Nanoscale ITO/ZnO layer-texturing for high-efficiency InGaN/GaN light emitting diodes

We propose a simple technique to improve the light extraction efficiency of GaN-based light emitting diodes (LEDs) by using nanoscale ITO/ZnO layer-texturing. The surface texturing of the ITO and ZnO layers was performed using a wet chemical etching and a spin-coating process, respectively. It has been found that the light extraction efficiency of the ITO-/ZnO-textured LED was 34.5% greater than that of a conventional LED with a planar ITO, at 20 mA of current injection. A high level of multiple light scattering at the textured surface promoted a high-efficiency in the InGaN/GaN LEDs. In addition, the individual performance of the ITO and ZnO texturing on the LED surface was also investigated. The lowered forward voltage of the ITO/ZnO layer-textured LED indicated this could be a damage-free approach for device fabrication.     

Controlling electron overflow in phosphor-free InGaN/GaN nanowire white light-emitting diodes

We have investigated for the first time the impact of electron overflow on the performance of nanowire light-emitting diodes (LEDs) operating in the entire visible spectral range, wherein intrinsic white light emission is achieved from self-organized InGaN quantum dots embedded in defect-free GaN nanowires on a single chip. Through detailed temperature-dependent electroluminescence and simulation studies, it is revealed that electron leakage out of the device active region is primarily responsible for efficiency degradation in such nanowire devices, which in conjunction with the presence of nonradiative surface recombination largely determines the unique emission characteristics of nanowire light-emitting diodes. We have further demonstrated that electron overflow in nanowire LEDs can be effectively prevented with the incorporation of a p-doped AlGaN electron blocking layer, leading to the achievement of phosphor-free white light-emitting diodes that can exhibit for the first time virtually zero efficiency droop for injection currents up to ~2200 A/cm(2). This study also provides unambiguous evidence that Auger recombination is not the primary mechanism responsible for efficiency droop in GaN-based nanowire light-emitting diodes.     

Enhanced performance of GaN-based LEDs via electroplating of a patterned copper layer on the backside

InGaN/GaN multi-quantum well light-emitting diodes (LEDs) are conventionally grown on a sapphire substrate due to a lack of compatible substrates with a high compressive strain. This is a result of the relatively large lattice, and thermal expansion coefficient mismatches between GaN and sapphire. The compressive strain is considered to be a major obstacle to further improve next-generation high-performance GaN-based LEDs. In this paper, we have designed, electroplated, and tested an efficient substrate using a patterned copper (Cu) layer on the backside of sapphire to relax the compressive strain in a GaN epilayer. The patterned Cu layer has a significant function in that it supports the GaN/sapphire LEDs with an external tensile stress. The external tensile stress is capable of compensating for the compressive strain in the GaN/sapphire LEDs by controlling the curvature of the wafer bowing. This patterned Cu layer, when applied to the GaN/sapphire LEDs, suppresses the compressive strain by up to 0.28 GPa. The GaN-based LEDs on this innovative and effective sapphire/Cu substrate offer improved optical and electrical performance.     

High efficiency GaN-based light-emitting diodes with embedded air voids/SiO2 nanomasks

In this paper, the high performance GaN-based light-emitting diodes (LEDs) with embedded microscale air voids and an SiO(2) nanomask by metal-organic chemical vapor deposition (MOCVD) were demonstrated. Microscale air voids and an SiO(2) nanomask were clearly observed at the interface between GaN nanorods (NRs) and the overgrown GaN layer by scanning electron microscopy (SEM). From the reflectance spectra we show strong reflectance differences due to the different refractive index gradient between the GaN grown on the nanotemplate and sapphire. It can increase the light extraction efficiency due to additional light scattering. The transmission electron microscopy (TEM) images show the threading dislocations were suppressed by nanoscale epitaxial lateral overgrowth (NELOG). The LEDs with embedded microscale air voids and an SiO(2) nanomask exhibit smaller reverse-bias current and large enhancement of the light output (65% at 20 mA) compared with conventional LEDs.     

Room-temperature red emission from light-emitting diodes with Eu-doped GaN grown by organometallic vapor phase epitaxy

We obtained room-temperature red emission from GaN-based light-emitting diodes (LEDs) using a Eu-doped GaN (GaN:Eu) as an active layer. The bright emission was observed under normal lighting condition, which is associated with the intra-4f shell transition of Eu³⁺ ions. The LED properties depends on the growth condition of GaN:Eu layer. Since the high-quality GaN can be grown at higher growth pressure, the intense electroluminescence (EL) was observed in the LED with a GaN:Eu active layer grown at atmospheric pressure, which is due to the enhancement of the energy transfer efficiency from the GaN host material to the Eu ions. At a d.c. current of 20 mA, the light output power and external quantum efficiency were 17 μW and 0.04%, respectively. These results indicate the feasibility of GaN:Eu to realize a GaN-based red emitter for fabrication of nitride-based monolithic optical devices.     

