Nd-Fe-B包晶合金定向凝固组织的研究

利用亚快速定向凝固设备制备Nd-Fe-B合金,并研究了其定向凝固组织.设计合金成分为:亚包晶成分(Nd10.8Fe83.8B5.4)、包晶成分(Nd11.76Fe82.36B5.88)和过包晶成分(Nd13.5Fe79.75B6.75).对抽拉速率在5～500μm/s范围内合金的定向凝固及微观组织的研究表明:三种成分Nd-Fe-B合金的最终凝固组织均由α-Fe枝晶相、包晶Nd2Fe14B相和富Nd相组成;随着抽拉速率的提高,α-Fe相的一次枝晶间距呈减小的趋势;三种成分凝固组织中的α-Fe相的体积分数随着抽拉速率的提高都表现出了先减后增的趋势,而Nd2Fe14B相的体积分数都表现出了先增后减的趋势.     

亚共晶Ni-Si合金的凝固组织特征研究

采用布里奇曼定向凝固技术制备了NiNi3Si亚共晶复合材料,系统地研究了Ni-Ni3Si亚共晶的定向凝固组织特征。在较低的凝固速率R=3μm/s时亚共晶成分的合金为规则的层片共晶组织。随着凝固速率的增大,当R=8μm/s时,平界面失稳,在第二相的旁边出现浅胞状组织。当R=25μm/s时在析出相的旁边出现了突起的胞状组织。当R=40μm/s时由于固液界面前沿的成分过冷逐渐增大,凝固组织生长成为典型的树枝晶组织。并根据"成分过冷"判据,评估了固液界面前沿的"成分过冷"的大小,理论计算与实验结果基本吻合。此外,根据BH模型计算和比较了α-Ni相的界面生长温度和共晶界面生长温度,证明较高速定向凝固下不太可能制备出全耦合生长的共晶组织。随凝固速率的增大,一次枝晶间距减小,组织细化。     

重力对Sn-20%Ni合金的初生相形态和包晶反应的影响

使用高度为50 m的落管研究了Sn-20%(质量分数) Ni包晶合金在重力和微重力作用下的凝固行为。用金相显微镜(OM)观察了合金的凝固组织并使用图像处理软件IPP(Image Pro Plus)统计了样品中的初生相、包晶相以及终凝相的含量,使用能谱仪(EDS)和X射线衍射(XRD)仪分析了样品凝固组织中的成分分布和组成相。结果表明,Sn-20%Ni包晶合金的凝固以初生相在固液界面前沿形核、枝晶生长和包晶反应的形式进行,重力对初生相的生成和包晶反应都有显著的影响,在微重力作用下的微观组织配比、分布以及合金元素的分布都与在重力作用下明显不同。在重力的作用下残余初生相的含量和残余初生相和包晶相的总量总是比在重力作用下的低,而包晶相的含量则总是比在微重力作用下的高。同时,样品中溶质元素的分布与残余初生相和包晶相的总量的分布趋势基本一致。结果表明,微重力环境有利于Sn-20%Ni合金初生相的形核和长大,而重力环境则促进包晶反应,其原因与重力导致的浮力对流和晶核沉积有关。     

合金成分对Mg-Zn-Y合金准晶形貌和体积分数的影响

利用铁模铸造法制备Zn/Y=6:1(原子比)的Mg-Zn-Y合金,通过XRD,SEM,EDS,TEM和DSC等研究合金成分对Mg-Zn-Y合金相组成、Mg_3Zn_6Y准晶相(准晶Ⅰ相)形貌和体积分数的影响。结果表明:Mg-Zn-Y合金的相组成、准晶Ⅰ相形貌、体积分数及其生成反应与合金成分密切相关。随着合金中Zn和Y元素含量的减少,准晶Ⅰ相的形成反应由单一的包晶反应到包-共晶反应再到完全共晶反应。当合金中Y含量≥7%(原子分数,下同)时,合金由(Mg, Zn)_5Y、准晶Ⅰ相、Mg_2Zn_3和Mg_7Zn_3相组成,且以叠层状形式分布在合金组织中。合金在凝固过程中通过包晶反应形成多边形块状准晶Ⅰ相;当Y含量<7%时,合金中除(Mg, Zn)_5Y、准晶Ⅰ相和Mg_7Zn_3相外,还析出了Mg相。当合金中Y含量在5%～7%时,准晶Ⅰ相通过包晶和共晶反应生成,以共晶反应为主。当Y含量≤4%时,准晶Ⅰ相完全通过共晶反应形成(Mg+I-phase)层片状共晶组织。所研究的合金中均生成了体积分数大于27%的准晶Ⅰ相,Mg₃₀Zn₆₀Y₁₀合金中准晶Ⅰ相的体积分数最高,约为77%。     

