Creep–fatigue life of Sn–8Zn–3Bi solder under multiaxial loading

This paper describes a creep–fatigue life of Sn–8Zn–3Bi solder under multiaxial loading. A push–pull and a reversed torsion tests were carried out using seven types of strain waveforms, which are a fast–fast, a fast–slow, a slow–fast and a slow–slow waveforms and three types trapezoidal strain waveforms with different strain holding times. The strain waveforms had a significant effect on creep–fatigue life and the shortest creep–fatigue life was found in the slow–fast strain waveform while the longest life in the slow–slow waveform in the push–pull and the reversed torsion tests. Creep–fatigue life in the reversed torsion test was approximately twice longer than that in the push–pull test at each strain waveform. Applicability of common used creep–fatigue damage models for life evaluation was discussed based on the obtained experimental results and only a grain boundary sliding model could evaluate the lives within a small scatter.     

Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders

Abstract

The influence of isothermal aging on the creep behaviour of Sn–9Zn and Sn–8Zn–3Bi solder alloys was studied by impression testing. The tests were carried out under constant impression stress in the range from 90 to 230 MPa at room temperature. Aging affected the microstructure and, thus, the creep behaviour of the materials. The binary Sn–9Zn alloy, with an as cast microstructure characterised by an almost uniform distribution of fine Zn precipitates, was much more creep resistant than the aged condition containing a more sparse precipitate in a softer matrix. In the ternary Sn–8Zn–3Bi alloy, however, isothermal aging enhanced Bi precipitation with almost no change in the distribution and density of Zn particles, the result being an improved creep resistance of the aged material. Irrespective of the processing condition, Sn–8Zn–3Bi showed much lower steady state creep rates than the Sn–9Zn due to both precipitation and a solid solutioning effect of Bi in the Sn matrix. The stress exponents of the as cast and aged conditions were found to be respectively 8·5 and 7·7 for Sn–9Zn and 9·8 and 7·8 for Sn–8Zn–3Bi. These values are in agreement with those determined by room temperature conventional creep testing of the same materials reported in the literature.     

Creep–fatigue crack growth of intermetallic compound Ni3 Al(B) at elevated temperatures

Abstract

The creep–fatigue crack growth of Ni₃ Al(B) alloy was investigated at elevated temperatures in air under four different loading waveforms. Two types of time dependent damage mechanisms have been identified: oxidation and creep effects. As compared with fatigue crack growth in air at room temperature, the effect of oxidation at the crack tip on the crack growth acceleration is significant. Creep effects, on the other hand, are dominant for tensile holding and slow–fast loading waveforms. The complicated interaction between creep–fatigue, oxidation induced embrittlement, and oxide induced crack closure determined the different fatigue crack growth behaviours for different loading waveforms at elevated temperature. The relationship between the constants C and m in the Paris formula and loading waveform were examined, and the influence of loading waveform on the crack propagation were also discussed.     

Ratcheting‐fatigue behaviour of bainite 2.25Cr1MoV steel with tensile and compressed hold loading at 455°C

The ratcheting behaviour of a bainite 2.25Cr1MoV steel was studied with various hold periods at 455°C. Particular attention was paid to the effect of stress hold on whole‐life ratcheting deformation, fatigue life, and failure mechanism. Results indicate that longer peak hold periods stimulate a faster accumulation of ratcheting strain by contribution of creep strain, while double hold at peak and valley stress has an even stronger influence. Creep strains produced in peak and valley hold periods are noticeable and result in higher cyclic strain amplitudes. Dimples and acquired defects are found in failed specimen by microstructure observation, and their number and size increase under creep‐fatigue loading. Enlarged cyclic strain amplitude and material deterioration caused by creep lead to fatigue life reduction under creep‐fatigue loading. A life prediction model suitable for asymmetric cycling is proposed based on the linear damage summation rule.     

An assessment of three creep–fatigue life prediction methods for nickel‐based superalloy GH4049

High‐temperature low‐cycle fatigue tests with and without a 10‐s strain hold period in a cycle were performed on a nickel base superalloy GH4049 under a fully reversed axial total strain control mode. Three creep–fatigue life prediction methods are chosen to analyse the experimental data. These methods are the linear damage summation method (LDS), the strain range partitioning method (SRP) and the strain energy partitioning method (SEP). Their ability to predict creep‐fatigue lives of GH4049 at 700, 800 and 850 °C has been evaluated. It is found that the SEP method shows an advantage over the SRP method for all the tests under consideration. At 850 °C, the LDS and SEP methods give a more satisfactory prediction for creep–fatigue lives. At the temperatures of 700 and 800 °C, the SRP and SEP methods can correlate the life data better than the LDS method. In addition, the differences in predictive ability of these methods have also been analysed. The scanning electron microscopy (SEM) examination of fracture surfaces reveals that under creep–fatigue test conditions crack initiation mode is transgranular, while crack propagation mode is either intergranular plus transgranular or entirely intergranular, dependent on test temperature.     

