Investigations on the annealing behavior of high-energy carbon irradiated Au/n-GaAs Schottky barrier diodes

Au Schottky barrier diodes (SBDs) have been irradiated using high-energy carbon ion fluences of 1×10¹¹, 1×10¹² and 1×10¹³ cm⁻². Current–voltage characteristics of unirradiated and irradiated diodes have been analyzed. The change in reverse leakage current increases with increasing ion fluence due to the irradiation-induced defects at the interface. The diodes were annealed at 523 and 623 K to study the effect of annealing. The rectifying behavior of the irradiated SBDs improves at 523 K. But at 623 K, the diode behavior deteriorates irrespective of the fluences. Better enhancement in the barrier height and also improvement in the ideality factor of the diodes has been observed at the annealing temperature of 523 K. Scanning Electron Microscopic analysis was carried out on the irradiated samples to delineate the projected range of the defects by high-energy carbon ion irradiation.     

Evaluation of the hydrostatic pressure effect on Mn/p-Si Schottky barrier diode electrical parameters and interface states

Mn/p-Si Schottky barrier diode (SBD) electrical parameters and interface state density have been investigated with current–voltage (I–V) characteristics and Cheung's functions employing hydrostatic pressure. The interface state density of the diodes has an exponential growth with bias from the midgap towards the top of the valance band. We have seen that the Schottky barrier height (SBH) for Mn/p-Si SBD has a pressure coefficient of 1.61 meV/kbar (16.1 meV/GPa). We have reported that the p-type barrier height exhibited a weak pressure dependence, accepting that the Fermi level at the interface do not shift as a function of the pressure.     

Temperature dependent dielectric studies of Ni/n-GaP Schottky diodes by capacitance and conductance measurements

The dielectric properties of Ni/n-GaP Schottky diode were investigated in the temperature range 140–300 K by capacitance–voltage (C–V) and conductance–voltage (G/ω–V) measurements. The effect of temperature on series resistance (R_s) and interface state density (N_ss) were investigated. The dependency of dielectric constant (ε′), dielectric loss (ε′′), loss tangent (tan δ), ac conductivity (σ_ac), real (M′) and imaginary (M′′) parts of the electric modulus over temperature were evaluated and analyzed at 1 MHz frequency. The temperature dependent characteristics of ε′ and ε′′ reveal the contribution of various polarization effects, which increases with temperature. The Arrhenius plot of σ_ac shows two activation energies revealing the presence of two distinct trap states in the chosen temperature range. Moreover, the capacitance–frequency (C–f) measurement over 1 kHz to 1 MHz was carried out to study the effect of localized interface states.     

Self-heating and destruction of high-voltage 4H-SiC rectifier diodes under a single short current surge pulse

Self-heating of high-voltage (6 kV class) 4H-SiC rectifier p⁺–n–n⁺ diodes under the action of a single 20 μs forward current surge pulse has been studied experimentally up to current densities j ≈ 100 kA/cm². The diode parameters are stable after a single surge pulse with current density j ≈ 60 kА/cm², although the estimated temperature of the diode at the end of this pulse is ～1650 K. After several pulses of this amplitude or after subjecting the diode to pulses with higher current density, the diode degrades. The degradation is manifested in an irreversible decrease of the differential resistance of the diode under a high forward bias. Even a single 20 μs pulse with peak current density j ≈ 100 kA/cm² leads to total destruction of the device.     

Determination of contact parameters of Ni/n-GaP Schottky contacts

The electrical analysis of Ni/n-GaP structure has been investigated by means of current–voltage (I–V), capacitance–voltage (C–V) and capacitance–frequency (C–f) measurements in the temperature range of 120–320 K in dark conditions. The forward bias I–V characteristics have been analyzed on the basis of standard thermionic emission (TE) theory and the characteristic parameters of the Schottky contacts (SCs) such as Schottky barrier height (SBH), ideality factor (n) and series resistance (R_s) have been determined from the I–V measurements. The experimental values of SBH and n for the device ranged from 1.01 eV and 1.27 (at 320 K) to 0.38 eV and 5.93 (at 120 K) for Ni/n-GaP diode, respectively. The interface states in the semiconductor bandgap and their relaxation time have been determined from the C–f characteristics. The interface state density N_ss has ranged from 2.08 × 10¹⁵ (eV^?1 m^?2) at 120 K to 2.7 × 10¹⁵ (eV^?1 m^?2) at 320 K. C_ss has increased with increasing temperature. The relaxation time has ranged from 4.7 × 10^?7 s at 120 K to 5.15 × 10^?7 s at 320 K.     

