High-Performance Metal–Insulator–Metal Capacitors Using Amorphous BaSm2Ti4O12 Thin Film

The dielectric properties of the amorphous BaSm₂Ti₄O₁₂ (BSmT) film with various thicknesses were investigated to evaluate its potential use as a metal-insulator-metal (MIM) capacitor. An amorphous 35-nm-thick BSmT film grown at 300 degC exhibited a high capacitance density of 9.9 fF/mum² at 100 kHz and a low leakage current density of 1.790 nA/cm² at 1 V. The quadratic and linear voltage coefficients of capacitance of the film were 599 ppm/V² and -81 ppm/V at 100 kHz, respectively. The temperature coefficient of capacitance of the film was also low about 236 ppm/degC at 100 kHz. These results confirmed the suitability of the amorphous BSmT film as a high-performance MIM capacitor     

Electrical Properties of $hbox{Bi}_{5}hbox{Nb}_{3} hbox{O}_{15}$ Thin Film Grown on $hbox{TiN}/hbox{SiO}_{2}/ hbox{Si}$ at Room Temperature for Metal–Insulator–Metal Capacitors

Buckling was observed in $hbox{Bi}_{5}hbox{Nb}_{3}hbox{O}_{15}$ (BiNbO) films grown on $hbox{TiN}/hbox{SiO}_{2}/hbox{Si}$ at 300 $^{circ}hbox{C}$ but not in films grown at room temperature and annealed at 350 $^{circ}hbox{C}$. The 45-nm-thick films showed a high capacitance density and a low dissipation factor of 8.81 $hbox{fF}/muhbox{m}^{2}$ and 0.97% at 100 kHz, respectively, with a low leakage current density of 3.46 $hbox{nA}/hbox{cm}^{2}$ at 2 V. The quadratic and linear voltage coefficients of capacitance of this film were 846 $hbox{ppm}/hbox{V}^{2}$ and 137 ppm/V, respectively, with a low temperature coefficient of capacitance of 226 $hbox{ppm}/^{circ}hbox{C}$ at 100 kHz. This suggests that a BiNbO film grown on a $hbox{TiN}/ hbox{SiO}_{2}/hbox{Si}$ substrate is a good candidate material for high-performance metal–insulator–metal capacitors.      

High Density and Low Leakage Current in $ hbox{TiO}_{2}$ MIM Capacitors Processed at 300 $^{circ} hbox{C}$

We report Ir/TiO₂/TaN metal-insulator-metal capacitors processed at only 300degC, which show a capacitance density of 28 fF/mum² and a leakage current of 3 times 10^-8 (25degC) or 6 times 10^-7 (125degC) A/cm² at -1 V. This performance is due to the combined effects of 300degC nanocrystallized high-kappa TiO₂, a high conduction band offset, and high work-function upper electrode. These devices show potential for integration in future very-large-scale-integration technologies.     

Electrical Properties of Amorphous $hbox{Bi}_{5} hbox{Nb}_{3}hbox{O}_{15}$ Thin Film for RF MIM Capacitors

Amorphous $hbox{Bi}_{5}hbox{Nb}_{3}hbox{O}_{15}(hbox{B}_{5} hbox{N}_{3})$ film grown at 300 $^{circ}hbox{C}$ showed a high-$k$ value of 71 at 100 kHz, and similar $k$ value was observed at 0.5–5.0 GHz. The 80-nm-thick film exhibited a high capacitance density of 7.8 fF/$muhbox{m}^{2}$ and a low dissipation factor of 0.95% at 100 kHz with a low leakage-current density of 1.23 nA/ $hbox{cm}^{2}$ at 1 V. The quadratic and linear voltage coefficient of capacitances of the $hbox{B}_{5}hbox{N}_{3}$ film were 438 ppm/$hbox{V}^{2}$ and 456 ppm/V, respectively, with a low temperature coefficient of capacitance of 309 ppm/$^{circ}hbox{C}$ at 100 kHz. These results confirmed the potential of the amorphous $hbox{B}_{5}hbox{N}_{3}$ film as a good candidate material for a high-performance metal–insulator–metal capacitors.      

