新型大尺寸电磁驱动MEMS光学扫描镜的研制

设计并制作了一种结构新颖的镜面尺寸为6mm×4mm的电磁驱动MEMS光学扫描镜.这种背面为微型铜驱动线圈的MEMS硅基扭转镜面沉浸在由包含永磁体的磁回路产生的磁场中,当电流信号通过驱动线圈时,MEMS光学扫描镜绕着扭转梁发生了大角度的扫描运动.采用MEMS体硅加工工艺和电镀技术制作的器件显示出了优良的性能,实验获得的扫描镜静态转角斜率为0.03°/mA,当器件进行动态扫描时,在381Hz的谐振频率下获得了最大±10.2°的光学扭转角度,空气中的Q因子为221,相应的功耗为13μW,与此同时MEMS光学扫描镜具备了出色的镜面粗糙度、光学反射率和镜面平整度.实验证明该器件完全适合于微型光谱仪和可调光滤波器的应用.     

Harnessing the Actuation Potential of Solid‐State Intercalation Compounds

High‐strain, high‐force mechanical actuation technologies are desirable for numerous applications ranging from microelectromechanical systems (MEMS) to large‐scale “smart structures” that are able to change shape to optimize performance. Here we show that electrochemical intercalation of inorganic compounds of high elastic modulus offers a low‐voltage mechanism (less than 5 V) with intrinsic energy density approaching that of hydraulics and more than a hundred times greater than that of existing field‐operated mechanisms, such as piezostriction and magnetostriction. Exploitation of the reversible crystallographic strains (several percent) of intercalation compounds while under high stress is key to realization of the available energy. Using a micromachined actuator design, we test the strain capability of oriented graphite due to electrochemical lithiation under stresses up to 200 MPa. We further demonstrate that simultaneous electrochemical expansion of the LiCoO₂/graphite cathode/anode couple can be exploited for actuation under stresses up to ～ 20 MPa in laminated macroscopic composite actuators of similar design to current lithium‐ion batteries. While the transport‐limited actuation mechanism of these devices results in intrinsically slower actuation compared to most ferroic materials, we demonstrate up to 6.7 mHz (150 s) cyclic actuation in a laminated actuator designed for a high charge/discharge rate. The potential for a new class of high‐strain, high‐force, moderate‐frequency actuators suitable for a broad range of applications is suggested.     

低电压驱动的硅基Ka波段级联式MEMS移相器

通过在共平面波导上周期性地分布微机械电容,外加电压驱动改变电容值,可实现级联式MEMS移相器.本文讨论了优化相移特性对共平面波导特性阻抗及下拉电压的要求,通过工艺参数优化制备了高阻硅基上的Ka波段级联式MEMS移相器,测试结果表明制备器件具有较低的驱动电压,8V时即产生明显的相移量,在36GHz处15V驱动电压时相移量为118°,25V时为286°.对微结构弹性膜的机械振动寿命测试表明,13级级联的MEMS移相器所有弹性膜同步振动的寿命为3×10⁶次.为器件的实用化提供了重要保障.     

电磁驱动推拉式射频MEMS开关的设计与制作

提出了一种新型电磁驱动推拉式射频MEMS开关。针对传统静电驱动单臂梁开关所需驱动电压大、恢复力不足等问题,设计了一种推拉式开关结构,降低了驱动电压(电流),提高了开关的隔离度,同时实现了单刀双掷的功能。单晶Si梁由于自身无应力,解决了悬臂梁残余应力引起的梁变形问题。通过理论计算和有限元分析,优化了开关设计尺寸,在外围永磁铁磁感应梯度dB/dz=100T/m,在线圈通入100mA电流的驱动下,单晶Si扭转梁末端可以获得约10μm的弯曲量,满足开关驱动要求。给出了开关的详细微细加工流程,对开关的传输参数进行了测试,在10GHz时隔离度为-40dB.     