Impression creep of the rare-earth doped Sn–2%Bi lead-free solder alloy

Creep behavior of the Sn–2Bi–RE alloys containing 0.1, 0.25 and 0.5 wt% rare earth (RE) elements was studied by impression testing and compared to that of the Sn–2Bi alloy. The tests were carried out under constant punching stress in the range 70–190 MPa and at temperatures in the range 298–370 K. Results showed that for all loads and temperatures, Sn–2Bi–0.25RE had the lowest creep rate, and thus the highest creep resistance among all materials tested. This was attributed to the formation of Sn–Bi, Sn–RE, and Sn–Bi–RE intermetallic particles which act as both strengthening agent and grain refiner in the RE-containing Sn–2Bi alloy. RE contents higher than 0.25 wt%, resulted in a lower creep resistance due to the formation of the same intermetallics but with much higher Bi content. This consumes the Bi content of the matrix and reduces the corresponding solid solution hardening, resulting in a lower creep resistance of the material. The stress exponents in the range 8–10.5, 8.4–11.5, 8.8–12.3, 8.4–11.6 and average activation energies of 64.5, 65.1, 67.4 and 68.0 kJ mol^?1 were obtained for Sn–2Bi, Sn–2Bi–0.1RE, Sn–2Bi–0.25RE, and Sn–2Bi–0.5RE, respectively. Although these activation energies are close to the activation energy of lattice self diffusion for β-Sn, the relatively high stress exponents of about 8–12 suggests that creep mechanisms associated with dislocation movement such as dislocation creep are prevailing.     

A comparison of impression, indentation and impression-relaxation creep of lead-free Sn–9Zn and Sn–8Zn–3Bi solders at room temperature

Creep behavior of Sn–9% Zn and Sn–8% Zn–3% Bi solder alloys was studied by impression, indentation, and impression-relaxation tests at room temperature (T > 0.6T _m ) in order to evaluate the correspondence of the creep results obtained by different testing techniques, and to evaluate the effect of Bi on the creep response of the eutectic Sn–9Zn alloy. Stress exponent values were determined through these methods and in all cases the calculated exponents were in good agreement. The average stress exponents of 8.6 and 9.9, found respectively for the binary and ternary alloys, are close to those determined by room temperature conventional creep testing of the same materials reported in the literature. These exponents imply that dislocation creep is the possible mechanism during room temperature creep deformation of these alloys. The introduction of 3% Bi into the binary alloy enhanced the creep resistance due to both solid solutioning effect and sparse precipitation of Bi in the Sn matrix.     

Impression creep behaviour of tin based lead free solders

Abstract

Growing concern about the toxic effects of lead in conventional solders has prompted the development of lead free solders. Creep owing to heating in service is one of the causes of solder joint failures in electronic packages. The present study deals with the impression creep behaviour of eutectic Sn – 58Bi, Sn – 57Bi – 1˙3Zn and Sn – 38Pb alloys in the temperature range 303 – 393 K and stress range 2˙6 – 180 MPa. Power law creep with stress exponent n varying from 2 to 6˙3 is observed. All the alloys reveal a strong stress dependence of activation enthalpy with values 155, 120 and 112 kJ mol^-1 for Sn – 58Bi, Sn – 57Bi – 1˙3Zn and Sn – 38Pb, respectively, which are well above those for self-diffusion. The steady state impression velocity varies linearly with punch diameter for all three alloys. It is concluded that a mechanism such as forest intersection involving attractive junctions controls the creep flow in these alloys.     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.     

Advances in lead-free electronics soldering

Lead-free soldering has emerged as one of the key technologies for assembling in environmental-conscious electronics. Among several candidate alloys, the Sn–Ag–Cu alloy family is believed to be the first choice with the combination of other alloys such as Sn–Zn–Bi, Sn–Cu and Sn–Bi–Ag. Phase diagrams of lead-free alloy systems have been intensively examined by using careful thermal and microstructural analysis combined with the thermodynamic calculation such as the CLAPHAD method. The Cu₆Sn₅/Cu₃Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.     

