Carrier lifetime limitation defects in polycrystalline silicon ribbons grown on substrate (RGS)

Carrier lifetime limitation defects in polycrystalline silicon ribbons have been examined in samples with high oxygen and carbon content. Infrared spectroscopy showed that essentially all supersaturated oxygen impurities precipitated within 1 h annealing at over 800 °C. Preferential defect etching revealed that a much higher density of oxygen precipitates were generated in dislocation-free grains than in those highly dislocated (10⁵–10⁷ cm⁻²) ones. Correlated with electron-beam-induced current imaging, we found that oxygen precipitates are the dominant carrier recombination defects in dislocation-free grains, while dislocations are the lifetime killer for highly dislocated grains. It is suggested that eliminating dislocations alone will not improve the carrier lifetime, considering that a higher density of oxygen precipitates formed in the absence of dislocation-related heterogeneous nucleation sites will significantly degrade the carrier lifetime.     

Effects of RTA temperatures on conductivity and micro-structures of boron-doped silicon nanocrystals in Si-rich oxide thin films

In this work, the B-doped Si rich oxide (SRO) thin films were deposited and then annealed using rapid thermal annealing (RTA) to form SiO₂-matrix silicon nanocrystals (Si NCs). The effects of the RTA temperatures on the structural properties, conduction mechanisms and electrical properties of B-doped SRO thin films (BSF) were investigated systematically using Hall measurements, Fourier transform infrared spectroscopy and Raman spectroscopy. Results showed that the crystalline fraction of annealed BSF increased from 41.3% to 62.8%, the conductivity was increased from 4.48×10⁻³ S/cm to 0.16 s/cm, the carrier concentration was increased from 8.74×10¹⁷ cm⁻³ to 4.9×10¹⁸ cm⁻³ and the carrier mobility was increased from 0.032 cm² V⁻¹ s⁻¹ to 0.2 cm² V⁻¹ s⁻¹ when the RTA temperatures increased from 1050 °C to 1150 °C. In addition, the fluctuation induced tunneling (FIT) theory was applicable to the conduction mechanisms of SiO₂-matrix boron-doped Si-NC thin films.     

Effect of electron irradiation on morphological,compositional and electrical properties of nanocluster carbon thin films grown using room temperature based cathodic arc process for large area microelectronics

The influence of 8 MeV electron beam bombardment on room temperature grown nanocluster carbon using cathodic arc process has been studied here. Atomic force microscopy (AFM) study shows that surface roughness varies with varying electron doses. High doses of electrons could causes thermal induce graphitization and morphological changes in the films. Raman spectroscopy analysis reveals that G-peak vary from 1555 cm⁻¹ to 1570 cm⁻¹ and D-peak varying from 1361 cm⁻¹ to 1365 cm⁻¹ indicating the disorderness and presence of both graphitic and diamond-like phases. Room temperature conductivity changes by two to three orders in magnitude. The conductivity in the films could be due to conduction of charge carriers through neighboring islands of conductive chains. Defect states calculated using the differential technique varies from 8 × 10¹⁷cm⁻³ eV⁻¹ to 1.5 × 10¹⁹ cm⁻³ eV⁻¹. Irradiation of nanocluster carbon thin films could be helpful to tune the electrical properties and defect densities of the nanocluster carbon films for various large area, flexible electronic and nano electronic applications.     

Investigation of Si/SiGe/Si heterostructure implanted by H ion and annealed in vacuum and dry O2 ambient

The 20-nm-thick Si cap layer/74-nm-thick Si_0.72Ge_0.28 epilayer/Si heterostructures implanted by 25 keV H⁺ ion to a dose of 1×10¹⁶ cm⁻² were annealed in ultra-high vacuum ambient and dry O₂ ambient at the temperature of 800 °C for 30 min, respectively. Rutherford backscattering/ion channeling (RBS/C), Raman spectra, high-resolution X-ray diffraction (HRXRD) and atomic force microscopy (AFM) were used to characterize the structural characteristics of the Si_0.72Ge_0.28 layer. Investigations by RBS/C demonstrated that the crystal quality of the Si/Si_0.72Ge_0.28/Si heterostructure sample implanted by 25 keV H⁺ in conjunction with subsequent annealing in dry O₂ ambient is superior to that of identical sample annealing in ultra-high vacuum ambient. The less strain relaxation of SiGe layer of the Si/Si_0.72Ge_0.28/Si heterostructures implanted by H ion and annealed in dry O₂ ambient at the temperature of 800 °C for 30 min could be doublechecked by Raman spectra as well as HRXRD, which was compared with that in an identical sample annealed in ultra-high vacuum ambient for identical thermal budget. In addition, the SiGe layer of the H-implanted Si/SiGe/Si heterostructural sample annealed in dry O₂ ambient accompanied by better crystal quality and less strain relaxation made its surface morphology superior to that of the sample annealed in ultra-high vacuum ambient at the temperature of 800 °C for 30 min, which was also verified by AFM images.     