聚酰亚胺振动膜微型电场传感器

设计并分析了一种新型的以硅为基底、聚酰亚胺为振动膜的微型电场传感器。此种传感器利用了聚酰亚胺耐热、耐腐蚀并具有良好机械性能的特点,采用MEMS技术制造,使其具备体积小、重量轻、功耗低、便于与其他器件集成等特点,而且制作工艺简单,成本较低。本文阐述了此传感器的工作原理,并通过计算机模拟确定了增强信号的方法,同时描述了新型传感器的结构设计和加工工艺过程。     

基于MEMS技术的微波滤波器研究进展

基于MEMS技术的滤波器是现行RF结构中一个关键的MEMS器件。与传统的采用金属矩形或圆柱波导以及半导体元件制作的滤波器相比,MEMS滤波器具有低损耗、高隔离度、线性好、体积小、易于集成等优点。对利用MEMS技术制作的滤波器做了分类总结,综述了近几年MEMS滤波器的研究进展,包括硅体微加工滤波器、LIGA传输线型滤波器和基于MEMS开关/电容实现的可调滤波器。指出可调滤波器的开发适应微波、毫米波波段的多频段、宽带无线通信系统的迫切需要,具有重要的现实意义。     

Photothermal Bimorph Actuators with In‐Built Cooler for Light Mills,Frequency Switches,and Soft Robots

Photothermal bimorph actuators are widely used for smart devices, which are generally operated in a room temperature environment, therefore a low temperature difference for actuation without deteriorating the performance is preferred. The strategy for the actuator is assembling a broadband‐light absorption layer for volume expansion and an additional water evaporation layer for cooling and volume shrinkage on a passive layer. The response time and temperature‐change‐normalized bending speed under NIR, white, and blue light illumination are at the same level of high performance, fast photothermal actuators based on polymer or polymer composites. The classical beam theory and finite element simulations are also conducted to understand the actuation mechanism of the actuator. A new type of light mill is designed based on a wing‐flapping mechanism and a light‐modulated frequency switch. A fast‐walking robot (with a speed of 26 mm s^?1) and a fast‐and‐strong mechanical gripper with a large weight‐lifting ratio (≈2142), respectively, are also demonstrated.     

微型热致动器研究

本论文围绕微型热致动器的研制开发,对热致动方式进行较为深入研究,利用硅微细加工工艺制造出多种型热致动器,并进行了理论分析和实验测试。     

一种新型三谐振点电容式RF MEMS开关

给出了改进的电容式开关等效电路模型以及基于该电路模型的一种新型的多频段工作的电容式RFM EM S开关的设计和制作研究。分析表明,当开关的上电极为多支撑梁结构时,需要对传统的开关等效电路加以改进。利用新型等效电路模型进行模拟发现,通过适当的参数选择,可以获得多谐振点开关,不仅可以在多个频段适用,并且可以适用于较低频段。设计了一种可工作在X波段下的三谐振点电容式RF MEMS开关,并在高阻硅衬底上采用表面微加工工艺制备了开关样品。三谐振点开关的在片测试结果为:驱动电压为7 V,“开”态的插入损耗为0.69 dB@10.4 GHz,“关”态的隔离度为30.8 dB@10.4 GHz,其微波性能在0~13.5 GH z频段下优于类似结构的传统单谐振点开关。     

Analysis and optimization of two movable plates RF MEMS switch for simultaneous improvement in actuation voltage and switching time

An attempt to overcome the existing limitations of RF MEMS switch like high actuation voltage and low switching time simultaneously has been addressed by introducing the concept of moving bottom plate (CPW central line).The performance characteristics of such MEMS switch with two movable plates has been analyzed by setting up the continuity equation of both the plates and solving it analytically with valid approximations. It is seen that for all practical cases such two movable plate designs can be represented by a single movable plate with equivalent membrane parameters. It is observed that a simultaneous reduction of both the actuation voltage and switching time around 20% is possible by optimizing the dimensions. Alternatively a maximum reduction of 30% in the actuation voltage is possible keeping the switching time unaltered and the switching time can be reduced by 50% keeping the switching voltage unaltered. Closed form expressions for the actuation voltage and switching time are obtained which are seen to match with the numerical results.     

