一种基于锡锑氧化物的透明PN结及整流特性

利用反应磁控溅射法制备了半导体锡锑氧化物薄膜 (TAO). 根据霍尔效应测试结果,当Sn/Sb 原子比处于0.22~0.33范围内时,TAO薄膜是p型导电的,在此范围之外,TAO薄膜是n型导电的. 光学带隙测量结果表明,不同Sn/Sb比的TAO薄膜的禁带宽度基本相同(~3.9eV).构造了一个全透明的PN结,其中n区为Sn/Sb原子比为0.5的TAO薄膜, p区为Sn/Sb原子比为0.33的TAO薄膜.n区TAO的电极用铟锡氧化物（ITO）,p区TAO的电极用Cu薄膜.实验结果表明,由于两种导电类型的TAO薄膜具有相同的禁带宽度,上述透明PN结构具有典型的准同质PN结的整流特性.     

p型透明导电的锡镓氧化物薄膜的制备及其表征

本文通过磁控溅射锡镓合金靶(Ga/Sn=0.2)及热氧化的方法,成功地制备了p型透明导电的锡镓氧化物(TGO)薄膜.X射线衍射(XRD)测试结果表明,TGO薄膜保持SnO2的金红石结构.吸收谱测试表明TGO薄膜在可见光范围内透过率可达到85%以上,其光学禁带宽度Eg约3.8 eV.霍尔效应测试结果表明,TGO薄膜的载流子类型及其浓度与热处理温度密切相关.热氧化温度过高或过低均不利于空穴浓度.当热氧化温度处于(600～700) ℃之间时,可以获得p型透明导电的TGO薄膜,最高空穴浓度高达8.84×1018 cm-3.     

透明导电氧化物镀膜玻璃的光伏应用前景

一、透明导电氧化物镀膜玻璃简介1.透明导电氧化物镀膜玻璃的定义透明导电氧化物镀膜(Transparent Conductive Oxide,TCO)玻璃,是在平板玻璃表面通过物理或者是化学镀膜的方法均匀镀上一层透明导电氧化物薄膜,主要包括铟(In)、锡(Sn)、锌(Zn)和镉(Cd)氧化物及     

用Rietveld精修法研究前驱体相组成对铟锡氧化物相组成的影响

采用Rietveld全谱拟合方法对一系列相组成不同的铟锡氧化物前驱体在不同温度下热处理后的样品进行定量物相分析.研究结果表明,铟锡氧化物的相组成在很大程度上依赖于前驱体的相组成和煅烧温度.当煅烧温度较低(如＜650℃)且时间较短(如＜2 h)时,前驱体中In(OH)3含量越高,则煅烧后铟锡氧化物(ITO)中立方相的含量越高;反之,前驱体中InOOH含量越高,则煅烧后铟锡氧化物(ITO)中六方相的含量越高.在煅烧温度很高时只能得到立方结构的铟锡氧化物.     

氯离子与铟离子的总浓度比对铟锡氧化物前驱体氢氧化物)粒径的影响

用络盐法制备了铟锡氧化物(ITO)纳米粉末. 通过对铟和锡的络合盐[(NH₄)₂InCl₅·H₂O和(NH₄)₂SnCl₆]的制备研究, 证实了反应初始溶液中络离子的存在. 通过调节氯离子与铟离子的总浓度比研究了络离子对ITO前驱体(氢氧化物)粒径的影响. 提出了络离子对纳米ITO粉末粒径的影响原理: 络离子的存在, 降低了反应初始溶液中游离In ³⁺和Sn ⁴⁺的浓度, 有利于纳米级ITO粉末的生成. 通过XRD和激光粒度仪对ITO前驱体(氢氧化物)进行了表征.     

金属Sn氧化薄膜的真空退火与原位XPS测量

本文研究了在真空退火过程中金属Sn氧化薄膜表面L元素Sn和O的化学性质．利用X射线光电子能谱（XPS）的表面分析方法,发现在金属Sn氧化薄膜的表面上存在大量的吸附氧粒子（O^-和O^-_2）提高真空退火温度,吸附氧粒子的数量增加;同时吸附氧粒子的负电性变弱．当退火温度低于350℃时,吸附氧粒子数量的增加是起因于SnO₂→Sn₂O₃的转变;在这种情况下,可以观察到Sn2O3是相对稳定的金属Sn氧化物,继续提高退火温度,达到400℃时,Sn在金属Sn中的相对含量急剧增大,Sn在金属Sn中相对含量增加的原因与金属Sn的价态Sn³⁺→Sn⁰的转变相关在这个转变过程中伴随着O的释放和薄膜表面氧粒子的进一步堆积．与温度低于350℃时的退火条件相比,XPS的测量也发现,在400℃的退火温度下;SnO₂相对于Sn₂O₃反而成为比较稳定的金属Sn氧化物．还讨论了金属Sn氧化薄膜表面上吸附氧粒子的吸附状态以及吸附状态与退火温度的关系．     