Effects of oxygen content on the structural,optical, and electrical properties of NiO films fabricated by radio-frequency magnetron sputtering

Nickel oxide (NiO) films were deposited on Corning glass substrate with variable (0–100%) oxygen content by radio-frequency sputtering. Effects of different oxygen content on the structural, optical, and electrical properties of NiO films were studied. X-ray diffraction showed that the NiO film deposited on substrate with 0% oxygen content resulted in a random polycrystalline structure and small grain size. The introduction of oxygen gas leaded to a (200) preferential orientation and larger grain size. The transmittance decreases with oxygen content due to the increase of oxygen interstitials in NiO films. The 0%-O₂ deposited NiO film has a tensile strain and a small band gap. Upon introducing 33%-O₂ content, the NiO film exhibits a compressive strain, increasing the bandgap. However, the compressive strain is released and gradually turns into tensile strain, which leads to the narrowing of bandgap with the increase of oxygen content. Hall measurement shows the obtained NiO is p-type and the resistivity decreases from 4.3 × 10⁵ Ω-cm to 5.02 Ω-cm with increasing oxygen content from 0% to 100%. The carrier concentration increases from 6.3 × 10¹⁴ cm⁻³ to 4.6 × 10¹⁸ cm⁻³ and the mobility decreases from 26 cm²/V-s to 0.26 cm²/V-s for the NiO films deposited with oxygen content increasing from 50% to 100%. X-ray photoelectron spectroscopy showed that the Ni⁺³/Ni⁺² ratio is the origin of p-type NiO and the ratio increases from 1.32 to 2.63 by increasing the oxygen content from 0% to 100%, which caused more defects, oxygen interstitials and nickel vacancies.     

Structural,optical and dielectric properties of HfSiO films prepared by co-evaporation method

HfSiO dielectric films were prepared on Si substrate by the co-evaporation method. The chemical composition, crystalline temperature, optical and electrical properties of the compound film were investigated. X-ray photoelectron spectroscopy analysis illustrated that the atom ratio of Hf to Si was about 4:1 and Hf–Si–O bonds appeared in the film. The X-ray diffraction analysis revealed that the crystalline temperature of the film was higher than 850 °C. Optical measurements showed that the refractive index was 1.82 at 550 nm wavelengths and the optical band gap was about 5.88 eV. Electrical measurements demonstrated that the dielectric constant and a fixed charge density were 18.1 and 1.95×10¹² cm⁻² respectively. In addition, an improved leakage current of 7.81 μA/cm² at the gate bias of −3 V was achieved for the annealed HfSiO film.     

Non-destructive Raman evaluation of a heavily doped surface layer fabricated by laser doping with B-doped Si nanoparticles

The heavy B-doping of an intrinsic Si(1 0 0) wafer has been performed by irradiating a B-doped Si nanoparticle film on the surface of the Si(1 0 0) substrate with energy densities of 8.0 and 16.0 J/cm² by 532-nm laser light. The thicknesses of the heavily doped surface layers were investigated using Raman spectroscopy. The observed 488.0-nm-excited Raman bands were decomposed into two bands: a Fano-type band due to the heavily doped Si surface layer and a Voigt band due to the lightly doped, intrinsic Si region. The analysis of the Fano-type band indicated that the carrier concentration of the heavily doped region was larger than approximately 10¹⁹ cm⁻³. Based on the two-state model, the thicknesses of the heavily doped surface layers were 480 and 630 nm for the samples prepared with energy densities of 8.0 and 16.0 J/cm², respectively. These values were consistent with those obtained by secondary ion mass spectroscopy (SIMS).     

