非规则截面散热板内嵌热管的传热能力分析

对一种空间实验装置中电子箱热控制系统的关键热控元件——散热板内嵌热管的传热能力进行了热分析计算.采用热容热阻网络法,建立了非规则截面槽道热管的传热模型,在传热网络分析的基础上,以热管No.21和热管No.22为例,选取空间实验装置在最热工况下稳定运行和最冷工况下从启动到稳定运行两种实验边界条件,计算了热管的传热能力,并与西班牙IberEspacio热管公司提供的传热极限数据进行了比较.结果表明,全部内嵌热管都能在传热极限范围内可靠运行,其中最热工况和最冷工况下热管的最大传热能力分别为工作温度41.7℃时的74.9W·m和-9.3℃时的69.6W·m.     

成果介绍

热管是60年代中期研制成的一种新型的传热元件,早期用于人造卫星、宇审飞船等装置上,取得了良好的温度传递作用。热管作为一种先进的传热元件,广泛的应用于节能技术方面,已经引起人们的重视。我校热工教研室研制成功的热RGSD—250型热管,是一种以水为工质的热管,管材为钢——铜复合管,外绕以钢管翅片,管内有60个纵向毛细槽道作为吸液芯结构。此种热管宜于从烟气中吸收废热用以加热空气。管内工质的最高工作温度为250℃,单根热     

中温萘热管的研究与应用前景

本文讨论了以萘作为中温热管的工质的性质及其传热能力问题。实验表明:在工作温度为150～478.5℃范围内,即使与碳钢管壳配用,也可确保萘与碳钢具有良好的相容性和安全性,工质不会变劣或分解。根据实验条件,萘热管的传热率介于4.24～10.61W/cm~2之间。本文还讨论了萘热管的应用前景,如果合理设计萘热管换热器,可望在低于700℃的烟气温度下使用。     

轴向槽道热管的加工制作及传热性能研究

轴向槽道热管具有较高的传热能力和可靠的运行稳定性,在航空航天和电子领域具有广阔的应用前景。文章针对“Ω”形轴向槽道热管的特点,设计并搭建了专门的加工和实验平台,通过讨论温度分布规律、当量导热系数、热阻和最大传热能力等参数,对成品热管的传热性能进行了研究和分析。结果表明:热管具有良好的动态响应热性;在相同工作温度下,热管的冷热端温差与加热功率的增加呈正向关系;当热管的工作温度升高时,当量导热系数逐渐增大,并随着功率和充液率的升高而升高,而总热阻在加热功率增加时呈下降趋势;随着充液率的增加,热管的最大传热能力增加,但是增幅会趋缓。     

非规则截面散热板内嵌热管的传热能力分析

对一种空间实验装置中电子箱热控制系统的关键热控元件——散热板内嵌热管的传热能力进行了热分析计算．采用热容热阻网络法,建立了非规则截面槽道热管的传热模型,在传热网络分析的基础上,以热管No．21和热管No．22为例,选取空间实验装置在最热工况下稳定运行和最冷工况下从启动到稳定运行两种实验边界条件,计算了热管的传热能力,并与西班牙IberEspacio热管公司提供的传热极限数据进行了比较．结果表明,全部内嵌热管都能在传热极限范围内可靠运行,其中最热工况和最冷工况下热管的最大传热能力分别为工作温度41．7℃时的74．9W·m和-9．3℃时的69．6W·m．     

燕尾型轴向槽道热管薄液膜热传递及实验验证

基于薄液膜的传热传质理论建立了燕尾形槽道热管的蒸发段与冷凝段热传递的数学模型,利用Laplace-Young方程得到不同负荷下的轴向毛细半径分布.分析求解了蒸发段温降与冷凝段的温降随热负荷的变化,进而得出了热管温降随热负荷的变化.实验研究了热管在不同冷源温度下温降随热负荷的变化.结果表明:槽道中液膜厚度沿轴向逐渐增厚;蒸发段和冷凝段温降随热负荷增大而增大;通过比较模型预测值和实验测量值,发现两者吻合较好,进一步验证本文所建的模型的正确性.     

微槽冷却热沉结构尺寸的优化设计

以热阻和压降作为2个目标函数建立了微槽冷却热沉的多目标优化模型,采用序列二次规划(SQP)方法对微槽的结构尺寸进行了优化设计。优化结果表明:微槽冷却热沉的结构形状对传热性能有很大的影响,与三角形和梯形结构相比,矩形微槽结构的传热效率更高。给出了2种加权系数情况下的优化尺寸,相应的微槽宽度分别为130μm和120μm,槽栅的宽度分别为176μm和350μm,微槽的高度分别为640μm和1000μm,相应的热阻分别为0.4857K/W和0.5094 K/W。对以上得到的优化结构的微槽冷却热沉的流体流动和传热进行了数值模拟,得到芯片的最高温度分别为358.34 K和361.52 K,完全可以满足工作芯片对温度的要求。     