RF and Logic Performance Improvement of $ hbox{In}_{0.7}hbox{Ga}_{0.3}hbox{As}/hbox{InAs}/hbox{In}_{0.7}hbox{Ga}_{0.3}hbox{As}$ Composite-Channel HEMT Using Gate-Sinking Technology

Eighty-nanometer-gate In_0.7Ga_0.3As/InAs/In_0.7Ga_0.3As composite-channel high-electron mobility transistors (HEMTs), which are fabricated using platinum buried gate as the Schottky contact metal, were evaluated for RF and logic application. After gate sinking at 250degC for 3 min, the device exhibited a high g_m value of 1590 mS/mm at V_d = 0.5 V, the current-gain cutoff frequency f_T was increased from 390 to 494 GHz, and the gate-delay time was decreased from 0.83 to 0.78 ps at supply voltage of 0.6 V. This is the highest f_T achieved for 80-nm-gate-length HEMT devices. These superior performances are attributed to the reduction of distance between gate and channel and the reduction of parasitic gate capacitances during the gate-sinking process. Moreover, such superior performances were achieved through a very simple and straightforward fabrication process with optimal epistructure of the device.     

Comparison of MONOS Memory Device Integrity When Using $hbox{Hf}_{1 - x - y}hbox{N}_{x}hbox{O}_{y}$ Trapping Layers With Different N Compositions

We have studied the nitrogen composition dependence of the characteristics of Hf_1-x-yN_xO_y/SiO₂/Si MONOS memory devices. By increasing the N composition in the Hf_1-x-yN_xO_y trapping layer, both the memory window and high-temperature retention improved. The Hf_0.3N_0.2O_0.5 MONOS device displayed good characteristics in terms of its plusmn9-V program/erase (P/E) voltage, 100-mus P/E speed, large initial 2.8-V memory window, and a ten-year extrapolated retention of 1.8 V at 85degC or 1.5 V at 125degC.     

Performance Improvement of $hbox{Sm}_{2}hbox{O}_{3}$ MIM Capacitors by Using Plasma Treatment After Dielectric Formation

In this letter, we investigate the dependence of the performance of metal-insulator-metal (MIM) capacitors with Sm₂O₃ dielectric on plasma treatment (PT) performed before Sm₂O₃ deposition, after Sm₂O₃ deposition, or both before and after Sm₂O₃ deposition. By performing PT in N₂ ambient (PTN) after Sm₂O₃ dielectric formation, the effective quadratic voltage coefficient of capacitance (VCC) can be reduced from 498 to 234 ppm/V² and the effective linear VCC can be reduced from 742.3 to 172 ppm/V for MIM capacitor with Sm₂O₃ dielectric having a capacitance density of ~ 7.5 fF/mum². The leakage current density at +3.3 V can be reduced from 3.44 10^-7 to 1.60 times 10^-8 A/cm² by performing PTN in both before and after Sm₂O₃ deposition. PTN after dielectric formation is an effective way to improve the performance of high-kappa dielectric MIM capacitors for RF and analog/mixed signal IC applications.     

Low-Voltage and High-Speed Operations of 30-nm-Gate Pseudomorphic $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}/hbox{In}_{0.7}hbox{Ga}_{0.3} hbox{As}$ HEMTs Under Cryogenic Conditions

In this letter, we fabricated 30-nm-gate pseudomorphic In_0.52 Al_0.48As/In_0.7Ga_0.3As HEMTs with multilayer cap structures to reduce source and drain parasitic resistances; we measured their dc and radio-frequency characteristics at 300, 77, and 16 K under various bias conditions. The maximum cutoff frequency fT was 498 GHz at 300 K and 577 GHz at 77 K. The maximum fT exceeded 600 GHz at 16 K. Even at a drain-source voltage V _ds of 0.4 V, we obtained an fT of 500 GHz at 16 K. This indicates that cryogenic HEMTs are favorable for low-voltage and high-speed operations. Furthermore, the present 30-nm-gate HEMTs at 300 K show almost the same fT values at the same dc-power dissipation as compared to 85-nm-gate InSb-channel HEMTs. The improvement of the maximum-oscillation-frequency f _max values was also observed at 77 and 16 K.     

A Two-Step-Recess Process Based on Atomic-Layer Etching for High-Performance $hbox{In}_{0.52}hbox{Al}_{0.48}hbox{As}hbox{/}hbox{In}_{0.53} hbox{Ga}_{0.47}hbox{As}$ p-HEMTs

We investigated 60-nm In_0.52Al_0.48As/In_0.53Ga_0.47As pseudomorphic high-electron mobility transistors (p-HEMTs) fabricated by using a Ne-based atomic-layer-etching (ALET) technology. The ALET process produced a reproducible etch rate of 1.47 Aring/cycle for an InP etch stop layer, an excellent InP etch selectivity of 70 against an In_0.52Al_0.48As barrier layer, and an rms surface-roughness value of 1.37 Aring for the exposed In_0.52Al_0.48As barrier after removing the InP etch stop layer. The application of the ALET technology for the gate recess of 60-nm In_0.52Al_0.48As/In_0.53Ga_0.47As p-HEMTs produced improved device parameters, including transconductance (G_M), cutoff frequencies (f_T)> and electron saturation velocity (vsat) in the channel layer, which is mainly due to the high etch selectivity and low plasma-induced damage to the gate area. The 60-nm In_0.52Al_0.48As/In_0.53Ga_0.47As p-HEMTs fabricated by using the ALET technology exhibited G_M,_Max = 1-17 S/mm, f_T = 398 GHz, and v_sat = 2.5 X 10⁷ cm/s.     