Innovational radiation sensor by integrating AL2O3:C optically stimulated luminescent dosemeter and GaN detectors

We report a new dosimetry concept that is built on an earlier integrated sensor concept by our group at University of Washington to integrate a radiation-dosimetry-quality Al2O3:C and a high quantum-efficiency GaN-based p-i-n photodiode on one side, and light emitting diodes (LEDs) on the opposite side as the stimulation source. The performance of the sensor has been evaluated by computer simulation, the performance of GaN photodiodes and studying the GaN films. The absorption spectrum of the GaN film was measured and indicated that the GaN photodiodes would not respond to the output wavelengths of the stimulating LEDs. The electrical properties and the performance of GaN p-i-n photodiode under irradiation were simulated. The results showed that the sensor offered comparable radiation sensitivity to current technologies and could be operated in active mode.     

Temperature-dependent nonradiative recombination processes in GaN-based nanowire white-light-emitting diodes on silicon

In this paper, we have performed a detailed investigation of the temperature- and current-dependent emission characteristics of nanowire light-emitting diodes, wherein InGaN/GaN dot-in-a-wire nanoscale heterostructures and a p-doped AlGaN electron blocking layer are incorporated in the device's active region to achieve white-light emission and to prevent electron overflow, respectively. Through these studies, the Auger coefficient is estimated to be in the range of ～10(-34) cm(6) s(-1) or less, which is nearly four orders of magnitude smaller than the commonly reported values of planar InGaN/GaN heterostructures, suggesting Auger recombination plays an essentially negligible role in the performance of GaN-based nanowire light-emitting diodes. It is observed, however, that the performance of such nanowire LEDs suffers severely from Shockley-Read-Hall recombination, which can account for nearly 40% of the total carrier recombination under moderate injection conditions (～100 A cm(-2)) at room temperature. The Shockley-Read-Hall nonradiative lifetime is estimated to be in the range of a few nanoseconds at room temperature, which correlates well with the surface recombination velocity of GaN and the wire diameters used in this experiment.     

MBE grown InGaN quantum dots and quantum wells: effects of in-plane localization

InGaN/GaN heterostructure samples were grown by molecular beam epitaxy using ammonia as a nitrogen precursor. The growth of InGaN/GaN self-assembled quantum dots was monitored in situ by reflection high energy electron diffraction intensity oscillations. Atomic force microscopy scans showed a very high density of InGaN islands, 1×10¹¹ cm⁻², well above the dislocation density. This could explain the increased radiative efficiency of these samples compared to homogeneous quantum wells. Light emitting diodes (LEDs) with InGaN active layers buried in GaN were realized. Electroluminescence and photocurrent spectra of these LEDs evidence a strong Stokes shift that can be attributed to high localization of carriers in InGaN layers.     

Cathodoluminescence study of crystalline quality of (Al, In, Ga)N heterostructures

Wurtzite InGaN/GaN and AlGaN/GaN heterostructures grown by metal organic vapor phase epitaxy were studied using cathodoluminescence (CL) combined with secondary electron microscopy (SEM) and scanning transmission electron microscopy (STEM). The surface morphology of samples containing InGaN layers is dominated by three types of defects: mesa-like hexagonal structures, hexagonal pyramids and micropipes. At the positions of pyramids the whole epilayer is thicker than at defect free positions, while at the positions of micropipes the whole epilayer is much thinner. The luminescence efficiency as well as the emission wavelength are influenced by these defects. In SL structures an increasing SL period thickness in the growth direction was observed. Panchromatic CL images show intensity inhomogeneity in both InGaN/GaN and AlGaN/GaN heterostructure, which are related to local variations of the interface quality. In AlGaN/GaN SQW structures a broad deep-level luminescence band at around 543 nm was observed, which is generally absent in InGaN/GaN heterostructures. This deep-level emission is strongly enhanced in defect positions.     

InGaN-based nano-pillar light emitting diodes fabricated by self-assembled ITO nano-dots

InGaN/GaN based nano-pillar light emitting diodes (LEDs) with a diameter of 200-300 nm and a height of 500 nm are fabricated by inductively coupled plasma etching using self-assembled ITO nano-dots as etching mask, which were produced by wet etching of the as-deposited ITO films. The peak PL intensity of the nano-pillar LEDs was significantly higher than that of the as-grown planar LEDs, which can be attributed to the improvement of external quantum efficiency of the nano-pillar LEDs due to the large sidewall of the nano-pillars. We have also demonstrated electrical pumping of the InGaN/GaN based nano-pillar LEDs with a self-aligned TiO2 layer as a passivation of sidewall of the nano-pillars.     