抽拉速度对Ti-48Al-8Nb合金定向凝固组织的影响

采用Bridgeman定向凝固设备成功制备了Ti-48Al-8Nb(原子分数,%)合金定向凝固试样,分析了不同抽拉速度对柱状晶形貌及过渡区、稳态区和淬火区凝固组织的影响。实验结果表明:在不同抽拉速度下,柱晶沿抽拉方向生长良好,柱状晶内部片层取向一致,与生长方向呈45°、90°夹角;当抽拉速度为8μm/s时,固液界面以胞状形貌向前推进,抽拉速度增大到15μm/s时固液界面开始向树枝状生长转化,随着抽拉速度进一步增大,二次枝晶间距逐渐变小,组织明显细化,片层间距显著减小;组织中与生长方向垂直的片层组织所占比例随抽拉速度增大而增加。     

Ni-Ni3Nb共晶合金跃迁变速定向凝固下的组织演化

为了研究非稳态凝固过程对共晶合金凝固组织的影响,在Ni-Ni3Nb共晶合金中采用跃迁变速的方法,研究了凝固组织的变化.研究结果表明:凝固速率从1μm/s跃迁到10μm/s时,共晶层片间距因Ni相分叉而发生细化,跃迁前后的层片间距满足λV1/2=18μm3/2s-1/2;从10μm/s跃迁减速到1μm/s时,共晶层片间距因Ni相合并而发生粗化,粗化过程在一个较长的凝固区域内进行;凝固速率从5μm/s跃迁加速到15μm/s时,部分Ni相失稳长大,而Ni3Nb相保持不变,导致合金凝固组织从规则共晶转变为非规则共晶.     

冷却速度对无铅焊料Sn-3.5Ag合金微观组织和显微硬度的影响

在～102K/s、～103K/s和～104K/s的冷速条件下研究了凝固速度对无铅焊料Sn-3.5Ag合金微观组织和显微硬度的影响.结果表明:由于非平衡凝固条件下动力学过冷的影响,导致了该共晶合金实际凝固过程开始于平衡共晶凝固点以下,合金凝固组织中包含初生β-Sn枝晶,且该初生β-Sn枝晶组织随合金凝固速度的提高而发生细化.另外,维氏硬度测试结果表明,无铅焊料Sn-3.5Ag合金在不同冷速条件下的凝固组织与显微硬度的关系符合经典Hall-Petch关系式,即初生β-Sn枝晶细化能显著提高焊料合金的显微硬度.     

过冷Fe-Co合金的包晶凝固

采用熔融玻璃净化法使Fe-Co包晶合金实现了深过冷快速凝固。当熔体过冷度较小时,Fe-Co包晶合金的凝固组织为典型的包晶组织。借助电子探针分析和DTA差热分析,证实了非平衡条件下Fe-Co包晶合金凝固过程中发生了包晶反应和包晶转变。研究表明,深过冷Fe-Co包晶合金的非平衡凝固过程从理论上可以划分为4个阶段:初生δ相的形核与生长、包晶反应、包晶转变和γ相的外延生长。     

深过冷Sb-Sn过包晶合金的快速凝固

采用落管无容器处理技术研究了Sb74.7Sn25.3二元过包晶合金的快速凝固,获得的合金粒子直径D介于70～1080μm之间。理论计算表明,随着粒子直径的减小,过冷度和冷却速率均呈指数关系增大,最大过冷度为298K(0.36TL)。研究发现,在自由落体条件下,快速凝固组织由初生Sb固溶体相和包晶SbSn金属间化合物相组成,Sb固溶体相以非小平面和小平面两种生长方式长大。当过冷度增大时,释放的熔化潜热增多,初生相逐渐细化,非小平面初生Sb相由"粗大枝晶"向"碎断枝晶"转变,当D<400μm时,一次枝晶臂显著变短,二次枝晶间距明显减小;同时发生溶质截留现象,初生Sb固溶体相中溶质Sn的固溶度发生了显著拓展,由ΔT=32K时的7.86%(原子分数,下同)线性增大至ΔT=298K时的10.47%。     

凝固速率对IN718合金定向凝固组织和偏析行为的影响

采用LMC高梯度定向凝固和微观分析方法,研究了不同凝固速率下IN718合金的凝固组织和偏析行为。结果表明,随着凝固速率的提高,凝固界面由胞晶转为枝晶;一次胞/枝晶间距在凝固速率为20μm/s时提高到最大值257μm,随后逐渐降低,二次枝晶间距明显细化,溶质分配比也随凝固速率的增加而减小。同时,凝固速率增加使糊状区枝晶骨架的渗透性减小,增大了对液体流动的阻碍作用。     

Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr

In the present work, effects of trace amount of Pr on the microstructure, wettability and mechanical properties of Sn-9Zn solder were studied. The range of Pr content in Sn-9Zn solder alloys varied from 0.01 to 0.25 wt%. Test results indicate that adding appropriate amount of Pr can evidently improve the wettability and mechanical properties of the Sn-9Zn solder alloy. The Sn-9Zn-0.08Pr solder shows the best comprehensive properties compared to other solders with different Pr content. At the same time, notable changes in microstructure were found compared with the Pr-free alloy. The needle-like Zn-rich phase in the Sn-9Zn solder was refined and became more uniform. Moreover, the thickness of the IMC layer at Sn-9Zn/Cu substrate was remarkably depressed with Pr addition.     

