2 MeV Si ion implantation damage in relaxed Si1−xGex

The damage produced by implanting, at room temperature, 3 μm thick relaxed Si_1−xGe_x layers with 2 MeV Si⁺ ions has been measured as a function of Ge content (x = 0.04, 0.13, 0.24 or 0.36) and Si dose in the dose range 10¹⁰–10¹⁵ cm⁻². The accumulation of damage with increasing dose has been studied as a function of Ge content by Rutherford Backscattering Spectrometry, Optical Reflectivity Depth Profiling and Transmission Electron Microscopy and an increased damage efficiency in Si_1−xGe_x with increasing x is observed. The characteristics of implantation-induced defects have been investigated by Electron Paramagnetic Resonance. The results are discussed in the context of a model of the damage process in SiGe.     

A comparative EPR study of ion implantation induced damage in Si, Si1−xGex (x ≠ 0) and SiC

Electron Paramagnetic Resonance (EPR) measurements have been made to investigate the build up of damage in silicon in relaxed crystalline Si_1−xGe_x (x = 0.04, 0.13, 0.24, 0.36) and in 6H-SiC as a result of increasing the ion dose from low levels (10¹² cm⁻²) up to values (10¹⁵ cm⁻²) sufficient to produce an amorphous layer. Si, Si_1−xGe_x (x ≠ 0) and SiC were implanted at room temperature with 1.5 MeV Si, 2 MeV Si and 0.2 MeV Ge ions respectively. A comparison is made between the ways in which the type and population of paramagnetic defects depend on ion dose for each material.     

High temperature high dose C ion implantation in epitaxial SiGe

Si_{1 − x}Ge_x epitaxial layers fully strained (x = 0.27) and relaxed (x = 0.55) have been implanted with C ions at 500°C. Implantation energy and doses were selected to obtain the C peak in the central region of the SiGe layer, with a concentration similar to the Ge content. The implanted layers have been analyzed by Raman scattering, X-ray diffraction, transmission electron microscopy and secondary ion mass spectroscopy. The data obtained show the direct synthesis of β-SiC precipitates aligned in relation to the SiGe lattice after the implantation, as well as a Ge enrichment and stress relaxation of the SiGe lattice. For the relaxed layer a significant Ge redistribution from the implanted region is observed.     

Characterization of Si/GexSi1 − x heterojunction bipolar transistors formed by Ge ion implantation in Si

Epitaxial Si/Ge_xSi_{1 − x} heterojunctions were formed by high dose Ge ion implantation in Si followed by rapid thermal annealing at 1000°C for 10 s. This technique was adopted to fabricate Si/Ge_xSi_{1 − x} heterojunction n-p-n bipolar transistors (HBT) using a self-aligned, double polycrystalline silicon process commonly used for fast Si bipolar transistors. The devices are characterized by a 60 nm wide neutral base with a Ge concentration peak of ≈ 7 at.% at the base-collector junction. Good static and dynamic electrical characteristics are demonstrated and discussed.     

Micro-RBS characterisation of the chemical composition and particulate deposition on pulsed laser deposited Si1−xGex thin films

The formation and deposition of particulates by pulsed laser deposition of Si_1−xGe_x semiconductor alloy thin films are discussed. Using Rutherford backscattering spectrometry with micrometer lateral resolution (micro-RBS) the film composition was measured with high accuracy, even in the presence of particulates with a high areal density of 20,000–30,000 particulates per mm². We show that on impact of a particulate, the part of the thin film which is already deposited probably melts and its Ge content segregates to the surface.     

Rapid thermal annealing of arsenic implanted relaxed Si1−xGex

The electrical activity and redistribution during rapid thermal annealing (RTA) of high concentrations of As implanted into epitaxially grown, relaxed Si_1−xGe_x for x≤0.5 have been studied as a function of composition x and RTA parameters. At a given RTA temperature the maximum carrier concentration decreases and the redistribution increases with increasing x. Maximum carrier concentrations and junction depths as a function of composition and RTA parameters are given.     