Characterization of InGaN/GaN light-emitting diodes with micro-hole arrayed indium-tin-oxide layer

We demonstrate that InGaN/GaN multiple quantum well light-emitting diodes (LEDs) with micro-hole arrayed indium-tin-oxide layers exhibit better performance and optoelectrical properties than do conventional LEDs. Under 20 mA injection current operation the room-temperature output power conversion efficiency and external quantum efficiency obtained by employing a micro-hole array on the top surface of the LED structure could be increased by 28.7% and 14.3%, respectively, over that of conventional broad area devices. The room temperature current-voltage characteristics of the LEDs showed the series resistance and leakage current to be related to the hole dimensions and etching depth, respectively. Interestingly, the leakage current of the transparent conductive layer was dominated by the contribution of the micro-hole side-wall, the number of etched micro-holes, and the wet-etching depth. We conclude that a well-designed micro-hole array structure fabricated using the wet etching process can indeed, not only significantly inhibit the leakage current of the indium-tin-oxide transparent conductive layer, but also enhance the external quantum efficiency and extraction efficiency over a broad temperature range.     

Characteristics of dielectrophoretically aligned UV-blue GaN nanowire LEDs

This is a report on the characteristics of UV-blue light emitting diodes (LEDs) containing homojunction gallium nitride (GaN) nanowires (NWs). These LEDs were prepared by the dielectrophoresis assisted assembly deposition (DAAD) method. The incorporation of an additional silicon dioxide (SiO2) and a Au capping metal layer was found to improve the electrical and optical properties of the DAAD-prepared GaN NW LEDs. These LEDs exhibited a parasitic series resistance of 120-180 komega with a sharp turn-on forward voltage of 3.4-4.0 V and had as low as approximately approximately 7 x 10(-7) A of leakage current for a reverse bias of -10 V. Typical electroluminescence (EL) spectra, observed from these LEDs under a forward bias, had a broad ultraviolet (UV)-blue emission with a wavelength of 388-422 nm. These LEDs could be seen with the naked eye. We concluded that the high-brightness EL spectra resulted from the enhancement of the carrier injection due to the size effect of the n-GaN nanowires on the p-GaN substrate.     

基于双蓝光有源区激发YAG:Ce荧光粉的高显色性白光LED

在(0001)蓝宝石衬底上利用金属有机化学气相沉积系统,分别生长含有p-AlGaN电子阻挡层和反对称n-AlGaN层的双蓝光波长发射的InGaN/GaN混合多量子阱发光二极管(LED)。结果发现,与传统的具有p-AlGaN电子阻挡层的双蓝光波长LED相比,这种n-AlGaN层能有效改善电子和空穴在混合多量子阱活性层中的分布均匀性和减少电子溢出,并减弱双蓝光发射光谱对电流的依赖性。此外,基于这种双蓝光波长发射的芯片与YAG:Ce荧光粉封装成白光LED能实现高显色性的白光发射,在20 mA电流驱动下,6500 K色温时显色指数达到91,而基于单蓝光芯片的白光LED显色指数只有75。     

AZO薄膜用于GaN基LED透明电极的性能研究

采用脉冲激光沉积法制备了Al掺杂ZnO(AZO)薄膜, 研究了不同沉积氧压下薄膜的光电性能。当沉积压强为0.1 Pa时, AZO薄膜光电性能最优。将该薄膜用于GaN基LED透明电极作为电流扩展层, 在20 mA正向电流下观察到了520 nm处很强的芯片发光峰, 但芯片工作电压较高, 约为10 V, 芯片亮度随正向电流的增大而增强。二次离子质谱测试表明, AZO薄膜与GaN层界面处两种材料导电性能的变化以及钝化层的形成是导致芯片工作电压偏高的原因。     

Characteristics of AlGaN-based deep ultraviolet light-emitting diodes with a hole strengthened-injection layer

The optical and electrical properties of AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs) with the novel Mg-doping hole strengthened-injection layer (HSIL) are studied numerically and compared with conventional DUV LEDs. In this paper, two kinds of inserted layer of DUV LEDs have been investigated theoretically by the advanced physical model of semiconductor device (APSYS) software. The internal quantum efficiency, light output power, energy band diagrams, distributions of carrier concentration, radiative recombination rate and spontaneous emission intensity of three structures are calculated. The simulation results reveal that the carrier concentration and radiative recombination rates in the multiple quantum wells of DUV LEDs with HSIL are enhanced significantly. Moreover, the HSIL between EBL and p-doped region is able to reduce effective barrier height for holes in valence band, which is beneficial for hole injection from the p-doped region. As a result, the devices with HSIL, which is capable of alleviating the efficiency droop as the injection current increases, show excellent optical performance.     

