A 155.52 mbps-3.125 gbps continuous-rate clock and data recovery circuit

A 155.52 Mbps-3.125 Gbps continuous-rate clock and data recovery (CDR) circuit using the full-rate bang-bang phase detector is presented. A frequency detector is proposed to eliminate the harmonic locking problem even with a wide range of data rates and its theoretical analysis is also discussed. A quadrature divider is also presented to generate the clocks with accurate quadrature phases. This CDR circuit has been realized in a 0.18-/spl mu/m CMOS process and its die area is 1.1/spl times/0.8 mm/sup 2/. It consumes 95 mW at the highest bit rate of 3.125 Gbps. It can recover the NRZ data of a 2/sup 31/-1 PRBS with the bit rate ranging from 155.52 Mbps to 3.125Gbps for the incremental frequency acquisition and the NRZ data of a 2/sup 7/-1 PRBS for the decremental frequency acquisition. All the measured bit error rates are less than 10/sup -12/.     

10 GHz full-rate clock and data recovery circuit in 0.18 /spl mu/m CMOS without external reference clock

The design of a fully monolithic integrated 10 GHz full-rate clock and data recovery (CDR) circuit in 0.18 /spl mu/m digital CMOS technology, which employs an injection phase-locked loop (PLL) technique is presented. The CDR operating without the external reference exhibits a capture range of 200 MHz while consuming 205 mA current from 1.8 V supply including the output buffer. The recovered clock signal with 250 mV/sub pp/ pseudorandom bit Sequence input data of length 2/sup 31/-1 exhibits 7.9 ps of peak-to-peak (p-p) and 1.1 ps of root-mean-square (RMS) jitter. The measured clock phase noise at 1 MHz offset is approximately -109 dBc/Hz.     

Low jitter and multirate clock and data recovery circuit using a MSADLL for chip-to-chip interconnection

A fully integrated clock and data recovery circuit (CDR) using a multiplying shifted-averaging delay locked loop and a rate-detection circuit is presented. It can achieve wide range and low jitter operation. A duty-cycle-insensitive phase detector is also proposed to mitigate the dependency on clock duty cycle variations. The experimental prototype has been fabricated in a 0.25-/spl mu/m 1P5M CMOS technology and occupies an active area of 2.89 mm/sup 2/. The measured CDR could operate from 125 Mb/s to 2.0 Gb/s with a bit error rate better than 10/sup -12/ from a 2.5-V supply. Over the entire operating frequency range, the maximum rms jitter of the recovered clock is less than 4 ps.     

A 10-Gb/s CMOS clock and data recovery circuit with a half-rate binary phase/frequency detector

A 10-Gb/s phase-locked clock and data recovery circuit incorporates a multiphase LC oscillator and a half-rate phase/frequency detector with automatic data retiming. Fabricated in 0.18-/spl mu/m CMOS technology in an area of 1.75/spl times/1.55 mm/sup 2/, the circuit exhibits a capture range of 1.43 GHz, an rms jitter of 0.8 ps, a peak-to-peak jitter of 9.9 ps, and a bit error rate of 10/sup -9/ with a pseudorandom bit sequence of 2/sup 23/-1. The power dissipation excluding the output buffers is 91 mW from a 1.8-V supply.     

A 4-Gb/s CMOS clock and data recovery circuit using 1/8-rate clock technique

A 4-Gb/s clock and data recovery (CDR) circuit is realized in a 0.25-/spl mu/m standard CMOS technology. The CDR circuit exploits 1/8-rate clock technique to facilitate the design of a voltage-controlled oscillator (VCO) and to eliminate the need of 1:4 demultiplexer, thereby achieving low power consumption. The VCO incorporates the ring oscillator configuration with active inductor loads, generating four half-quadrature clocks. The VCO control line comprises both a programmable 6-bit digital coarse control and a folded differential fine control through a charge-pump and a low pass filter. Duty-cycle correction of clock signals is obtained by exploiting a high common-mode rejection ratio differential amplifier at the ring oscillator output. A 1/8-rate linear phase detector accomplishes the phase error detection with no systematic phase offset and inherently performs the 1:4 demultiplexing. Test chips demonstrate the jitter of the recovered clock to be 5.2 ps rms and 47 ps pk-pk for 2/sup 31/-1 pseudorandom bit sequence (PRBS) input data. The phase noise is measured to be -112 dBc/Hz at 1-MHz offset. The measured bit error rate is less than 10/sup -6/ for 2/sup 31/-1 PRBS. The chip excluding output buffers dissipates 70 mW from a single 2.5-V supply.     

