用于聚焦型场发射阵列的Ni-SiO2透明电阻薄膜

为用自对准技术制作聚焦型发射阵列(FFEA)的聚焦极,要求FFEA的电阻层能透过光刻用近紫外光.为此提出用共溅射法制作Ni-SiO2金属陶瓷电阻层.研究结果表明,当适当调整Ni和SiO2成份比例,可得到既能满足方阻要求又不妨碍光刘的电阻层.同时时此电阻层的电镜微观形貌,能谱成份分析,方阻及透光率进行了讨论.最后,给出一个利用此电阻层制作场发射聚焦电极的实例.     

分布串联横向电阻Spindt型FEA的研究

提出了一种新型的分布串联横向电阻Ｓｐｉｎｄｔ型ＦＥＡ的制作工艺。通过溅射的办法制备了各层电极、绝缘层以及ＦＥＡ电阻层。利用磁增强反应离子刻蚀设备，刻蚀出Ｍｏ薄膜电极图图案和直径１μｍ，深度１μｍ的ＳｉＯ２绝缘层圆孔，利用电子束双源蒸发设备，蒸发Ａｌ和Ｍｏ薄膜，得到Ｍｏ的微尖阵列，制成了分布串联横向电阻Ｓｐｉｎｄｔ型ＦＥＡ。最后得到了常规条件下可测量的场发射。     

用SEM改装成的电子束光刻线宽10nm及套刻精度不足50nm的器件图形

用ＳＥＭ改装成的电子束光刻线宽１０ｎｍ及套刻精度不足５０ｎｍ的器件图形美国明尼苏达大学电子工程系的Ｐ．Ｂ．Ｆｉｓｃｈｅｒ和Ｓ．Ｙ．Ｃｈｏｕ等人利用一台ＪＥ－ＯＩＬ－８４０Ａ型扫描电镜（ＳＥＭ）改装成一台电子束直接光刻系统，采用Ｎｉ／Ａｕ剥离工艺，在大...     

采用聚焦离子束注入和反应离子刻蚀SiO_2的干法光刻

采用聚焦离子束注入和反应离子刻蚀ＳｉＯ＿２的干法光刻ＤｒｙｌｉｔｈｏｇｒａｐｈｙｕｓｉｎｇｆｏｃｕｓｅｄｉｏｎｂｅａｍｉｍｐｌａｎｔａｔｉｏｎａｎｄｒｅａｃｔｉｖｅｉｏｎｅｔｃｈｉｎｇｏｆＳｉＯ＿２［刊，英］／Ｃｈｏｑｕｅｔｔｅ，Ｋ．Ｄ．…　∥Ａｐｐ...     

RTP改善超薄SiO2膜特性的研究

超薄ＳｉＯ２膜经快速热处理后，电特性得到了改善，本研究用超薄ＲＴＰＳｉＯ２膜制作ＭＯＳ电容，ｈ－ＮＭＯＳＦＥＴ中介栅介质层及ＦＬＯＴＯＸ－Ｅ＾２ＰＲＯＭ中作隧道氧化层，取得了一些实验结果，从结果中可以看出具有实有价值。     

多晶硅栅光刻前后注F对MOS器件辐射特性的影响

分析研究了Ｈ２＋Ｏ２合成栅氧化、多晶硅栅光刻前后注Ｆ和Ｐ的沟和Ｎ沟ＮＯＳＦＥＴ，在最劣γ辐照偏置下的阈电压和Ｉｄｓ－Ｖｇｓ亚阈特性的辐射影响应。结果表明，多晶硅栅光刻前注Ｆ比光刻后注Ｆ和未注Ｆ，具有更强的抑制辐射感生氧化物电荷积累和界面态生长的能力。其辐射敏感性的降低可能归结为ＳｉＯ２栅介质和Ｓｉ／ＳｉＯ２界面附近Ｆ的浓度相对较大以及栅场介质中Ｆ注入缺陷相对较少所致。     