A cross-linked poly(methyl methacrylate) gate dielectric by ion-beam irradiation for organic thin-film transistors

The electrical characteristics of pentacene organic thin-film transistors (OTFTs) using cross-linked poly(methyl methacrylate) (PMMA) as the gate dielectric are reported. Ultra-thin films of cross-linked PMMA could be obtained by spin-coating and subsequent irradiation using a 1.515 MeV ⁴He⁺ ion beam. The resulting film, with a thickness of 33 nm, possessed a low leakage current density of about 10^?6 A cm^?2 for fields up to 2 MV cm^?1. OTFTs incorporating the cross-linked dielectric operated at relatively low voltages, <10 V, and exhibited a mobility of 1.1 cm² V^?1 s^?1, a threshold voltage of ?1 V, a sub-threshold slope of 220 mV per decade and an on/off current ratio of 1.0 × 10⁶.     

Frequency and voltage dependence of negative capacitance in Au/SiO2/n-GaAs structures

The frequency (f) and bias voltage (V) dependence of electrical and dielectric properties of Au/SiO₂/n-GaAs structures have been investigated in the frequency range of 10 kHz–3 MHz at room temperature by considering the presence of series resistance (R_s). The values of R_s, dielectric constant (ε′), dielectric loss (ε″) and dielectric loss tangent (tan δ) of these structures were obtained from capacitance–voltage (C–V) and conductance–voltage (G/ω–V) measurements and these parameters were found to be strong functions of frequency and bias voltage. In the forward bias region, C–V plots show a negative capacitance (NC) behavior, hence ε′–V plots for each frequency value take negative values as well. Such negative values of C correspond to the maximum of the conductance (G/ω). The crosssection of the C–V plots appears as an abnormality when compared to the conventional behavior of ideal Schottky barrier diode (SBD), metal–insulator–semiconductor (MIS) and metal–oxide–semiconductor (MOS) structures. Such behavior of C and ε′ has been explained with the minority-carrier injection and relaxation theory. Experimental results show that the dielectric properties of these structures are quite sensitive to frequency and applied bias voltage especially at low frequencies because of continuous density distribution of interface states and their relaxation time.     

Investigation of deep level defects in copper irradiated bipolar junction transistor

Commercial bipolar junction transistor (2N 2219A, npn) irradiated with 150 MeV Cu¹¹⁺-ions with fluence of the order 10¹² ions cm^?2, is studied for radiation induced gain degradation and deep level defects. I–V measurements are made to study the gain degradation as a function of ion fluence. The properties such as activation energy, trap concentration and capture cross-section of deep levels are studied by deep level transient spectroscopy (DLTS). Minority carrier trap levels with energies ranging from E_C ? 0.164 eV to E_C ? 0.695 eV are observed in the base–collector junction of the transistor. Majority carrier trap levels are also observed with energies ranging from E_V + 0.203 eV to E_V + 0.526 eV. The irradiated transistor is subjected to isothermal and isochronal annealing. The defects are seen to anneal above 350 °C. The defects generated in the base region of the transistor by displacement damage appear to be responsible for transistor gain degradation.     

Electrical and optical properties of Cu2ZnSnS4 grown by a thermal co-evaporation method and its diode application

Cu₂ZnSnS₄ (CZTS) is low cost and constitutes non-toxic materials abundant in the earth crust. Environment friendly solar cell absorber layers were fabricated by a thermal co-evaporation technique. Elemental composition of the film was stated by energy dispersive spectroscopy (EDS). Some optical and electrical properties such as absorption of light, absorption coefficient, optical band gap charge carrier density, sheet resistance and mobility were extracted. Optical band gap was found to be as 1.44 eV, besides, charge carrier density, resistivity and mobility were found as 2.14×10¹⁹ cm⁻³, 8.41×10⁻⁴ Ω cm and 3.45×10² cm² V⁻¹ s⁻¹, respectively. In this study Ag/CZTS/n-Si Schottky diode was fabricated and basic diode parameters including barrier height, ideality factor, and series resistance were concluded using current–voltage and capacitance–voltage measurements. Barrier height and ideality factor values were found from the measurements as 0.81 eV and 4.76, respectively, for Ag/CZTS/n-Si contact.     

