Active‐matrix organic light‐emitting displays employing two thin‐film‐transistor a‐Si:H pixels on flexible stainless‐steel foil

Abstract— An active‐matrix organic light‐emitting diode (AMOLED) display driven by hydrogenated amorphous‐silicon thin‐film transistors (a‐Si:H TFTs) on flexible, stainless‐steel foil was demonstrated. The 2‐TFT voltage‐programmed pixel circuits were fabricated using a standard a‐Si:H process at maximum temperature of 280°C in a bottom‐gate staggered source‐drain geometry. The 70‐ppi monochrome display consists of (48 × 4) × 48 subpixels of 92 ×369 μm each, with an aperture ratio of 48%. The a‐Si:H TFT pixel circuits drive top‐emitting green electrophosphorescent OLEDs to a peak luminance of 2000 cd/m².     

Polysilicon TFT technology on flexible metal foil for AMPLED displays

Abstract— A top‐emitting 230‐dpi active‐matrix polymer light‐emitting diode (AMPLED) display, having a VGA format and a 3.3‐in.‐diagonal size, on a flexible stainless‐steel‐foil substrate is reported. The active‐matrix array was fabricated with laser‐crystallized polysilicon TFTs at a maximum process temperature of 700°C. The top‐emitting PLED diodes were prepared by spin‐casting organic light‐emitting polymers. This work demonstrates the compatibility of polysilicon‐TFT technology with flexible metal‐foil substrates for active‐matrix organic light‐emitting‐diode (AMOLED) display applications.     

High‐temperature thin‐film barriers for foldable AMOLED displays

We present a thin‐film dual‐layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light‐emitting diode displays and that can facilitate foldable active‐matrix organic light‐emitting diode devices with a bending radius of <2 mm. We demonstrate organic light‐emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high‐temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active‐matrix organic light‐emitting diode displays on GEN1‐sized substrates.     

9.1‐inch stretchable AMOLED display based on LTPS technology

In this work, we report a freeform shaped active‐matrix organic light‐emitting diode (AMOLED) display based on low‐temperature polycrystalline silicon technology. It was found that our AMOLED, developed with a unique pixel structure, can withstand in various desired shapes featuring its stretchable property with no degradation of image quality and device characteristics. We demonstrated unprecedented convex/concave shape of the 9.1‐inch AMOLED display by low‐temperature thermoforming process. The AMOLED display with freeform design is promising for future display applications such as automotive, Internet of things devices, and wearable electronics.     

Circuits and AMOLED display with self‐aligned a‐IGZO TFTs on polyimide foil

A process to make self‐aligned top‐gate amorphous indium‐gallium‐zinc‐oxide (a‐IGZO) thin‐film transistors (TFTs) on polyimide foil is presented. The source/drain (S/D) region's parasitic resistance reduced during the SiN interlayer deposition step. The sheet resistivity of S/D region after exposure to SiN interlayer deposition decreased to 1.5 kΩ/□. TFTs show field‐effect mobility of 12.0 cm²/(V.s), sub‐threshold slope of 0.5 V/decade, and current ratio (I_ON/OFF) of >10⁷. The threshold voltage shifts of the TFTs were 0.5 V in positive (+1.0 MV/cm) bias direction and 1.5 V in negative (?1.0 MV/cm) bias direction after extended stressing time of 10⁴ s. We achieve a stage‐delay of ~19.6 ns at V_DD = 20 V measured in a 41‐stage ring oscillator. A top‐emitting quarter‐quarter‐video‐graphics‐array active‐matrix organic light‐emitting diode display with 85 ppi (pixels per inch) resolution has been realized using only five lithographic mask steps. For operation at 6 V supply voltage (V_DD), the brightness of the display exceeds 150 cd/m².     

Highly reliable a‐IGZO TFTs on a plastic substrate for flexible AMOLED displays

We have successfully reduced threshold voltage shifts of amorphous In–Ga–Zn–O thin‐film transistors (a‐IGZO TFTs) on transparent polyimide films against bias‐temperature stress below 100 mV, which is equivalent to those on glass substrates. This high reliability was achieved by dense IGZO thin films and annealing temperature below 300 °C. We have reduced bulk defects of IGZO thin films and interface defects between gate insulator and IGZO thin film by optimizing deposition conditions of IGZO thin films and annealing conditions. Furthermore, a 3.0‐in. flexible active‐matrix organic light‐emitting diode was demonstrated with the highly reliable a‐IGZO TFT backplane on polyimide film. The polyimide film coating process is compatible with mass‐production lines. We believe that flexible organic light‐emitting diode displays can be mass produced using a‐IGZO TFT backplane on polyimide films.     

