Bi2O3薄膜的制备及其电阻开关特性的研究

电阻式存储器由于具有众多的优点有望成为最有前景的下一代高速非挥发性存储器的选择之一.实验利用射频磁控溅射法在重掺硅上沉积了Bi2O3薄膜,并对该薄膜的结晶状态和Au/Bi2O3/n+Si/Al结构的电阻开关特性进行了研究.XRD分析结果表明,射频磁控溅射法沉积所得的Bi2O3薄膜结晶性能好,(201)取向明显.I-V曲线测试结果表明,Au/Bi2O3/n+Si/Al结构具有单极性电阻开关特性.通过对不同厚度Bi2O3薄膜的Au/Bi2O3/n+Si/Al结构I-V特性比较发现,随着薄膜厚度的增加,电阻开关的Forming、Set和Reset阈值电压均随之增加.对于Bi2O3薄膜厚度为31.2 nm的Au/Bi2O3/n+Si/Al结构,其Forming、Set和Reset阈值电压均低于4 V,符合存储器低电压工作的要求.     

铋掺杂对SrTiO3薄膜微观结构及阻变行为的影响

采用溶胶-凝胶及快速退火工艺在p+-Si上制备了Bi掺杂SrTiO_3薄膜,构建了Ag/Sr_(1-x)Bi_xTiO_3/p+-Si结构阻变器件,研究了Bi掺杂量对薄膜微观结构、器件阻变行为及特性的影响。结果表明:Bi掺杂量较低时并未改变Sr_(1-x)Bi_xTiO_3薄膜的相结构,但随着掺杂比例的增大,晶粒尺寸也明显增大,当掺杂量x=0.16时,有Bi4SrTi4O15及TiO2相形成;不同Bi掺杂量的Ag/Sr_(1-x)Bi_xTiO_3/p+-Si器件均呈现出双极性阻变特性,且有明显的多级阻变行为。随Bi掺杂量的增加,器件的阻变性能逐步提高,当x=0.12时器件的高、低阻态电阻比值最大,达到105左右,并且在2 000次可逆循环测试下,高、低阻态电阻比未出现衰减,表现出良好的抗疲劳特性,但当掺杂量x达到或超过0.16后,器件的性能呈下降趋势。Bi掺杂量的增大会导致器件高阻态时的导电机制从空间电荷效应(SCLC)导电机制(x0.16)转变为肖特基势垒发射(x=0.16)。器件在低阻态下均遵循欧姆导电机制。     

薄膜厚度对Au/ZnO/n+-Si薄膜压敏电阻器阈值电压的影响

本文采用直流磁控溅射法和多次沉积与掩膜技术,在n+Si(100)衬底上制备了一系列厚度不同的ZnO薄膜,表面镀Au的探针与ZnO/n+-Si构成了一系列ZnO层厚不同的Au/ZnO/n+-Si薄膜压敏电阻器.利用X射线衍射确定沉积的ZnO薄膜为高度c轴(0002)取向的晶体薄膜,利用紫外-可见透射光谱对沉积的ZnO薄膜...     

TiO2-KTaO3复合薄膜制备与湿敏传感性质研究

通过溶胶凝胶法和旋涂法制备了单层和双层TiO2-KTaO3薄膜,并在不同的温度下退火1h,研究了该薄膜的湿敏传感特性.通过扫描电镜和X射线衍射研究了薄膜的形态特性,发现该薄膜具有纳米颗粒和毛细多孔结构.环境湿度变化从12%RH～97%RH的变化过程中,在500℃下退火的TiO2/KTaO3薄膜具有很高的灵敏度.对比单层薄膜,双层薄膜显示出有更大的电阻变化范围.还研究了TiO2/KTaO3薄膜的湿敏传感机理.     

晶体结构对Er/Yb共掺TiO2薄膜荧光光谱的影响

通过对不同退火温度下Er/Yb共掺TiO2薄膜的结构和光致荧光光谱(PL)的分析,研究了退火处理所导致的晶体结构变化对薄膜荧光光谱的影响,探讨了薄膜的结晶状态在Er3+激活、荧光光谱形状等方面的作用及可能的物理机制.研究结果表明:退火处理所导致的Er3+的PL的变化与薄膜的相结构之间有着密切的联系.退火温度低于700C时的宽化谱和Er/Yb共掺TiO2薄膜的非晶结构有关,多峰结构的PL是Er3+在烧绿石相ErxYb2-xTi2O7中的典型特征.     