ZnO/p-Si heterojunction photodiode by sol–gel deposition of nanostructure n-ZnO film on p-Si substrate

The electrical and photovoltaic properties of the nanostructure ZnO/p-Si diode have been investigated. The nanostructure ZnO/p-Si diode was fabricated using sol–gel spin coating method. The ideality factor and barrier height of the diode were found to be 3.18 and 0.78 eV, respectively. The obtained n ideality factor is higher than 2, indicating that the diode exhibits a non-ideal behavior due to the oxide layer and the presence of surface states. The nanostructure of the ZnO improves the quality of ZnO/p-Si interface. The diode shows a photovoltaic behavior with a maximum open circuit voltage V_oc of 0.26 V and short-circuits current I_sc of 1.87×10^?8 A under 100 mW/cm². It is evaluated that the nanostructure ZnO/p-Si diode is a photodiode with the obtained electronic parameters.     

Fabrication and electrical characterization of Al/p-ZnIn2Se4 thin film Schottky diode structure

Polycrystalline thin films of ternary ZnIn₂Se₄ compound with p-type conductivity were deposited on a pre-deposited aluminium (Al) film by a flash evaporation technique. A Schottky diode comprising of Al/p-ZnIn₂Se₄ structure was fabricated and characterized in the temperature range 303–323 K in dark condition. The Schottky diode was subjected to current (I)-voltage (V) and capacitance (C)-voltage (V) characterization. The Al/p-ZnIn₂Se₄ Schottky diode showed behaviour typical of a p-n junction diode. The devices showed very good diode behaviour with the rectification ratio of about 10⁵ at 1.0 V in dark. The Schottky diode ideality factor, barrier height, carrier concentration, etc. were derived from I-V and C-V measurements. At lower applied voltages (V≤0.5 V), the electrical conduction was found to take place by thermionic emission (TE) whereas at higher voltages (V>0.5 V), a space charge limited conduction mechanism (SCLC) was observed. An energy band diagram was constructed for fabricated Al/p-ZnIn₂Se₄ Schottky diode.     

2 MeV ion irradiation effects on AlGaN/GaN HFET devices

AlGaN/GaN heterostructure field effect transistors (HFETs) were irradiated with 2 MeV protons, carbon, oxygen, iron and krypton ions with fluences ranging from 1 × 10⁹ cm^?2 to 1 × 10¹³ cm^?2. DC, pulsed I–V characteristics, loadpull and S-parameters of the AlGaN HFET devices were measured before and after irradiation. In parallel, a thick GaN reference layer was also irradiated with the same ions and was characterized by X-ray diffraction, photoluminescence, Hall measurements before and after irradiation. Small changes in the device performance were observed after irradiation with carbon and oxygen at a fluence of 5 × 10¹⁰ cm^?2. Remarkable changes in device characteristics were seen at a fluence of 1 × 10¹² cm^?2 for carbon, oxygen, iron and krypton irradiation. Similarly, remarkable changes were also observed in the GaN layer for irradiations with fluence of 1 × 10¹² cm^?2. The results found on devices and on the GaN layer were compared and correlated.     