溶胶凝胶法制备ITO透明导电薄膜的工艺研究

以五水硝酸铟和乙酰丙酮为原料,以无水氯化锡为掺杂剂,采用溶胶凝胶工艺,用提拉法在石英玻璃基体上制备了ITO透明导电薄膜.采用DTA-TG、XRD、sEM等测试手段对薄膜从凝胶态向结晶态转变过程及微区形貌特点进行了表征,并利用四探针电阻率仪考察了热处理温度、提拉速度、冷却速度、提拉次数等工艺条件对薄膜的导电性能的影响.结果表明:ITO干凝胶膜在600℃热处理温度下完全转化为结晶态,ITO薄膜具有由球形粒子堆积而成的多孔结构;热处理温度与冷却速度均会对ITO薄膜的导电率产生重要影响.     

热处理对CuInS2薄膜导电类型及光学特性的影响

真空蒸发在载玻片上沉积CuInS2薄膜(Cu、In、S原子配比为1∶0.1∶1.2).摸索CuInS2薄膜发生导电类型转换最有效的热处理条件,研究不同热处理工艺对CuInS2薄膜的结构、表面形貌、化学成分比和光学性能的影响.实验给出:沉积的薄膜进行360℃热处理30 min后,得到黄铜矿结构的CuInS2薄膜;SEN分析显示薄膜表面呈颗粒状较平整致密性略差,导电类型为N型,薄膜的本征吸收限为1.46eV,直接光学带隙Eg=1.38 eV.对薄膜进行370℃热处理20 min同样可得到N型CuInS2但含有少量的CuS2成分,薄膜表面致密性变好但粗糙度增大,本征吸收限发生红移为1.42 eV,Eg=1.40 eV.370℃,30 min热处理后可得到P型CuInS2薄膜,Eg=1.37 eV.制备的三种CuInS2薄膜的光吸收系数都在104 cm-1数量级以上.CuInS2薄膜中In或Cu元素含量大小,对薄膜的导电类型的变化起着决定性的作用,而薄膜中S和In元素的变化直接取决于热处理的条件.     

氧流量和热处理温度对锡酸锌薄膜结构的影响

本文采用锌锡质量比为52:48的Zn-Sn合金靶,利用中频交流反应磁控溅射方法,制备了锡酸锌(Zn2SnO4)晶体薄膜.考察比较了氧流量和热处理温度对锌锡合金氧化物薄膜晶体结构的影响,确定了制备晶态Zn2SnO4薄膜的合适氧流量和热处理温度.通过XRD分析了薄膜的晶体结构和组成.结果表明:室温条件下制备的沉积态锌锡合金氧化物薄膜,均呈非晶态结构;在基底温度为室温,氧流量达到60sccm以上条件下制备锌锡氧化物薄膜进行热处理,热处理温度在高于550℃,薄膜中开始出现Zn2SnO4晶体结构,随着热处理温度升高,薄膜中晶态结构大量增加;在氧流量(60～70) sccm、热处理温度650 ℃条件下,形成完全结晶态Zn2SnO4薄膜.     

基于p-n导电转变的二氧化钛对CO高温感应性能的研究

研究了以金红石TiO2半导体材料为气敏材料的一氧化碳(CO)传感器在600~800℃之间的气敏性能.该传感器在测试温度600~700℃时对20~2000 mg/m3的CO(载气为氮氧混合物且氧气含量为2%~25%)表现出p型电导行为.随着测试温度从600℃升高至700℃,传感器的感应强度迅速下降到接近于1.当温度升高到750℃以上时,传感器再次出现对CO的感应强度并且表现出n型导电行为.随着温度升高到800℃,传感器对CO的n型感应信号进一步增强,表现出良好的高温感应性能.利用交流阻抗谱仪对该TiO2敏感材料的高温导电特性进行了研究,并初步讨论了TiO2在高温下对CO还原气氛的诱导导电性能变化的原因.     