一种硅微机械陀螺制造方法研究

给出了一种硅微机械陀螺制造方法,该方法可适用于各种不同的微机电系统(MEMS)器件,包括加速度计、剪切应力传感器及MEMS光开关等。利用该方法制备了硅微机械陀螺,并给出了该陀螺的性能测试结果。同时分析了利用该方法制备各种不同器件时,工艺流程对器件性能的影响,重点讨论了硅-玻璃阳极键合、减薄工艺及深刻蚀所形成的侧壁质量,包括侧壁垂直度、侧壁杂质等因素对器件性能的影响。     

基于MEMS工艺的电热致动器研究进展

基于MEMS工艺的电热致动器具有与集成电路兼容的驱动电压、大的致动位移和致动力,比静电致动器、压电致动器和磁致动器有更大的优势,是现阶段致动方式的研究热点.高精度、高可靠度、可控和稳定性好的电热致动器是未来研究的新方向.针对MEMS微加工工艺制作的固体材料电热致动器,综述了电热致动器的结构形式、典型应用、模型建立以及测试方法的研究现状和主要研究成果.对电热致动器的结构设计、建模分析和测试技术方面的关键技术和存在的主要问题进行了分析和展望,以期为基于MEMS工艺的电热致动器的设计、分析和测试提供借鉴和参考.     

Dry‐Type Artificial Muscles Based on Pendent Sulfonated Chitosan and Functionalized Graphene Oxide for Greatly Enhanced Ionic Interactions and Mechanical Stiffness

Biopolymer‐based artificial muscles are promising candidates for biomedical applications and smart electronic textiles due to their multifaceted advantages like natural abundance, eco‐friendliness, cost‐effectiveness, easy chemical modification and high electical reactivity. However, the biopolymer‐based actuators are showing relatively low actuation performance compared with synthetic electroactive polymers because of inadequate mechanical stiffness, low ionic conductivity and ionic exchange capacity (IEC), and poor durability over long‐term activation. This paper reports a high‐performance electro‐active nano‐biopolymer based on pendent sulfonated chitosan (PSC) and functionalized graphene oxide (GO), exhibiting strong electro‐chemo‐mechanical interations with ionic liquid (IL) in open air environment. The proposed GO‐PSC‐IL nano‐biopolymer membrane shows an icnreased tensile strength and ionic exchange capacity of up to 44.8% and 83.1%, respectively, and increased ionic conductivity of over 18 times, resulting in two times larger bending actuation than the pure chitosan actuator under electrical input signals. Eventually, the GO‐PSC‐IL actuators could show robust and high‐performance actuation even at the very low applied voltages that are required in realistic applications.     

RF MEMS器件驱动机制理论与分析

介绍了驱动机制在RF MEMS器件制作中所处的地位。以悬梁类型的RF MEMS开关为例,介绍了RF MEMS器件的各种驱动方式,给出了其原理结构图;详细分析了静电驱动、压电驱动、热驱动和磁驱动的原理。对各种驱动机制进行了比较和分析,得出应根据不同场合和不同参数要求,选择不同驱动机制的驱动器。     

压电MEMS兰姆波器件技术的最新进展与展望

兰姆波谐振器(LWR)作为一种新兴的压电微机电系统(MEMS)声学器件,同时具有高工作频率、高机电耦合系数、高品质因数值及低功耗等特点,其制造工艺与集成电路工艺兼容,可在单片晶圆上实现多频率器件。基于LWR的声学滤波器是实现高性能射频前端组件的有效解决方案之一,能够满足未来通信设备多频率及集成化的发展要求,其相关研究已成为微声器件领域的热点。该文简要介绍了兰姆波的基本原理,综述了近年来基于氮化铝(AlN)薄膜和铌酸锂薄膜(LNOI)的压电MEMS兰姆波器件研究取得的最新成果,并讨论了压电MEMS兰姆波器件的发展趋势。     

Copper(I) Iodide as Hole‐Conductor in Planar Perovskite Solar Cells: Probing the Origin of J–V Hysteresis