Laser Micromachining of Barium Titanate $({hbox {BaTiO}}_{3})$-Epoxy Nanocomposite-Based Flexible/Rollable Capacitors: New Approach for Making Library of Capacitors

This paper discusses laser micromachining of barium titanate (BaTiO₃)-polymer nanocomposite thin films. In particular, recent developments on high-capacitance, large-area, thin, flexible, embedded capacitors are highlighted. A variety of barium titanate (BaTiO₃)-epoxy polymer nanocomposite-based flexible/rollable thin films ranging from 2 to 25 mum thick were processed on large-area substrates (330 mm times 470 mm, or 495 mm times 607 mm) by liquid coating processes. The electrical performance of composites was characterized by dielectric constant (Dk), capacitance, and dissipation factor (loss) measurements. Nanocomposites provided high capacitance density (10-100 nF/in²) and low loss (0.02-0.04) at 1 MHz. Scanning electron microscopy (SEM) micrographs showed uniform particle distribution in the coatings. Uniform mixing of nanoparticles in the epoxy matrix results in high dielectric (> 3 times 10⁷ V/m) and mechanical strengths (> 3700 PSI). Reliability of the capacitor was ascertained by thermal cycling. Capacitance change was less than 5% after baking at 140degC for 4 h, and 1100 cycles from -55degC to 125degC (deep thermal cycle). A frequency-tripled Nd:YAG laser operating at a wavelength of 355 nm was used for the micromachining study. The micromachining was used to generate arrays of variable-thickness capacitors from the nanocomposites. The resultant thickness of the capacitors depends on the number of laser pulses applied.     

Fabrication of Self-Aligned Enhancement-Mode $ hbox{In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ MOSFETs With $ hbox{TaN/HfO}_{2}hbox{/AlN}$ Gate Stack

In this letter, we report the fabrication and characterization of self-aligned inversion-type enhancement-mode In_0.53Ga_0.47As metal-oxide-semiconductor field-effect transistors (MOSFETs). The In_0.53Ga_0.47As surface was passivated by atomic layer deposition of a 2.5-nm-thick AIN interfacial layer. In_0.53Ga_0.47As MOS capacitors showed an excellent frequency dispersion behavior. A maximum drive current of 18.5 muA/mum was obtained at a gate overdrive of 2 V for a MOSFET device with a gate length of 20 mum. An I_on/_off ratio of 104, a positive threshold voltage of 0.15 V, and a subthreshold slope of ~165 mV/dec were extracted from the transfer characteristics. The interface-trap density is estimated to be ~7-8 times 10¹² cm^-2 ldr eV^-1 from the subthreshold characteristics of the MOSFET.     

Flicker-Noise Improvement in 100-nm $L_{g} hbox{Si}_{0.50}hbox{Ge}_{0.50}$ Strained Quantum-Well Transistors Using Ultrathin Si Cap Layer

This letter presents a record low flicker-noise spectral density in biaxial compressively strained p-channel 100-nm L_gSi_0.50Ge_0.50 quantum-well FETs (QWFETs) with ultrathin Si (~2 nm) barrier layer and 1-nm EOT hafnium silicate gate dielectric. The normalized power spectral density of I_d fluctuations (S_Id/I_d ²) in Si_0.50Ge_0.50 QWFETs exhibits significant improvement by ten times over surface channel unstrained Si pMOSFETs at high V_g due to strong confinement of holes within the high-mobility QW and strong quantization in the ultrathin Si barrier layer enabled by low-thermal-budget device processing. The noise behavior in strained QW devices is found to evolve from being correlated mobility fluctuation dominated across most of V_g range to being Hooge mobility fluctuation dominated at very high V_g.     

