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1.
Characterization of NiCo composite silicides by 10 nm-Ni50Co50 alloy films with additional annealing
We fabricated 10 nm-Ni50Co50 alloy films into a single crystal and a polycrystalline silicon substrate, and applied silicidation annealing to these substrates
at 600 °C to 1100 °C for 40 s. To test the thermal stability of the processed silicide layers, we examined the change in their
physical properties after an additional 30-min annealing at the given rapid thermal annealing (RTA) temperatures. To characterize
the physical properties of the silicide layers, we used a four-point probe, an x-ray diffractometer (XRD), a transmission
electron microscope, a scanning electron microscope, an Auger electron spectroscope, and an atomic force microscope. The silicide
layer formed only through RTA showed low resistance (20 Ω/sq) at up to 1100 °C and 900 °C for the single crystal and for the
polycrystalline silicon substrate, respectively. Sheet resistance after the additional 30-min annealing was low, and did not
differ significantly before and after the additional annealing for the single crystal substrate, but it became high at all
temperatures for the polycrystalline substrate. The XRD confirmed the formation of the NiSi (or Ni(Co)Si) phase, in which
there were no changes after the additional annealing. The thickness of the RTA-formed silicide layers varied from 11 nm to
13 nm, 20 nm and 28 nm, depending on whether the temperature was 700 °C or 1000 °C, for both the single and the polycrystalline
substrates. The thickness of the silicide layers tended to increase from 22 nm to 25 nm, 48 nm and 82 nm after the additional
30-min annealing. Auger depth profiling also confirmed changes in thickness with the additional annealing. The surface roughness
was no greater than 10 nm in all cases, even with the additional annealing. We verified that the nano-silicide layer formed
with the proposed nano-NiCo alloy films satisfied the requirements for the nano-CMOS process. 相似文献
2.
采用强变形技术在金属间化合物Ni3Al表层制备了纳米晶,并对其进行了低温退火处理。采用X射线衍射仪、透射电镜和显微硬度计对变形态和退火态Ni3Al表层的相结构、晶粒形貌和显微硬度分布进行了研究。结果显示,350 ℃低温退火时,强变形时形成的fcc结构无序Ni固溶体重新有序化,部分转变为L12有序结构的Ni3Al相。退火后,纳米晶Ni3Al的晶粒尺寸没有明显长大,微观应变显著降低。退火后表层纳米晶的组织不均匀,细晶粒尺寸为10~20 nm,大晶粒尺寸仍小于100 nm。350 ℃退火后表层部分的显微硬度仍可达525 HV0.2,强变形的强化作用在低温退火后仍可保持。 相似文献
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A nanocrystalline layer was produced on the surface of Ni3Al intermetallic by means of surface mechanical attrition treatment. The surface nanocrystallites were annealed at 250-750 ℃ for 30 min. Microstructure evolution of nanocrystallites during annealing was studied by X-ray diffraction (XRD) and transmission electronic microscope (TEM). The experimental results show that long-rang order recovers rapidly when annealing temperature is below 250℃ and changes slowly at 350-550 ℃, and then it increases rapidly at 750℃. The grain size of nanocrystallites of Ni3Al keeps stable and crystal defects recover when they are annealed below 550℃. The grains grow normally in low temperature annealing and abnormal growth occurs at 750℃. 相似文献
