A 220 GHz Single-Chip Receiver MMIC With Integrated Antenna

This letter presents the design and characterization of a 220 GHz microstrip single-chip receiver monolithic microwave integrated circuit (MMIC) with an integrated antenna in a 0.1 mum GaAs metamorphic high electron mobility transistor technology. The receiver MMIC consists of a novel slot-square substrate lens feed antenna, a three-stage low noise amplifier, and a sub-harmonically pumped resistive mixer. The receiver MMIC is mounted on a 12 mm silicon substrate lens which focuses the radiation from the calibration loads to the on-chip antenna through an opening in the backside metallization of the MMIC. The double sideband noise figure of this quasioptical receiver is as low as 8.4 dB (1750 K) at 220 GHz including the losses in the antenna and in the lens. To the best of the authors' knowledge, this work demonstrates the highest integration level versus operating frequency for a MMIC ever published, regardless of technology.     

振荡型有源集成天线

研制中心频率为18 GHz的振荡型有源集成天线,包括微带天线设计、单片压控振荡器(MMIC VCO)的设计及微带天线与单片压控振荡器二者的集成。微带天线的芯片面积为4.5 mm×3.5 mm,增益为3.67 dB,中心频率为18.032 GHz,最小输入驻波系数为1.098;单片压控振荡器芯片面积1.1 mm×1.0 mm,调谐范围为15.978～18.247 GHz,输出功率大于6 dBm。振荡型有源集成天线的方向图测试结果与微带天线的特性符合,该振荡型有源集成天线能够正常工作。     

Integrated uniplanar transition for linearly tapered slot antenna

This paper presents the design, fabrication, and numerical modeling of two new uniplanar microstrip-to-coplanar strip (CPS) line transitions and a new variant of the linearly tapered slot antenna (LTSA). This new variant with an integrated uniplanar microstrip-to-coplanar strip line feed is called a V-LTSA. The advantages of these transitions in packaging and monolithic microwave integrated circuits (MMIC) integration are listed. The two transitions and the feed are modeled using finite difference time domain (FDTD) method. The overall agreement between the measured and modeled return-loss and insertion-loss characteristics of two back-to-back transitions is good. The resonance frequencies predicted by the FDTD method are within a few percentage points of the measurements. Furthermore, the V-LTSA with the feed is experimentally shown to have a wide return loss (⩽-10 dB) bandwidth, good radiation patterns, and low cross-polarization. The gain of the V-LTSA is 9 dB at the design frequency of 10 GHz. A proof-of-concept package to house the feed is experimentally evaluated and shown to have negligible effect on the antenna characteristics. This type of antenna readily integrates with MMIC packages in an array having a brick architecture. The V-LTSA has potential applications in phased arrays     

星载SAR功能结构一体化天线技术研究

提出了新型低剖面合成口径雷达(SAR)有源相控阵天线设计方法———多功能结构一体化天线技术,采用高密度互联、新型功能材料等进行模块化、轻量化的系统级集成设计,将系统功能与天线结构相结合,大幅减小了SAR天线的体积,增大了内部可用空间;同时,有效去除天线寄生质量及各分系统间的重复质量。对SAR天线进行了一体化设计验证,结果表明天线性能、结构承载及热控的指标满足要求,多功能结构一体化设计方法对大型有源相控阵天线系统的结构设计有实际指导意义。     

Frequency-scanning antenna using the crosstie-overlay slow-wavestructures as transmission lines

Crosstie-overlay slow-wave transmission lines are used in a traveling-wave antenna array to reduce the circuit size. Series connection of the antenna radiation elements and transmission lines makes the antenna integratable. These two properties make the antenna suitable for microwave monolithic integrated circuit (MMIC) elements. The measured radiation pattern is shown to agree with the calculated pattern. The antenna's frequency-scanning feature is demonstrated     

Miniaturised microstrip antenna for MMIC applications

A novel miniaturised quarter wavelength, H-shaped antenna which will find applications in monolithic microwave integrated circuit (MMIC) design is presented. The antenna occupies approximately one tenth of the substrate area of a half wavelength patch antenna. The effect on the resonance frequency, bandwidth and gain of the antenna are reported     

