化学镀Ni-Cu-P合金工艺及性能研究

研究了化学镀Ni-Cu-P合金镀液组成及操作条件对镀层厚度及硬度的影响.筛选出了体系的最佳工艺条件,获得了82.391%Ni-10.298%P-5.297%Cu的合金镀层,其硬度在450～500HV之间.X射线衍射表明:Ni-Cu-P合金镀层在镀态下为非晶态结构,但镀层经400℃和600℃热处理后,其结晶区域有Ni3P、Cu3P等特征的衍射峰出现,表明镀层为晶态结构.此外,研究表明:镀层厚度随硫酸镍浓度、次亚磷酸钠浓度、镀液温度及pH值的升高而增加,随硫酸铜浓度、络合剂浓度的升高而降低.     

化学镀Ni-Cu-P镀液组成研究

应用正交设计方法，研究Ni-Cu-P化学镀液主要成分对化学沉积Ni-Cu-P合金镀层性能的影响。对Ni-Cu-P镀液体系进行了优化，获得了外观平滑、光亮和耐蚀性能好的Ni-Cu-P三元合金镀层。复合络合剂的加入有效抑制了铜的优先析出，获得了具有优异结合力的镀层。经X射线衍射分析可知，当镀液中硫酸铜的量小于0．5g/L时所得镀层为非晶态结构。     

铜含量对镁合金化学镀Ni-Cu-P镀层性能的研究

为研究镀液中不同铜离子含量对镁合金AZ91D化学镀Ni-Cu-P镀层性能的影响,采用硫酸镍为镍源,在镁合金化学镀Ni-P的镀液中加入不同含量的铜离子,可直接得到不同的Ni-Cu-P镀层,但都较均匀致密,结合力良好.经过耐醋酸腐蚀、磨粒磨损试验,结果表明:在硫酸铜含量为0.5g/L的镀液中获得的Ni-Cu-P镀层,较基体的耐蚀性提高了0.84倍,耐磨性提高了0.56倍.由此得出结论:镀液中硫酸铜含量为0.5g/L,所得到的镀层性能最佳.     

钢铁件化学镀Ni-Cu-P合金工艺研究

在酸性化学镀Ni-P合金镀液中加入硫酸铜和光亮剂,成功研制了一种钢铁件的全光亮化学镀Ni-Cu-P合金工艺,检测了镀液和镀层性能,探讨了主要成分和工艺条件对化学镀Ni-Cu-P合金镀层性能的影响.结果表明,所形成的Ni-Cu-P合金镀层结晶细致、光泽高,具有较高的装饰性,镀层耐蚀性、耐磨性和镀液稳定性优于酸性化学镀Ni-P合金工艺.     

铸造铝合金化学镀Ni-Cu-P性能研究

采用直接化学镀Ni-Cu-P工艺对ZL104合金的耐蚀和耐磨性能进行研究;与化学镀Ni-P二元镀层相比,利用恒电位仪、扫描电镜和显微硬度计等分析测试手段研究了镀层的性能。结果表明:Ni-P-Cu三元合金镀层的耐蚀性、硬度、耐磨性等性能都优于Ni-P合金镀层,对ZL104合金起到了更好的保护作用。     

镁及其镁合金化学镀Ni-Cu-P三元合金沉积工艺的研究

本文研究了镁及镁合金的化学镀Ni-Cu-P工艺,找出了最佳的镀覆条件,并对镀层的组织结构及性质进行了测试,所得的Ni-Cu-P三元非晶态镀层结合力好,并具有良好的导电性和耐蚀性能。     

化学镀Ni-P和Ni-Cu-P合金耐蚀性研究

研究了硫酸铜加入量对化学镀Ni-Cu-P合金的镀层成分、组织及热稳定性影响,用中性盐雾实验和在20%H2SO4+20 g/LAl2O3溶液中的冲刷腐蚀实验研究了Ni-P与Ni-Cu-P合金的耐蚀性和耐冲刷腐蚀性能.结果表明,Ni-Cu-P合金镀层具有比Ni-P合金镀层更好的热稳定性、耐蚀性和耐冲刷腐蚀性能.     

镁合金化学镀Ni-Cu-P/Ni-P复合镀层及腐蚀防护机理研究

目的为提高镁合金化学镀Ni-P合金镀层的腐蚀防护性能。方法在AZ31B镁合金表面,先化学镀Ni-Cu-P,再化学镀Ni-P,制备Ni-Cu-P/Ni-P复合镀层。研究复合镀层的表面形貌、成分、厚度和腐蚀电流密度随镀液硫酸铜浓度的变化规律,表征1.0 g/L硫酸铜质量浓度下,复合镀层的截面形貌、成分和晶态结构。结合动电位极化曲线和盐雾试验,分析复合镀层的耐蚀性能和腐蚀防护机理。结果复合镀层中的铜含量随硫酸铜浓度的增加而升高,铜对复合镀层的结构和性能影响很大。通过抑制镀层表面胞状物的生长和增加形核点数量,铜的共沉积能够大幅提高复合镀层的致密性。随硫酸铜浓度的增加,样品表面的催化活性下降,镀液稳定性升高,由此导致复合镀层的厚度随硫酸铜浓度的增加而明显下降。硫酸铜质量浓度为1.0 g/L时,复合镀层均匀致密,并具有可钝化性,按照ISO 9227,其耐盐雾腐蚀时间超过180 h。结论化学镀Ni-Cu-P/Ni-P复合镀层能够赋予镁合金表面优异的耐蚀性能,复合镀层所具有的可钝化性和均匀致密的镀层结构,是镀层腐蚀防护性能提升的主要原因。     

