正极材料zLi2MnO3·（1-z）LiNi0.4Mn0.4Co0.2O2的合成与性能

富锂锰过渡金属层状正极材料以其成本低、安全、容量高受到广泛关注,X射线衍射（XRD）和电化学性能测试显示以共沉淀结合煅烧成功合成富锂层状正极材料zLi2MnO3.（1-z）LiMn0.4Ni0.4Co0.2O2（z=0.2,0.4,0.6）。其中z=0.4组分的放电容量达到210mAh/g（2-4.8V,0.05C）,远高于z=0.6组分,而经20个充放电循环的稳定性也优于z=0.2组分。微分容量分析表明z=0.2组分中因Ni/（Co＋Mn）比值较大和Li2MnO3含量较少可能导致其容量逐渐衰减。z=0.6则因所含LiMn0.4Ni0.4Co0.2O2量较少,造成其放电容量较低;z=0.4拥有最佳Li2MnO3及LiMn0.4Ni0.4Co0.2O2组合使其容量和循环性能最好。     

High damping in Fe-Ga-La alloys: Phenomenological model for magneto-mechanical hysteresis damping and experiment

Ferromagnetic high damping (FHA) alloys with a wide temperature range from-150 ℃ to 300 ℃ have unique application value in extreme environments.In the present work,the damping behaviors of Fe21Ga-xLa (x =0.12 wt.％,0.24 wt.％,0.47 wt.％,1.18 wt.％,and 2.33 wt.％La) alloys have been studied in detail,and a new phenomenoiogical model has been proposed.With the increase of La content,the Laves phase (LaGa2) in the matrix increases gradually,and the resistance opposing the domain movement increases as well.Combined with the results of synchrotron radiation X-ray diffraction,neutron diffraction,and magnetic domain observation,the resistance mainly comes from three parts: the average stress related to the lattice distortion of the matrix,the average stress related to the increasing area energy of domain walls (DWs),and the average stress related to the increasing demagnetization energy induced by the Laves phase.Different from the traditional method of reducing internal stress through annealing to improve the damping capacity,the proper internal stress barriers are necessary to Barkhausen jumps to dissipate energy.Therefore,proper doping to balance resistance and mobility of DWs is a reliable way to improve damping capacity.Meanwhile,for Fe-Al and Fe-Cr based Alloys,the new model also has a good fitting effect.This study provides a theoretical and experimental reference for improving the functional properties of ferromagnetic alloys.     

国内外搅拌摩擦焊用搅拌头的研究现状及发展趋势

本文概述了国内外搅拌摩擦焊用搅拌头在搅拌头材料开发、轴肩和搅拌针设计优化、搅拌头抗磨损破坏性等方面开展的工作进展。预测了搅拌头研究的未来发展趋势主要集中在低成本高性能搅拌头新材料和制造技术研发、搅拌头设计技术的改进和优化等。这将对我国搅拌摩擦焊行业的战略规划、技术研发、成果应用等工作的开展起到重要启示作用。     

Characterisation of quasi‐stationary temperature fields in laser welding by infrared thermography

In this work, high‐speed thermography is shown to effectively capture quasi‐stationary temperature fields during the laser welding of steel plates. This capability is demonstrated for two cases, with one involving the addition of a ferritic‐bainitic filler wire, and the other involving the addition of a low‐transformation‐temperature (LTT) filler wire. The same welding parameters are used in each case, but the temperature fields differ, with the spacing between isotherms being greater in the case where the low‐transformation‐temperature filler material is added. This observation is consistent with the differences in the extent of the heat‐affected zone in each sample, and the shape of the weld pool ripples on the weld bead surfaces. The characterization of temperature fields in this way can greatly assist in the development of novel methods for reducing residual stresses, such as the application of low‐transformation‐temperature filler materials through partial‐metallurgical injection (PMI). This technique reduces or eliminates tensile residual stresses by controlling the temperature fields so that phase transformations take place at the optimum times, and success can only be guaranteed through precise knowledge of the temperature fields in the vicinity of the welding heat source in real time.     

Advances in piezoelectric thin films for acoustic biosensors,acoustofluidics and lab-on-chip applications

Recently, piezoelectric thin films including zinc oxide (ZnO) and aluminium nitride (AlN) have found a broad range of lab-on-chip applications such as biosensing, particle/cell concentrating, sorting/patterning, pumping, mixing, nebulisation and jetting. Integrated acoustic wave sensing/microfluidic devices have been fabricated by depositing these piezoelectric films onto a number of substrates such as silicon, ceramics, diamond, quartz, glass, and more recently also polymer, metallic foils and bendable glass/silicon for making flexible devices. Such thin film acoustic wave devices have great potential for implementing integrated, disposable, or bendable/flexible lab-on-a-chip devices into various sensing and actuating applications. This paper discusses the recent development in engineering high performance piezoelectric thin films, and highlights the critical issues such as film deposition, MEMS processing techniques, control of deposition/processing parametres, film texture, doping, dispersion effects, film stress, multilayer design, electrode materials/designs and substrate selections. Finally, advances in using thin film devices for lab-on-chip applications are summarised and future development trends are identified.