A 3.125-Gb/s clock and data recovery circuit for the 10-Gbase-LX4 Ethernet

A 3.125-Gb/s clock and data recovery (CDR) circuit using a half-rate digital quadricorrelator frequency detector and a shifted-averaging voltage-controlled oscillator is presented for 10-Gbase-LX4 Ethernet. It can achieve low-jitter operation and improve pull-in range without a reference clock. This CDR circuit has been fabricated in a standard 0.18-/spl mu/m CMOS technology. It occupies an active area of 0.6 /spl times/ 0.8 mm/sup 2/ and consumes 83 mW from a single 1.8-V supply. The measured bit-error rate is less than 10/sup -12/ for 2/sup 7/ - 1 PRBS 3.125-Gb/s data. It can meet the jitter tolerance specifications for the 10-Gbase-LX4 Ethernet application.     

A 10-gb/s CMOS clock and data recovery circuit with an analog phase interpolator

This paper presents a 10-Gb/s clock and data recovery (CDR) circuit for use in multichannel applications. The module aligns the phase of a plesiochronous system clock to the incoming data by use of phase interpolation. Thus, coupling between voltage-controlled oscillators (VCOs) in adjacent channels can be avoided. The controller for the phase interpolator is realized with analog circuitry to overcome the speed and phase resolution limitations of digital implementations. Fabricated in a 0.11-/spl mu/m CMOS technology the module has a size of 0.25/spl times/1.4 mm/sup 2/. The power consumption is 220 mW from a supply voltage of 1.5 V. The CDR exceeds the SDH/SONET jitter tolerance specifications with a pseudo random bit sequence of length 2/sup 23/-1 and a bit-error rate threshold of 10/sup -12/. The re-timed and demultiplexed data has an rms jitter of 3.2 ps at a data rate of 2.7 Gb/s.     

A 33-mW 8-Gb/s CMOS clock multiplier and CDR for highly integrated I/Os

A 0.622-8-Gb/s clock and data recovery (CDR) circuit using injection locking for jitter suppression and phase interpolation in high-bandwidth system-on-chip solutions is described. A slave injection locked oscillator (SILO) is locked to a tracking aperture-multiplying DLL (TA-MDLL) via a coarse phase selection multiplexer (MUX). For the fine timing vernier, an interpolator DAC controls the injection strength of the MUX output into the SILO. This 1.2-V 0.13-/spl mu/m CMOS CDR consumes 33 mW at 8Gb/s. Die area including voltage regulator is 0.08 mm/sup 2/. Recovered clock jitter is 49 ps pk-pk at a 200-ppm bit-rate offset.     

A 10-Gb/s CDR/DEMUX with LC delay line VCO in 0.18-/spl mu/m CMOS

A monolithic 10-Gb/s clock/data recovery and 1:2 demultiplexer are implemented in 0.18-/spl mu/m CMOS. The quadrature LC delay line oscillator has a tuning range of 125 MHz and a 60-MHz/V sensitivity to power supply pulling. The circuit meets SONET OC-192 jitter specifications with a measured jitter of 8 ps p-p when performing error-free recovery of PRBS 2/sup 31/-1 data. Clock and data recovery (CDR) is achieved at 10 Gb/s, demonstrating the feasibility of a half-rate early/late PD (with tri-state) based CDR on 0.18-/spl mu/m CMOS. The 1.9/spl times/1.5 mm/sup 2/ IC (not including output buffers) consumes 285 mW from a 1.8-V supply.     

4-bit multiplexer/demultiplexer chip set for 40-Gbit/s optical communication systems

We have designed and fabricated a low-power 4:1 multiplexer (MUX), 1:4 demultiplexer (DEMUX) and full-clock-rate 1:4 DEMUX with a clock and data recovery (CDR) circuit using undoped-emitter InP-InGaAs HBTs. Our HBTs exhibit an f/sub T/ of approximately 150 GHz and an f/sub max/ of approximately 200 GHz at a collector current density of 50 kA/spl mu/m/sup 2/. In the circuit design, we utilize emitter-coupled logic and current-mode logic series gate flip-flops and optimized the collector current density of each transistor to achieve low-power operation at required high bit rates. Error-free operation at bit rates of up to 50 Gbit/s were confirmed for the 4:1 MUX and 1:4 DEMUX, which dissipates 2.3 and 2.5 W, respectively. In addition, the full-clock-rate 1:4 DEMUX with the CDR achieved 40-Gbit/s error-free operation.     