Density measurement of amorphous SixGe1 − x alloys

The atomic density of amorphous Si_xGe_{1 − x} alloys (x = 1, 0.85, 0.67, 0.50, 0.20 and 0) has been measured. Mono-crystalline Si_xGe_1−x layers Were implanted with 1.50–2.75 MeV Si²⁺ and Ge²⁺ ions to produce the amorphous material. Using surface profilometry and RBS/channeling, it was found that amorphous alloys are less dense than the crystalline alloys, and that Vegard's law underestimates the a-Si_xGe_1−x density.     

Ion beam synthesis and recrystallization of amorphous SiGe/SiC structures

Si_1−xGe_x amorphous layers implanted with different doses of carbon (between 5 × 10¹⁵ and 2 × 10¹⁷ cm⁻² and annealed at 700°C and 900°C have been analyzed by Raman and Infrared spectroscopies, electron microscopy and Auger electron spectroscopy. The obtained data show the synthesis of amorphous SiC by implanting at the highest doses. In these cases, recrystallization only occurs at the highest annealing temperature (900°C). The structure of the synthesized SiC strongly depends on the implantation dose, in addition to the anneal temperature. For the highest dose (2 × 10¹⁷ cm⁻²), crystalline β-SiC is formed. Finally, a strong migration of Ge towards the Si substrate is observed from the region where SiC precipitation occurs.     

High resolution channeling contrast microscopy and channeling analysis of SiGe quantum well structures

High resolution channeling contrast microscopy (CCM) and channeling measurements were carried out to characterize SiGe quantum well structures on micron thick graded layers (i.e. virtual substrates). The virtual substrates were grown by gas source molecular beam epitaxy at a pressure of 10⁻⁵ mbar and low pressure chemical vapor deposition at 10⁻² mbar on boron doped Si(0 0 1) substrates respectively. A homoepitaxial silicon buffer layer was grown prior to the deposition. The nominal structure is a 20 nm Si_0.75Ge_0.25 layer at the surface, followed by 10 nm pure Si, 500 nm Si_0.75Ge_0.25 and a 1000 nm thick graded SiGe (0–26%) layer. RBS was used to measure the depth profiles, and angular scans around the (1 0 0) axis were carried out to assess crystal and interface quality. CCM was used to acquire depth resolved images of micron-sized lateral inhomogenities (‘cross-hatch') present on both samples.     

RBS investigations of buffer layers between YBa2Cu3O7−x and silicon

The deposition of high-quality high-T_c superconducting films on silicon wafers for future hybrid electronic devices is strongly hampered by the interdiffusion between films and substrate. This effect degrades the superconducting properties seriously and is a strong function of temperature. Since high processing temperatures are inevitable for good films, suitable buffer layers are needed to reduce the interdiffusion. We have investigated the combinations ZrO₂/Si(100), BaF₂/Si(100), and noble-metal/TiN/Si(100) at temperatures up to 780°C in oxidizing ambient. YBa₂Cu₃O_7−x films have been deposited onto the buffer layers by laser ablation. Thereafter the interfaces have been analyzed by Rutherford backscattering. So far only ZrO₂ has demonstrated sufficient stability to serve as a buffer layer for the laser-ablated YBa₂Cu₃O_7−x films. All other combinations suffer from interdiffusion or oxidation.     

The property of Si/SiGe/Si heterostructure during thermal budget characterized by HRXRD

Si/SiGe/Si heterostructures grown by ultra-high-vacuum chemical vapor deposition (UHVCVD) were characterized by Rutherford backscattering/Channeling (RBS/C) together with high resolution X ray diffraction (HRXRD). High quality SiGe base layer was obtained. The Si/SiGe/Si heterostructures were subject to conventional furnace annealing and rapid thermal annealing with temperature between 750℃ and 910℃. Both strain and its relaxation degree in SiGe layer are calculated by HRXRD combined with elastic theory, which are never reported in other literatures. The rapid thermal annealing at elevated temperature between 880℃ and 910℃ for very short time had almost no influence on the strain in Si0.84Ge0.16 epilayer. However, high temperature (900℃@) furnace annealing for 1h prompted the strain in Si0.84Ge0.16 layer to relax.     

