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1.
本文用介电分析法研究了树脂系统中固化剂含量对其固化过程中tgδ值的影响。经多次测试,发现tgδ-温度曲线上,固化终止点的tgδ值与固化剂含量呈抛物线关系,有最小极值。此最小机值的固化剂含量所对应的配方固化度最高。此结果可应用于树脂系统选取固化剂的最佳用量,亦可选取促进剂和稀释剂的最佳用量。此方法具有速度快、灵敏度高的特点。  相似文献   

2.
用介电分析法测试其固化终止点C点的tgδ值,其中有一点为最小值,与此最小值tgδ对应的固化剂含量则是最佳配比.用此法也可筛选其它组分.  相似文献   

3.
对不同配比的聚醚胺/酚醛胺-环氧树脂体系的力学性能进行了研究,并采用示差扫描量热法(DSC),在25~230℃范围内以不同的升温速率(5℃/rmin、10℃/min、15℃/min、20℃/min)研究了以聚醚胺/酚醛胺为固化剂的环氧树脂体系固化行为,对其不同升温速率下的固化度进行了分析,采用T-β外推法得出该体系的起始固化温度、峰顶固化温度和终止固化温度等固化工艺参数.  相似文献   

4.
在介电分析法研究中得出固化剂含量对tgδ值的关系曲线,用此方法进行树脂系统固化剂含量、促进剂含量、稀释剂含量的最佳配比的选择,具有速度快,灵敏度高等特点。  相似文献   

5.
溶液聚合BMI/DDM/ER树脂基绝缘复合材料的研究   总被引:1,自引:0,他引:1  
本文介绍了以单胺为封端剂,溶液聚合BMI/DDM/ER树脂配比对力学及电学性能的影响,研究了树脂的反应性,确定了树脂的固化工艺制度,测试了用该树脂和高硅氧纤维制备的复合材料的力学、电学性能.结果表明,该树脂能湿法成型,在120℃可进行固化反应,复合材料具有良好的机械性能与介电性能.在工频下tgδ为0.0044,在高频1MHz下tgδ为0.0051.它可用作宽频断、耐高温绝缘材料的基体.  相似文献   

6.
采用差示扫描量热法(DSC)研究了聚异氰酸酯/环氧树脂的固化过程,研究了不同配比对固化反应的影响、固化度与固化温度的关系,计算了固化反应表观活化能和反应级数,确定了聚异氰酸酯/环氧树脂胶粘剂的固化工艺。结果表明:胶粘剂中固化剂的含量对环氧树脂的固化反应过程有显著的影响,随着聚异氰酸酯含量的增加,固化放热量增加。当聚异氰酸酯的含量达到1.2份时,固化反应放热量达到最大值;在不同升温速率下,体系固化温度有很大差异,随着升温速率的提高,固化温度升高。通过动力学计算得到体系最佳固化温度为108℃,固化时间为6—8h,固化体系的活化能为43.31kJ/mol,反应级数为1.17。  相似文献   

7.
采用改性胺类潜伏性固化剂制备单组分环氧胶粘剂,并研究固化剂含量、增韧剂含量、填料种类、偶联剂种类对终产物的性能影响。结果表明,当固化剂含量为15%,增韧剂含量为15%,粉料选择硅微粉,偶联剂选择M110时,所得单组分环氧胶粘剂可在80℃×30min条件下固化,并且固化后产品性能最优。  相似文献   

8.
分别以4,4‘-二氨基二苯甲烷(DDM)和4,4‘-二氨基二苯砜(DDS)为固化剂,采用非等温差示扫描量热法(DSC)研究了E-44和E-51两种双酚A型环氧树脂的固化反应动力学。收集与分析了在25~350℃范围内分别以5、10、15、20℃/min的升温速率进行固化的反应参数,然后采用Starink法计算得到不同环氧固化体系的表观活化能。同时,借助各固化体系的动态流变性能,分析了双酚A型环氧树脂/芳香胺固化体系的固化反应机理,并选用双参数自催化模型计算了各固化体系的反应速率方程。研究结果表明:当环氧固化体系的固化剂不同时,采用DDM作为固化剂的环氧固化体系(E-44/DDM、E-51/DDM),其表观活化能均低于添加DDS固化剂的环氧体系;选用同种固化剂(DDM或DDS)时,E-51树脂体系的表观活化能均低于E-44树脂固化体系。反应速率方程结果显示,该双参数自催化模型与实际试验结果的吻合性良好,可用于描述双酚A型环氧树脂/芳香胺固化体系的固化历程。  相似文献   