化学镀Ni-Cu-P合金工艺研究

通过实验数据及图表论述了化学镀 Ni- Cu- P的工艺条件 ,探讨了镀液的主要组成成分、镀液的 p H值、施镀时间对镀层中 Ni、Cu、P质量百分含量、镀层的沉积速度的影响 ,总结随工艺参数变化镀层成分变化的趋势及规律     

NdFeB磁性材料化学镀Ni-Cu-P合金沉积过程分析

通过SEM观察Ni-Cu-P合金沉积过程的形貌,提出了Ni-Cu-P非晶态合金镀层形核与长大过程的沉积模型.结果表明:初期沉积过程具有明显的择优倾向和不均匀性,原子并非以单个原子的形式沉积于基体表面,而是还原后的原子在固-液界面处首先形成原子团,然后在基体表面的高能量区域优先沉积,并开始形核且以不规则形态长大;在施镀后期,随着P含量的不断增加,镀层形貌逐渐由不规则形态变为规则胞状形态,直至形成光滑平整的非晶态镀层.     

络合剂对铝基化学镀Ni - Cu -P合金性能的影响

本试验研究了酒石酸钾钠对铝基化学镀Ni - Cu -P合金性能的影响.结果表明,镀屡沉积速率、镀层显微硬度及耐腐蚀性能均随酒石酸钾钠含量的增加先增大后减小;酒石酸钾钠最佳质量浓度为10g/L时,沉积速率高达1.78×10-3g/(cm2·h),显微硬度为415HV,自腐蚀电位为-0.581V,自腐蚀电流为1.389e-6A,此时镀层综合性能最好.酒石酸钾钠浓度为10g/L时,得到的镀层光滑致密,沉积颗粒均匀,综合性能良好.成分分析可知,镀层各成分的质量分数分别为W(Ni)84.01％,W(Cu)4.71％,W(P) 11.28％.     

化学镀及腐蚀时间对镍铜磷镀层成分组织性能影响

采用扫描电子显微镜(SEM)和能谱仪(EDS)研究了化学镀及腐蚀时间对镍铜磷镀层组织和耐蚀性影响。结果表明,延长化学镀时间,镍铜磷镀层由球形颗粒逐渐转变为等轴状和长条形胞状组织,镀层中镍、磷含量按对数规律增大,铜含量在化学镀10 min时达到最大;随腐蚀时间延长,镀态镍铜磷腐蚀速率按线性规律增大,热处理态镍铜磷腐蚀速率具有极小值;长时间腐蚀后,镀态镍铜磷镀层表面呈"菜花状",热处理态镍铜磷表面为多孔结构,腐蚀时间对化合物膜成分影响较小;镍铜磷的腐蚀电流密度随腐蚀时间延长而增大,阻抗值则减小。     

高效加工硬质合金沉孔用新型金刚石工具与工艺研究

介绍了一种加工硬质合金沉孔用新型金刚石工具与加工工艺。采用电镀和烧结金刚石磨头在数控铣床上,以螺旋进刀的加工方式,在不同进刀量和进给速度条件下,研究加工效率和磨头寿命的关系;研究不同尺寸、槽型的电镀和烧结金刚石磨头对不同材质的硬质合金沉孔的加工效率和沉孔精度等的影响;并采用扫描电镜（SEM）和光学显微镜分析金刚石磨头的显微组织。结果表明:与电镀金刚石磨头相比,烧结金刚石磨头具有更好的使用寿命和加工效率,将传统硬质合金沉孔（φ13 mm×5 mm）每孔的加工时间由2 h缩短为10~15 min,且每只磨头的打孔寿命约为33~42个。该研究有望进一步增大硬质合金等硬脆带孔材料的应用范围。      

Using electroless plating Cu technology for TFT-LCD application

This study investigates the feasibility of using electroless plating (ELP) technology to manufacture copper (Cu) gate electrodes in thin film transistors (TFTs). The problem of poor adhesion between Cu and glass substrates is overcome by introducing ELP nickel-phosphorus (NiP) layers. Copper pattern formation with a desired taper can be self-aligned subsequently on a NiP layer without any layer etching process. ELP Cu film shows an obvious (111) preferred orientation, which may enhance the electrode's anti-electromigration ability. The electrical characteristics of the ELP Cu gate TFT are also similar to those of the sputter-deposited Cu gate TFT.     