基于新时域算法的集总加载线天线的耦合分析

在电磁工程应用中, 天线通过加载, 可以缩短天线尺寸, 实现小型化设计.文中提出了网格内置集总元件的时域有限差分(Finite Difference Time Domain, FDTD)处理新方法, 将细导线FDTD与集总元件FDTD结合起来, 模拟了强电磁脉冲对集总加载线天线的耦合, 能够快速计算得到天线上耦合的电流响应.通过与有限积分法软件的仿真结果进行对比, 验证了混合算法的正确性.在此基础上, 分析了入射电磁脉冲的类型以及脉冲宽度对天线上电流响应的影响, 为天线进行前门防护设计提供理论依据.     

Packaging design of wide-angle phased-array antenna for frequenciesabove 20 GHz

Mechanical aspects of a new phased-array antenna design with a scan angle of ±70 degrees are presented. New packaging concepts were needed to accomplish, an industry first, the fabrication of a 91-element 44-GHz transmit array. The array architecture uses one hybrid module per channel. The RF signal is radiatively coupled to the modules, eliminating RF connectors. Multilayer boards are used to distribute control signals and DC which are connected to each module with space-efficient elastomeric connectors. All connections are made during the assembly of the array without need for permanent bonding. The array is designed for a low conductive thermal impedance from the monolithic microwave integrated circuits (MMIC) chips to the back of the array, where the heat is removed by convection     

The tapered slot antenna-a new integrated element formillimeter-wave applications

Tapered slot antennas (TSAs) with a number of potential applications as single elements and focal plane arrays are discussed. TSAs are fabricated with photolithographic techniques and integrated in either hybrid or MMIC circuits with receiver or transmitter components. They offer considerably narrower beams than other integrated antenna elements and have high aperture efficiency and packing density as array elements. Both the circuit and radiation properties of TSAs are reviewed. Topics covered include: antenna beamwidth, directivity, and gain of single-element TSAs; their beam shape and the effect of different taper shapes; and the input impedance and the effects of using thick dielectrics. These characteristics are also given for TSA arrays as are the circuit properties of the array elements. Different array structures and their applications are also described     

The evolution of packages for monolithic microwave andmillimeter-wave circuits

The maturing of monolithic microwave integrated circuit (MMIC) technology has spawned a variety of new military and commercial applications. As-a result, there is an increased emphasis on the packaging of MMIC chips and MMIC-based components. Currently, the industry is applying a number of new assembly and packaging technologies to RF components and subsystems driven by the forces of performance, size and weight, and cost. This paper outlines the current evolution in microwave and millimeter-wave packaging using examples drawn from the area of active array antennas     

Single feed proximity coupled circularly polarized microstripmonofilar Archimedean spiral antenna array

The analysis is presented for a microstrip feed proximity coupled monofilar Archimedean spiral four-element antenna array. Interactions between the microstrip corporate feed and the radiating elements are rigorously included. Results demonstrate that circular polarization can be achieved with proper spiral arm length. Polarization of either sense is controlled by the location of the feedline. The 3-dB axial ratio (AR) and voltage standing wave ratio (VSWR) bandwidths are 9%. The antenna is small (2R/λ₀=0.33) and the interelement spacing is 0.51λ₀. The microstrip feed produces a completely planar antenna system, which is compatible with microwave integrated circuits (MIC) and monolithic microwave integrated circuits (MMIC)     

一种新型集成化X波段低噪声放大器

低温共烧陶瓷 (LTCC)和倒装芯片 (FC)是实现小型化、高可靠微波组件的一种理想的组装和互连技术。文中对带有埋置式电阻的 LTCC微波多层互连基板和倒装芯片组装技术进行了研究 ,以研制出体积小、重量轻、微波性能好的高密度集成化 X波段低噪声放大器。利用商用三维电磁场分析软件 HFSS对集成化低噪声放大器组装和互连中的关键参数进行了仿真和优化。研制出的集成化 X波段低噪声放大器带宽为 1 .6GHz,增益≥ 2 8d B,噪声系数≤ 2 d B,输入 /输出驻波≤ 1 .8,体积仅为 1 2 mm× 6mm× 1 .5 mm。     

On the modeling of metal strip antennas contiguous with the edge ofelectrically thick finite size dielectric substrates

