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Sn-Bi-Sb无铅焊料微观结构及性能 总被引:1,自引:0,他引:1
研究了Sn-(1.3~1.5)Bi-(0.4~0.6)sb无铅焊料的制备工艺和微观组织,并测试了钎料的相关物理、力学性能,阐述了焊料的力学性能与微观结构特征间的关系。试验测试结果表明:该焊料具有较高的强度和塑性,具有良好的润湿铺展性和机械加工性能。焊料微观结构由(Sn)、B(SbSn)第二相和(Bi)所构成,其抗拉强度为55.4MPa,延伸率为35.9%,扩展率为80.6%,熔点为226.9℃~234.4℃。 相似文献
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为改善Sn-0.7Cu-0.05Ni钎料抗氧化性差及溶铜速率快的问题,向Sn-0.7Cu-0.05Ni钎料中添加微量锗,研究了不同锗添加量(质量分数0.01%~0.10%)对SnCuNi钎料合金显微组织及性能的影响。结果表明,微量的锗能显著细化Sn-0.7Cu-0.05Ni钎料合金组织,抑制金属间化合物的生长,改善合金的组织分布,提高钎料的润湿性及力学性能。此外,锗的添加还能显著提高钎料的抗氧化性并降低溶铜速率,当锗的质量分数从0增至0.10%时,溶铜速率从0.117 m/s降至0.110 m/s。 相似文献
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《固体电子学研究与进展》2020,(2)
通过对共晶锡铅焊球与Ni/NiP UBM层扫描电镜界面微观组织观察和成分分析,研究了Sn-37Pb/Ni和Sn-37Pb/NiPUBM焊点界面反应特性。研究表明芯片侧界面IMC由Ni层到焊料的顺序为:靠近Ni层界面化合物为(Ni,Cu)_3Sn,靠近焊料侧化合物为(Cu,Ni)_6Sn_5;PCB板侧界面IMC包括靠近NiP层的NiSnP化合物和靠近焊料侧的(Cu,Ni)_6Sn_5化合物,NiSnP是由于Ni的扩散形成。PCB板侧NiP镀层中存在微裂纹缺陷,此裂纹缺陷会导致金属间化合物中产生裂纹,从而对焊点力学性能和可靠性产生不良的影响。 相似文献
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Y. J. Hu Y. C. Hsu T. S. Huang C. T. Lu Albert T. Wu C. Y. Liu 《Journal of Electronic Materials》2014,43(1):170-175
Various microstructural zones were observed in the solidified solder of flip-chip solder joints with three metal bond-pad configurations (Cu/Sn/Cu, Ni/Sn/Cu, and Cu/Sn/Ni). The developed microstructures of the solidified flip-chip solder joints were strongly related to the associated metal bond pad. A hypoeutectic microstructure always developed near the Ni bond pad, and a eutectic or hypereutectic microstructure formed near the Cu pad. The effect of the metal bond pads on the solder microstructure alters the Cu solubility in the molten solder. The Cu content (solubility) in the molten Sn(Cu) solder eventually leads to the development of particular microstructures. In addition to the effect of the associated metal bond pads, the developed microstructure of the flip-chip solder joint depends on the configuration of the metal bond pads. A hypereutectic microstructure formed near the bottom Cu pad, and a eutectic microstructure formed near the top Cu pad. Directional cooling in the flip-chip solder joint during the solidification process causes the effects of the metal bond-pad configuration. Directional cooling causes the Cu content to vary in the liquid Sn(Cu) phase, resulting in the formation of distinct microstructural zones in the developed microstructure of the flip-chip solder joint. 相似文献
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In this work we studied the initial microstructure and microstructural evolution of eutectic Au-Sn solder bumps on Cu/electroless
Ni/Au. The solder bumps were 150–160 m in diameter and 45–50 m tall, reflowed on Cu/electroless Ni/Au, and then aged at 200°C
for up to 365 days. In addition, Au-Ni-Sn-alloys were made and analyzed to help identify the phases that appear at the interface
during aging. The detailed interfacial microstructure was observed using a transmission electron microscope (TEM). The results
show that the introduction of Au from the substrate produces large islands of-phase in the bulk microstructure during reflow.
Two Au-Ni-Sn compounds are formed at the solder/substrate interface and grow slowly during aging. The maximum solubility of
Ni in the—phase was measured to be about 1 at.% at 200°C, while Ni in the-phase is more than 20 at.%. The electroless Ni layer
is made of several sublayers with slightly different compositions and microstructures. There is, in addition, an amorphous
interaction layer at the solder/electroless Ni interface. 相似文献
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J. Y. Tsai C. W. Chang C. E. Ho Y. L. Lin C. R. Kao 《Journal of Electronic Materials》2006,35(1):65-71
The microstructures of the eutectic Au20Sn (wt.%) solder that developed on the Cu and Ni substrates were studied. The Sn/Au/Ni
sandwich structure (2.5/3.75/2 μm) and the Sn/Au/Ni sandwich structure (1.83/2.74/5.8 μm) were deposited on Si wafers first.
The overall composition of the Au and the Sn layers in these sandwich structures corresponded to the Au20Sn binary eutectic.