Ultraviolet photodetectors based on low temperature processed ZnO/PEDOT:PSS Schottky barrier diodes

In this work, vertical Schottky barrier diodes (SBDs) were fabricated using a thin film of ZnO (50 nm) and PEDOT:PSS deposited by RF Sputtering and micro-drop casting, respectively. ITO and Au were used as ohmic contacts to ZnO and PEDOT:PSS films, respectively. The final structure consisted on Glass/ITO/ZnO/PEDOT:PSS/Au. The SBDs performance was characterized under dark and four different wavelengths conditions. From current–voltage characteristics, under dark and ambient conditions, a diode ideality factor of 1.4; a saturation current density of 1×10⁻⁹ A/cm²; a Schottky barrier height of 0.9 eV and a rectification ratio of 5 orders of magnitude at ±1 V were obtained. A carrier density of 5×10¹⁷ cm⁻³ for the ZnO film was estimated from capacitance–voltage measurements. For their characterization as photodiodes, the SBDs were illuminated with an ultra-bright UV (~380 nm) LED. A maximum UV responsivity of 0.013 A/W was obtained. The transient response of the SBDs was also analyzed with the UV LED connected to a pulsed signal of 0.5 Hz, demonstrating rise and fall times in the order of 200 ms. With a low temperature processing (<80 °C), visible-blind and UV photon-detection characteristics, the fabricated SBDs are candidates for flexible optoelectronics devices such as optical receivers for digital signal processing and measurement of light intensity.     

High-performing transparent photodetectors based on Schottky contacts

Transparent UV-photodetectors exhibiting very high responsivity and fast operation are discussed. Schottky contact photoelectric devices utilizing wide band gap TiO₂ absorber layer were evaluated for their performances as UV-photodetectors. Three different work function metals Cu, Mo and Ni were used to realize Schottky barrier with TiO₂. Ni Schottky contacts were found to be most suitable to fabricate high responsivity (2.034 A/W) photodetector with faster rise time (0.14 ms) and wide linear dynamic range (128 dB) operating at small applied reverse bias of −1 V. However, higher barrier height in the case of Mo/TiO₂ interface resulted in lowest dark current density of the value 2.21×10⁻⁸ A/cm² with quick fall time of 0.52 ms. The modulation of the barrier height would provide a route for designing fast and high responsive Schottky photodetector with broad linear dynamic range performance.     

Improved interfacial quality of GaAs metal-oxide-semiconductor device with NH3-plasma treated yittrium-oxynitride as interfacial passivation layer

The interfacial and electrical properties of GaAs metal-oxide-semiconductor capacitors with yittrium-oxynitride interfacial passivation layer treated by N₂ −/NH₃-plasma are investigated, showing that lower interface-state density (1.24 × 10¹² cm^− 2 eV^− 1 near midgap), smaller gate leakage current density (1.34 × 10^− 5 A/cm² at V_fb + 1 V), smaller capacitance equivalent thickness (1.43 nm), and larger equivalent dielectric constant (24.5) can be achieved for the sample with NH₃-plasma treatment than the samples with N₂ −/no-plasma treatment. The mechanisms lie in the fact that NH₃-plasma can provide not only N atoms, but H atoms and NH radicals to effectively passivate the high-k/GaAs interface, thus less pinning the Femi level at high-k/GaAs interface.     

Temperature and light dependent diode current in high-efficiency solution-processed small-molecule solar cells

This paper reports on the detail analysis of the DC electrical and photoelectrical properties of the high-efficient (η = 8.01% under standard 100 mW/cm² AM1.5 illumination) small molecule bulk heterojunction (SM BHJ) solar cells p-DTS(FBTTh₂)₂/PC₇₀BM. In this SM BHJ solar cell, the dark diode current is determined by the multistep tunnel-recombination via interface states at low forward bias (V < 0.65 V) and the interface state assisted thermionic emission at high forward bias (V > 0.65 V). The effect of illumination on the diode current was also quantitatively investigated. It was observed a reduced Shockley–Read–Hall recombination via interface states at large forward bias (from the maximum power point to the open-circuit conditions). The expression of the load I–V characteristic of the illuminated high-efficient SM BHJ solar cells was derived in the presence of the light dependent series and shunt resistance.     