三元硅化物(Co_xNi_(l-x))Si_2薄膜的制备及特性

在Ｓｉ（１００）衬底上用离子束溅射方法淀积Ｎｉ,Ｃｏ,Ｔｉ薄膜,形成Ｃｏ／Ｎｉ／Ｓｉ,Ｎｉ／Ｃｏ／Ｓｉ和Ｃｏ／Ｎｉ／Ｓｉ等结构,通过氮气中快速热退火反应生成三元硅化物（ＣｏｘＮｉｌ－ｘ）Ｓｉ２。用ＡＥＳ,ＸＲＤ,ＲＢＳ沟道谱,ＳＥＭ及四探针等方法对（ＣｏｘＮｉｌ－ｘ）Ｓｉ２薄膜的物理特性和电学特性进行了测试,在Ｓｉ衬底上Ｃｏ,Ｎｉ多层膜经快速热退火可形成高电导的（ＣｏｘＮｉｌ－ｘ）Ｓｉ２薄膜,其电阻率在１５～２０μΩ·ｃｍ之间。Ｃｏ／Ｎｉ／Ｔｉ／Ｓｉ（１００）多层结构固相反应可以得到外延（ＣｏｘＮｉｌ－ｘ）Ｓｉ２薄膜。（ＣｏｘＮｉｌ－ｘ）Ｓｉ２的晶格为ＣａＦ２立方结构,晶格常数介于ＣｏＳｉ２和ＮｉＳｉ２之间。通过热处理和选择腐蚀等工艺,可在有ＣＭＯＳ图形的衬底上形成自对准的三元硅化物源漏接触和栅极互连图形。     

多晶硅栅光刻前后注F对MOS器件辐照特性的影响

分析研究了Ｈ２＋Ｏ２合成栅氧化、多晶硅栅光刻前后注Ｆ和Ｐ的沟和Ｎ沟ＮＯＳＦＥＴ，在最劣γ辐照偏置下的阈电压和Ｉ（ｄｓ）－Ｖ（ｇｓ）亚阈特性的辐射影响应．结果表明，多晶硅栅光刻前注Ｆ比光刻后注Ｆ和未注Ｆ，具有更强的抑制辐射感生氧化物电荷积累和界面态生长的能力．其辐射敏感性的降低可能归结为ＳｉＯ２栅介质和Ｓｉ／ＳｉＯ２界面附近Ｆ的浓度相对较大以及栅场介质中Ｆ注入缺陷相对较少所致．     

三元硅化物（CoxNi1—x）Si2薄膜的制备及特性

在Ｓｉ（１００）衬底上用离子束溅射方法淀积Ｎｉ,Ｃｏ,Ｔｉ薄膜,形成Ｃｏ／Ｎｉ／Ｓｉ,Ｎｉ／Ｃｏ／Ｓｉ和Ｃｏ／Ｎｉ／Ｓｉ等结构,通过氮气中快速热退火反应生成三元硅化物（ＣｏｘＮｉ１－ｘ）Ｓｉ２。用ＡＥＳ,ＸＲＤ,ＲＢＳ沟道谱,ＳＥＭ及四探针等方法（ＣｏｘＮｉ１－ｘ）Ｓｉ２薄膜的物理特性和电学特性进行了测试,在Ｓｉ衬底上Ｃｏ,Ｎｉ多层膜经快速热退火可形成高电导的（ＣｏｘＮｉ１－ｘ）Ｓｉ２薄膜,其电阻     

Si（Ge）MOSFET器件微结构的研究

采用横断面的透射电子显微术，扫描电子显微术和高分辨电子显微学方法，研究了ＧｅＳｉ沟道ｐ－ＭＯＳＦＥＴ的微结构。观察表明，器件是由Ｓｉ基片／ＳｉＯ２非晶层／ＳＯＩＳｉ层／ＧｅＳｉ沟道层／超薄ＳｉＯ２非晶层／Ｓｉ细晶层／ＳｉＯ２非晶层／Ａｌ电极层等组成的；ＳＯＩＳｉ层工作区单晶性良好，很难找到缺陷，缺陷能效地被限制在工作两侧的缺陷聚集区；在ＳＯＳＳｉ层和ＧｅＳｉ沟道层之间存在着一些瓣状衬底，它可能是在     