A high-speed 850-nm optical receiver front-end in 0.18-/spl mu/m CMOS

A high-speed optical interface circuit for 850-nm optical communication is presented. Photodetector, transimpedance amplifier (TIA), and post-amplifier are integrated in a standard 0.18-/spl mu/m 1.8-V CMOS technology. To eliminate the slow substrate carriers, a differential n-well diode topology is used. Device simulations clarify the speed advantage of the proposed diode topology compared to other topologies, but also demonstrate the speed-responsivity tradeoff. Due to the lower responsivity, a very sensitive transimpedance amplifier is needed. At 500 Mb/s, an input power of -8 dBm is sufficient to have a bit error rate of 3/spl middot/10/sup -10/. Next, the design of a broadband post-amplifier is discussed. The small-signal frequency dependent gain of the traditional and modified Cherry-Hooper stage is analyzed. To achieve broadband operation in the output buffer, so-called "f/sub T/ doublers" are used. For a differential 10 mV/sub pp/ 2/sup 31/-1 pseudo random bit sequence, a bit error rate of 5/spl middot/10/sup -12/ at 3.5 Gb/s has been measured. At lower bit-rates, the bit error rate is even lower: a 1-Gb/s 10-mV/sub pp/ input signal results in a bit error rate of 7/spl middot/10/sup -14/. The TIA consumes 17mW, while the post-amplifier circuit consumes 34 mW.     

A CMOS 5.4/3.24‐Gbps Dual‐Rate CDR with Enhanced Quarter‐Rate Linear Phase Detector

This paper presents a clock and data recovery circuit that supports dual data rates of 5.4 Gbps and 3.24 Gbps for DisplayPort v1.2 sink device. A quarter‐rate linear phase detector (PD) is used in order to mitigate high speed circuit design effort. The proposed linear PD results in better jitter performance by increasing up and down pulse widths of the PD and removes dead‐zone problem of charge pump circuit. A voltage‐controlled oscillator is designed with a ‘Mode’ switching control for frequency selection. The measured RMS jitter of recovered clock signal is 2.92 ps, and the peak‐to‐peak jitter is 24.89 ps under 231–1 bit‐long pseudo‐random bit sequence at the bitrate of 5.4 Gbps. The chip area is 1.0 mm×1.3 mm, and the power consumption is 117 mW from a 1.8 V supply using 0.18 μm CMOS process.     

A CMOS 0.25-/spl mu/m continuous-time FIR filter with 125 ps per tap delay as a fractionally spaced receiver equalizer for 1-gb/s data transmission

This paper presents a CMOS 0.25-/spl mu/m continuous-time 6-tap FIR filter that is used as a fractionally spaced receiver equalizer for 1-Gb/s data transmission. Each tap of the FIR filter delay line is realized with a second-order low-pass filter. Simulations show that the tap delay can be tuned from 100 ps to 300 ps while keeping a constant group delay within the bandwidth of 2.1 GHz and 800 MHz correspondingly. Experimental results show that the FIR filter can successfully recover a 1-Gb/s differential digital signal that has been transmitted over a 220-inch PCB trace which causes -31.48-dB attenuation at the symbol rate frequency of 1 GHz. The measured bit error rate after equalization is less than 10/sup -12/ over a 750-ps sampling range, compared to a 10/sup -2/ bit-error rate before equalization. Also presented are the measurement results comparing the horizontal and the vertical openings of the signals before and after equalization for PCB traces with different length. The chip dissipates 45 mW from a 2.5-V supply and occupies 0.33/spl times/0.27 mm/sup 2/ in a 0.25-/spl mu/m CMOS process.     

PLL design technique by a loop-trajectory analysis taking decision-circuit phase margin into account for over-10-Gb/s clock and data recovery circuits

A design technique for an over-10-Gb/s clock and data recovery (CDR) IC provides good jitter tolerance and low jitter. To design the CDR using a PLL that includes a decision circuit with a certain phase margin affecting the pull-in performance, we derived a simple expression for the pull-in range of the PLL, which we call the "limited pull-in range," and used it for the pull-in performance evaluation. The method allows us to quickly and easily compare the pull-in performance of a conventional PLL with a full-rate clock and a PLL with a half-rate clock, and we verified that the half-rate PLL is advantageous because of its wider frequency range. For verification of the method, we fabricated a half-rate CDR with a 1:16 DEMUX IC using commercially available Si bipolar technology with f/sub T/=43 GHz. The half-rate clock technique with a linear phase detector, which is adopted to avoid using the binary phase detector often used for half-rate CDR ICs, achieves good jitter characteristics. The CDR IC operates reliably up to over 15 Gb/s and achieves jitter tolerance with wide margins that surpasses the ITU-T specifications. Furthermore, the measured jitter generation is less than 0.4 ps rms, which is much lower than the ITU-T specification. In addition, the CDR IC can extract a precise clock signal under harsh conditions, such as when the bit error rate of input data is around 2/spl times/10/sup -2/ due to a low-power optical input of -24 dBm.     