Excellent Switching Uniformity of Cu-Doped $hbox{MoO}_{x}/hbox{GdO}_{x}$ Bilayer for Nonvolatile Memory Applications

We have investigated a Cu-doped MoO_x/GdO_x bilayer film for nonvolatile memory applications. By adopting an ultrathin GdO_x layer, we obtained excellent device characteristics such as resistance ratio of three orders of magnitude, uniform distribution of set and reset voltages, switching endurance up to 10⁴ cycles, and ten years of data retention at 85degC. By adopting bilayer films of Cu-doped MoO_x/GdO_x, a local filament was formed by a two-step process. Improved memory characteristics can be explained by the formation of nanoscale local filament in the ultrathin GdO_x layer.     

Characterizing Fluorine-Ion Implant Effects on Poly-Si Thin-Film Transistors With ${hbox{Pr}}_{2}{hbox{O}}_{3}$ Gate Dielectric

The fluorine ion implantation applied to the polycrystalline silicon thin-film transistors (poly-Si TFTs) with high-k Pr₂O₃ as gate dielectric is investigated for the first time. Using the Pr₂O₃ gate dielectric can obtain a high gate capacitance density and thin equivalent-oxide thickness, exhibiting a greatly enhancement in the driving capability of TFT device. Introducing fluorine ions into the poly-Si film by fluorine ion implantation technique can effectively passivate the trap states in the poly-Si film and at the Pr₂O₃/poly-Si interface to improve the device electrical properties. The Pr₂O₃ TFTs fabricated on fluorine-implanted poly-Si film exhibit significantly improved electrical performances, including lower threshold voltage, steeper subthreshold swing, higher field-effect mobility, lower off-state leakage current, and higher on/off current ratio, as compared with the control poly-Si Pr₂O₃ TFTs. Also, the incorporation of fluorine ions also improves the reliability of poly-Si Pr₂O₃ TFTs against hot-carrier stressing, which is attributed to the formation of stronger Si-F bonds. Furthermore, superior threshold-voltage rolloff characteristic is also demonstrated in the fluorine-implanted poly-Si Pr₂O₃ TFTs. Therefore, the proposed scheme is a promising technology for high-performance and high-reliability solid-phase crystallized poly-Si TFT.     

Effect of Oxygen Pressure on the Electrical Properties of $hbox{Bi}_{5} hbox{Nb}_{3}hbox{O}_{15}$ Films Grown by RF Magnetron Sputtering

$hbox{Bi}_{5}hbox{Nb}_{3}hbox{O}_{15} (hbox{B}_{5}hbox{N}_{3})$ films grown under a low oxygen partial pressure (OP) of 1.7 mtorr showed a high leakage current density of 0.1 $hbox{A/cm}^{2}$ at 1.0 MV/cm. However, the leakage current density decreased with increasing OP to a minimum of $hbox{5.8} times hbox{10}^{-9} hbox{A/cm}^{2}$ for the film grown under 5.1 mtorr due to the decreased number of oxygen vacancies. This film also showed an improved breakdown field of 2.2 MV/cm and a large capacitance density of 24.9 $hbox{fF}/muhbox{m}^{2}$. The electrical properties of the film, however, deteriorated with a further increase in OP, which is probably due to the formation of oxygen interstitial ions. Therefore, superior electrical properties for the $ hbox{B}_{5}hbox{N}_{3}$ film can be obtained by careful control of OP.      

Spectroscopy and Lasing of Yb-Doped ${hbox {NaY}}{({hbox {WO}}_{4})}_{2}$: Tunable and Femtosecond Mode-Locked Laser Operation

Tetragonal (space group f4 macr) single crystals of NaY(WO₄)₂ doped with Yb to a density of 4.52 times 10²⁰ cm^-3 have been employed as laser active materials for the 1-mum spectral range, operating at room temperature. Using Ti:sapphire laser pumping, slope efficiencies as high as 74.6% were achieved without special cooling for the pi-polarization. The Yb-laser was continuously tunable from 1003.7 to 1073.0 nm with a birefringent filter. Pulses as short as 53 fs were obtained at 1035 nm by SESAM passive mode-locking with intracavity dispersion compensation and additional extracavity pulse compression using analogous prism pairs. Experimental data on the spectroscopic properties of Yb³⁺ in the 5-300 K temperature range and the room temperature optical properties of this novel Yb-host is also presented.     