Chemical thermodynamic representation of AmO2−x

The AmO_2−x solid solution data set for the dependence of the oxygen potential on the composition, x, and temperature was retrieved from the literature and represented by a thermodynamic model. The data set was analysed by least-squares using equations derived from the classical thermodynamic theory for the solid solution of a solute in a solvent. Two representations of the AmO_2−x data were used, namely the Am_5/4O₂–AmO₂ and AmO_3/2–AmO₂ solid solution. No significant difference was found between the two, and the Am_5/4O₂–AmO₂ solution was preferred on the basis of the phase diagram. From the results the Gibbs energy of formation of Am_5/4O₂ has been derived.     

Thermal stability and brazing characteristics of Zr0.7−xMxBe0.3 (M=Ti or Nb) ternary amorphous filler metals

The effects of Ti or Nb substitution on the thermal stability and brazing characteristics of Zr_0.7−xM_xBe_0.3 (M=Ti or Nb) ternary amorphous alloys were investigated in order to improve properties of Zr–Be binary amorphous alloy as a new filler metal for joining zirconium alloy. The Zr_0.7−xM_xBe_0.3 (M=Ti or Nb; 0x0.1) ternary amorphous alloys were produced by melt-spinning method. In the selected compositional range, the thermal stability of Zr_0.7−xTi_xBe_0.3 and Zr_0.7−xNb_xBe_0.3 amorphous alloys are improved by the substitution of titanium or niobium for zirconium. As the Ti and Nb content increases, the crystallization temperatures increase from 610°C to 717°C and 610°C to 678°C, respectively. These amorphous alloys were put into practical use in joining bearing pads on zircaloy cladding sheath. Using Zr–Ti–Be amorphous alloys as filler metals, smooth interface and spherical primary particles (proeutectic phase) appear in the brazed layer, which is the similar microstructure of using Zr_0.7Be_0.3 binary amorphous alloys. In the case of Zr–Nb–Be amorphous alloys, Ni-precipitated Zr phase that may cause some degradation in ductility and corrosion-resistance is formed at both sides of the brazed layer.     

Sputtering yield of Ti1−xBx films by 2 keV deuterium bombardment

We deposited titanium borides (Ti_1−xB_x; 0.40 < x < 0.77) by the co-sputter coating method and measured their sputtering yield by 2 keV deuterium ion bombardment as a function of their chemical composition at room temperature. The total sputtering yield is found to increase with increase of the boron content in Ti_1−xB_x. The total sputtering yield of stoichiometric TiB₂ is estimated to be 2.8 × 10⁻², about the same as those reported previously. Concerning the partial sputtering yield, that of the titanium does not depend on the chemical composition, but that of the boron increases with increase of the boron content. These experimental results could be explained by assuming that the partial sputtering yield is proportional to the spatial concentration of each atom in the Ti_1−xB_x matrix.     

Electrical conductivity and non-stoichiometry in the (U,Gd)O2±x system

The isothermal electrical conductivity and oxygen potential of the (U,Gd)O_2±x solid solution were measured in various oxygen partial pressure regions at 1200 °C and 1300 °C. The electrical conductivity gradually decreased with decreasing oxygen partial pressure even in the hypo-stoichiometric region. These findings were in contrast to the implication of a hypo-stoichiometry where the electrical conductivity is increased through the formation of oxygen vacancies. The (U_1−yGd_y)O_2−y/2 was defined as a new stoichiometric composition to determine the relationship between the deviation of the oxygen composition from stoichiometry and oxygen partial pressure. The dependence of the new oxygen deviation, z in (U_1−yGd_y)O_2−y/2+z, on the oxygen partial pressure corresponds to the dependence of the electrical conductivity, and thus a consistent defect structure model can be deduced from both the dependence curves. It suggests that the defect type is oxygen interstitial even below the oxygen composition of 2.     