Microfabrication of a nickel mold insert by a modified deep X-ray lithography process and its application to hot embossing

In the present study, a modified deep X-ray lithography process is utilized for an efficient fabrication of precise metallic mold insert. A bare bulk polymethylmethacrylate (PMMA) sheet is used without any substrate as an X-ray photoresist in order to achieve a stable fabrication by avoiding a generation of a secondary radiation during a deep X-ray lithography process. The patterned PMMA sheet after development is then bonded on a metallic substrate using adhesive layers. The adhesive layers on the opened region of the patterned PMMA sheet are subsequently removed by X-ray exposure of short duration time. The next procedure is an electroplating process onto the opened area in the PMMA sheet, consequently resulting in the final mold insert. In this manner, a robust metallic mold insert for a mass replication of microstructures could be realized quite efficiently. The present fabrication method is confirmed by an example with a replication of microchannels via hot embossing process.     

Edge condition of a perfectly conducting wedge with its exterior region divided by a resistive sheet

The edge condition for a perfectly conducting wedge which has its exterior region divided by a resistive sheet is derived. It is shown that the behavior of an electromagnetic field at the edge is altered as a result of the appearance of the resistive sheet but is independent of the resistance value. In particular, the singularities in the electric field components transverse to the edge in the absence of the resistive sheet have been eliminated. This assures the finiteness of the energy dissipated on the resistive sheet in the vicinity of the edge.     

Multifaceted and Nanobored Particle Arrays Sculpted Using Colloidal Lithography

A novel method of fabricating multifaceted and nanobored particle arrays via colloidal lithography using colloidal‐crystal layers as masks for anisotropic reactive‐ion etching (RIE) is reported. The shape of the sculpted particles is dependent on the crystal orientation relative to the etchant flow, the number of colloidal layers, the RIE conditions, and the matrix (or mask) structure in colloidal lithography. Arrays of non‐spherical particles with sculpted shapes, which to date could not otherwise be produced, are fabricated using a tilted anisotropic RIE process and the layer‐by‐layer growth of a colloidal mask. These non‐spherical particles and their ordered arrays can be used for antireflection surfaces, biosensors, and nanopatterning masks, as well as non‐spherical building blocks for novel colloidal crystals. In addition, polymeric particles with patterned holes of controlled depths obtained by the present method can be applied to the fabrication of functional composite particles.     

场发射阵列中聚焦电极制备的自对准技术

本文讨论了制造Spindt型聚焦场发射阵列FFEA过程中需要的对准技术,提出了具有自对准能力的刻蚀方法,满足了聚焦型发射阵列的聚焦极与门极的精确对准.比较了传统方法与新方法的不同,具体论述了整个工艺过程,并对制备出的器件进行了SEM观测,结果达到了预想的目标.     

基于X光移动光刻技术的PMMA微透镜阵列制备

微透镜阵列的制备已经成为微光学领域的研究热点。利用两次X光移动光刻技术,以聚甲基丙烯酸甲酯(PMMA)为正光刻胶,在PMMA基板上制造了微透镜阵列,并对其制作原理进行了详细说明。设计了制备微透镜阵列用的掩膜图形,并通过掩膜图形模拟仿真,预测了微透镜在两次移动曝光显影后的形状。第一次X光移动光刻后,理论上会得到半圆柱状三维结构;第一次光刻后将掩膜板旋转90,进行第二次移动曝光光刻,最终在PMMA基板上制备了面积为10 mm10 mm的3030个微透镜阵列,阵列中每个微透镜的直径约248m、厚度约82m。同时也研究了X光曝光量与PMMA刻蚀深度之间的关系。微透镜阵列形貌测试表明此种制备微透镜阵列的新方法是可行的。     

