微型传感器在汽车中的应用

本文简要分析了目前微型传感器在汽车中的应用情况，并对下一步的发展趋势进行了预测。     

微型传感器在汽车中的应用

本文简要分析了目前微型传感器在汽车中的应用情况，并对下一步的发展趋势进行了预测。     

微型光扫描器在传感器中的应用

本文介绍日本立石公司技术本部中央研究所的后藤博史等人研究开发的小型光扫描装置(微型扫描器)及其在传感器中的应用。     

MEMS传感器在汽车电子中的应用

阐述了MEMS(微机电系统)的技术与市场特征,从加速度传感器、陀螺仪和压力传感器等多个方面,分析了MEMS传感器在汽车安全与舒适驾驶中的应用。     

微型数码相机应用中的CMOS传感器

现在,实现更高分辨率和更小尺寸的数码相机的有效途径,是在数码相机市场内引进CMOS图像传感器,与比较相似的CCD技术展开竞争。 CMOS的优势是能够利用标准生产线,能够在敏感阵列附近集成大量的数字电路,从而减少数码相机设计需要的集成电路的数量,而CCD则需要专门的硅制造工序,但CCD的信噪比目前在性能上仍占据上风,尤其是在微光条件下更是如此。不过,CMOS正在慢慢地缩小与CCD在这方面的差距。     

传感器技术在无人驾驶汽车中的应用研究

随着时代的不断发展,人们对于汽车电子化的发展越来越重视,同时对于传感器的研究也越来越深入.对于汽车电子控制系统而言,传感器具有非常重要的意义,对其的发展有促进作用.本文通过对传感器技术与原理和传感器技术在无人驾驶汽车中的应用进行阐述,来进行对传感器技术在无人驾驶汽车中的应用研究.     

微型传感器及纳米传感器

综述了微型传感器及内米传感器的发展现状，叙述了微型传感器技术的发展趋势及其关键技术，并介绍了微型传感器技术在军事领域中的应用情况。     

多孔硅微细加工及其在微型传感器中的应用（二）

多孔硅微细加工的压阻压力传感器 微型压力传感器是在60年代末出现的,微细加工技术就是从此开始发展的。上面所述的各向异性化学腐蚀、电化学腐蚀和硅片直接融结等都已用来制造微型压阻压力传感器。微型压阻压力传感器尚需解决的问题是制造工艺太复杂、生产成本太高以及不易制造高灵敏的微压传感器等。针对这种情况,本文     

Reliability aspects of microsensors and micromechatronic actuators for automotive applications

In modern cars microsensors and micromechatronic actuators play an essential and still increasingly important role as the interface between the vehicle with its complex functions of motor management, chassis systems, safety as well as comfort and convenience on the one hand and the respective electronic control units on the other hand. They have to fulfill their task in a harsh environment over the entire lifetime of an automobile. Therefore reliability aspects have moved more and more into the focus of engineering and research activities in microsystem technology. A methodical procedure is described that allows reliability issues to be approached efficiently. The implementation of the methodology is illustrated with real-life examples of reliability aspects of hot film mass air flow sensors, inertial sensors as well as piezoelectric actuators.     

Energy scavenging and power management in networks of autonomous microsensors

Networks of autonomous microsensors promise to revolutionize the way people interact with electronics, enabling ambient intelligence. In this paper we investigate different energy scavenging options in real applications to find out which devices are more suitable to power a microsensor having a volume of only 100 mm³. Photovoltaic cells are the most promising power generators when a power level of 100 μW is required. If the power consumption can be reduced to about 10 μW, MEMS-based vibration-driven scavengers and thermoelectric generators can also be used.

The paper presents as well a power management architecture that enables the use of a scavenger as power source, and discusses some consequences of the limited available volume on power electronics.     