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对溅射靶材用Cr20Ni80合金冷轧管材的微观组织和再结晶退火工艺进行了研究。首先观察了冷轧管材轴向与径向的微观组织变化;其次利用JMatPro计算了Cr20Ni80合金的相图,并设计了再结晶退火工艺;最后对冷轧管材进行了再结晶退火试验,表征了退火后管材的微观组织、晶粒尺寸和硬度。结果表明,冷轧管材沿轴向均为拉长晶,且存在大量孪晶;管材沿径向的微观组织中晶粒尺寸因形变量的增大而减小;当再结晶退火温度为690 ℃时,冷轧管材试样已开始发生再结晶;790 ℃×30 min时,形变晶粒已完全再结晶,平均晶粒尺寸为24.1 μm,为最优再结晶退火工艺;当退火温度进一步升高、保温时间进一步延长时,再结晶晶粒逐渐长大;试样的硬度随退火温度的升高而减小。 相似文献
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选择Ni和Ti粉末及其机械合金化粉末制备Ni/Ti扩散偶,利用扫描电镜和X射线衍射等手段研究了Ni/Ti扩散偶在固相热处理作用下金属间化合物的形成及生长规律.随着热处理温度的提高,Ni3Ti,Ti2Ni和NiTi金属间化合物的数量增加明显;随热处理保温时间的增加,NiTi金属间化合物呈抛物线规律生长,而对Ni3Ti和Ti2Ni的生长影响不大.结果表明,金属间化合物在形成过程中,Ni3Ti和Ti2Ni优先形成,达到一定厚度后,NiTi金属间化合物开始形成并快速增长. 相似文献
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通过铜辊甩带法制备了成分为Fe73.5-xSi13.5B9Cu1Nb3Nix(x=0、1、2、3)的非晶带材,并对其进行退火处理。利用XRD、DSC、VSM和软磁直流测试仪等对带材的相结构、热稳定性以及软磁性能进行测试分析。结果表明,所制备合金带材淬火态下均为完全非晶结构,经560 ℃保温60 min退火处理后,合金中形成了非晶和α-Fe(Si)纳米晶双相共存结构。随着Ni含量的增加,整体上非晶带材的一级起始晶化温度Ts1和二级起始晶化温度Ts2先减小后增大,两级起始晶化温度之差ΔTs整体呈下降的趋势,由166.0 ℃下降至132.8 ℃,热稳定性降低。淬火态下,Ni元素的添加使得非晶带材的软磁性能有所恶化。经退火处理后,带材的软磁性能明显提升,当Ni含量x=1时,具有较好的软磁性能,其饱和磁化强度为157.7 emu/g,矫顽力为6.8 Oe。 相似文献
7.
15 nm-Co/15 nm-Ni/p−Si (100) was thermally annealed using rapid thermal annealing for 40 s at 700∼1100°C. The annealed bilayer
structure developed into the composite CoNiSix and the resulting changes in sheet resistance, microstructure, and composition were investigated using a four-point probe,
transmission electron microscopy, Auger electron spectroscopy, and X-ray photoelectron spectroscopy. The final thickness of
the composite CoNiSix was approximately 100 nm and it maintained its sheet resistance below 5 Ω/sq after silicidation annealing at 1100°C. The
proposed CoNiSix silicides may be superior to conventional single phased silicides due to their improved thermal stability and thickness adjustment. 相似文献
8.
退火工艺对镍/铝复合带金属间化合物的影响 总被引:2,自引:0,他引:2
研究了镍/铝复合带的退火热处理工艺,探讨了退火温度和时间对复合界面上金属间化合物生长的影响.结果表明:退火中温度过高会使界面上生成较厚的金属间化合物,退火温度在450~460℃时,镍/铝复合带的综合组织性能较为理想.当达到一定的热力学条件后,金属间化合物首先在界面局部区域生成并迅速完成长大,随退火时间延长,各区域的化合物新生相沿界面连接为一个整体.延长退火时间对金属间化合物层的相组成和各相厚度影响不大.综合复合带组织与性能的要求,得到优选退火工艺为460℃退火1h. 相似文献
9.
A new method, microwave hydrogen plasma annealing of sputter-deposited titanium films on an Si (111) substrate, was used to
fabricate TiSi2 films. The films were characterized by x-ray diffraction, Auger electron spectroscopy, sputter depth profiling, and four-point
probe resistivity measurements. Polycrystalline TiSi2, dominated by components with (040) orientation, was grown at the annealing temperature of 800 °C. The microwave hydrogen
plasma was considered not only to provide the heat for the solid-phase reaction, but also to promote the solid-phase reaction
by enhancing atom mobility and diffusion. 相似文献
10.
Ni/Al复合涂层经200℃以上温度退火后,可在Ni层和Al层的交界处形成Al3Ni和Al3Ni2两个稳定相以及Al9Ni2亚稳相。随着退火温度的升高,复合涂层中Ni和Al晶粒的长大使得涂层的强度和硬度降低。摩擦系数从退火前的0.36减小为退火后的0.27,涂层摩擦性能改善的主要原因是由于金属间化合物相的产生。 相似文献
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为了满足高温热防护的需求,采用等离子喷涂技术制备Ni3Al复合涂层,并详细研究了涂层的组织结构、结合强度、热震性能及高温抗氧化性能。结果表明,由于Ni、Al粉体之间接触充分,喷涂过程中,完全反应生成了Ni3Al中间相,并放出大量的热,涂层与基体呈微冶金结合,结合强度较普通镍包铝涂层高30%~40%,并具有良好的抗热震性和高温抗氧化性能 相似文献
14.