P-type InP grown by liquid phase epitaxy with rare earths: not intentional Ge acceptor doping

InP single crystal layers were grown by liquid phase epitaxy (LPE) on semi-insulating InP:Fe substrates with praseodymium added to the melt. Room temperature Hall effect measurements revealed p-type conductivity of the layers with the hole concentration 6×10¹⁴ cm⁻³ and mobility 150 cm² V⁻¹ s⁻¹. By measuring temperature dependence of the hole concentration the binding energy of the dominant acceptor was determined as 223 meV. A photoluminescence line was found at 1.195 eV, close to the previously estimated no-phonon line of Ge acceptor transitions in Ge doped n-type InP. It was concluded that Ge acceptors cause the p-type conductivity of the grown layers.     

Effect of annealing on the formation of p-type conductivity in nano-Zn0.92Mn0.08O:N films

P-type conductive Mn-N co-doped ZnO films were prepared by annealing N(+)-implanted Zn0.92Mn0.08O films in a N2 ambient. Effect of the annealing on the structural, surface morphological, electrical and local chemical states of the films were investigated by X-ray diffraction (XRD), high-resolution field-emission scanning electron microscopy (FE-SEM), Hall-effect and X-ray photoelectron spectroscopy (XPS) measurements, respectively. The results indicate that all the samples were single phase and well oriented along the c-axis. The as-implanted samples were n-type semiconductors, while after thermal annealing at 650 degrees C ranging from 10 to 30 minutes, they were converted to p-type conductivity with the hole concentration of 10(16)-10(17) cm(-3). But with further increasing the annealing time or the temperature, it was observed that the p-type conductivity decreased and ultimately reverted to n-type conductivity again. The change of conductive type may be ascribed to the local chemical states evolution of nitrogen in the process of thermal annealing.     

纳米TiO2薄膜的脉冲激光沉积及其光学特性

采用脉冲激光沉积技术(PLD)在硅基片上生长了二氧化钛纳米晶氧化物薄膜, 系统讨论了基片温度、氧分压等因素对薄膜结构特性的影响.X射线衍射结果表明在氧气氛下, 生长的薄膜为锐钛矿结构, 其结晶性随着基片温度的升高而增强, 在750℃、5Pa氧压的情况下为完全c轴取向的锐钛矿相TiO₂薄膜, 在750℃、5Pa氩气氛下则为(110)取向的金红石相薄膜. 场发射扫描电子显微镜结果表明薄膜表面致密, 呈纳米晶结构, 其晶粒尺寸在35nm左右.用傅立叶红外光谱和拉曼光谱对不同条件下制备的TiO₂薄膜进行了表征.紫外-可见透射光谱的测试结果表明, 薄膜在可见光区具有良好的透过率, 计算得到制备的锐钛矿和金红石相TiO₂薄膜在550nm处的折射率分别为2.3和2.5, 其光学带隙分别为3.2和3.0eV.因此通过沉积条件的改变可得到结晶性能和光学性能都不同的TiO₂薄膜.     

Highly conducting doped poly-Si deposited by hot wire CVD and its applicability as gate material for CMOS devices

Highly conducting p- and n-type poly-Si:H films were deposited by hot wire chemical vapor deposition (HWCVD) using SiH₄+H₂+B₂H₆ and SiH₄+H₂+PH₃ gas mixtures, respectively. Conductivity of 1.2×10² (Ω cm)⁻¹ for the p-type films and 2.25×10² (Ω cm)⁻¹ for the n-type films was obtained. These are the highest values obtained so far by this technique. The increase in conductivity with substrate temperature (T_s) is attributed to the increase in grain size as reflected in the atomic force microscopy results. Interestingly conductivity of n-type films is higher than the p-type films deposited at the same T_s. To test the applicability of these films as gate contact Al/poly-Si/SiO₂/Si capacitor structures with oxide thickness of 4 nm were fabricated on n-type c-Si wafers. Sputter etching of the poly-Si was optimized in order to fabricate the devices. The performance of the HWCVD poly-Si as gate material was monitored using C–V measurements on a MOS test device at different frequencies. The results reveal that as deposited poly-Si without annealing shows low series resistance.     

A novel transparent pn junction based on indium tin oxides

p-Type indium-doped SnO₂ thin films were successfully fabricated on degenerate n⁺ indium tin oxide glass and quartz glass by sol gel dip-coating method. It was found from the X-ray diffraction results that indium-doped SnO₂ thin films were in the same rutile structure as that of undoped SnO₂. Hall effect measurement results showed that for In/Sn ratio≤0.33 and process temperature approximately 525 °C, the indium-doped tin oxide were p-type. The I–V curve measurement of a prototype transparent pn⁺ junction consisting of a layer of p-type indium-doped SnO₂ and a layer of degenerate n⁺ tin-doped indium oxide showed typical rectifying characteristics.     