固溶体Mg-5Al-xGd合金的制备及其压缩性能EI北大核心

利用Gd(0.00%,0.25%,0.50%,0.75%,1.00%,质量分数,下同)元素和凝固压力(3 GPa)调控Mg-5Al合金凝固组织结构,对合金样品进行压缩测试,并研究组织结构与室温压缩性能相关性。结果表明:常压石墨型铸造下,仅Mg-5Al-0.75Gd合金获得了晶界无共晶相生成、粒状Al2Gd相弥散分布在基体上、晶粒平均尺寸约为85μm的固溶体组织,其抗压强度和最大压缩应变分别为379 MPa和33.46%,高于存在晶间第二相的合金。3 GPa高压下,Gd含量≤0.25%合金的凝固组织为单一固溶体,Gd含量≥0.50%合金的晶界(枝晶间)有共晶Al_(2)Gd相生成。固溶体Mg-5Al-0.25Gd合金的平均晶粒尺寸是74μm,抗压强度是402 MPa,最大压缩应变是33.61%。Mg-5Al-0.75Gd合金的平均晶粒尺寸是38μm,抗压强度和最大压缩应变分别是341 MPa和25.12%,其性能低于Mg-5Al-0.25Gd合金。可见,晶间Al,Gd元素的存在形式是影响铸造Mg-Al合金力学性能的重要因素。     

Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy

It is important, for electronic application, to decrease the melting point of Sn-5Sb solder alloy because it is relatively high as compared with the most popular eutectic Pb-Sn solder alloy. Adding Au or Ag can decrease the onset melting temperature （233℃） of this alloy to 203,5℃ and 216℃, respectively. The results indicate that the Sn-5Sb-i.5Au alloy has very good ultimate tensile strength （UTS）, ductility, and fusion heat, which are better than both those of the Sn-5Sb-3.SAg and Sn-5Sb alloys. The formation of intermetallic compounds （IMCs） AuSn4 and Ag3Sn enhanced the SbSn precipitates in the solidification microstructure microstructure stability, while retained the formation of thus significantly improved the strength and ductility For all alloys, both UTS and yield stress （σy） increase with increasing strain rate and decrease with increasing temperature in tensile tests, but changes of ductility are generally small with inconsistent trends.     

定向凝固Cu-0.33Cr-0.1Ti亚共晶合金中带状组织的形成机理

考察了Cu-0.33Cr-0.1Ti亚共晶合金在凝固速率为20μm/s下的定向凝固组织,利用SEM和EDS对带状组织的形貌和成分进行了分析,并从动力学、形核条件等方面探讨了带状组织形成的原因和机理。结果表明,该带状组织是由单相胞状α-Cu相与(α-Cu)+(β-Cr)共晶组织交替生长形成,带状组织的产生与定向凝固界面前沿的溶质分布有关,即主要受溶质浓度、有效溶质系数和凝固速率等因素的影响。     

Microstructures and phase selection in rapidly solidified Zn-Mg alloys

The Zn-Mg system has potential glass-forming ability, and therefore studies were made of rapidly solidified zinc-based Zn-Mg alloys containing up to 6 wt% Mg. These alloys exhibited interesting eutectic phase selections and structural transitions across the ribbon thickness which are represented on a microstructure selection diagram for rapid solidification conditions. Although rapid solidification is known in many cases to produce metastable phases, in this case the equilibrium eutectic mixtures of Zn-Mg₂Zn₁₁ are observed after rapid solidification, whereas the metastable eutectic mixture Zn-MgZn₂ forms under normal solidification conditions. However, in the melt-spun Zn-Mg alloy which is exactly at eutectic composition, three different structures are observed across the ribbon thickness. These three structures do not exist simultaneously in the same region, but structural transitions occur as the thickness increases from the wheel side to the free side. Eutectic and hypereutectic alloys show a tendency to form a metallic glass. In these alloys a critical growth velocity exists beyond which eutectic solidification is not possible, suggesting a possible transition from eutectic solidification to amorphous phase formation. The eutectic phase selection and the extent to which a specific microstructure is present depends on the variation in growth rate and solid-liquid interface stability during rapid solidification.[/p]     

Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders

Non modified and Ag-modified eutectic Sn-0.7Cu solder alloys were directionally solidified under transient heat flow conditions. The microstructure of the Sn-0.7Cu alloy has been characterized and the present experimental results include the cell/primary dendrite arm spacing (λ₁) and its correlation with: the tip cooling rate ( $\mathop T\limits^{ \bullet }$ ) during solidification, ultimate tensile strength (σ_u) and elongation to fracture (δ). Distinct morphologies of intermetallic compounds have been associated with the solidification cooling rate for both alloys examined. For the Sn-0.7Cu alloy, cellular regions were observed to occur for cooling rates lower than 0.9 K/s, being characterized by aligned eutectic colonies. On the other hand, the alloy containing 2.0 wt %Ag enabled the launch of tertiary branches within the dendritic arrangement. The comparison of results allows stating that finer solder microstructures are shown to be associated with higher ultimate tensile strengths (σ_u) for both alloys although a more complex microstructure was found for the SAC alloy. In contrast the elongation (δ) exhibited opposite tendencies. The growth of coarse Ag₃Sn fibers and platelets within interdendritic regions seems to contribute for the reduction on ductility observed for the SAC alloy.     

FMI-Ⅰ-600型钕铁硼真空速凝炉冷却强度对铸带组织的影响

采用Nd-Pr合金、工业硼铁、纯铁及海绵锆为原料,在不同的冷却速度下采用FMI-Ⅰ-600型真空速凝炉制备Re(Nd,Pr)FeB永磁合金铸带,分析了速凝薄带的厚度分布,采用扫描电子显微镜及能谱重点分析了铸锭的组织结构,从而确定了合理的冷却范围。本文在真空条件下加热1400～1450℃,氩气保护下在1.5～2.0m/s的冷却速度下获得的速凝薄片形成了完整的柱状晶,富稀土相均匀分散在主相周围,有效抑制α-Fe的生成。     

微量镨对Al-5Mg组织及室温和高温力学性能的影响

通过显微组织分析、室温及高温力学性能测试、XRD和SEM分析等方法,研究了稀土Pr对Al_5 Mg合金的显微组织、凝固区间和室/高温力学性能的影响。实验结果表明,Al_5Mg合金中加入稀土Pr使合金凝固区间变窄,细化了合金组织;Pr的加入净化了合金组织,减少了合金组织杂质缺陷,提高了合金性能;Pr的加入对合金有固溶和强化相强化作用,β-Al_(11)Pr_3强化相具有较高的高温稳定性能,提高了合金的高温性能。     

Bi-Pb-Sn-Cd易熔合金的设计与性能研究

根据铋基合金的特点与合金相图,设计了不同成分的Bi Pb Sn Cd易熔合金;并利用差热分析仪、X射线衍射仪及力学检测设备等研究了成分对合金熔点、组织和抗拉强度的影响。结果表明,设计的易熔合金由Bi、Pb7Bi3、Sn和Cd等物相组成;合金的熔点均在72℃左右。随Cd、Bi元素含量的增加,液相线温度逐渐降低;Cd元素对合金熔程、抗拉强度的影响最大,Sn元素次之,Pb元素的影响最小。正交试验表明,Bi 30Pb 15Sn 9Cd合金的综合性能最佳。     

Electrochemical corrosion behaviour of Sn-Zn-xBi alloys used for miniature detonating cords

Recently, Sn-Zn-Bi alloys have been reported to be the sheath material for miniature detonating cords, due to appropriate mechanical properties, ease of manufacturing, and low cost. Bi addition was found beneficial to the mechanical performance of Sn-Zn. However, limited information about the influence of Bi on the corrosion properties of Sn-Zn alloys has been provided. In this work, electrochemical corrosion behaviours of Sn-3Zn-xBi (x = 0, 1, 3, 5, 7 wt%) alloys were investigated using potentiodynamic polarization and electrochemical impedance spectroscopy (EIS) techniques, to explore the effects of Bi on the corrosion performance of Sn-Zn alloys. The corrosion mechanism of Sn-Zn-Bi alloys was analysed through microstructure examination on the surface of alloys after corrosion measurements. Results indicated that the addition of 1 wt% Bi increased the corrosion susceptibility of the Sn-3Zn alloy, mainly attributed to the coarsened and more uniformly distributed corrosion-vulnerable Zn-rich precipitates, while further increasing the Bi contents decreased the corrosion susceptibility of Sn-3Zn-xBi alloys due to the higher fraction of nobler Bi particles serving as anodic barriers. The Sn-3Zn-7Bi possessed the best corrosion resistance among all Sn-Zn-Bi alloys investigated. The role of Bi on corrosion was considerably discussed.