湿法腐蚀制备的SOI光波导

用化学湿法腐蚀的方法制作了SOI光波导,并且用三维波束传播方法分析和设计了单模波导和1×2 3dB多模干涉分束器,修正了有效折射率和导模传输方法的误差.制作的器件具有低传输损耗(- 1 37dB/cm)、低附加损耗(- 2 2dB)、良好的均衡性(0 3dB)等优良性能.     

玻璃基多模波导光功分器的研制

利用Ag+-Na+电场辅助玻璃基离子交换技术制作了低损耗的掩埋多模波导,并在此基础上研制了多模波导光功分器.测试分析了多模波导和光功分器的损耗和偏心率特性.所研制的多模直波导传输损耗小于0.1dB/cm,所制作的1×2的多模波导光功分器附加损耗小于1.3 dB.     

基于SOI的16通道200GHz阵列波导光栅

设计并制作了基于绝缘体上硅(SOI)材料的1×16阵列波导光栅(AWG).该AWG器件的中心波长为1 550 nm,信道间隔为200 GHz,采用了脊型波导结构.首先确定了波导的结构尺寸以保证单模传输,并利用束传播法(BPM)模拟了波导间隔、弯曲半径和锥形波导长度等参数对器件性能的影响,对器件结构进行了优化,同时也利用BPM方法模拟了器件的传输谱.模拟结果显示:器件的最小信道损耗为4.64 dB,串扰小于-30 dB.根据优化的器件结构,通过光刻等半导体工艺制作了AWG,经测试得到AWG器件的损耗为4.52～8.1 dB,串扰为17～20 dB,能够实现良好的波分复用/解复用功能.     

X波段8路波导功分器/合成器

波导结构具有传输损耗低、功率容量大的特点。本文提出了一种基于波导结构功分器/合成器设计方法,并利用CST2014软件设计了一款X波段8路波导功分器/合成器。仿真与测试都显示其性能良好,在整个X波段插损小于0.05dB,反射损耗大于15dB,中间大部分频段(8.8~12.2GHz)反射损耗优于20dB。     

低损耗高集成度氮化硅阵列波导光栅波分(解)复用器

氮化硅平台阵列波导光栅(AWG)波分(解)复用器具有损耗低、集成度高、温度敏感性低等优势。基于联合微电子中心有限责任公司(CUMEC)的氮化硅集成光子工艺平台,从波导传输损耗、阵列波导与平板波导模式转换损耗、截断损耗、泄漏损耗等方面对氮化硅基AWG波光(解)复用器插入损耗进行了优化,并采用标准CMOS工艺完成低损耗C波段AWG密集波分(解)复用器制备。该氮化硅基AWG密集波分(解)复用器输出通道数为16,输出通道频率间隔200 GHz。测试结果表明,该AWG波分(解)复用器的平均插入损耗为2.34 dB,1 dB带宽为0.44 nm,3 dB带宽为0.76 nm,串扰约为-28 dB。芯片尺寸为850μm×1700μm,较平面光波导(PLC)基AWG大大减小。     

基于Banyan网络的无阻塞SiO2波导4×4矩阵光开关

提出了一种基于Mach-Zehder干涉仪(MZI)结构开关单元和Banyan网络的严格无阻塞4×4矩阵光开关.相对于Crossbar结构的7级单元级联,Banyan结构只需3级连接.分析了Banyan网络中交叉连接损耗与交叉角度的关系,交叉角30°时损耗为0.09 dB.优化设计了MZI开关单元结构,并制作了2×2光开关,测得插入损耗(IL)为-14 dB、串扰(XT)为-38 dB和功耗为450 mW.设计了基于Banyan网络的4×4光开关,连接波导交叉角为30°.基于光波导平面光波线路(PLC)技术,制作了严格无阻塞的SiO2波导4×4矩阵光开关,测得平均IL为3.95 dB、通道XT为-37 dB、偏振相关损耗(PDL)为0.4 dB、单通道开关功率约为670 mW及开关响应时间小于1 ms.     