9.
李建  黄志雄  孙忠登 《粘接》2011,(6):51-55
以2-乙基-4-甲基咪唑(2E4MI)为芯材、聚乙二醇(PEG-6000)为壁材,采用熔融喷雾法制备了一种环氧片状模塑料用微胶囊固化剂。对微胶囊进行了表征,对环氧树脂的固化行为进行了研究。研究表明,该胶囊固化剂中囊芯材料2E4MI的质量分数约为l3.7%。ESMC的最佳固化工艺确定为:101℃/10min+111℃/10min+150℃/10min+180℃/10min。微胶囊化固化剂中的PEG-6000壁膜在常温下可以阻止环氧树脂的固化,使ESMC树脂糊体系具有更好的室温贮存稳定性。固化剂的微胶囊化不会引起固化机理的变化。环氧树脂的固化度α可达0.93。  相似文献   

10.
通过转矩流变仪用E-12型环氧树脂和TC-125固化剂及其他助剂在90℃下熔融混合10min,然后在平板硫化机上冷压3min,最后经过球磨机粉碎制得环氧粉末涂料。制得的粉末涂料和漆膜经过差示扫描量热法和红外光谱分析.并讨论了固化剂用量、升温速率等对涂料性能的影响。结果表明:该粉末涂料可实现低温固化,固化条件为120℃下恒温固化35min;固化剂用量为28%时,涂膜的各项物理性能良好。  相似文献   

11.
为改善环氧树脂的介电性能及提升石英纤维的界面性能,使用缩水甘油醚基笼型倍半硅氧烷(G-POSS)和γ-氨丙基三乙氧基硅烷(KH-550)分别对环氧树脂和石英纤维进行改性.利用差示扫描量热法研究改性后环氧树脂的固化过程,并通过外推法确定了其固化工艺,根据固化工艺制备环氧树脂/石英纤维复合材料,分别对该复合材料的热稳定性、...  相似文献   

12.
Monitoring the reaction of an aromatic diamine cure agent with epoxy by fluorescence technique was used for cure characterization of the interphase in epoxy/glass and epoxy/carbon composites. The effect of the various surface treatments was first studied by the model interphase obtained by using a quartz plate for glass or a modified quartz plate for carbon surface. Aminosilane treated quartz cured faster and showed increased cure extent, while water aging and air oxidation showed almost no effect on the cure kinetics in comparison to the untreated quartz surface. For a model carbon surface, air oxidation showed a faster reaction only at the early stage of cure. The effects of the various surface treatments on glass or carbon fiber were also studied with the actual composites made by a thin coating of epoxy-diamine melt on glass or carbon fiber bundles. Epoxy/glass fiber composite showed a similar trend as the model interphase system. In the case of epoxy/carbon fiber composite, both air oxidation and water aging treatment showed a faster cure reaction at the early stage of cure. Furthermore, air oxidation treatment for the epoxy/carbon fiber composite showed somewhat increased cure extent. The reasons for these trends have been discussed. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 63: 1769–1775, 1997  相似文献   

13.
This paper presents a study of the cure of glass and graphite fiber epoxy composites using dielectric monitoring techniques. Initial results reported here deal with the neat resin and the relationship between its conductivity and corresponding changes in glass transition temperature during cure.  相似文献   

14.
玻璃纤维布增强EP/PPO复合材料性能及应用   总被引:3,自引:2,他引:1  
利用材料试验机、扫描电镜、高频微波仪及差示扫描量热仪研究了玻璃纤维布增强环氧树脂(EP)/聚苯醚(PPO)复合材料的弯曲性能、相态、介电性能和耐热性。结果表明,树脂含量对EP/PPO复合材料的弯曲强度和介电性能影响很大,在树脂质量分数约为40%时,复合材料的弯曲强度最大;当树脂质量分数大于30%时,介电常数的理论预测值与实验结果基本符合;硅烷偶联剂KH-550处理玻璃纤维布制得复合材料的弯曲性能较优;玻璃纤维布增强EP/PPO复合材料的热性能比纯EP/PPO树脂的热稳定性好。  相似文献   