Thin relaxed SiGe layer grown on Ar^＋ ion implanted Si substrate by ultra-high vacuum chemical vapor deposition

1 Introduction Relaxed SiGe layers have gained considerable attention due to their applications in strained Si/SiGe high electron mobility transistor, metal-oxide-semi- conductor field-effect transistor (MOSFET) and other devices. High-quality relaxed SiGe templates, espe- cially those with low threading dislocation density and smooth surface, are crucial for the electrical perform- ance of devices.[1,2] In order to realize high-quality relaxed SiGe layer with such good characteristics, …     

Release of nitrogen from SiOxNy films during RBS measurement

We have found that nitrogen atoms are released very rapidly from ultrathin SiO_xN_y films (2.6 nm) during RBS measurement with 500 keV He⁺ ions. The release behavior strongly depends on the preparation technique of the SiO_xN_y films. There is no release from the film prepared by thermal nitridation of SiO₂, while 80% of the nitrogen atoms are released from the film prepared by plasma nitridation at a fluence of 1×10¹⁶ cm⁻². The release cross-section for plasma SiO_xN_y films is of the order of 10⁻¹⁶ cm². This large cross-section cannot be explained by a simple recoil mechanism. The nitrogen release is also observed under irradiation with 5–10 keV electrons though the cross-section is of the order of 10⁻¹⁹ cm². These findings suggest that the observed nitrogen release is an electronic excitation induced process.     

Plasma nitridation of thin SiO2 films: AES, ELS and IR study

Auger electron spectroscopy, low-energy electron loss spectroscopy and infrared spectroscopy are used to investigate the nitridation of thin (10–22 nm) thermal SiO₂ in RF soft NH₃ plasma. It is found that plasma action at a substrate temperature of 573 K can completely nitridate the thermal oxide to an oxynitride layer. The layers obtained are macroscopic mixtures of two phases SiO₂ and Si₃N₄, rather than amorphous polymers of Si, O and N.     

Electrical and optical properties of Co ion implanted a-Si1 − xCx:H alloys

Low resistivity a-Si_1 − xC_x:H alloy films have been formed by high dose Co⁺ ion implantation. The influence of the carbon content of the films on the resistivity has been studied and the lowest values, of the order of 10 Ω/Sq, have been observed for the carbon free films. Even lower resistivities, a further reduction of up to 50%, have resulted from annealing at temperatures up to 500°C. Changes in the optical and structural properties of the implanted a-Si_1 − xC_x:H films have been studied by means of IR and Raman spectroscopy. Results show that the implantation produces considerable structural and chemical modifications. The formation of, and the transition to, a possible CoSi₂ phase has been observed by examining the IR and Raman spectra as a function of implant dose.     

Thermodynamic properties of nonstoichiometric urania-gadolinia solid solutions in the temperature range 700–1100° C

Partial molar thermodynamic quantities for urania-gadolinia solid solutions of compositions U_1−yGd_yO_2+x, with y values of 0.04 to 0.27, have been obtained using a solid electrolyte galvanic cell technique. The measurements were made for O/M ratios ranging from near stoichiometry to 2.20, and for temperatures ranging from 700 to 1100°C. The results for pure UO_2+x are in accordance with data reported earlier. The oxygen potentials for U_1−yGd_yO_2+x are higher than for pure UO_2+x and increase positively with increasing Gd content or excess oxygen. They can be represented as a function of the mean U valence, except at the stoichiometric composition. Both the partial molar entropy and enthalpy increase negatively with increasing Gd content or excess oxygen.