一种新型2×2 SOI热光开关

设计并制作了一种新型的SOI 2×2马赫-曾德(MZ)热光开关.这种光开关采用了深刻蚀结构的配对多模干涉耦合器,同时,为了保证单模传输和调制,在连接波导和调制臂区域采用了浅刻蚀结构.深刻蚀结构增强了多模干涉耦合器对光场的限制,有利于自映像质量的提高,从而减少了自映像损耗和不均衡度,同时也提高了制作容差.基于强限制配对干涉耦合器的新型热光开关,其插入损耗为-11.0 dB,其中包括光纤-波导耦合损耗-4.3 dB,上升和下降开关时间分别为3.5μs和8.8μs.     

Ti：LiNbO3对称Y分叉的优化设计和制作

通过对分叉结构、单模波导参数的优化，在X切LiNbO3衬底上设计、制作了Y分叉光功分器。该Y分叉具有损耗低、可制作性好和功分均匀的特点。Y分叉的插入损耗理论值为0．22dB，光纤-波导的耦合损耗为1．2dB。     

X波段基片集成波导带通滤波器的设计

基片集成波导是一种具有低差损、低辐射、高品质因数的新型平面导波结构.文中利用基片集成波导结构设计并制作了一种x波段的带通滤波器,该滤波器易与其它微波平面电路集成.实测结果表明,该滤波器的中心频率是9.58 GHz,相对带宽是8.35%,通带内的插入损耗是3.8 dB,回波损耗＜-15 dB.     

MEMS微波功率传感器的共面波导优化设计

归纳了目前存在的一些减小共面波导损耗的方法,用HFSS模拟了这些方法的插入损耗和回波损耗.根据微波功率传感器的特点选取了二氧化硅隔离层的结构来制作共面波导,指出了这种结构存在的缺陷,并运用半导体物理的知识解释了造成缺陷的原因,最后提出了改进结构并通过HFSS模拟证实了这些结构的正确性.从最终的结果来看,三种优化结构得到的插入损耗绝对值均减小到了0.6dB以下,回波损耗也降到了-30dB以下.     

用于光互连的聚硅氧烷脊型光波导研究

采用软成型和图案转移技术,制备了可用于高速芯片间光互连的大尺寸聚硅氧烷脊型光波导,光波导长度达23cm.利用有效折射率法,对芯层残留层和传输模场的关系进行了分析.采用截断和数字化散射两种方法,测得输入光波长为633nm时的平均传输损耗小于0.14dB/cm.研究结果表明,波导的长度和损耗指标满足高速芯片间光互连的要求.     

采用多模输入/输出波导的多模干涉型SOI分束器

一个适用于光纤通信系统中的1×8多模干涉功率分束器被设计并通过ICP刻蚀方法成功研制.这种基于SOI材料的功率分束器是采用多模波导作为输入/输出波导;经过光束传播方法模拟,该器件显示出了优良的性能.测试结果表明,在1550nm波长处器件的传波损耗低于0.80dB,损耗均匀性为0.45dB,而且偏振相关损耗低于0.70dB.器件的尺寸只有2mm×10mm.     

Improved 8×8 integrated optical matrix switch usingsilica-based planar lightwave circuits

An improved 8×8 optical matrix switch was fabricated using silica-based planar lightwave circuits (PLCs) on a silicon substrate. Three improvements were made. First, the waveguide material was changed from titanium-doped silica (SiO₂₂-TiO₂) to germanium-doped silica (SiO₂₂-GeO₂) to reduce propagation loss. Second, offset driving powers were supplied to every switch unit to realize high extinction ratios. Third, the dummy switch units were modified to suppress the crosstalk through these units. The average insertion loss of the fabricated device was 3.81 db in the TE mode and 3.82 dB in the TM mode. The average extinction ratio of the switch units was 25.3 dB in the TE mode and 22.3 dB in the TM mode. The accumulated crosstalk was estimated to be less than -14 dB in the TE mode and -11 dB in the TM mode. The average driving power of the phase shifter in the on-state was 0.54 W in the TE mode and 0.52 W in the TM mode. The switching response time was 1.3 ms. The packaged 8×8 matrix switch with additional fiber-waveguide coupling loss of 2.7 dB was successfully employed in photonic multimedia switching and photonic inter-module connector system experiments     