直流磁控溅射制备SnO2薄膜的阻变特性研究

采用直流磁控溅射法在Pt/Ti/SiO2基片上分别以三种不同的基板温度和后热处理工艺制备了二氧化锡(SnO2)薄膜。采用X射线衍射仪对三种薄膜的晶格结构进行了分析表征,通过Keithley 4200半导体参数分析仪对薄膜的阻变特性进行了测试。实验结果表明:三种制备条件下的SnO2薄膜均具有阻变性能,基板温度350℃和850℃退火处理分别制备的薄膜同时具有良好的写入/擦除电压分布一致性、较好的高阻态阻值离散性和较大的开关比。初步讨论了三种薄膜阻变特性的机理,薄膜内部导电细丝的形成和断裂程度不同造成三种薄膜高低阻态电阻分布不同,同时影响了写入与擦除阈值电压的分布一致性等阻变参数。     

大规模真空蒸镀二氧化钛薄膜及其表征

采用大型真空镀膜设备在玻璃基底上蒸镀二氧化钛(TiO2)薄膜,并对TiO2薄膜进行了SEM、AFM、XRD、紫外可见光吸收光谱、亲水性的测试及分析,探讨了退火温度对薄膜性能的影响.结果表明制备的TiO2薄膜具有良好的均匀性.在室温条件下,TiO2薄膜具有无定型的结构;在300～500℃的条件下,TiO2薄膜退火2h后以锐铁矿晶型为主,600℃退火的TiO2薄膜明显向金红石型转变.随退火温度的升高,薄膜对紫外光和可见光的吸收有明显提高,并出现了明显的红移现象.另外,亲水性也随退火温度的升高而变强,500和600℃退火的TiO2薄膜表面出现超亲水性.     

退火温度对纳米TiO2薄膜结构和亲水性的影响

采用射频磁控溅射方法制备出纳米二氧化钛(TiO2)薄膜,研究了不同退火温度对薄膜微观结构和超亲水性的影响.结果表明:退火温度升高,晶粒长大,孔隙率减小;常温制备300 ℃以下退火的TiO2薄膜为无定形结构,亲水性差;400 ℃～650 ℃退火的薄膜为锐钛矿结构,表现出超亲水性;800 ℃退火薄膜为金红石结构,亲水性有所下降.     

SnO2:F沉积的La0.67Sr0.33MnO3薄膜的电阻开关特性研究

采用脉冲激光沉积技术在SnO2:F(FTO)衬底上制备了La0.67 Sr0.33 MnO3( LSMO)薄膜.室温下利用直流电压对Au/LSMO/FTO三明治结构的器件进行了电化学测试.结果显示样品具有明显的双极性电阻开关性能.通过对I-V特性曲线进行分析,认为在高阻态时肖特基势垒和空间电荷限制电流输运机制调控.在高场区,电阻开关的高低阻态现象由电子陷阱中心分布的不对称引起的空间电荷限制电流理论来解释.     

锐钛矿型二氧化钛薄膜制备及其光催化性能研究

在室温下采用直流磁控反应溅射法制备纳米TiO2薄膜,用XRD、XPS等手段对未退火及不同退火温度处理的薄膜进行了研究,以紫外灯为光源对亚甲基兰进行了光催化降解试验.结果表明:室温制备未退火的薄膜为非晶结构,400～500℃退火的薄膜为锐钛矿相结构.制备的锐钛矿型TiO2薄膜具有一定的光催化性能,在500℃退火2 h且厚度较大的薄膜光催化性能较好.     

Improvement of resistive switching characteristics in ZrO2 film by embedding a thin TiOx layer

The stabilization of the resistive switching characteristics is important to resistive random access memory (RRAM) device development. In this paper, an alternative approach for improving resistive switching characteristics in ZrO(2)-based resistive memory devices has been investigated. Compared with the Cu/ZrO(2)/Pt structure device, by embedding a thin TiO(x) layer between the ZrO(2) and the Cu top electrode, the Cu/TiO(x)-ZrO(2)/Pt structure device exhibits much better resistive switching characteristics. The improvement of the resistive switching characteristics in the Cu/TiO(x)-ZrO(2)/Pt structure device might be attributed to the modulation of the barrier height at the electrode/oxide interfaces.     

Influence of Cu diffusion conditions on the switching of Cu-SiO2-based resistive memory devices

This paper presents a study of Cu diffusion at various temperatures in thin SiO₂ films and the influence of diffusion conditions on the switching of Programmable Metallization Cell (PMC) devices formed from such Cu-doped films. Film composition and diffusion products were analyzed using secondary ion mass spectroscopy, Rutherford backscattering spectrometry, X-ray diffraction and Raman spectroscopy methods. We found a strong dependence of the diffused Cu concentration, which varied between 0.8 at.% and 10^− 3 at.%, on the annealing temperature. X-ray diffraction and Raman studies revealed that Cu does not react with the SiO₂ network and remains in elemental form after diffusion for the annealing conditions used. PMC resistive memory cells were fabricated with such Cu-diffused SiO₂ films and device performance, including the stability of the switching voltage, is discussed in the context of the material characteristics.     