15.
The curing of an epoxy prepolymer based on the diglycidyl ether of bisphenol A (DGEBA) with dicyandiamide (DDA) as the hardener and imidazole as the catalyst agent was analyzed using microdielectrometry, differential scanning calorimetry, viscosity measurements, and insolubles in THF for gel-point detection. Interpreting dielectric data with respect to chemorheology continues to be the subject of scientific discussion. The focus of this issue is to give an industrial point of view on the collected on-line dielectric measurements during an epoxy/fiber glass composite cure. Hence, isothermal polymerizations of DGEBA/DDA/imidazole resin were examined and dielectric properties such as ionic conductivity were related to the cure kinetics by conversion through an experimentally established equation. This mathematical model was used to predict reaction advancement of epoxy processing under nonisothermal cure conditions. This model is shown to be able to forecast both isothermal and nonisothermal cure data of unaged resin. According to these results, cure monitoring was carried out on prepregs. Whereas some deviations of the law were observed at the time of the last stage of the cure, good correlation was obtained for the reaction rate during the in-mold process curing time.  相似文献   

16.
玻璃纤维增强环氧基复合界面介电性能的研究   总被引:1,自引:0,他引:1  
通过介电性能试验和理论计算研究了偶联剂对玻璃纤维/环氧复合界面层介电性能的影响。对玻璃纤维经偶联剂处理前后表面自由能和浸润活化能等进行了研究分析,探讨了偶联剂对玻璃纤维/环氧复合界面介电性能的影响机制。  相似文献   

17.
Epoxy composites filled with glass fiber and organo‐montmorillonite (OMMT) were prepared by the hand lay‐up method. The flexural properties of the epoxy/glass fiber/OMMT composites were characterized by a three‐point bending test. The flexural modulus and strength of epoxy/glass fiber were increased significantly in the presence of OMMT. The optimum loading of OMMT in the epoxy/glass fiber composites was attained at 3 wt%, where the improvement in flexural modulus and strength was approximately 66 and 95%, respectively. The fractured surface morphology of the epoxy/glass fiber/OMMT composites was investigated using field emission scanning electron microscopy. It was found that OMMT adheres on the epoxy/glass fiber interface, and this is also supported by evidence from energy dispersive X‐ray analysis. Copyright © 2007 Society of Chemical Industry  相似文献   

18.
Because crack detection for laminated composites in‐service is an effective method for improving structural reliability, various nondestructive methods have been studied to detect cracks in laminated composites. A recent study on the damage monitoring of composite materials using the piezoelectric method, which uses the piezoelectric characteristics of polymeric materials for the matrix of composite materials, concluded that the piezoelectric method can be a useful, nondestructive method for the damage monitoring of glass fiber epoxy composites. The dielectric and piezoelectric properties of composites are the basic properties used for the analysis of electromechanical coupling systems, along with the mechanical properties. In this research, therefore, the electromechanical characteristics of unidirectional glass fiber epoxy composites as well as their electric and mechanical characteristics were investigated. The dielectric, piezoelectric, and mechanical properties of unidirectional glass fiber epoxy composites were measured experimentally with respect to the fiber orientation, and the relationship between the piezoelectric and mechanical characteristics of unidirectional glass fiber epoxy composites was analyzed. POLYM. COMPOS., 2011. © 2011 Society of Plastics Engineers  相似文献   

19.
通过双螺杆挤出机制备了聚丙烯/马来酸酐接枝聚丙烯/环氧树脂/玻璃纤维(PP/PP-g-MAH/EP/GF)复合材料,并研究了PP-g-MAH含量、EP含量及固化剂对复合材料力学性能的影响。结果表明,PP-g-MAH含量为10份,含有固化剂EP的含量为3份时,复合材料的综合力学性能最佳;与不加EP的复合材料相比,其拉伸强度、弯曲强度、冲击强度分别提高了41 %、47 %、86 %。扫描电子显微镜分析表明,EP的加入明显改善了GF和PP基体的黏结强度。  相似文献   

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