Growth of GaSb-rich and InAs-rich GaInAsSb alloys on GaSb substrates by MOCVD

MOCVD growth and characterization of GaSb-rich and InAs-rich GaInAsSb on GaSb substrates was investigated. The surface of InAs-rich GaInAsSb epilayers showed morphological features very different from those on GaSb-rich films. Solid compositions of Ga1-xInxAsySb1-y films were dependent on growth temperature and the input source ratios, such as Ga/III ratio and Sb/V ratio. Unintentionally doped InAs-rich GaInAsSb showed n-type conduction, and GaSb-rich samples were p-type. A room temperature electron mobility of 5000 cm2v-1s-1 with electron concentration of 3.6×1017cm-3 for InAs-rich films was obtained. On the other hand, a hole mobility of 360 cm2v-1s-1 with a hole concentration of 1×1017cm-3 for GaSb-rich samples was achieved. © 1998 Chapman & Hall     

Optical and electrical properties of p-type AgInSnxS2−x (x = 0–0.04) thin films prepared by spray pyrolysis

AgInSn_xS_2−x (x = 0–0.2) polycrystalline thin films were prepared by the spray pyrolysis technique. The samples were deposited on glass substrates at temperatures of 375 and 400 °C from alcoholic solutions comprising silver acetate, indium chloride, thiourea and tin chloride. All deposited films crystallized in the chalcopyrite structure of AgInS₂. A p-type conductivity was detected in the Sn-doped samples deposited at 375 °C, otherwise they are n-type. The optical properties of AgInSn_xS_2−x (x < 0.2) resemble those of chalcopyrite AgInS₂. Low-temperature PL measurements revealed that Sn occupying an S-site could be the responsible defect for the p-type conductivity observed in AgInSn_xS_2−x (x < 2) thin films.     

喷雾热解法生长N掺杂ZnO薄膜机理分析

通过超声喷雾热解工艺,以醋酸锌和醋酸铵的混合水溶液为前驱溶液,在单晶Si(100) 衬底上制备了N掺杂ZnO薄膜,采用热质联用分析(TG—DSC—MS)、X射线衍射(XRD)、场发射扫描电镜(FESEM)和霍耳效应(Hall-effect)测试等手段研究了喷雾热解工艺下N掺杂ZnO薄膜的生长机理、晶体结构和电学性能.结果表明,随衬底温度的不同,薄膜呈现出不同的生长机理,从而影响薄膜的晶体结构和电学性能.在优化的衬底温度下,实现了ZnO薄膜的p型掺杂,得到的p型ZnO薄膜具有优异的电学性能,载流子浓度为3.21×10¹⁸cm^-3,霍耳迁移率为110cm²·V^-1s^-1,电阻率为1.76×10^-2Ω·cm.     

PdSe2半导体薄膜的真空硒化法制备研究

PdSe₂薄膜主要通过机械剥离法和气相沉积法制得, 本研究采用一种简单有效的可在SiO₂/Si衬底上制备PdSe₂薄膜的方法。通过高真空磁控溅射技术在SiO₂/Si衬底上沉积一层Pd金属薄膜, 将Pd金属薄膜与Se粉封在高真空的石英管中并在一定的温度下进行硒化, 获得PdSe₂薄膜。根据截面高分辨透射电镜(HRTEM)照片可知PdSe₂薄膜的平均厚度约为30 nm。进一步研究硒化温度对PdSe₂薄膜电输运性能的影响, 当硒化温度为300 ℃时, 所制得的PdSe₂薄膜的体空穴浓度约为1×10¹⁸ cm^-3, 具有最大的室温迁移率和室温磁阻, 分别为48.5 cm²·V^-1·s^-1和12%(B=9 T)。值得注意的是, 本实验中通过真空硒化法获得的薄膜空穴迁移率大于通过机械剥离法制得的p型PdSe₂薄膜。随着硒化温度从300 ℃逐渐升高, 由于Se元素容易挥发, Pd薄膜的硒化程度逐渐减小, 导致薄膜硒含量、迁移率和磁电阻降低。本研究表明：真空硒化法是一种简单有效地制备PdSe₂薄膜的方法, 在贵金属硫族化合物的大面积制备及多功能电子器件的设计中具有潜在的应用价值。