MEMS技术现状及应用

微机电系统(MEMS)技术是一门新兴的技术,它将微电子技术和精密机械加工技术融合在一起,实现了微电子与机械的融为一体。近年来,对MEMS的技术发展、加工工艺及其产业化的研究也被越来越多的人所重视。文章介绍了MEMS的特点与技术发展现状、MEMS器件的类型及其功能,并以多层弯曲磁芯结构微执行器为例介绍了磁驱动微执行器工作原理与制作工艺过程。     

汽车电磁仿真技术与应用

随着汽车智能化和网联化的发展,对汽车电磁兼容（electromagnetic compatibility,EMC）设计提出了更高的要求.在这一背景下,需要加快提升汽车EMC仿真预测的设计方法和手段,将电磁仿真预测融入整车开发过程中,减少后期整改的时间和成本,以适应新趋势所提出的EMC需求.本文主要介绍了汽车电磁仿真国内外的发展现状,对基于FEKO软件的汽车电磁仿真方法、仿真过程中发现的问题进行了阐述.     

Electrochemical microsensors

A critical review of recent developments in electrochemical microsensors is presented. The main emphasis is on chemiresistors and potentiometric microsensors. Both types of sensors have reached a degree of considerable maturity. It appears that the main future thrust can be expected in development of microfabricated sensing arrays based on these two principles.     

Micromachined microsensors for manufacturing

The rapid development of microelectromechanical systems (MEMS) technologies in recent years has provided a high degree of spatial miniaturization and integration of electromechanical components, which enable integrated sensing and control in manufacturing. This article provides an overview of the state of the art of micromachined microsensors for the measurement of mechanical signals in the manufacturing industry for automobiles, manufacturing, medical equipment, environment, robotics, food, and other consumer products. Measurements of pressure, acceleration, and acoustic emission (AE) are the three physical quantities that are most encountered in industrial and manufacturing applications. Discussed are the major design parameters of such microsensors, such as dynamic range, sensitivity, resolution, and accuracy and provide a real-world application. Also discussed are the issues related to the spatial integration of signal processing, power supply, and wireless communication with the sensing elements, which are of direct relevance to the overall performance of the microsensors.     

光开关技术发展及应用

人们对光开关的研究巳有二三十年的历史，全光网络的发展，需要高速传输大量数据，光开关越来越受到重视。由于新的光开关技术不断涌现，光开关的规模化和集成化程度不断提高，为此介绍了光开关技术的发展现状及其应用。     

MOS integrated piezoresistive microsensors

A comparative performance analysis is reported that addresses different circuit configurations of MOS integrated piezoresistive microsensor. It is proposed that circuit configurations be evaluated in terms of two sensitivities to process-induced spread in circuit parameters as well as in terms of piezoresistive sensitivity. The sensitivities are calculated subject to circuit-parameter correlation.Translated from Mikroelektronika, Vol. 34, No. 1, 2005, pp. 65–71.Original Russian Text Copyright © 2005 by Dragunov.     

汽车试验场道路管理系统的设计与应用

信息化管理能大大减少人力与物力的支出。汽车试验场道路管理的需要出发,建立了基于C／S体系结构的信息管理系统。详细介绍了系统的体系结构,功能模块及系统特色,实现了可通用的试验场道路信息管理系统。     

Material characterization of fluorosilicone gels for automotive application

Fluorosilicone gel is commonly used in die passivation. This paper studies the characteristics of fluorosilicone gel applied on the manifold air pressure (MAP) sensor die. The cure mechanism and material characterization of the three types of gels were analyzed using differential scanning calorimeter (DSC), thermogravimetric analysis (TGA), and rheometer. The temperature and time relationships were derived for each material type. In the process of characterization, it was discovered that characterized material does not always behave as expected in the production confirmation run. It was found that the gel selected interacted with the thermoplastic packaging material hence leading to further findings of cure inhibitation. This paper concludes with the valuable lessons learnt from this material characterization project and explains the importance of these lessons learnt to actual manufacturing experience.