topography of the film has been characterized using Atomic Force Microscopy as well as Scanning Electron Microscopy. Chemical compositions of the films have been analyzed using Energy Dispersive X-ray Spectroscopy. Optical properties of the films are investigated using Photoluminescence Spectroscopy which also shows good optical quality.     

Si(111)衬底上HVPE GaN厚膜生长

在Si(111)衬底上,以MOCVD方法高温外延生长的AIN为缓冲层,使用氮化物气相外延(HVPE)方法外延生长了15Km的c面GaN厚膜.并利用X射线衍射(XRD)、光致发光谱(PL)、拉曼光谱(Raman)等技术研究了GaN厚膜的结构和光学性质.分析结果表明,GaN厚膜具有六方纤锌矿结构,外延层中存在的张应力较小,...     

Strain accommodation in Ga-assisted GaAs nanowires grown on silicon (111)

We study the mechanism of lattice parameter accommodation and the structure of GaAs nanowires (NWs) grown on Si(111) substrates using the Ga-assisted growth mode in molecular beam epitaxy. These nanowires grow preferentially in the zincblende structure, but contain inclusions of wurtzite at the base. By means of grazing incidence x-ray diffraction and high-resolution transmission electron microscopy of the NW-substrate interface, we show that the lattice mismatch between the NW and the substrate is released immediately after the beginning of NW growth through the inclusion of misfit dislocations, and no pseudomorphic growth is obtained for NW diameters down to 10 nm. NWs with a diameter above 100 nm exhibit a rough interface towards the substrate, preventing complete plastic relaxation. Consequently, these NWs exhibit a residual compressive strain at their bottom. In contrast, NWs with a diameter of 50 nm and below are completely relaxed because the interface is smooth.     

Effects of SiC buffer layer growth temperature on the residual strain of GaN/SiC/Si thin films

Effects of SiC buffer layers were studied on the residual strain of GaN films grown on 3C-SiC/Si (111) substrates. It was clearly observed by Raman scattering measurement that the residual strain of the GaN/Si is reduced by inserting the SiC intermediate layer. Furthermore, residual strain within the GaN/SiC/Si films decreased when the growth temperature of the SiC buffer layer decreased. It was proposed that the irreversible creep phenomenon occurs during the high temperature growth of SiC, affecting nature of the residual strain within the SiC and the GaN layers.     

Determining polytype composition of silicon carbide films by UV ellipsometry

A universal ellipsometric model is proposed that describes the optical properties of silicon carbide (SiC) films grown on Si substrates by the method of atomic substitution due to a chemical reaction between the substrate and gaseous carbon monoxide. According to the proposed three-layer model, Si concentration decreases in a stepwise manner from the substrate to SiC film surface. The ellipsometric curves of SiC/Si(111), SiC/Si(100), and SiC/Si(110) samples grown under otherwise identical conditions have been measured in a 1.35–9.25 eV range using a VUV-VASE (J.A. Woollam Co.) ellipsometer with a rotating analyzer. Processing of the obtained spectra in the framework of the proposed model allowed the polytype composition of SiC films to be determined for the first time. It is established that SiC grown on Si(111) is predominantly cubic, while SiC on Si(110) is predominantly hexagonal (with cubic polytype admixture) and SiC on Si(100) has a mixed polytype composition.