一种宽带低损耗声表面波滤波器

阐述了一种利用纵向耦合双模制作宽带低损耗声表面波滤波器的方法，给出了理论计算方法和计算机模拟结果，最后给出了制作中心频率为４５３ＭＨｚ的声表面波滤波器实验结果，插入损耗为１．９ｄＢ，１ｄＢ带宽为６．６６ＭＨｚ，远端带外抑制大于４５ｄＢ。     

Fabrication and characterization of an InGaAsP/InP active waveguide optical isolator with 14.7 dB/mm TE mode nonreciprocal attenuation

The authors have fabricated transverse electric (TE) mode InGaAsP/InP active waveguide optical isolators based on the nonreciprocal loss shift and demonstrated improved TE mode isolation ratio of 14.7 dB/mm with reduced insertion loss at a wavelength of 1550 nm for monolithically integrable optical isolators. The wavelength dependence of the isolation ratio and the propagation loss were also measured. An isolation ratio greater than 10 dB/mm was realized over the entire wavelength range of 1530-1560 nm. These results lead to the monolithic integration of semiconductor waveguide optical isolators with edge-emitting semiconductor lasers and highly functional photonic integrated circuits with many cascaded optical devices.     

Fabrication of single-mode polymeric optical waveguides bylaser-beam writing

A laser-beam writing system is developed for large-area optical waveguide fabrication. Single-mode embedded channel optical waveguides are successfully fabricated on both 4- and 8-in silicon substrates using deuterated fluoromethacrylate polymers by laser-beam writing in photoresist and dry etching. The propagation loss of the waveguides is as low as 0.1 dB/cm at 1.3 μm     

Low-loss polymeric optical waveguides fabricated with deuteratedpolyfluoromethacrylate

Deuterated polyfluoromethacrylate which has high transparency, low birefringence and good processability was newly synthesized for use as optical waveguide materials, and both single-mode and multimode optical waveguides were fabricated using the polymer. The propagation loss and waveguide birefringence of the single-mode waveguides were as low as 0.10 dB/cm and -5.5×10^-6 at 1.31 μm, respectively. The propagation losses of the multimode waveguides were less than 0.02 dB/cm at both 0.68 and 0.83 μm, and 0.07 dB/cm at 1.31 μm     

C-band fundamental/first-order mode converter based on multimode interference coupler on InP substrate

The design, fabrication and characterization of a fundamental/first-order mode converter based on multimode interference coupler on InP substrate were reported. Detailed optimization of the device parameters were investigated using 3D beam propagation method. In the experiments, the fabricated mode converter realized mode conversion from the fundamental mode to the first-order mode in the wavelength range of 1530-1565 nm with excess loss less than 3 dB. Moreover, LP₀₁ and LP₁₁ fiber modes were successfully excited from a few-mode fiber by using the device. This InP-based mode converter can be a possible candidate for integrated transceivers for future mode-division multiplexing system.     

Mode Converters for Coupling to High Aspect Ratio Silicon-on-Insulator Channel Waveguides

The design, simulation, and experimental performance of mode converters for coupling from single-mode silicon-on-insulator ridge waveguides to high aspect ratio channel waveguides are described. The converters consist of a two-level adiabatic taper structure. The final channel waveguide is 1.5 mum high by 0.8 mum wide. Simulations predict that for total coupler lengths longer than 20 mum, the coupling loss from the fundamental ridge mode to the slit mode is better than -0.2 dB. The couplers and waveguides were fabricated using a two-step self-aligned process. The measured coupling loss for fabricated mode converters is -0.4 dB