The microstructures of the Au20Sn solder on the Cu and Ni substrates could be controlled by using different bonding conditions.
When the bonding condition was 290°C for 2 min, the microstructure of Au20Sn/Cu and Au20Sn/Ni was a two-phase (Au5Sn and AuSn) eutectic microstructure. When the bonding condition was 240°C for 2 min, the AuSn/Au5Sn/Cu and AuSn/Au5Sn/Ni diffusion couples were subjected to aging at 240°C. The thermal stability of Au20Sn/Ni was better than that of Au20Sn/Cu.
Moreover, less Ni was consumed compared to that of Cu. This indicates that Ni is a more effective diffusion barrier material
for the Au20Sn solder. 相似文献
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Jing-Feng Gong Chan P.C.H. Guo-Wei Xiao Lee R.S.W. Yuen M.M.F. 《Components and Packaging Technologies, IEEE Transactions on》2006,29(1):164-172
The effects of under bump metallurgy (UBM) microstructures on the intermetallic compound (IMC) growth of electroplated and stencil printed eutectic Sn-Pb solder bumps were investigated. The process parameters and their effects on UBM surface morphology and UBM shear strength were studied. For the electroplating process, the plating current density was the dominant factor to control the Cu UBM microstructure. For the stencil printing process, the zincation process has the most significant effect on the Ni UBM surface roughness and Ni grain sizes. In both processes, the good adhesion of UBM to aluminum can be obtained under suitable UBM processing conditions. Samples with different UBM microstructures were prepared using the two processes. The resulting samples were thermal aged at 85/spl deg/C, 120/spl deg/C, and 150/spl deg/C. It was observed that the Cu UBM surface roughness had larger effect on the IMC growth and solder ball shear strength than the Ni UBM surface roughness. The thickness of Cu/sub 3/Sn and Cu/sub 6/Sn/sub 5/ IMC depended strongly on the UBM microstructure. However, for Ni/Au UBM, no significant dependence was observed. More likely, the thickness of Au-Ni-Sn IMC near the IMC/solder interface was controlled by the amount of gold and the gold diffusion rate in the solder. Shear tests were performed after thermal aging tests and thermal/humidity tests. Different failure modes of different sample groups were analyzed. Electroless Ni UBM has been developed because it is a mask-less, low-cost process compared to electroplated Cu UBM. This study demonstrated that the process control was much easier for Ni UBM due to its lower reactivity with Sn material. These properties made Ni UBM a promising candidate for the lead-free solder applications. 相似文献
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Chin-Hung Kuo Hsin-Hui HuaHo-Yang Chan Tsung-Hsun YangKuen-Song Lin Cheng-En Ho 《Microelectronics Reliability》2013
The effects of minor Ni addition (0.05 wt.%) on the microstructures and mechanical reliability of the lead-free solder joints used in the pin through hole (PTH) components were carefully investigated using a scanning electron microscope (SEM), a field-emission electron probe x-ray microanalyzer, and a pull tester. The PTH walls (i.e., Cu) of printed circuit boards (PCBs) were coated with organic solderability preservative (OSP) or electroless nickel/immersion gold (ENIG) surface finish before soldering. During soldering, the pins of the electronic components were first inserted into the PTHs deposited with OSP or ENIG, and then joined using a Sn–3Ag–0.5Cu (SAC) solder bath through a typical wave-soldering process. After wave soldering, a rework (the second wave soldering) was performed, where an SAC or Sn–0.7Cu–0.05Ni (SCN) solder bath was employed. The SCN joints were found to possess a higher tensile strength than the SAC ones in the OSP case. The sluggish growth of Cu3Sn, along with few Kirkendall voids at the solder/Cu interface caused by minor Ni addition into the solder alloy (i.e., SCN), was believed to be the root cause responsible for the increase in the strength value. However, the mechanical strength of the PTH components was revealed to be insensitive to the solder composition in the alternative case where an ENIG was deposited over the PTH walls. The implication of this study revealed that minor addition of Ni into the solder is beneficial for the solder/Cu joints, but for the solder/Ni(P) joints. 相似文献
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Hiroshi Nishikawa Jin Yu Piao Tadashi Takemoto 《Journal of Electronic Materials》2006,35(5):1127-1132
The interfacial reaction between Sn-0.7mass%Cu-(Ni) solders and a Cu substrate was investigated to reveal the effect of the
addition of Ni to Sn-Cu solder on the formation of intermetallic compounds (IMCs). Sn-0.7Cu-xNi solders (x=0, 0.05, 0.1, 0.2
mass%) were prepared. For the reflow process, specimens were heated in a radiation furnace at 523 K for 60 sec, 300 sec, and
720 sec to estimate the interfacial reaction between the molten solder and Cu substrate. Then, for the aging process, some
specimens were heat-treated in an oil bath at 423 K for 168 h and 504 h. The cross sections of soldered specimens were observed
to measure the dissolution thickness of the Cu substrate and the thickness of the IMC and to investigate the microstructures