Resistive switching in copper oxide nanorods: a bottom up approach applicable for enhanced scalability

Reversible, stable and reproducible resistive switching in a parallel network of Cu2O nanorods, observed in the present study, highlights the advantages of using nanorods in comparison to normally used thin films. Unipolar and symmetric current-voltage characteristics of the metal/insulator/metal structure consisting of Hg top contact/Copper oxide (Cu2O) nanorods/Ag bottom contact in a sandwich configuration shows electroforming at about 11 V, reproducible reset and set points at 0.53 +/- 0.03 and 4.2 +/- 0.02 V and a high OFF/ON resistance ratio > 10(3). Slope of current-voltage characteristics and current contrast in CAFM mapping indicate that filamentary conduction mechanism is responsible for resistive switching. This study sets the foundation for fabricating a nanorods based resistive random access memory device and thus a manifold increase in the device scalability.     

Fabrication and resistive switching characteristics of high compact Ga-doped ZnO nanorod thin film devices

This study investigates the resistive switching behavior of Ga-doped ZnO (GZO) nanorod thin films with various Ga/Zn molar ratios. Vertically well-aligned and uniform GZO nanorod thin films were successfully grown on Au/Ti/SiO(2)/p-Si substrates using an aqueous solution method. X-ray diffraction (XRD) results indicate that GZO nanorods have [0001] highly preferred orientation. Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) observations show the formation of highly ordered and dense nanorod thin films. These compact GZO nanorod thin films can be used to make resistive switching memory devices. Such memory devices can be reversibly switched between ON and OFF states, with a stable resistance ratio of ten times, narrow dispersion of ON and OFF voltages, and good endurance performance of over 100 cycles. The resistive switching mechanism in these devices is related to the formation and rupture of conducting filaments consisting of oxygen vacancies, occurring at interfaces between GZO nanorods (grain boundaries). Results show that the resulting compact GZO nanorod thin films have a high potential for resistive memory applications.     

Bipolar Resistive Switching of Single Gold-in-Ga(2)O(3) Nanowire

We have fabricated single nanowire chips on gold-in-Ga(2)O(3) core-shell nanowires using the electron-beam lithography techniques and realized bipolar resistive switching characteristics having invariable set and reset voltages. We attribute the unique property of invariance to the built-in conduction path of gold core. This invariance allows us to fabricate many resistive switching cells with the same operating voltage by simple depositing repetitive metal electrodes along a single nanowire. Other characteristics of these core-shell resistive switching nanowires include comparable driving electric field with other thin film and nanowire devices and a remarkable on/off ratio more than 3 orders of magnitude at a low driving voltage of 2 V. A smaller but still impressive on/off ratio of 10 can be obtained at an even lower bias of 0.2 V. These characteristics of gold-in-Ga(2)O(3) core-shell nanowires make fabrication of future high-density resistive memory devices possible.     

Resistance Random Access Memory Based on a Thin Film of CdS Nanocrystals Prepared via Colloidal Synthesis

We demonstrate that resistance random access memory (RRAM) can be fabricated based on CdS-nanocrystal thin films. A simple drop-drying of the CdS-nanocrystal solution leads to the formation of uniform thin films with controlled thickness. RRAMs with a Ag/Al(2) O(3) /CdS/Pt structure show bipolar switching behavior, with average values of the set voltage (V(Set) ) and reset voltage (V(Reset) ) of 0.15 V and -0.19 V, respectively. The RRAM characteristics are critically influenced by the thickness of the Al(2) O(3) barrier layer, which prevents significant migration of Ag into the CdS layer as revealed by Auger electron spectroscopy (AES). Interestingly, RRAM without an Al(2) O(3) layer (i.e., Ag/CdS/Pt structure) also shows bipolar switching behavior, but the polarity is opposite to that of RRAM with the Al(2) O(3) layer (i.e., Ag/Al(2) O(3) /CdS/Pt structure). The operation of both kinds of devices can be explained by the conventional conductive bridging mechanism. Additionally, we fabricated RRAM devices on Kapton film for potential applications in flexible electronics, and the performance of this RRAM device was comparable to that of RRAMs fabricated on hard silicon substrates. Our results show a new possibility of using chalcogenide nanocrystals for RRAM applications.     

室温下制备非晶ZnO薄膜及其电阻开关特性研究

室温下采用紫外固化的方法取代溶胶-凝胶方法中的高温退火制备了氧化锌薄膜, XRD分析结果表明薄膜为非晶的, XPS分析结果表明薄膜的主要成分是ZnO。在深紫外固化后的薄膜表面溅射Al作为顶电极获得Al/a-ZnO/FTO结构的器件,研究深紫外照射时间对器件电阻转变性能的影响, 进一步解释了深紫外固化的机制。研究表明: 经过充足时间(12 h)照射的器件表现出双极性电阻开关特性,阈值电压分布集中(-3.7 V<V_set<-2.9 V, 3.4 V< V_reset<4.3 V)且符合低电压工作的要求, 至少在4000 s内器件的高低阻态都没有发生明显的退化, 表现出了良好的存储器特性。Al/a-ZnO/FTO器件的这种电阻转变特性可以用空间电荷限制电流传导机制解释。