Current–voltage and capacitance–voltage characteristics of Al Schottky contacts to strained Si-on-insulator in the wide temperature range

The electrical characteristics of Al/strained Si-on-insulator (sSOI) Schottky diode have been investigated using current–voltage (I–V) and capacitance–voltage (C–V) measurements in the wide temperature range of 200–400 K in steps of 25 K. It was found that the barrier height (0.57–0.80 eV) calculated from the I–V characteristics increased and the ideality factor (1.97–1.28) decreased with increasing temperature. The barrier heights determined from the C–V measurements were higher than those extracted from the I–V measurements, associated with the formation of an inhomogeneous Schottky barrier at the interface. The series resistance estimated from the forward I–V characteristics using Cheung and Norde methods decreased with increasing temperature, implying its strong temperature dependence. The observed variation in barrier height and ideality factor could be attributed to the inhomogeneities in Schottky barrier, explained by assuming Gaussian distribution of barrier heights. The temperature-dependent I–V characteristics showed a double Gaussian distribution with mean barrier heights of 0.83 and 1.19 eV and standard deviations of 0.10 and 0.16 eV at 200–275 and 300–400 K, respectively. From the modified Richardson plot, the modified Richardson constant were calculated to be 21.8 and 29.4 A cm⁻² K⁻² at 200–275 and 300–400 K, respectively, which were comparable to the theoretical value for p-type sSOI (31.6 A cm⁻² K⁻²).     

Characteristics of Ni/SiC Schottky diodes grown by ICP-CVD

A Ni/SiC Schottky diode was fabricated with an α-SiC thin film grown by the inductively coupled plasma chemical vapor deposition, ICP-CVD method on a (1 1 1) Si wafer. The α-SiC film was grown on a carbonized Si layer that the Si surface had been chemically converted to a very thin SiC layer by the ICP-CVD method at 700 °C. To reduce defects between the Si and α-SiC, the surface of the Si wafer is slightly carbonized. The film characteristics of α-SiC were investigated by employing TEM and FT-IR. A sputtered Ni thin film was used for the anode metal. The boundary status of the Ni/SiC contact was investigated by AES as a function of annealing temperature. It is shown that the ohmic contact could be acquired below 1000 °C annealing temperature. The forward voltage drop of the Ni/α-SiC Schottky diode is 1.0 V at 100 A/cm². The breakdown voltage is 545 V which is five times larger than the ideal breakdown voltage of a silicon device. Also, the dependence of barrier height on temperature was observed.     

Effect of interface traps for ultra-thin high-k gate dielectric based MIS devices on the capacitance-voltage characteristics

The impact of states at the Al₂O₃/Si interface on the capacitance-voltage C-V characteristics of a metal/insulator/semiconductor heterostructure (MIS) capacitor was studied by a numerical simulation, by solving Schrodinger-Poisson equations and taking the electron emission rate from the interface state into account. Efficient computation and accurate physics based capacitance model of MOS devices with advanced ultra-thin equivalent oxide thickness (EOT) (down to 2.5 nm clearly considered here) were introduced for the near future integrated circuit IC technology nodes. Due to the importance of the interface state density for a low dimension and very low oxide thickness, a high frequency C-V model has been developed to interpret the effect of interface state density traps which communicate with the Al₂O₃/Si and their influence on the C-V characteristics. We found that these states are manifested by jumping capacity in the inversion zone, for a density of interface, higher than 1 × 10¹¹ cm^− 2 eV^− 1 during a p-doping of 1 × 10¹⁸ cm^− 3. This behavior has been investigated with various doping, temperature, frequency and energy levels on the C-V curves, and compared with the MIS structure that contains a standard SiO₂ insulator.     

Characterization of MIS structures and thin film transistors using RF-sputtered HfO2/HIZO layers

MIS structures using HfO₂ and HIZO layers, both deposited by room temperature RF magnetron sputtering are fabricated for TFTs application and characterized using capacitance-voltage. The relative dielectric constant obtained at 1 kHz was 11, the charge carrier concentration of the HIZO was in the range of (2–3) × 10¹⁸ cm^− 3 and the interface trap density at flat band was smaller than 2 × 10¹² cm^− 2. The critical electric field of the HfO₂ layer was higher than 5 × 10⁵ V/cm, with a current density in the operating voltage range below 4 × 10^− 8 A/cm². The hysteresis and bias stress behavior of RF-sputtered HfO₂/HIZO MIS structures is presented. Fabricated HfO₂/HIZO TFTs worked in the operation voltage range below 8 V.