Power saving through state retention in IGZO‐TFT AMOLED displays for wearable applications

We present a qHD (960 × 540 with three sub‐pixels) top‐emitting active‐matrix organic light‐emitting diode display with a 340‐ppi resolution using a self‐aligned IGZO thin‐film transistor backplane on polyimide foil with a humidity barrier. The back plane process flow is based on a seven‐layer photolithography process with a CD = 4 μm. We implement a 2T1C pixel engine and use a commercial source driver IC made for low‐temperature polycrystalline silicon. By using an IGZO thin‐film transistor and leveraging the extremely low off current, we can switch off the power to the source and gate driver while maintaining the image unchanged for several minutes. We demonstrate that, depending on the image content, low‐refresh operation yields reduction in power consumption of up to 50% compared with normal (continuous) operation. We show that with the further increase in resolution, the power saving through state retention will be even more significant.     

Fast voltage‐driving scheme for AMOLED displays based on internal feedback

Abstract— A new driving scheme for active‐matrix organic light‐emitting diodes (AMOLED) displays based on voltage programming is proposed. While conventional voltage drivers have a trade‐off between speed and accuracy, the new scheme is inherently fast and accurate. Based on the new driving scheme, a fast pixel circuit is designed using amorphous‐silicon (a‐Si) thin‐film transistors (TFTs). As the simulation results indicate, this pixel circuit can compensate the threshold‐voltage shift (VT shift) of the driver transistors. This pixel can be programmed in just 10 μsec, and it can compensate the threshold‐voltage shifts over 5 V with an error rate of less than 5% for a 1 ‐μA pixel current.     

Threshold‐voltage‐compensation methods for AMOLED pixel and analog buffer circuits

Abstract— New pixel‐circuit designs for active‐matrix organic light‐emitting diodes (AMOLEDs) and a new analog buffer circuit for the integrated data‐driver circuit of active‐matrix liquid‐crystal displays (AMLCDs) and AMOLEDs, based on low‐temperature polycrystalline‐silicon thin‐film transistors (LTPS‐TFTs), were proposed and verified by SPICE simulation and measured results. Threshold‐voltage‐compensation pixel circuits consisting of LTPS‐TFTs, an additional control signal line, and a storage capacitor were used to enhance display‐image uniformity. A diode‐connected concept is used to calibrate the threshold‐voltage variation of the driving TFT in an AMOLED pixel circuit. An active load is added and a calibration operation is applied to study the influences on the analog buffer circuit. The proposed circuits are shown to be capable of minimizing the variation from the device characteristics through the simulation and measured results.     

Effects of post‐annealing on a‐Si:H TFT characteristics fabricated on stainless‐steel substrate

Abstract— A 14.1‐in.‐diagonal backplane employing hydrogenated amorphous‐silicon thin‐film transistors (a‐Si:H TFTs) was fabricated on a flexible stainless‐steel substrate. The TFTs exhibited a field‐effect mobility of 0.54 cm²/V‐sec, a threshold voltage of 1.0 V, and an off‐current of 10^?13 A. Most of the electrical characteristics were comparable to those of the TFTs fabricated on glass substrates. To increase the stability of a‐Si:H TFTs fabricated on stainless‐steel substrate, the specimens were thermally annealed at 230°C. The field‐effect mobility was reduced to 71% of the initial value because of the strain of the released hydrogen atoms and residual compressive stress in a‐Si:H TFT under thermal annealing at 230°C.     

A flexible full‐color AMOLED display driven by OTFTs

Abstract— Organic thin‐film‐transistor (OTFT) technologies have been developed to achieve a flexible backplane for driving full‐color organic light‐emitting diodes (OLEDs) with a resolution of 80 ppi. The full‐color pixel structure can be attained by using a combination of top‐emission OLEDs and fine‐patterned OTFTs. The fine‐patterned OTFTs are integrated by utilizing an organic semiconductor (OSC) separator, which is an insulating wall structure made of an organic insulator. Organic insulators are actively used for the OTFT integration, as well as for the separator, in order to enhance the mechanical flexibility of the OTFT backplane. By using these technologies, active‐matrix OLED (AMOLED) displays can be driven by the developed OTFT backplane even when they are mechanically flexed.     

Comparison of a‐Si and Poly‐Si for AMOLED displays

Abstract— The characteristics of OLED backplanes including the intrinsic properties of a‐Si TFTs and LTPS TFTs will be reviewed. While LTPS TFTs reveal satisfactory stability in AMOLED‐display applications, a‐Si AMOLEDs show better uniformity and are capable of driving OLEDs. However, the stability of a‐Si TFTs under long‐term operation is still unacceptable and remains to be the key issue constraining the commercialization of a‐Si TFT AMOLEDs.     

5.8‐inch QHD flexible AMOLED display with enhanced bendability of LTPS TFTs

By applying the curve‐type thin film transistor (TFT) with longitudinal strain, TFT parameters do change little down to the 2R bending. The mobility variation range reduces down to 4% compared with 28% of the line‐type channel with transverse strain. The smaller variation is preferred for a high quality display. We clarified that majority carrier's effective mass and scattering rate are dominant factors influencing the bended TFT's performance, which can be controlled by the strain orientation and channel shape. This understanding and improvement was embedded in the 5.8″ flexible QHD active matrix organic light emitting diode panel with multi edge curvature of Galaxy S8. Through this achievement, we made our flexible premium active matrix organic light emitting diode panels more performable, reliable, and highly productive in small R bending circumstance.     

