12位80MHz采样率具有梯度误差补偿的CMOS电流舵D/A转换器实现

提出了一种12位80 MHz采样率具有梯度误差补偿的电流舵D/ A转换器实现电路.12位DAC采用分段式结构,其中高8位采用单位电流源温度计码DAC结构,低4位采用二进制加权电流源DAC结构,该电路中所给出的层次式对称开关序列可以较好地补偿梯度误差.该D/ A转换器采用台湾U MC 2层多晶硅、2层金属(2 P2 M) 5 V电源电压、0 .5μm CMOS工艺生产制造,其积分非线性误差小于±0 .9L SB,微分非线性误差小于±0 .6 L SB,芯片面积为1.2 7mm×0 .96 m m ,当采样率为5 0 MHz时,功耗为91.6 m W.     

8bit 80MHz采样率具有梯度误差补偿的温度计码D/A转换器实现

提出了一种8bit 80MHz采样率具有梯度误差补偿的温度计码D/A转换器实现电路,该电路中所给出的层次式对称开关序列可以较好地补偿梯度误差,该D/A转换器采用台湾UMC 2层多晶硅,2层金属,5V电源电压,0.5μm CMOS工艺生产制造,其积分非线性误差以及微分非线性误差均小于0.5LSB,芯片面积为1.275mm×1.05mm,当采样率为50MHz时,功耗为56mW。     

10bit 200MHz采样率具有梯度误差补偿的CMOS视频D/A转换器实现

提出了一种10bit 200MHz采样率具有梯度误差补偿的CMOS视频D/A转换器实现电路。采用分段式结构,利用层次式对称开关序列消除由热分布不均所引起的对称误差。该DAC集成在一款视频自适应均衡芯片中,整个芯片采用Charted 3.3V电压、0.35μm CMOS工艺生产制造。DAC的面积为1.26mm×0.78mm,工作在4Fsc(14.318MHz)采样频率时,其有效数据比特为9.3个,其积分非线性误差和微分非线性误差均小于±0.5LSB。     

一种CMOS视频D/A转换器的设计与应用

提出了一种10位200 MHz CMOS电流舵视频D/A转换器(DAC)实现电路。权衡线性度、功耗、面积以及弱化毛刺等因素,该DAC的高6位采用单位译码矩阵,低4位采用二进制加权阵列。采用新型开关策略,进一步提高单位译码矩阵的线性度;设计带平滑电路的电流源与差分开关电路,以提高动态性能。整个芯片采用新加坡特许半导体公司3.3 V工作电压、0.35μm2P2M CMOS工艺制造。DAC的面积为1.26 mm×0.78 mm,其积分非线性误差和微分非线性误差均小于±0.2 LSB。     

一种1.8V 10位120MS/s CMOS电流舵D/A转换器IP核

采用低摆幅低交叉点的高速CMOS电流开关驱动器结构和中心对称Q2随机游动对策拓扑方式的pMOS电流源阵列版图布局方式,基于TSMC 0.18靘 CMOS工艺实现了一种1.8V 10位120MS/s分段温度计译码电流舵CMOS电流舵D/A转换器IP核.当电源电压为1.8V时,D/A转换器的微分非线性误差和积分非线性误差分别为0.25LSB和0.45LSB,当采样频率为120MHz,输出频率为24.225MHz时的SFDR为64.9dB.10位D/A转换器的有效版图面积为0.43mm×0.52mm,符合SOC的嵌入式设计要求.     

一种1.8V 10位120MS/s CMOS电流舵D/A转换器IP核

采用低摆幅低交叉点的高速CMOS电流开关驱动器结构和中心对称Q2随机游动对策拓扑方式的pMOS电流源阵列版图布局方式,基于TSMC 0.18靘 CMOS工艺实现了一种1.8V 10位120MS/s分段温度计译码电流舵CMOS电流舵D/A转换器IP核.当电源电压为1.8V时,D/A转换器的微分非线性误差和积分非线性误差分别为0.25LSB和0.45LSB,当采样频率为120MHz,输出频率为24.225MHz时的SFDR为64.9dB.10位D/A转换器的有效版图面积为0.43mm×0.52mm,符合SOC的嵌入式设计要求.     

高速12位D/A转换器

介绍了高速12位D/A转换器的电路设计,采用2μm等平面高速双极工艺,研制出数据更新率≥80MHz,线性误差≤3LSB,微分非线性≤3LSB的12位D/A转换器电路.     

高速12位D/A转换器

介绍了高速12位D/A转换器的电路设计,采用2μm等平面高速双极工艺,研制出数据更新率≥80MHz,线性误差≤3LSB,微分非线性≤3LSB的12位D/A转换器电路.     