Creep deformation behavior of Sn–Zn solder alloys

Creep properties of three Sn–Zn solder alloys (Sn–9Zn, Sn–20Zn, and Sn–25Zn, wt%) were studied using the impression creep technique. Microstructural characteristics were examined using a scanning electron microscope. The alloys exhibited stress exponents of about 5.0. The activation energy for creep was calculated to be ~50–75 kJ/mol with a mean value of 66.3 kJ/mol. The likely creep mechanism was identified to be the low temperature viscous glide of dislocations.     

Influence of hold times on the elevated-temperature fatigue behavior of an oxide–oxide ceramic composite in air and in steam environment

The effect of hold times at maximum stress on fatigue behavior of an oxide–oxide ceramic composite was investigated at 1200 °C in laboratory air and in steam environments. The composite consists of a porous alumina matrix reinforced with woven mullite/alumina (Nextel™720) fibers, has no interface between the fiber and matrix, and relies on the porous matrix for flaw tolerance. Tension–tension fatigue tests with a ratio R (minimum to maximum stress) of 0.05, and hold times of 10 and 100 s were performed for fatigue stresses of 125 and 154 MPa in laboratory air, and for fatigue stresses of 100 and 125 MPa in steam environment. Block loading tests incorporating periods of cyclic and sustained loading were carried out to assess the effects of loading history on material behavior and environmental durability. In laboratory air, lives produced in fatigue tests with hold times exceeded those produced in creep but were shorter than those obtained in fatigue. Prior fatigue resulted in an order of magnitude improvement in creep life. Prior creep had no effect on subsequent fatigue life. Presence of steam significantly degraded the material performance. In steam, lives produced in fatigue tests with hold times were close to those obtained in creep. Prior fatigue reduced the creep resistance, and prior creep degraded the subsequent fatigue life. Composite microstructure, as well as damage and failure mechanisms were investigated. A qualitative spectral analysis showed evidence of silicon species migration from fiber to matrix, especially in steam.     

蠕变/疲劳共同作用下寿命估算方法

通过载荷谱转换，将带保载时间的蠕变／疲劳循环用不带保载时间的纯疲劳循环代替，提出蠕变／疲劳共同作用时的寿命估算方法。对１２Ｃｒ１ＭｏＶ钢母材和焊材的蠕变／疲劳交互作用试验数据的分析结果表明，本方法方便、实用。提出一个表征蠕变／疲劳连续加载时交互作用行为的参数，蠕变／疲劳寿命比。分析认为，材料的蠕变疲劳交互作用行为与该比值的大小腾。材料在蠕变／疲劳共同作用下呈这是呈负交经作用，并非材料固有的特性，还取决于载荷条件。     

Thermal property,wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders

The effect of indium (In) addition on thermal property, microstructure, wettability and interfacial reactions of Sn–8Zn–3Bi lead-free solder alloys has been investigated. Results showed that addition of In could lower both solidus and liquidus temperatures of the solder alloys with wettabilty significantly improved. The spreading area of Sn–8Zn–3Bi–1.0In was increased by 34% compared to that of Sn–8Zn–3Bi. With the increase of In content, Zn-rich precipitates were smaller in size and distributed more uniformly, which might be beneficial for mechanical properties and corrosion resistance of the solders. The intermetallic compounds (IMCs) formed between Sn–8Zn–3Bi–xIn solder/Cu substrate was identified as Cu–Zn with a scallop layer adjacent to the solder and a flat layer to the substrate. The addition of In slightly influenced the thickness of the IMCs. The newly developed Sn–Zn–Bi–In solder system has great potential to replace the Sn–Pb solders as low-temperature lead-free solders.     

Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

Creep and fatigue behaviors of the interconnections soldered by the lead-free Sn–Ag–Cu–Bi solder were investigated at different elevated temperatures (with the homologue temperature in the range of 0.71– 0.82), with a comparison to that of a traditional Sn60Pb40 solder. The results show that the lead-free Sn–Ag–Cu–Bi solder shows a superior anti-creep performance over the Sn60Pb40 solder, in terms of a much lower creep strain rate and a vastly elongated creep fracture lifetime; in the secondary creep regime, the calculated creep-activation energy for two solders is reasonably close to other published data. In addition, it has also been shown that the joints soldered by the lead-free Sn–Ag–Cu–Bi solder exhibits a superb fatigue property.     