A solution to the problem of radiation by a narrow metal strip antenna contiguous with the edge of a dielectric substrate is presented where the substrate has parameters such that its electrical thickness is appreciable. Such an antenna may be useful at millimeter wavelengths as an integrated phased array element forming a part of a monolithic microwave integrated circuit (MMIC). A suitable geometry for this application is illustrated and an efficient computational procedure developed. Comparisons with experimental results for the input impedance and far-field radiation patterns show excellent agreement. The influence of the dielectric substrate on the performance of an antenna designed to operate at approximately 60 GHz is discussed. Two examples, the first involving the analysis of a coplanar strip transmission line fed antenna and the second involving impedance matching and control of cross-polarized radiation using a folded strip dipole, are given to illustrate practical applications of the analytical method to design problems     

Active 60 GHz front-end with integrated dielectric antenna

The hybrid integration of a dielectric antenna together with an MMIC low-noise amplifier in a 60 GHz front-end is presented. It is demonstrated how a low-loss substrate integrated dielectric antenna can efficiently be interconnected at miniature scale with the coplanar waveguide input of the MMIC. The experimentally obtained return loss is better than 11 dB from 55 to 65 GHz. Transmission path loss measurements of a wireless link confirm the low-loss potential of this approach for millimetre-wave front-ends.     

60 GHz multi-chip-module receiver with substrate integrated waveguide antenna and filter

A compact 60 GHz MCM receiver has been demonstrated by integrating millimetre-wave substrate-integrated waveguides and GaAs MMICs for the first time. The module includes a waveguide antenna and filter, MMIC LNA and mixer, and lumped elements for IF filtering embedded into the multilayer photo-imageable thick-film substrate. Cavities for MMIC attachment are photo-imaged as part of the standard process.     

Radio-Optical Dual-Mode Communication Modules Integrated With Planar Antennas

This paper presents new results on integrated devices for radio and free-space optical dual-mode communication. Two novel hybrid packaging schemes using two different microwave printed antenna designs are presented for the integration of radio-optical front-end circuits on a planar compact printed circuit board with shared electrical and structural components. Full-wave electromagnetic (EM) simulations are presented for antenna optimization to minimize EM interference between the radio and optical circuits. A hybrid radio-optical package design is developed, prototyped, and experimentally studied using a modified quasi-Yagi antenna with split directors to form pads for opto-electronic device integration. Dual-mode link connectivity is investigated in simulations and experiments. A data rate of 2.5 Gb/s is demonstrated for the optical channel despite 15–20-dB signal coupling between the optical and microwave circuits.      

一种雷达微波接收机电路的集成化设计与实现

文章叙述了实现雷达接收机立体微波集成电路的基板及焊接工艺,研制了一种针对多通道雷达接收机的接收集成电路.提出了芯片电路设计,多层基板实现,以及芯片封装等实现方法.测试结果表明,电路达到了预期的设计目标.该集成电路的实现,提高了雷达整机的集成化水平.     

Small H-shaped antennas for MMIC applications

A small short-circuited H-shaped GaAs monolithic microwave integrated circuits (MMICs) patch antenna is presented. Resonant at 5.98 GHz, it is the lowest frequency MMIC patch antenna reported that we are aware of and is intended for short-range communications (e.g., vehicular). Initial experimental and theoretical characterization of the proposed structure has been carried out on soft microstrip substrates. It has been shown that the size of an H-shaped patch antenna can be reduced to as low as one tenth of that of a half wavelength patch antenna resonant at the same frequency, saving valuable substrate space. The resonance frequency, radiation patterns and gain have been investigated. Ground plane truncation effects, which are important for MMIC applications, have been examined using the finite-difference time-domain (FDTD) method     

Analysis of rectangular spiral transformers for MMIC applications

Multidielectric planar structures such as transformers and triformers are analyzed by cascading multidimensional chain matrices. The distributed-line model facilitates the use of these elements in microwave monolithic integrated circuits (MMIC) applications as wideband transformers and baluns. High-speed routines suitable for inclusion in computer-aided design packages for desktop PCs are implemented and used to calculate S parameters. Wideband MMIC triformers are fabricated and measured, showing good agreement between theory and measurement over the frequency range 1-10 GHz