Electrical Characteristics of Passivated Pseudomorphic HEMTs With $hbox{P}_{hbox{2}}hbox{S}_{hbox{5}}/(hbox{NH}_{hbox{4}})_{hbox{2}}hbox{S}_{hbox{X}}$ Pretreatment

This paper elucidates the dc, pulse I-V, microwave, flicker noise, and power properties of AlGaAs/InGaAs pseudomorphic high electron mobility transistors (pHEMTs) after various ex situ sulfur pretreatments. The pHEMTs were pretreated with NH₄OH, (NH₄)₂S_X, and P₂S₅/(NH₄)₂S_X solutions before SiO₂ passivation to reduce the GaAs native oxide-related surface states. Stable phosphorus oxides and sulfur bound to the Ga and As species can be efficiently obtained using P₂S₅/(NH₄)₂S_X pretreatment; therefore, the leakage current in pHEMT was reduced following this process. Atomic force microscopy measurements indicated that the phosphorus oxides formed by P₂S₅/(NH₄)₂S_X treatment also provided a better surface roughness than obtained following traditional (NH₄)2S_X-only pretreatment, reducing mobility degradation after sulfur pretreatment. Based on the dc and 1 mus pulse I-V measurement results, P₂S₅/(NH₄)₂S_X-treated pHEMT exhibited very similar I_ds trends, especially at high currents; however, NH₄OH, (NH₄)₂S_X treatments clearly reduced the current upon pulse measurement because of the presence of surface traps. Hence, this novel pretreatment method has great potential for highly linear microwave power transistor applications.     

AlGaN/GaN MOS-HEMT With $hbox{HfO}_{2}$ Dielectric and $hbox{Al}_{2}hbox{O}_{3}$ Interfacial Passivation Layer Grown by Atomic Layer Deposition

We have developed a novel AlGaN/GaN metal-oxide-semiconductor high-electron mobility transistor using a stack gate HfO₂/Al₂O₃ structure grown by atomic layer deposition. The stack gate consists of a thin HfO₂ (30-A) gate dielectric and a thin Al₂O₃ (20- A) interfacial passivation layer (IPL). For the 50-A stack gate, no measurable C-V hysteresis and a smaller threshold voltage shift were observed, indicating that a high-quality interface can be achieved using a Al₂O₃ IPL on an AlGaN substrate. Good surface passivation effects of the Al₂O₃ IPL have also been confirmed by pulsed gate measurements. Devices with 1- mum gate lengths exhibit a cutoff frequency (fT) of 12 GHz and a maximum frequency of oscillation (f _MAX) of 34 GHz, as well as a maximum drain current of 800 mA/mm and a peak transconductance of 150 mS/mm, whereas the gate leakage current is at least six orders of magnitude lower than that of the reference high-electron mobility transistors at a positive gate bias.     

35-nm Zigzag T-Gate $hbox{In}_{0.52}hbox{Al}_{0.48} hbox{As/In}_{0.53}hbox{Ga}_{0.47}hbox{As}$ Metamorphic GaAs HEMTs With an Ultrahigh $f_{max}$ of 520 GHz

Metamorphic GaAs high electron mobility transistors (mHEMTs) with the highest-f _max reported to date are presented here. The 35-nm zigzag T-gate In_0.52Al_0.48As/In_0.53Ga_0.47As metamorphic GaAs HEMTs show f _maxof 520 GHz, f _T of 440 GHz, and maximum transconductance (g _m) of 1100 mS/mm at a drain current of 333 mA/mm. The combinations of f _max and f _T are the highest data yet reported for mHEMTs. These devices are promising candidates for aggressively scaled sub-35-nm T-gate mHEMTs.     

Reliable Low-Cost Fabrication of Low-Loss $hbox{Al}_{2}hbox{O} _{3}{:}hbox{Er}^{3+}$ Waveguides With 5.4-dB Optical Gain

A reliable and reproducible deposition process for the fabrication of Al₂O₃ waveguides with losses as low as 0.1 dB/cm has been developed. The thin films are grown at ~ 5 nm/min deposition rate and exhibit excellent thickness uniformity within 1% over 50times50 mm² area and no detectable OH^- incorporation. For applications of the Al₂O₃ films in compact, integrated optical devices, a high-quality channel waveguide fabrication process is utilized. Planar and channel propagation losses as low as 0.1 and 0.2 dB/cm, respectively, are demonstrated. For the development of active integrated optical functions, the implementation of rare-earth-ion doping is investigated by cosputtering of erbium during the Al₂O₃ layer growth. Dopant levels between 0.2-5times10²⁰ cm^-3 are studied. At Er³⁺ concentrations of interest for optical amplification, a lifetime of the ⁴I_13/2 level as long as 7 ms is measured. Gain measurements over 6.4-cm propagation length in a 700-nm-thick Al₂O₃:Er³⁺ channel waveguide result in net optical gain over a 41-nm-wide wavelength range between 1526-1567 nm with a maximum of 5.4 dB at 1533 nm.