Low‐cycle fatigue of IN 718: Effect of waveform

The influence of various strain waveforms on the low‐cycle fatigue of IN 718 tested at 650°C has been investigated. The straining paths are accompanied by dwell‐induced creep component(s) or unequal strain distribution in different portions of cycles reducing strength of material. The investigation intends to clarify mainly mechanistic aspects of relaxation‐fatigue interaction. Features of time‐dependent effect induced by nonpeak dwell and the same accompanied by peak dwell, slow unloading from the peak to a lower strain, and different loading and unloading rates are compared in terms of stress amplitude responses, mean stress relaxation, hysteresis loops, life, and damage parameter D_C‐F. Softening is common in all the cases, and degree of softening varies linearly with life. The energy‐based life prediction model has been found to work well for the data, and we have introduced energy fraction–based approach to observe simultaneous contribution from both creep and fatigue on life.     

Room-temperature indentation creep of lead-free Sn–Bi solder alloys

Creep behavior of the lead-free Sn–Bi alloys with bismuth contents in the range of 1–5 wt.% was studied by long time Vickers indentation testing at room temperature. The materials were examined in the homogenized cast and wrought conditions. The stress exponents, determined through different indentation methods, were in good agreement. The exponents of 13.4–15.3 and 9.2–10.0, found respectively for the cast and wrought conditions, are close to those determined by room-temperature conventional creep testing of the same material reported in the literature. Due to the solid solution hardening effects of Bi in Sn, creep rate decreased and creep resistance increased with increasing Bi content of the materials. Cast alloys, with a rather coarser grain structure and some Bi particles at the grain boundaries, showed typically higher resistance to indentation creep compared to the wrought materials. These two factors have apparently resulted in a less tendency of the material for grain boundary accommodated deformation, which is considered as a process to decrease the creep resistance of soft materials.     

High temperature fatigue behavior in tensile hold LCF of near-alpha Ti-1100 with lamellar structure

The effect of various tensile hold times on high temperature LCF behavior of Ti-1100 with a lamellar structure was investigated at 600°C. It was found that fatigue lives for 10 and 30 min hold times were lower than those in continuous cycle fatigue due to additional creep resulting from stress relaxation during the tensile hold. Creep deformation during hold time resulted in a change of dislocation structure from a planar form to an homogeneous distribution within the lamellae. An apparent activation energy for creep deformation of about 520 kJ/mol was obtained from the stress relaxation curve and was consistent with results of other near- titanium alloys. In all cases failures were fatigue-dominated, although creep cavity formation was observed in hold time spcimens.     

A model for life prediction in low-cycle fatigue with hold time

In high-temperature and low-cycle fatigue, creep damage reduces fatigue life. In this investigation, a model for life prediction in low-cycle fatigue with hold time at tensile peak strain is suggested in the temperature region of 0.57T _m. This model is based on previously reported theories for creep cavitatation and we predict the creep-fatigue life. It is proposed that the fatigue life may be predicted in terms of plastic strain range, test temperature, hold time and other parameters. An equation for life prediction is given and checked using other investigators' experimental results with various hold times. The predicted creep-fatigue lives are in good agreement with those observed experimentally for 304 stainless steel, 316 stainless steel, CrMoV steel and 13CrMo44 steel.     

Creep-fatigue crack propagation in lead-free solder under cyclic loading with various waveforms

Crack propagation tests of lead-free solder were conducted using center-notched plate specimens under cyclic tension-compression of three load waveforms: pp waveform having fast loading and unloading, cp-h waveform having a hold time under tension, and cc-h waveform having a hold time under tension and compression. In the case of fatigue loading, i.e. pp waveform, the path of crack propagation was macroscopically straight and perpendicular to the maximum principal stress direction, showing tensile-mode crack propagation. The introduction of the creep components by hold time in cc-h and cp-h waveforms promoted shear-mode crack propagation. For fatigue loading of pp wave, the crack propagation rate was expressed as a power function of the fatigue J integral and the relation was identical for load-controlled and displacement-controlled conditions. The creep component due to the hold time greatly accelerates the crack propagation rate when compared at the same values of the fatigue J integral or the total J integral (the sum of fatigue J and creep J integrals). The creep crack propagation rate was expressed as a power function of the creep J integral for each case of cp-h and cc-h waveforms. The crack propagation rate for cp-h waveform is higher than that for cc-h waveform. The predominant feature of fracture surfaces was striations for pp waveform and grain boundary fracture for cp-h waveform. Grain fragmentation was abundantly observed on the fracture surface made under cc-h waveform.