2 MeV ion irradiation effects on AlGaN/GaN HFET devices

AlGaN/GaN heterostructure field effect transistors (HFETs) were irradiated with 2 MeV protons, carbon, oxygen, iron and krypton ions with fluences ranging from 1 × 10⁹ cm^?2 to 1 × 10¹³ cm^?2. DC, pulsed I–V characteristics, loadpull and S-parameters of the AlGaN HFET devices were measured before and after irradiation. In parallel, a thick GaN reference layer was also irradiated with the same ions and was characterized by X-ray diffraction, photoluminescence, Hall measurements before and after irradiation. Small changes in the device performance were observed after irradiation with carbon and oxygen at a fluence of 5 × 10¹⁰ cm^?2. Remarkable changes in device characteristics were seen at a fluence of 1 × 10¹² cm^?2 for carbon, oxygen, iron and krypton irradiation. Similarly, remarkable changes were also observed in the GaN layer for irradiations with fluence of 1 × 10¹² cm^?2. The results found on devices and on the GaN layer were compared and correlated.     

The influence of high energy electron irradiation on the Schottky barrier height and the Richardson constant of Ni/4H-SiC Schottky diodes

The influence of high energy electron (HEE) irradiation from a Sr-90 radio-nuclide on n-type Ni/4H–SiC samples of doping density 7.1×10¹⁵ cm⁻³ has been investigated over the temperature range 40–300 K. Current–voltage (I–V), capacitance–voltage (C–V) and deep level transient spectroscopy (DLTS) were used to characterize the devices before and after irradiation at a fluence of 6×10¹⁴ electrons-cm⁻². For both devices, the I–V characteristics were well described by thermionic emission (TE) in the temperature range 120–300 K, but deviated from TE theory at temperature below 120 K. The current flowing through the interface at a bias of 2.0 V from pure thermionic emission to thermionic field emission within the depletion region with the free carrier concentrations of the devices decreased from 7.8×10¹⁵ to 6.8×10¹⁵ cm⁻³ after HEE irradiation. The modified Richardson constants were determined from the Gaussian distribution of the barrier height across the contact and found to be 133 and 163 A cm⁻² K⁻² for as-deposited and irradiated diodes, respectively. Three new defects with energies 0.22, 0.40 and 0.71 eV appeared after HEE irradiation. Richardson constants were significantly less than the theoretical value which was ascribed to a small active device area.     

Enhancing charge transport in copper phthalocyanine thin film by elevating pressure of deposition chamber

Copper phthalocyanine (CuPc)-based thin film transistors were fabricated using CuPc films grown under different deposition pressure (P_dep) (ranging from 1.8 × 10⁻⁴ Pa to 1.0 × 10⁻¹ Pa). The transistor performance highly depended on P_dep. A field-effect mobility of 2.1 × 10⁻² cm²/(V s) was achieved under 1.0 × 10⁻¹ Pa. Detailed investigations revealed that P_dep modulates the molecular packing and orientation of the organic films grown on a SiO₂/Si substrate and influences the charge transport. Furthermore, from a device physics point of view, contact resistance of the fabricated transistors decreased when P_dep increased, which was beneficial in reducing energy consumption.     

Evaporated iron disulfide thin films with sulfurated annealing treatments

FeS₂ thin films were grown on a glass substrate using a physical vapor deposition technique at room temperature. Subsequently, the thin films were annealed in two different atmospheres: vacuum and vacuum-sulfur. In the vacuum-sulfur atmosphere a graphite box was used as sulfur container and the films were sulfurated successfully at 200–350 ºC. It was found that annealing in a vacuum-sulfur atmosphere was indispensable in order to obtain polycrystalline FeS₂ thin films. The polycrystalline nature and pure phase were determined by XRD and Raman techniques and the electrical properties by the Hall effect. Using the sulfurating technique, the n-type semiconductor was prepared at 200–350 °C and a p-type at 500 °C. The carrier concentrations were between 1.19×10²⁰ and 2.1×10²⁰ cm⁻³. The mobility was 9.96–5.25 cm² V⁻¹ s⁻¹ and the resistivity was 6.31×10⁻² to 1.089×10⁻² Ω cm. The results obtained from EDS showed that the films prepared in the vacuum-sulfur atmosphere were close to stoichiometric and that the indirect band gap varied between 1.03 and 0.945 eV.     