A fully integrated 1‐in. AMOLED display using current feedback based on a five‐mask LTPS CMOS process

Abstract— In the past, a five‐mask LTPS CMOS process requiring only one single ion‐doping step was used. Based on that process, all necessary components for the realization of a fully integrated AMOLED display using a 3T1C current‐feedback pixel circuit has recently been developed. The integrated data driver is based on a newly developed LTPS operational amplifier, which does not require any compensation for Vth or mobility variations. Only one operational amplifier per column is used to perform digital‐to‐analog conversion as well as current control. In order to achieve high‐precision analog behavior, the operational amplifier is embedded in a switched capacitor network. In addition to circuit verification by simulation and analytic analysis, a 1‐in. fully integrated AMOLED demonstrator was successfully built. To the best of the authors' knowledge, this is the first implementation of a fully integrated AMOLED display with current feedback.     

Flexible active‐matrix OLED displays: Challenges and progress

Abstract— Organic light‐emitting‐device (OLED) devices are very promising candidates for flexible‐display applications because of their organic thin‐film configuration and excellent optical and video performance. Recent progress of flexible‐OLED technologies for high‐performance full‐color active‐matrix OLED (AMOLED) displays will be presented and future challenges will be discussed. Specific focus is placed on technology components, including high‐efficiency phosphorescent OLED technology, substrates and backplanes for flexible displays, transparent compound cathode technology, conformal packaging, and the flexibility testing of these devices. Finally, the latest prototype in collaboration with LG. Phillips LCD, a flexible 4‐in. QVGA full‐color AMOLED built on amorphous‐silicon backplane, will be described.     

Performance of high‐efficiency AMOLED displays

Abstract— In this paper, the performance of active‐matrix‐driven small‐molecule OLED displays incorporating high‐efficiency electrophosphorescent dopants were analyzed. These enable triplet excitons to contribute to light emission and have led to pixel efficiencies of over 40 lm/W. By considering a conventional two TFT per pixel addressing scheme, we show how this OLED design enables the fabrication of very‐low‐power‐consumption displays (lower than AMLCDs). We simulate display performance and perform a trade‐off analysis comparing the power consumption of displays driven by both amorphous‐silicon and low‐temperature poly‐Si TFTs.     

Flexible OLED display development: Strategy and status

Abstract— In this paper, the current status of flexible OLED (FOLED®) display development will be reviewed, including previous results for passive‐matrix displays on plastic and current progress on active‐matrix displays on steel foil. The displays incorporate high‐efficiency small‐molecule phosphorescence OLED (PHOLE?) technology. The ultimate goal is to develop high‐information‐content high‐performance long‐lived, and large‐area FOLED displays that can be pulled or rolled out from a smaller pen‐like housing. The strategy for achieving this goal will be presented.     

A scalable manufacturing process for flexible active‐matrix e‐paper displays

Abstract— A scalable manufacturing process for fabricating active‐matrix backplanes on low‐cost flexible substrates, a key enabler for electronic‐paper displays, is presented. This process is based on solution processing, ink‐jet printing, and laser patterning. A multilayer architecture is employed to enable high aperture ratio and array performance. These backplanes were combined with E Ink electrophoretic media to create high‐performance displays that have high contrast, are bistable, and can be flexed repeatedly to a radius of curvature of 5 mm.     

Static active‐matrix OLED display without pixel refresh enabled by amorphous‐silicon non‐volatile memory

Abstract— An active‐matrix organic light‐emitting‐diode (AMOLED) display which does not require pixel refresh is demonstrated. This was achieved by replacing the thin‐film transistor (TFT) that drives the OLED with a non‐volatile memory TFT, in a 2‐transistor pixel circuit. The threshold voltage of the non‐volatile‐memory TFT can be changed by applying programming voltage pulses to the gate electrode. This approach eliminates the need for storage capacitors, increases the pixel fill factor, and potentially reduces power consumption. Each pixel can be individually programmed or erased using a standard active‐matrix addressing scheme. The programmed image is stored in the display even if power is turned off.     

Flexible thin‐film transistors application of amorphous tin oxide‐based semiconductors

The structural, optical, and electrical properties of Si‐doped SnO₂ (STO) films were investigated in terms of their potential applications for flexible electronic devices. All STO films were amorphous with an optical transmittance of ~90%. The optical band gap was widened as the Si content increased. The Hall mobility and carrier density were improved in the SnO₂ with 1 wt% Si film, which was attributed to the formation of donor states. Si (1 wt%) doped SnO₂ thin‐film transistor exhibited a good device performance and good stability with a saturation mobility of 6.38 cm²/Vs, a large I_on/I_off of 1.44 × 10⁷, and a SS value of 0.77 V/decade. The device mobility of a‐STO TFTs at different bending radius maintained still at a high level. These results suggest that a‐STO thin films are promising for fabricating flexible TFTs.