高速12位D/A转换器

介绍了高速12位D/A转换器的电路设计，采用2μm等平面高速双极工艺，研制出数据更新率≥80MHz，线性误差≤3LSB，微分非线性≤3LSB的12位D/A转换器电路.     

Nyquist电流型7位20MHz采样率CMOS数模转换器

介绍了一种高速7位DAC的设计及芯片测试结果,该DAC选取高5位单位电流源,低2位二进制电流源的分段结构。考虑了电流源匹配、毛刺降低以及版图中误差补偿等方面的问题来优化电路。流片采用0.35μmChartered双层多晶四层金属工艺,测试结果表明在20 MH z的采样频率下,微分非线性度和积分非线性度分别小于±0.2 LSB和±0.35 LSB。该DAC的满幅建立时间是20 ns,芯片面积为0.17 mm×0.23 mm。电源电压为3.3 V,功耗为3 mW。     

Performance improvement in tensile-strained In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As metamorphic HEMT

This paper proposes a In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As (x=0.3-0.5-0.3) metamorphic high-electron mobility transistor with tensile-strained channel. The tensile-strained channel structure exhibits significant improvements in dc and RF characteristics, including extrinsic transconductance, current driving capability, thermal stability, unity-gain cutoff frequency, maximum oscillation frequency, output power, power gain, and power added efficiency.     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

A 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode array

We report a 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode (APD) array. The mean breakdown voltage of the APD was 57.9 V and the standard deviation was less than 0.1 V. The mean dark current was /spl sim/2 and /spl sim/300 nA, and the standard deviation was /spl sim/0.19 and /spl sim/60 nA at unity gain (V/sub bias/ = 13.5 V) and at 90% of the breakdown voltage, respectively. External quantum efficiency was above 40% in the wavelength range from 1.0 to 1.6 /spl mu/m. It was /spl sim/57% and /spl sim/45% at 1.3 and 1.55 /spl mu/m, respectively. A bandwidth of 13 GHz was achieved at low gain.     

Al/sub 0.3/Ga/sub 0.7/As/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) doped-channel field-effect transistors (DCFET's)

The properties of both lattice-matched and strained doped-channel field-effect transistors (DCFET's) have been investigated in AlGaAs/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) heterostructures with various indium mole fractions. Through electrical characterization of grown layers in conjunction with the dc and microwave device characteristics, we observed that the introduction of a 150-/spl Aring/ thick strained In/sub 0.15/Ga/sub 0.85/As channel can enhance device performance, compared to the lattice-matched one. However, a degradation of device performance was observed for larger indium mole fractions, up to x=0.25, which is associated with strain relaxation in this highly strained channel. DCFET's also preserved a more reliable performance after biased-stress testings.<>     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

Highly linear Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMTs

We report an Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMT with enhanced linearity. By engineering the channel region, i.e., inserting a 6-nm-thick AlGaN layer with 5% Al composition in the channel region, a composite-channel HEMT was demonstrated. Transconductance and cutoff frequencies of a 1 /spl times/100 /spl mu/m HEMT are kept near their peak values throughout the low- and high-current operating levels, a desirable feature for linear power amplifiers. The composite-channel HEMT exhibits a peak transconductance of 150 mS/mm, a peak current gain cutoff frequency (f/sub T/) of 12 GHz and a peak power gain cutoff frequency (f/sub max/) of 30 GHz. For devices grown on sapphire substrate, maximum power density of 3.38 W/mm, power-added efficiency of 45% are obtained at 2 GHz. The output third-order intercept point (OIP3) is 33.2 dBm from two-tone measurement at 2 GHz.     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

Electrooptic ferroelectric Na/sub 0.5/K/sub 0.5/NbO/sub 3/ films

We report on waveguiding and electrooptic properties of epitaxial Na/sub 0.5/K/sub 0.5/NbO/sub 3/ films grown by radio-frequency magnetron sputtering on Al/sub 2/O/sub 3/(11_02) single crystal substrates. High optical waveguiding performance has been demonstrated in infrared and visible light. The in-plane electrooptic effect has been recorded in transmission using a transverse geometry. At dc fields, the effective linear electrooptic coefficient was determined to 28 pm/V, which is promising for modulator applications.     

A 1 cm/spl times/1 cm In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode array

We report a 1 cm/spl times/1 cm array of 100 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiodes (APD). The average breakdown voltage was 28.7 V with a standard deviation of less than 0.5 V. The distribution of breakdown voltage across the area followed a radial pattern consistent with a slight epitaxial growth nonuniformity. The mean dark current at a gain of 10, or 6.1 A/W, was 10.3 nA, and none of the 100 APDs had a dark current of more than 25 nA. The bandwidth at a gain of 10 was 6.2 GHz, and the maximum gain-bandwidth product was 140 GHz. This technology is ideally suited for next-generation three-dimensional imaging applications.