在室温条件下采用Bc模式等通道挤压变形(ECAP)结合中间退火方法制备二元Al—7Mg合金。经6道次ECAP变形后,该材料硬度高达HV218。透射电镜(TEM)表征揭示该Al—7Mg合金的晶粒得到明显细化。经5或6道次变形后得到的超细晶组织平均尺寸为100~200nm。X射线衍射分析表明Mg主要以固溶原子的形式存在。因此,由于Mg偏析或析出相造成的可能强化影响均忽略不计。经6道次ECAP变形后的A1-7Mg合金的高硬度主要来自于晶界强化,大约占总强度的41%,其次,位错强化及Mg原子的固溶强化分别约占总强度的24%和35%。此外,通过测量硬度变化研究了该A1—7Mg合金的热稳定性。结果表明在250℃退火处理时该材料相对稳定,然而当温度升至300℃时,该Al—7Mg合金的软化趋势明显加快。 相似文献
15.
对热轧态280VK微合金高强钢经冷轧后取样,在不同温度下进行退火处理。对退火试样组织进行SEM、TEM、EBSD观察,以及析出物含量测定和力学性能测试分析,揭示退火工艺对冷轧高强钢组织结构、织构演变和力学性能的影响。结果表明,试验钢经退火处理后,基体中产生大量TiC析出粒子;随着退火温度升高,基体晶粒度减小,析出粒子尺寸增大但数量减少,屈服强度、抗拉强度降低,伸长率升高。热力学计算表明,试验钢中析出相的优先级顺序为TiN>AlN>TiC,析出相以TiC为主。 相似文献
16.
采用中频感应熔炼制备Nd0.75Mg0.25(Ni0.8Co0.2)3.5储氢合金,在0.03 MPa氩气氛围进行退火,退火温度分别为850,900和950 ℃,保温时间均为7 h。分别对合金的电化学性能、气态储氢性能和合金的微观结构进行研究。结果表明,合金在退火热处理前后的相组成没有发生明显变化,主相均为Ce2Ni7型(Nd,Mg)2(Ni,Co)7相和CaCu5型NdNi5相。合金中晶粒尺寸随着退火温度的升高而增大,相界面则减少,退火消除晶格应力、增加成分均匀性、增加储氢容量;同时有部分Mg在热处理过程中损失导致储氢容量的下降。900 ℃热处理使得Nd0.75Mg0.25(Ni0.8Co0.2)3.5合金表现出较好的储氢性能,最大电化学放电容量为359 mAh/g,合金电极在100次循环后容量保持率为90.3%,气态储氢容量达到1.65%(质量分数,下同)。 相似文献
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为了研究电热合金Cr20Ni80在热变形过程中的组织演变规律,在Gleeble-1500D热模拟试验机上对该合金进行了高温压缩试验,并绘制了变形温度为900~1220℃、应变速率为0.001~10 s-1条件下合金的真应力-真应变曲线,同时对热变形后的金相组织进行了分析。结果表明:在相同的温度下,流变应力与变形速率正相关;在相同的速率下,流变应力与变形温度反相关;Cr20Ni80合金在高温变形过程中,与应变速率相比其组织演变过程对温度更为敏感。在较高的温度下及低应变速率下,原子有充足的时间和足够的能量进行扩散,利于组织的演变,且能够改善合金内部因锻造而产生的流线分布。 相似文献
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为改善5083Al和304不锈钢爆炸焊接质量,提升隔热效果,本研究采用1060Al、TA1和Ni作夹层材料,制备了具有热传导梯度的五层爆炸复合板。为消除爆炸焊接后的残余应力,减少绝热剪切带和微裂纹等缺陷,采用550℃×60min退火工艺对五层爆炸复合板进行退火处理,并通过SEM、EBSD和万能试验机等手段,分析研究退火对其组织演化及力学性能的影响。结果表明:五层爆炸复合板的4个焊接界面均呈波形,且在界面处存在微裂纹、孔洞、绝热剪切带和漩涡区等缺陷。经退火处理,4个焊接界面均发生不同程度的再结晶,微裂纹、绝热剪切带等缺陷得到有效改善;5083Al/1060Al/TA1界面的β相和Al-Ti金属间化合物增多,TA1/Ni界面在原TiNi3熔化层的基础上新增TiNi熔化层和Ti2Ni熔化层。界面抗拉剪强度均有所降低,但均仍远高于相应国标使用要求;拉脱试样在5083Al/1060Al界面断裂分离。 相似文献