High-speed monolithically integrated silicon photoreceivers fabricated in 130-nm CMOS technology

A complementary metal-oxide-semiconductor (CMOS) monolithically integrated photoreceiver is presented. The circuit was fabricated in a 130-nm unmodified CMOS process flow on 2-/spl mu/m-thick silicon-on-insulator substrates. The receiver operated at 8 Gb/s with 2-dBm average input optical power and a bit error rate of less than 10/sup -9/. The integrated lateral p-i-n photodetector was simultaneously realized with the amplifier and had a responsivity of 0.07 A/W at 850 nm. The measured receiver sensitivities at 5, 3.125, 2, and 1 Gb/s, were -10.9, -15.4, -16.5, and -19 dBm, respectively. A 3-V single-supply operation was possible at bit rates up to 3.125 Gb/s. The transimpedance gain of the receivers was in the range 53.4-31 dB/spl Omega/. The circuit dissipated total power between 10 mW and 35 mW, depending on the design.     

A 1.1-V 270-/spl mu/A mixed-signal hearing aid chip

This paper presents a single-chip mixed-signal IC for a hearing aid system. The IC consumes 270 /spl mu/A of supply current at a 1.1-V battery voltage. The presented circuit and architectural design techniques reduce the total IC power to 297 /spl mu/W, a level where up to 70 days of lifetime is achieved at 10 h/day for a small zinc-air battery. The measured input referred noise for the entire channel is 2.8 /spl mu/Vrms and the average THD in the nominal operating region is 0.02%. The jitter for the on-board ring oscillator is 147 ps rms. The chip area is 12 mm/sup 2/ in a 0.6-/spl mu/m 3.3-V mixed-signal CMOS process.     

A 39-to-45-Gbit/s multi-data-rate clock and data recovery circuit with a robust lock detector

We describe a 40-Gbit/s-class clock and data recovery (CDR) circuit with an extremely wide pull-in range. A Darlington-type voltage-controlled oscillator (VCO) is newly designed to cover the STM-256/OC-768 full-rate-clock frequencies with a wide frequency margin. We also describe a new lock detector using an exclusive-NOR gate. The CDR IC was fabricated using InP/InGaAs HBTs. Error-free operation and wide eye opening were confirmed for 40-, 43-, and 45-Gbit/s PRBS with a word length of 2/sup 31/ - 1. We attached a frequency search and phase control (FSPC) circuit to the chip as a new frequency acquisition aid, and this allows the CDR circuit to pull in throughout a 39-45-Gbit/s range. The peak-to-peak and rms jitter of the recovered clock were 3.6 and 0.48 ps, respectively.     

Full-Rate Bang-Bang Phase/Frequency Detectors for Unilateral Continuous-Rate CDRs

Full-rate bang-bang phase detectors (BBPDs) and bang-bang frequency detectors (FDs) are presented for continuous-rate clock and data recovery (CDR) circuits. The proposed BBPDs have only six latches, so they save the power and area. Their symmetric architecture minimizes the clock skew caused by the nonsymmetric layout. The proposed unilateral FDs have a wide detectable frequency range. The theoretical analysis for the proposed FDs is given. Two continuous-rate CDR circuits using the proposed BBPDs and FDs have been fabricated in a 0.18-$mu$m CMOS process. They recover the NRZ data of a $2^{31}-1$ PRBS from 622 Mbps to 3.125 Gbps. All of the measured bit error rates are less than $10^{-12}$.      

Si/SiGe resonant interband tunnel diode with f/sub r0/ 20.2 GHz and peak current density 218 kA/cm/sup 2/ for K-band mixed-signal applications

This letter presents the room-temperature high-frequency operation of Si/SiGe-based resonant interband tunnel diodes that were fabricated by low-temperature molecular beam epitaxy. The resulting devices show a resistive cutoff frequency f/sub r0/ of 20.2 GHz with a peak current density of 218 kA/cm/sup 2/, a speed index of 35.9 mV/ps, and a peak-to-valley current ratio of 1.47. A specific contact resistivity of 5.3/spl times/10/sup -7/ /spl Omega//spl middot/cm/sup 2/ extracted from RF measurements was achieved by Ni silicidation through a P /spl delta/-doped quantum well by rapid thermal sintering at 430/spl deg/C for 30 s. The resulting devices are very good candidates for RF high-power mixed-signal applications. The device structures presented here are compatible with a standard complementary metal-oxide-semiconductor or heterojunction bipolar transistor process.     

A 3-V, 0.35-/spl mu/m CMOS Bluetooth receiver IC

A fully integrated CMOS low-IF Bluetooth receiver is presented. The receiver consists of a radio frequency (RF) front end, a phase-locked loop (PLL), an active complex filter, a Gaussian frequency shift keying (GFSK) demodulator, and a frequency offset cancellation circuit. The highlights of the receiver include a low-power active complex filter with a nonconventional tuning scheme and a high-performance mixed-mode GFSK demodulator. The chip was fabricated on a 6.25-mm/sup 2/ die using TSMC 0.35-/spl mu/m standard CMOS process. -82 dBm sensitivity at 1e-3 bit error rate, -10 dBm IIP3, and 15 dB noise figure were achieved in the measurements. The receiver active current is about 65 mA from a 3-V power supply.