基于CDIO模式的高职通信专业课程教学实践研究

基于高等职业教育通信专业人才培养目标,以通信专业课程设计、教学为案例,探讨了基于CDIO工程教育模式下高职通信课程的教学设计方法与实践探索,重点论述了课程整体教学设计思路、教学内容组织与实施以及课程的评价标准。为高职通信技术专业课程体系的一体化构建起到了积极的推进作用。     

基于就业导向的计算机专业CDIO教学模式中教学资源的开发及使用成效研究——以“Photoshop平面设计”课程为例

CDIO教学模式在高职计算机专业课程教学中应用的研究具有重要的现实意义。文章主要以"Photoshop平面设计"课程为例,探讨基于CDIO教学模式下基于就业导向的教学资源开发和使用成效问题。主要从CDIO教育理念的研究现状、"Photoshop平面设计"的课程特点、CDIO教学模式的应用介绍、基于就业导向的教学资源设计介绍及学生基于此教学资源的碎片化学习能力培养几方面进行了探讨。     

电子信息工程技术专业中、高职课程体系衔接研究

如何构建现代职业教育体系,加强中、高职课程衔接,系统化培养专业技能型人才,这已成为高职教育研究的重要课题之一。针对中、高职衔接教育需求,分析中、高职3+2衔接模式中电子信息工程技术专业课程体系的构建及实施。     

基于CDIO模式高职室内设计课程三级项目设计与实施

近年来,以高职教育为代表的中国职业教育正面临新的突破和发展,原有通过本科"压缩饼干式"的学科式课程体系己远远不能满足现代国内企业对高素质技能型人才的需求。CDIO工程教育模式是以能力为本位的培养模式,这种模式适合职业教育的课程体系,在高职职业教育中应引入这一方法,并大力推广,以推动新一轮高等职业教育改革。通过在室内设计课程中引入CDIO工程教育模式,完成适合CDIO模式的课程培养方案制定,并通过三级项目设计的技术路线,完成该课程的三级项目的制定、设计与实施,形成一个完整、系统的项目实践教学体系框架。     

高职软件技术专业课程体系改革的实践与探索

高职院校进行教学改革的重要部分就是课程体系的建设,也是培养高质量专业人才的重要条件,在高职软件技术专业课程体系改革中,高职院校一定要根据自身特点和存在的问题,有效对软件技术专业课程体系进行改革创新,以培养专业型人才为重要目标,建立有效的素质教育体系,有效提高学生软件技术专业能力,本文就根据高校软件技术专业课程体系的现状及存在的问题进行分析,并根据相关问题提出有效的改革对策。     

适应“互联网+教育”的高职计算机专业课程体系改革研究

互联网+是当前互联网经济发展的重要形式,在互联网+背景下教育体系发生了深远变化,这种变化不但表现在教学技术上,还表现在课程教学体系改革方面,其中互联网+教育的高职计算机专业课程体系改革研究就是一个方面。文章首先从互联网+教育的含义出发,分析互联网+教育的高职计算机专业课程体系改革过程中存在的问题,这些问题主要包括:互联网+教育的高职计算机专业课程体系改革内容陈旧;互联网+教育技术运用不当;高职计算机专业课程教师知识结构不能满足互联网+教育要求。最后提出加强互联网+教育的高职计算机专业课程体系改革管理的措施:加强互联网+教育的高职计算机专业课程体系整合力度,将互联网+教育技术与高职计算机专业课程体系有机融合,提高新时期高职计算机专业素质,从而有效提高高职计算机专业课程体系改革水平。     

以工程能力素质培养为主线的高职机电一体化专业人才培养模式研究

基于CDIO工程教育模式,定位高职人才培养目标、探索能力素质主线、构建知识能力体系、整合课程、实施教学及考核改革,探索和实践了以工程能力素质培养为主线的机电一体化专业高水平应用型人才培养模式.     

"四元一体"的中高职衔接专业课程体系构建模式的研究

面对中高职衔接专业,如何解决好专业衔接过程中课程体系的科学构建是我们必须解决的重要难题.笔者尝试着分析该领域国内外职业教育研究的理论基础上,结合当前国内外中高职衔接专业课程体系的构建现状,针对衔接过程中课程体系出现的一些问题,提出了:"四元一体"的中高职衔接专业课程体系构建模式,为专业课程体系的构建模式提供借鉴,具有一定的指导意义.     

CDIO教育模式在电子商务实践教学中的应用

将CDIO教育模式引入到电子商务实践教学中,有利于培养学生创新精神和实践能力,实现电子商务应用型人才培养目标。文章通过研究CDIO教育模式在国内外电子商务实践教学中的应用现状,分析了在传统教学模式下电子商务实践教学存在的不足,构建了基于CDIO教育模式的电子商务实践创新教学体系。     

基于CDIO工程教育理念的软件技术专业人才培养模式研究与实践

基于CDIO工程理念的教育模式经过几年的推广,得到越来越多中国高校和产业界的认可。针对高职院校软件技能型人才工程实践能力及创新能力培养现状,根据CDIO国际工程教育理念,探索基于知识、能力和素质三方面构建的专业培养目标,创新我校软件技术专业人才培养模式。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.