High performance of GaN-based flip-chip light-emitting diodes with hole-shape patterned ITO ohmic contact layer and AgIn reflector

The enhancement of light extraction efficiency is observed when the hole-shape patterned ITO ohmic contact layer and AgIn reflector is adopted in GaN-based flip-chip (FC) light emitting diodes (LEDs). ITO layer (140 nm) and AgIn (200 nm) was deposited on the top of p-GaN by in-line DC sputtering and electron beam evaporating system, respectively. The ITO ohmic contact layer showed a low specific contact resistance of 2.66 x 10(-5) Omega cm(-2) and high transmittance of >85% at visible spectral regions. The AgIn reflector exhibited a low specific contact resistance of 1.90 x 10(-5) Omega cm(-2) and high reflectance of approximately 84% at visible spectral regions. Comparing with unpatterned ITO/AgIn layer, the optical output power of GaN-based FC LEDs improves approximately 30% by the adoption of micro size hole-shape patterned ITO ohmic contact layer and AgIn reflector.     

硅衬底GaN基LED研究进展

由于硅具有价格低、热导率高、大直径单晶生长技术成熟等优势以及在光电集成方面的应用潜力,GaN/Si基器件成为一个研究热点.然而,GaN与Si之间的热失配容易引起薄膜开裂,这是限制LED及其它电子器件结构生长的一个关键问题.近年来,随着工艺的发展,GaN晶体质量得到大幅度的提高.同时不少研究小组成功地在Si衬底上制造出LED.介绍了GaN薄膜开裂问题及近期硅衬底GaN基LED的研究进展.     

Submicrometre resolved optical characterization of green nanowire-based light emitting diodes

The electroluminescent properties of InGaN/GaN nanowire-based light emitting diodes (LEDs) are studied at different resolution scales. Axial one-dimensional heterostructures were grown by plasma-assisted molecular beam epitaxy (PAMBE) directly on a silicon (111) substrate and consist of the following sequentially deposited layers: n-type GaN, three undoped InGaN/GaN quantum wells, p-type AlGaN electron blocking layer and p-type GaN. From the macroscopic point of view, the devices emit light in the green spectral range (around 550 nm) under electrical injection. At 100 mA DC current, a 1 mm2 chip that integrates around 10(7) nanowires emits an output power on the order of 10 μW. However, the emission of the nanowire-based LED shows a spotty and polychromatic emission. By using a confocal microscope, we have been able to improve the spatial resolution of the optical characterizations down to the submicrometre scale that can be assessed to a single nanowire. Detailed μ-electroluminescent characterization (emission wavelength and output power) over a representative number of single nanowires provides new insights into the vertically integrated nanowire-based LED operation. By combining both μ-electroluminescent and μ-photoluminescent excitation, we have experimentally shown that electrical injection failure is the major source of losses in these nanowire-based LEDs.     

p-Type modulation doped InGaN/GaN dot-in-a-wire white-light-emitting diodes monolithically grown on Si(111)

Full-color, catalyst-free InGaN/GaN dot-in-a-wire light-emitting diodes (LEDs) were monolithically grown on Si(111) by molecular beam epitaxy, with the emission characteristics controlled by the dot properties in a single epitaxial growth step. With the use of p-type modulation doping in the dot-in-a-wire heterostructures, we have demonstrated the most efficient phosphor-free white LEDs ever reported, which exhibit an internal quantum efficiency of ～56.8%, nearly unaltered CIE chromaticity coordinates with increasing injection current, and virtually zero efficiency droop at current densities up to ～640 A/cm(2). The remarkable performance is attributed to the superior three-dimensional carrier confinement provided by the electronically coupled dot-in-a-wire heterostructures, the nearly defect- and strain-free GaN nanowires, and the significantly enhanced hole transport due to the p-type modulation doping.     

Effect of residual compressive stress on near-ultraviolet InGaN/GaN multi-quantum well light-emitting diodes

Thinning was investigated to reduce the residual compressive stress in GaN-based near-ultraviolet light-emitting diode (NUV-LED) substrates. This stress has a knock-on effect of reducing piezoelectric fields in the LED structure. As the sapphire substrate thickness is reduced, the compressive stress in the GaN layer is released, resulting in wafer bowing. The wafer bowing-induced mechanical stress alters the piezoelectric fields, which in turn reduces the quantum-confined Stark effect in the InGaN/GaN active region of the LED. The electroluminescence spectral peak wavelength was blue-shifted, and the internal quantum efficiency was improved by about 15% at an injection current of 50 mA. The LED with a 45-μm-thick sapphire substrate exhibited the highest light output power of ∼29 mW at an injection current of 50 mA, an improvement by about 39% compared to that of a 150-μm-thick sapphire substrate without increasing the operating voltage. The simulation results confirm that the relaxation of the compressive strain in the InGaN/GaN MQW structure results in the reduction of the piezoelectric field and improves the overlap of electron and hole wave functions with a corresponding increase in IQE.