of IMC. The results showed that, just after the reflow process, the dissolution thickness of the Cu substrate increased with
the increase of Ni content in the Sn-0.7Cu-xNi solder and the thickness of the IMC between the solder and Cu substrate was
the minimum in the Sn-0.7Cu-0.05Ni solder. After the aging process, the IMC grew with the increase of aging time. In the case
of 0.05% Ni, the IMC thickness was the thinnest regardless of aging time. It is clear that 0.05% Ni addition to Sn-0.7Cu solder
very effectively inhibits the formation and growth of the IMC between solder and Cu substrate. Electron probe microanalysis
of the IMC showed that the IMC layer in the Sn-0.7Cu-Ni solder contained Ni, and the IMC was expressed as (Cu1−y
,Ni
y
)6Sn5. 相似文献
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Toshihide Takahashi Shuichi Komatsu Hiroshi Nishikawa Tadashi Takemoto 《Journal of Electronic Materials》2010,39(8):1241-1247
Pb-based solders are used as high-temperature solders in power semiconductor devices. Although the use of Pb is globally restricted,
alternative materials cannot replace the Pb-based solder. This study proposes that the Pb-based solder can be replaced by
Zn-Sn alloys. Die shear tests revealed that some Zn-Sn solder joints between Cu substrates had a higher shear strength between
300 K and 543 K than those between Fe-42Ni substrates. The microstructure of the Zn-Sn solder joints between Cu substrates
showed network microstructures consisting of a Zn phase and ε-CuZn5 phase and direct connection between the network microstructures and intermetallic compound layer. These morphologies of the
high melting phase should improve the shear strength even at the elevated temperature of 543 K. 相似文献
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The interfaces between electroless Ni-P deposit and Pb-Sn solder and Sn-Ag solder were formed by reflowing for different time
periods to examine their microstructures and microchemistry. It was found that the Pb-Sn solder interface is more stable than
the Sn-Ag solder interface. Sn-Ag solder reacts quickly with the electroless Ni-P deposit and forms nonadherent Ni-Sn intermetallic
compounds (IMCs). Pb-Sn solder reacts slowly and forms adherent Ni-Sn IMC. A P-rich Ni layer, revealed as a dark layer under
scanning electron microscopy (SEM), is formed on the electroless Ni-P deposit due to the solder reaction. For short reflow
times, this P-rich Ni layer consists of only Ni3P compound, but during prolonged reflow, new crystals of Ni2P, Ni5P4, and NiP2 are also found to be formed from the amorphous electroless Ni-P layer. 相似文献
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Jong-Hyun Lee Jong-Hwan Park Dong-Hyuk Shin Yong-Ho Lee Yong-Seog Kim 《Journal of Electronic Materials》2001,30(9):1138-1144
In this study, the effects of the under bump metallurgy (UBM) structure and Cu content in solders on the redeposition rate
of Au-containing ternary intermetallics at the solder/UBM interface were investigated. A UBM structure with a Ni diffusion
barrier, Au/Ni/Cu, appeared to promote the redeposition of ternary Au-containing intermetallics at the solder/UBM interface
of the ternary during the solid-state aging treatment and the Au-embrittlement of the solder interconnections. Copper added
to the eutectic Sn-Pb and Sn-Ag solders was observed to be very effective in retarding the redeposition by forming the ternary
intermetallics in solder matrices and preventing the Au-embrittlement. These phenomena were discussed with the microstructures
observed.
Jointly appointed by CAAM at POSTECH 相似文献
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Guh-Yaw Jang Jeng-Gong Duh Hideyuki Takahashi Szu-Wei Lu Jen-Chuan Chen 《Journal of Electronic Materials》2006,35(9):1745-1754
Sn-Ag-Cu solder is a promising candidate to replace conventional Sn-Pb solder. Interfacial reactions for the flip-chip Sn-3.0Ag-(0.5
or 1.5)Cu solder joints were investigated after aging at 150°C. The under bump metallization (UBM) for the Sn-3.0Ag-(0.5 or
1.5)Cu solders on the chip side was an Al/Ni(V)/Cu thin film, while the bond pad for the Sn-3.0Ag-0.5Cu solder on the plastic
substrate side was Cu/electroless Ni/immersion Au. In the Sn-3.0Ag-0.5Cu joint, the Cu layer at the chip side dissolved completely
into the solder, and the Ni(V) layer dissolved and reacted with the solder to form a (Cu1−y,Niy)6Sn5 intermetallic compound (IMC). For the Sn-3.0Ag-1.5Cu joint, only a portion of the Cu layer dissolved, and the remaining Cu
layer reacted with solder to form Cu6Sn5 IMC. The Ni in Ni(V) layer was incorporated into the Cu6Sn5 IMC through slow solid-state diffusion, with most of the Ni(V) layer preserved. At the plastic substrate side, three interfacial
products, (Cu1−y,Niy)6Sn5, (Ni1−x,Cux)3Sn4, and a P-rich layer, were observed between the solder and the EN layer in both Sn-Ag-Cu joints. The interfacial reaction
near the chip side could be related to the Cu concentration in the solder joint. In addition, evolution of the diffusion path
near the chip side in Sn-Ag-Cu joints during aging is also discussed herein. 相似文献