Organic–inorganic lead halide perovskite solar cells are promising alternatives to silicon‐based cells due to their low material costs and high photovoltaic performance. In this work, thin continuous perovskite films are combined with copper(I) iodide (CuI) as inorganic hole‐conducting material to form a planar device architecture. A maximum conversion efficiency of 7.5% with an average efficiency of 5.8 ± 0.8% is achieved which, to our knowledge, is the highest reported efficiency for CuI‐based devices with a planar structure. In contrast to related planar 2,2′,7,7′‐tetrakis‐(N,N ‐di‐4‐methoxyphenylamino)‐9,9′‐spirobifluorene (spiro‐OMeTAD)‐based devices, the CuI‐based devices do not show a pronounced hysteresis when tested by scanning the potential in a forward and backward direction. The strong quenching of photoluminescence (PL) signal and comparatively fast decay of open‐circuit voltage demonstrates a more rapid removal of positive charge carriers from the perovskite layer when in contact with CuI compared to spiro‐OMeTAD. A slow response on a timescale of 10–100 s is observed for the spiro‐OMeTAD‐based devices. In comparison, the CuI‐based device displays a significantly faster response as determined through electrochemical impedance spectroscopy (EIS) and open‐circuit voltage decays (OCVDs). The characteristically slow kinetics measured through EIS and OCVD are linked directly to the current–voltage hysteresis.     

一种基于MEMS工艺的365 GHz硅微波导垂直转接结构

基于微电子机械系统(MEMS)工艺设计并制作了一种THz垂直转接结构,该结构采用6层硅片堆叠的硅微波导形式。理论分析计算了垂直转接结构的参数,并使用三维电磁场分析软件HFSS对该结构进行了模拟仿真。设计得到了中心频率为365 GHz、带宽为80 GHz、芯片尺寸为10 mm×7 mm×2.7 mm的THz垂直转接结构。给出了一套基于MEMS工艺的硅微波导的制作流程,制作了365 GHz垂直转接结构并对其进行测试。获得的THz垂直转接结构的回波损耗随频率变化的测试结果与仿真结果基本一致。采用MEMS工艺制作的硅微波导垂直转接结构具有精度高、一致性好、成本低的特点,满足THz器件的发展需求。     

Performance Evaluation and Equivalent Model of Silicon Interconnects for Fully-Encapsulated RF MEMS Devices

This paper aims to demonstrate the utility of silicon interconnects for radio-frequency (RF) microelectromechanical system (MEMS) devices that are packaged using a wafer-scale encapsulation process. Design and fabrication steps for the packaged interconnects are described. Measurement results show that encapsulated devices can be operated at frequencies up to 6 GHz with less than 1 dB insertion loss from the through-package silicon interconnects. This paper also describes a simple and accurate lumped-element model for simulating the performance of packaged silicon interconnects. The model is verified with S-parameter measurements from 50 MHz to 6 GHz. The modeling method and extracted values are intended to aid in the design and simulation of RF MEMS devices packaged using this technology.      

Microchemomechanical Systems

The development of microchemomechanical systems (MCMS) as an analogy to microelectromechanical systems (MEMS) is reviewed, with the distinction that the mechanical actuation of microscale structures is effected by chemical cues as opposed to electricity. The intellectual motivation to pursue MCMS, or the creation of integrated chemical‐stimuli‐responsive devices, is that such structures are widely observed in nature. From a practical standpoint, since chemicals can readily diffuse and produce changes over large distances, this approach is especially attractive in enabling wireless and autonomous devices at small size scales.     

RA码与网络编码的联合设计

针对现有编码技术存在的编译码系统结构复杂、网络传输性能稳定性差等问题,文中提出了一种RA码与网络编码的联合设计方法。RA码融合了Turbo码编码和LDPC码译码各自的优点,采用RA码的BP译码算法,通过将RA码的译码器加入到PNC的信息计算流程中,将基于RA码的信道编码与PNC进行结合。最后,在MATLAB平台上进行仿真,基于AWGN信道获取SNR/BER性能曲线图。仿真结果显示,该方案有效简化了系统结构,降低了系统的信噪比和延迟性,提高了传输性能的稳定性。