Low resistive transparent and flexible ZnO/Ag/ZnO/Ag/WO3 electrode for organic light-emitting diodes

Transparent electrodes cannot easily be created with high transmittance and low sheet resistance simultaneously, although some optoelectronic devices, such as large organic light-emitting diode (OLED) displays and lightings, require very low resistive transparent electrodes. Here, we propose a very low resistive transparent electrode (～1.6 Ω/sq) with a high transmittance (～75%) for OLED devices, the transmittance level of which represents the highest reported value to date given such a low sheet resistance level. It consists of a stacked silver (Ag)/zinc oxide (ZnO)/Ag multilayer covered by high refractive index dielectric layers. The proposed multilayer electrode with optimal layer thicknesses has a high and wide spectral transmittance peak due to interference. The low sheet resistance is a result of two Ag layers connected via the sandwiched ZnO layer. In addition to its low sheet resistance coupled with high transmittance, the proposed multilayer electrode has good flexibility. An OLED with an anode of the stacked Ag/ZnO/Ag multilayer shows performance comparable to that of an anode of indium tin oxide.     

Printing Methods and Materials for Large-Area Electronic Devices

Two digital printing methods for the fabrication of active matrix thin-film transistor (AM-TFT) backplanes for displays are described. A process using printed resists layers, referred to as digital lithography, was used to fabricate arrays of hydrogenated amorphous silicon TFTs. TFTs were also fabricated using a combination of digital lithography to pattern metals and inkjet printing to pattern and deposit a polymeric semiconducting layer. The relative performance of amorphous silicon and polymer TFTs were evaluated. The utility of digital lithographic processing was demonstrated by the fabrication of prototype reflective displays using electrophoretic media.     

Fabrication of surface reliefs on facets of singlemode optical fibres using nanoimprint lithography

Reported is the fabrication and investigation of surface reliefs on cleaved facets of optical fibres using nanoimprint lithography. The prepared structures are diffractive elements and arrays of holes with sub-wavelength feature sizes. The results obtained indicate that nanoimprint lithography affords opportunity to miniaturise optical devices at low fabrication costs, replacing free-space optical elements     

一种基于空间光调制器的微透镜阵列制备技术

提出了一种基于空间光调制器的并行光刻制备微透镜阵列的技术。采用数字微反射镜器件输入光刻图形,结合热回流技术,制作任意结构和排布的微透镜阵列。无限远校正显微微缩光学系统的长焦深保证了深纹光刻的实现,热回流法提供了良好的表面光滑度。与传统逐层并行光刻和掩模曝光技术相比,提出的技术方案更加便捷灵活,特别适合制作特征尺寸在数微米至百微米的微透镜阵列器件。得到的微透镜阵列模版经过电铸转移为金属模具,利用紫外卷对卷纳米压印技术在柔性基底上制备微透镜阵列器件,在超薄液晶显示、有机发光二极管(OLED)照明等领域有广泛应用。     

Patterning Colloidal Crystals and Nanostructure Arrays by Soft Lithography

As one of the most robust and versatile routes to fabricate ordered micro‐ and nanostructures, soft lithography has been extensively applied to pattern a variety of molecules, polymers, biomolecules, and nanomaterials. This paper provides an overview on recent developments employing soft lithography methods to pattern colloidal crystals and related nanostructure arrays. Lift‐up soft lithography and modified microcontact printing methods are applied to fabricate patterned and non‐close‐packed colloidal crystals with controllable lattice spacing and lattice structure. Combining selective etching, imprinting, and micromolding methods, these colloidal crystal arrays can be employed as templates for fabrication of nanostructure arrays. Realization of all these processes is favored by the solvent swelling, elasticity, thermodecomposition, and thermoplastic characteristics of polymer materials. Applications of these colloidal crystals and nanostructure arrays have also been explored, such as biomimetic antireflective surfaces, superhydrophobic coatings, surface‐enhanced Raman spectroscopy substrates, and so on.