Preparation of nickel-coated tungsten carbide powders by room temperature ultrasonic-assisted electroless plating

In this paper nickel (Ni)-coated tungsten carbide (WC) composite powders have been synthesized by ultrasonic-assisted electroless plating with a simplified pretreatment at room temperature as the conventional sensitization and activation steps have not been employed. The growth mechanism of Ni layers and surface morphologies and composition of initial WC powders, pretreated WC powders and Ni-coated WC powders were analyzed by field emission scanning electron microscopy, and energy dispersion spectrometry. The results shows that uniform Ni-coated WC composite powders were successfully synthesized without conventional sensitization and activation steps by ultrasonic-assisted electroless plating at room temperature. The growth mechanism of Ni layers appears as follows: the surfaces of pretreated WC powders appear step-like defects which act as activated sites. Nucleation and the growth of nickel grains take place on the activated sites of pretreated WC powder, and the process repeats continuously on the lath particles with reticulate structure on the as-coated surfaces of previously deposited Ni-cells, finally Ni cells grow up and merge into a layer.     

国产无压机分球式超高压装置用硬质合金顶锤的研究

介绍无压机分球式超高压装置（BARS——俄文的首字母БАРС=Беспрессовая Аппаратура высокого давления "Разрезная Сфера"）合成宝石级金刚石的基本原理,分析BARS装置用硬质合金顶锤的功能特性,论述国产BARS装置用硬质合金顶锤成功工业化应用的研究过程。研究表明:选用WC-Co细颗粒复合粉,并采用搅拌球磨、冷等静压压制和低压烧结等综合技术,能提高细晶粒材料的组织结构均匀性、抗压强度及弹性模量,满足顶锤高强度、高刚性的使用需求。同时,采用在磨削中互为基准的工艺方案,控制产品上下同轴线是自定位顶锤合理的加工方案;选用粒度号M22/36的砂轮做精磨砂轮,合理的进刀量是保证加工精度的关键。      

Magnetic performance and corrosion resistance of electroless plating CoWP film

The CoWP film with good magnetic performance and corrosion resistance was electrolessly plated from alkaline solution. The technical parameters of the electroless plating system were optimized. When the pH value of electroless plating solution was 11.0 and the reducing agent (NaH2PO2) content was 0.4 mol L 1, the target chemical reactions proceeded in the electroless plating solution smoothly with negligible interference and side effects. CoWP film prepared under optimal deposition condition contained more hexagonal close-packed (hcp) cobalt (ε-Co) of [110] and crystallographic orientation of Co [002]. VSM analysis reveals that the saturation magnetization of the CoWP film is 100～220 Am2 kg 1 and coercivity is (2.87～4.38)×104 A·cm 1. The corrosion behavior of CoWP film in 3.5% NaCl aqueous solution was studied by electrochemical experiments. The results prove that the corrosion resistance of the CoWP film deposited under the optimal depo-sition condition exhibites relatively lower corrosion current of (3.054～3.162)×10 6 A·cm 2. The surface morphology analysis indicates that the film is smooth and composed of regular-shaped crystallites.     

Combinatorial performance characteristics of agitated nickel hypophosphite electroless plating baths

In this article, we present the combinatorial performance characteristics of agitated sodium hypophosphite electroless plating baths. Various performance characteristics assessed include bath conversion, plating efficiency, selective conversion, metal film thickness, average pore size, effective porosity and percent pore densification (PPD). Bath agitation was brought forward by rotating a symmetric disk shaped porous ceramic substrate with a nominal pore size of 275 nm. The plating characteristics were investigated for wide range of nickel solution concentrations (0.04-0.16 mol/L), stirrer speed (0-200 rpm) and for two different loading ratios (defined as substrate surface area per unit volume of plating solution) values (196 and 393 cm²/L). It was evaluated that stirring had a profound effect on sodium hypophosphite based electroless nickel baths, which are characterized with lower conversions (10-39%) and higher plating efficiencies (62-99%) without stirring phenomena. The stirred plating baths provided about 20-56% excess nickel plating rate when compared to the baths without stirring. This lead to a reduction in average membrane pore size by 20-42 nm and an enhancement in percent pore densification values by about 2-7%. Further, higher concentrations as high as 0.16 mol/L have been found to be detrimental to reduce the metal plating efficiency to lower values (42%). Observed data trends confirm upon the urgent need to identify suitable mass transfer enhancement techniques that target enhancement in selective conversion while providing good values of plating efficiency and PPD.     

硬质合金轧辊在轧钢生产中的应用

为了满足用户对轧辊寿命和性能不断提高的要求 ,研制了含有较高和较低粘结相的硬质合金轧辊 ,并开发出复合硬质合金 (CIC)专利技术 ,应用于棒材、线材、无缝钢管及其他小型材生产 ,不仅具有良好的可加工性 ,而且寿命是普通铸铁轧辊的 2 0倍以上