Carrier gas and VI/II ratio effects on carbon clusters incorporation into ZnO films grown by MOCVD

Undoped ZnO films were deposited by atmospheric metal-organic chemical vapor deposition (MOCVD) on (0001) ZnO substrate. The films were grown at various partial pressure ratios of oxygen and zinc precursors (VI/II) using either N₂ or H₂ as carrier gas. Micro-Raman scattering was employed to study the effects of carrier gas, VI/II ratio and annealing on carbon impurity incorporation into the ZnO films. Besides the well known phonon modes of ZnO, Raman spectra of the samples grown with N₂ carrier gas show two additional broad peaks, which are ascribed to carbon sp² clusters related modes, spreading in the frequency range 1300–1600 cm^?1 and dominate the Raman spectrum of the sample grown under oxygen deficiency (VI/II=0.25). In addition, a band centered at ～520 cm^?1, considered as some defects related local vibrations, appears in the samples grown with N₂ as carrier gas and its intensity increases when the VI/II ratio decreases. The average cluster size, estimated from the intensity ratio of D over G bands of the carbon sp² clusters, ranges from 16.5 to 19.4 Å. However, in all the samples grown with H₂ as carrier gas, the bands related to carbon sp² clusters and defects, are largely suppressed and the second-order-Raman scattering band (1050–1200 cm^?1) is clearly observed in addition to the bulk ZnO lattice modes. After annealing the samples at 900 °C in oxygen ambient, the crystal quality has been improved for all the samples but the carbon related bands, formed in the as-deposited films grown with the N₂ carrier gas, were only weakened.     

Electronic properties of Si/Si-Ge Alloy/Si(100) heterostructures formed by ECR Ar plasma CVD without substrate heating

By using our low-energy Ar plasma enhanced chemical vapor deposition (CVD) at a substrate temperature below 100 °C during plasma exposure without substrate heating, modulation of valence band structures and infrared photoluminescence can be observed by change of strain in a Si/strained Si_0.4Ge_0.6/Si(100) heterostructure. For the strained Si_0.5Ge_0.5 film, Hall mobility at room temperature was confirmed to be as high as 660 cm² V⁻¹ s⁻¹ with a carrier concentration of 1.3×10¹⁸ cm⁻³ for n-type carrier, although the carrier origin was unclear. Moreover, good rectifying characteristics were obtained for a p⁺Si/nSi_0.5Ge_0.5 heterojunction diode. This indicates that the strained Si-Ge alloy and Si films and their heterostructures epitaxially grown by our low-energy Ar plasma enhanced CVD without substrate heating can be applicable effectively for various semiconductor devices utilizing high carrier mobility, built-in potential by doping and band engineering.     

The effect of temperature on the growth and properties of green light-emitting In0.5Ga0.5N films prepared by reactive sputtering with single cermet target

We have grown In_0.5Ga_0.5N films on SiO₂/Si (100) substrate at 100–400 °C for 90 min by rf reactive sputtering with single cermet target. The target was made by hot pressing the mixture of metallic indium, gallium and ceramic gallium nitride powder. X-ray diffraction (XRD) measurements indicated that In_0.5Ga_0.5N films had wurtzite structure and showed the preferential (1 0 -1 0) diffraction. Both SEM and AFM showed that In_0.5Ga_0.5N films were smooth and had small roughness of 0.6 nm. Optical properties were measured by photoluminescence (PL) spectra from room temperature to low temperature of 20 K. The 2.28 eV green emission was achieved at room temperature for all our InGaN films. The electrical properties of In_0.5Ga_0.5N films on a SiO₂/Si (100) substrate were measured by the Hall measurement at room temperature. InGaN films showed the electron concentration of 1.51×10²⁰–1.90×10²⁰ cm⁻³ and mobility of 5.94–10.5 cm² V⁻¹ s⁻¹. Alloying of InN and GaN was confirmed for the sputtered InGaN.     

Low-temperature formation of self-assembled Ge quantum dots on Si(100) under high carbon mediation via solid-phase epitaxy

CMOS-compatible low-temperature formation of self-assembled Ge quantum dots (QDs) by carbon (C) mediation via a solid-phase epitaxy (SPE) has been demonstrated. The samples were prepared by a solid-source molecular beam epitaxy (MBE) system. C and Ge were successively deposited on Si(100) at 200 °C and Ge/C/Si heterostructure was annealed in the MBE chamber. Sparse Volmer-Weber mode Ge dots without a wetting layer were formed for C coverage (θ_C) of 0.25 and 0.5 ML by lowering SPE temperature (T_S) to 450 °C, but small and dense Stranski-Krastanov (SK)-mode Ge QDs with the wetting layer were obtained with increasing C coverage of 0.75 ML even at 450 °C. From the investigation of SPE temperature effect on Ge QD formation for θ_C of 0.75 ML, SK-mode Ge QDs of about 10 nm in diameter and of about 4.5×10¹¹ cm⁻² in density were formed at T_S≥400 °C. The wetting layer of SK-mode QDs was almost constant 0.2-nm thick at T_S≥450 °C. Measurements of chemical binding states of C in Ge QDs and at Ge/Si interface revealed that a large amount of C–Ge bonds were formed in the wetting layer for high C coverage, and the formation of C–Ge bonds, together with the formation of C–Si bonds, enabled the low-temperature formation of small and dense Ge QDs. These results suggest that the C-mediated solid-phase epitaxy is effective to form small and dense SK-mode QDs at low temperature.     

