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1.
The interfacial reactions between In49Sn solders and Ag thick films at temperatures ranging from 200°C to 350°C have been
studied. The intermetallic compound formed at the Ag/In49Sn interface is Ag2In enveloped in a thin layer of AgIn2. Through the measurement of the thickness decrease of Ag thick films, it has been determined that the reaction kinetics of
Ag2In has a linear relation to reaction time. Morphology observations indicated that the linear reaction of Ag2In was caused by the floating of Ag2In into the In49Sn solder as a result of the In49Sn solder penetrating into the porous Ag thick film. A sound joint can be
obtained when a sufficient thickness of the Ag thick film (over 19.5 μm) reacts with the In49Sn solder. In this case, the
tensile tested specimens fracture in the In49Sn matrix. 相似文献
2.
T. H. Chuang S. Y. Chang L. C. Tsao W. P. Weng H. M. Wu 《Journal of Electronic Materials》2003,32(3):195-200
The intermetallic compounds formed at the interfaces between In-49Sn solder balls and Au/Ni/Cu pads during the reflow of In-49Sn
solder, ball-grid array (BGA) packages are investigated. Various temperature profiles with peak temperatures ranging from
140°C to 220°C and melting times ranging from 45 sec to 170 sec are plotted for the reflow processes. At peak temperatures
below 170°C, a continuous double layer of intermetallics can be observed, showing a composition of Au(In,Ni)2/Au(In,Ni). Through selective etching of the In-49Sn solders, the intermetallic layer is made up of irregular coarse grains.
In contrast, a number of cubic-shaped AuIn2 intermetallic compounds appear at the interfaces and migrate toward the upper domes of In-49Sn solder balls after reflow
at peak temperatures above 200°C for longer melting times. The upward floating of the AuIn2 cubes can be explained by a thermomigration effect caused by the temperature gradient present in the liquid solder ball.
The intermetallic compounds formed under various reflow conditions in this study exhibit different types of morphology, yet
the ball shear strengths of the solder joints in the In-49Sn BGA packages remain unaffected. 相似文献
3.
For the application of In-49Sn solder in bonding recycled-sputtering targets to Cu back plates, the intermetallic compounds
formed at the In-49Sn/Cu interface are investigated. Scanning electron microscopy (SEM) observations show that the interfacial
intermetallics consist of a planar layer preceded by an elongated scalloped structure. Electron-probe microanalyzer analyses
indicate that the chemical compositions of the planar layer and the scalloped structure are Cu74.8In12.2Sn13.0 and Cu56.2In20.1Sn23.7, respectively, which correspond to the ε-Cu3(In,Sn) and η-Cu6(In,Sn)5 phases. Kinetics analyses show that the growth of both intermetallic compounds is diffusion controlled. The activation energies
for the growth of η- and ε-intermetallics are calculated to be 28.9 kJ/mol and 186.1 kJ/mol. Furthermore, the formation mechanism of intermetallic compounds
during the In-49Sn/Cu soldering reaction is clarified by marking the original interface with a Ta-thin film. Wetting tests
are also performed, which reveal that the contact angles of liquid In-49Sn drops on Cu substrates decline to an equilibrium
value of 25°C. 相似文献
4.
The interfacial reactions between liquid In-49Sn solder and Ni substrates at temperatures ranging from 150°C to 450°C for
15 min to 240 min have been investigated. The intermetallic compounds formed at the In-49Sn/Ni interfaces are identified to
be a ternary Ni33In20Sn47 phase using electron-probe microanalysis (EPMA) and x-ray diffraction (XRD) analyses. These interfacial intermetallics grow
with increasing reaction time by a diffusion-controlled mechanism. The activation energy calculated from the Arrhenius plot
of reaction constants is 56.57 kJ/mol. 相似文献
5.
6.