热管式溶液吸收器传热传质过程的数值模拟

本文首次利用水重力热管，以溴化锂水溶液为工质，对在热管外壁面上溶液降膜吸收水蒸气并移出吸收热的传热传质过程进行了数值模拟。结果表明，在一定条件下，所需热管加热段长度随膜雷诺数的增加而增加，随输出热温度的提高而减小，并且降膜平均传热和传质系数随膜雷诺数的增加而降低；利用热管作为吸收器的传热传质元件，其传热温差很小，但在较大浓差和较大雷诺数下，所需热管加热段长度太长。在热管外壁面上的溶液降膜吸收过程有待强化，以使吸收过程产生的热量与热管的传热能力相匹配。     

微通道内纳米流体的流动与换热特性

以不同浓度的TiO2-水纳米流体和水为冷却工质,在扇形微通道热沉内进行流动和换热特性模拟和实验研究. 模拟采用有限体积法的两相混合模型,搭建了能测量纳米流体流量、进出口压降和温度、底面加热膜温度的实验系统;工质在微通道内的雷诺数处于207~465,加热膜热流密度为2 × 106 W/m2 . 结果显示:在扇形微通道内,纳米流体的摩擦阻力系数随Re变化趋势与水相似,且均比水大;随着Re的增大,各工质的摩擦阻力系数下降. 纳米流体的传热性能强于水;随着TiO2纳米颗粒浓度和Re的增大,Nu升高,纳米流体的强化传热能力随之提高.     

溴化锂溶液真空表面蒸发实验研究

以质量浓度为0—15％溴化锂溶液为“工质”,研究操作温度在40～70℃条件下溶液真空表面蒸发过程。实验结果表明：溴化锂溶液的蒸发速率随溶液浓度的增大而减小,但随溶液温度的升高而增大;该实验条件下获得的对流传热系数值在700～1400W·m-2·℃-1范围内,且随溶液浓度增大而显著减小。这主要是由于溶液浓度增大使得其粘度显著增加,导致热阻增大所致。     

Analysis of heat transfer of loop heat pipe used to cool high power LED

A novel loop heat pipe (LHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of the loop heat pipe under different heat loads and incline angles have been investigated experimentally. The obtained results indicate that the thermal resistance of the heat pipe heat sink is in the range of 0.19–3.1 K/W, the temperature uniformity in the evaporator is controlled within 1.5°C, and the junction temperature of high power LED can be controlled steadily under 100°C for a heat load of 100 W.     

Experimental study on start-up characteristics of loop heat pipes

Loop heat pipes (LHPs) are two-phase heat transfer devices which utilize theevaporation and condensation of the working fluid to transfer heat. It consists of anevaporator, a condenser, a compensation chamber (CC) and vapor and liquid lines. Fig. 1 shows the detailed structure of the evaporator, CC and condenser of a LHP.The basic principles of LHP were introduced in ref. [1]. When LHPs start to work, liquidis vaporized in the vapor grooves, the menisci formed in the wick develop c…     

Design and performance test of miniature capillary pumped loop for electronics cooling

Considering two characteristics of compact heat dissipation room and high heat flux, a novel miniature capillary pumped loop (MCPL) for electronics cooling was proposed. MCPL consists of evaporator, condenser, vapor and liquid line dissipates heat by boiling and condensation of working fluids with no extra power consumption. Working fluid circulation is ensured by vapor pressure and capillary head. Saturated wick screens vapor and liquid, and ensures one-way flow of working fluid with no extra valve. In order to promote heat dissipation capacity of MCPL, the intensified boiling and condensation structures are embedded into evaporator and condenser respectively, which are useful to increasing boiling and condensation efficiency. Startup and run characteristics are tested by experiments in the condition of different power inputs and working fluids. MCPL is capable of dissipating 80 W of thermal energy and keeping the bottom substrate temperature of evaporator at 80 ℃.     

Experimental investigation on operating instability of a dual compensation chamber loop heat pipe

The operating instability of a dual compensation chamber loop heat pipe (DCC-LHP) including temperature hysteresis, reverse flow and temperature oscillation is described and explained in this paper. Test results indicate that the steady state operating temperature under the variable conductance mode is not the same during the power cycle tests with the same heat load, and it is lower during the power reduction cycle than that during the power increase cycle. Orientation has an effect on the heat load range when temperature hysteresis occurs, and the effect of power variation amplitude can be ignored. Reverse flow tends to occur in some of the startups at low heat loads, even if vapor existed in the vapor grooves initially, which is caused by a higher pressure inside the wick due to evaporation in the evaporator core or vapor penetration into it. Temperature oscillation tends to occur in some of the startups at low head loads or some steady-state operations at high heat loads. Especially when the compensation chamber with the bayonet through is above the evaporator, the incidence rate of temperature oscillation is high. Supported by the National Natural Science Foundation of China (Grant No. 50676006)     