Investigations on the annealing behavior of high-energy carbon irradiated Au/n-GaAs Schottky barrier diodes

Au Schottky barrier diodes (SBDs) have been irradiated using high-energy carbon ion fluences of 1×10¹¹, 1×10¹² and 1×10¹³ cm⁻². Current–voltage characteristics of unirradiated and irradiated diodes have been analyzed. The change in reverse leakage current increases with increasing ion fluence due to the irradiation-induced defects at the interface. The diodes were annealed at 523 and 623 K to study the effect of annealing. The rectifying behavior of the irradiated SBDs improves at 523 K. But at 623 K, the diode behavior deteriorates irrespective of the fluences. Better enhancement in the barrier height and also improvement in the ideality factor of the diodes has been observed at the annealing temperature of 523 K. Scanning Electron Microscopic analysis was carried out on the irradiated samples to delineate the projected range of the defects by high-energy carbon ion irradiation.     

Properties of CdTe films brush plated on high temperature substrates

CdTe thin films were brush plated on substrates maintained at temperatures in the range 30–90 °C from the precursors. The films exhibited cubic structure. Optical band gap of 1.45 eV was obtained. XPS measurements indicated the formation of CdTe. AFM studies indicated the formation of fine grains of the order of 50 nm, for the films deposited on room temperature substrates. Hot probe measurements indicated films to be n-type. A mobility in the range of 5–60 cm² V⁻¹ s⁻¹ and a carrier density of 10¹⁵ cm⁻³ was obtained.     

Surface photovoltage measurements for Cu,Ti and W determination in Si wafers

p-type (1 0 0) Cz silicon wafers were contaminated with Cu, W, and Ti in the dose range of 5×10⁹–1×10¹⁴ cm⁻² by ion implantation. Surface photovoltage measurements were used to detect the metal impurities after annealing. Fast and slow cooling have been used and calibration curves have been obtained in all cases. Higher sensitivity has been determined for slow cooling (Cu and W) or fast cooling (Ti) depending if deep levels are associated with substitutional (Cu and W) or interstitial (Ti) position.     

In-situ MBE Si as passivating interlayer on GaAs for HfO2 MOSCAP’s: effect of GaAs surface reconstruction

We report a study of MOS capacitors having a dielectric of HfO₂ and an interlayer of Si deposited in-situ, by MBE on GaAs surfaces prepared with various surface-reconstructions. Interface state densities of about 1 × 10¹² eV⁻¹cm⁻² have been obtained. Capacitors on the Ga-rich surface, measured with peripheral illumination, show signs of a possible inversion layer.     

Effect of interface traps for ultra-thin high-k gate dielectric based MIS devices on the capacitance-voltage characteristics

The impact of states at the Al₂O₃/Si interface on the capacitance-voltage C-V characteristics of a metal/insulator/semiconductor heterostructure (MIS) capacitor was studied by a numerical simulation, by solving Schrodinger-Poisson equations and taking the electron emission rate from the interface state into account. Efficient computation and accurate physics based capacitance model of MOS devices with advanced ultra-thin equivalent oxide thickness (EOT) (down to 2.5 nm clearly considered here) were introduced for the near future integrated circuit IC technology nodes. Due to the importance of the interface state density for a low dimension and very low oxide thickness, a high frequency C-V model has been developed to interpret the effect of interface state density traps which communicate with the Al₂O₃/Si and their influence on the C-V characteristics. We found that these states are manifested by jumping capacity in the inversion zone, for a density of interface, higher than 1 × 10¹¹ cm^− 2 eV^− 1 during a p-doping of 1 × 10¹⁸ cm^− 3. This behavior has been investigated with various doping, temperature, frequency and energy levels on the C-V curves, and compared with the MIS structure that contains a standard SiO₂ insulator.