The intermetallic compounds (IMCs) formed during the reflow and aging of Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA
packages with Au/Ni surface finishes were investigated. After reflow, the thickness of (Cu, Ni, Au)6Sn5 interfacial IMCs in Sn3Ag0.5Cu0.06Ni0.01Ge was similar to that in the Sn3Ag0.5Cu specimen. The interiors of the solder balls
in both packages contained Ag3Sn precipitates and brick-shaped AuSn4 IMCs. After aging at 150°C, the growth thickness of the interfacial (Ni, Cu, Au)3Sn4 intermetallic layers and the consumption of the Ni surface-finished layer on Cu the pads in Sn3Ag0.5Cu0.06Ni0.01Ge solder
joints were both slightly less than those in Sn3Ag0.5Cu. In addition, a coarsening phenomenon for AuSn4 IMCs could be observed in the solder matrix of Sn3Ag0.5Cu, yet this phenomenon did not occur in the case of Sn3Ag0.5Cu0.06Ni0.01Ge.
Ball shear tests revealed that the reflowed Sn3Ag0.5Cu0.06Ni0.01Ge packages possessed bonding strengths similar to those of
the Sn3Ag0.5Cu. However, aging treatment caused the ball shear strength in the Sn3Ag0.5Cu packages to degrade more than that
in the Sn3Ag0.5Cu0.06Ni0.01Ge packages. 相似文献
7.
M. T. Sheen C. M. Chang H. C. Teng J. H. Kuang K. C. Hsieh W. H. Cheng 《Journal of Electronic Materials》2002,31(8):895-902
The joint strength and fracture surface of Pb/Sn and Au/Sn solders in laserdiode packages after thermal-aging testing were
studied experimentally. Specimens were aged at 150°C for up to 49 days. The joint strength decreased as aging time increased.
The microstructure and fracture surface of the Pb/Sn and Au/Sn solder joints showed that the joint strength decrease was caused
by both the enlargement of the initial voids and an increase in the number of voids as aging time increased. The formation
of Kirkendall voids with intermetallic-compound (IMC) growth of the Pn/Sn solder as aging time increased was also a possible
mechanism for the joint-strength reduction. Finite-element method (FEM) simulations were performed on the joint-strength estimation
of Pb/Sn and Au/Sn solders in thermal-aging tests. The coupled thermal-elasticity-plasticity model was used to simulate distributions
of the thermal and residual stresses, creep deformation, and joint-strength variations in the solder joints under various
thermal-aging tests. Simulation results were in good agreement with the experimental measurements that the solder-joint strength
decreased as aging time increased. The result suggests that the FEM is an effective method for analyzing and predicting the
solder-joint strength in laserdiode packages. 相似文献
8.
Intermetallic compound formation and morphology evolution in the 95Pb5Sn flip-chip solder joint with the Ti/Cu/Ni under bump
metallization (UBM) during 350°C reflow for durations ranging from 50 sec to 1440 min were investigated. A thin intermetallic
layer of only 0.4 μm thickness was formed at the 95Pb5Sn/UBM interface after reflow for 5 min. When the reflow was extended
to 20 min, the intermetallic layer grew thicker and the phase identification revealed the intermetallic layer comprised two
phases, (Ni,Cu)3Sn2 and (Ni,Cu)3Sn4. The detection of the Cu content in the intermetallic compounds indicated that the Cu atoms had diffused through the Ni layer
and took part in the intermetallic compound formation. With increasing reflow time, the (Ni,Cu)3Sn4 phase grew at a faster rate than that of the (Ni,Cu)3Sn2 phase. Meanwhile, irregular growth of the (Ni,Cu)3Sn4 phase was observed and voids formed at the (Ni,Cu)3Sn2/Ni interface. After reflow for 60 min, the (Ni,Cu)3Sn2 phase disappeared and the (Ni,Cu)3Sn4 phase spalled off the NI layer in the form of a continuous layer. The gap between the (Ni,Cu)3Sn4 layer and the Ni layer was filled with lead. A possible mechanism for the growth, disappearance, and spalling of the intermetallic
compounds at the 95Pb5Sn/UBM interface was proposed. 相似文献