液冷系统中均热板气液相变的热质传输模拟

为提高电池热管理液冷系统的均温性,研究一种铝槽式均热板和直流式液冷板相结合的复合液冷系统,并建立相应的三维传热模型。采用Volume-of-fluid(VOF)多相流模型,模拟均热板槽道内丙酮工质的气液相变过程,以及与液冷流道的耦合传热过程,并将模拟结果与实验结果进行了对比,验证了模型的正确性。研究结果显示,均热板可以提高液冷系统散热过程中的均温性,加热表面的温差可以控制在2.72 K以内。通过机理分析发现,其原因与均热板内部气液工质的热质传输过程有关。在液冷系统冷却液沿程温升的影响下,均热板腔室中的丙酮气相工质在长度方向上存在定向输运现象,相变产生的蒸汽会携带热量从高温区往低温区流动,从而抑制液冷板低温冷却水对加热表面温度分布的影响,提高了均温性能。     

Experiment investigation on visualization and operating characteristics of closed loop plate oscillating heat pipe with parallel channels

Using ethanol or acetone as the working fluid, visualization of oscillations in steady state was observed visually by high-speed cameras, and temperature oscillating and heat transfer characteristics of closed-loop plate oscillating heat pipe with parallel channels(POHP-PC) were experimentally investigated by varying liquid filled ratios(50%, 70%, 85%), section scales(1 mm×1 mm and 1 mm×1.5 mm), inclination angles, working fluids and heating inputs. It was found that during operating there was mixed flow consisting of plug flow and annular flow in channels of oscillating heat pipe at steady-state. There was an equilibrium position for working fluid of condenser during oscillating, and periodic oscillations occurred up and down in the vicinity of equilibrium position. With heat input increasing, equilibrium position rose slowly as a result of vapor pressure of evaporation.Evaporation temperature oscillating amplitude possessed a trend of small-large-small and frequency trend was of small-large during steady-state. It may be generally concluded that temperature, whether evaporator or condenser, fluctuated sharply or rose continuously when oscillating heat pipe coming to dry burning state. Simultaneously, it was found that temperature difference of cooling water possibly dropped with heat input rising during dry burning state. Thermal resistance of No. 2 with acetone was lower than that of No. 1 during experiments, but No. 2 achieving heat transfer limit was earlier than No. 1. However, with ethanol, thermal resistance of No. 1 and No. 2 were similar with the heating input less than 110-120 W and filling ratios of 50% and 70%. And with filling ratio of 85%, heating transfer performance of No. 2 was better compared to No. 1 during all the experiments.     

中低温地热发电有机朗肯循环工质的选择

为了筛选出适合于中低温地热发电有机朗肯循环的较优有机工质,采用热动循环的分析方法及PR状态方程计算以10种干流体有机工质为循环工质的中低温地热发电有机朗肯循环的效率及其余主要热力性能.结果表明,总体来看,随着循环工质临界温度的升高,蒸发压力、凝结压力、输出功率及效率呈下降趋势,而循环热效率及地热流经换热后的排放（或回灌）温度呈上升趋势.以R227ea（七氟丙烷）作工质的有机朗肯循环系统输出功率及效率最高,蒸发压力及凝结压力均处于较合适的范围,R227ea是中低温地热发电有机朗肯循环较理想的工质.     

电场强化微槽道结构蒸发器传热特性的实验研究

为了研究矩形微槽道表面施加电场后对蒸发/沸腾换热特性的影响,以R141b为工质展开实验.实验结果表明:高压电场对微槽道结构的蒸发/沸腾换热有明显的强化作用,蒸发/沸腾换热系数随着电场强度的增加而增大,换热强化系数相比未施加电场的状况最大增加了0.7,在高热流密度时,换热强化系数的变化则趋于平缓.     

Thermal analysis of an innovative flat heat pipe radiator

An innovative flat heat pipe radiator was put forward, and it has the features of high efficiency of heat dissipation, compact construction, low thermal resistance, light weight, low cost, and anti-dust-deposition. The thermal analysis of the flat heat pipe radiator for cooling high-power light emitting diode (LED) array was conducted. The thermal characteristics of the flat heat pipe radiator under the different heat loads and incline angles were investigated experimentally in natural convection. An electro-thermal conversion method was used to measure the junction temperature of the LED chips. It is found that the integral temperature distribution of the flat heat pipe radiator is reasonable and uniform. The total thermal resistance of the flat heat pipe radiator varies in the range of 0.38–0.45 K/W. The junction temperatures of LED chips with the flat heat pipe radiator and with the aluminum board at the same forward current of 0.35 A are 52.5 and 75.2 °C, respectively.