基于90nm CMOS工艺的一种10位低功耗SAR A/D转换器

Traditional and some recently reported low power,high speed and high resolution approaches for SAR A/D converters are discussed.Based on SMIC 65 nm CMOS technology,two typical low power methods reported in previous works are validated by circuit design and simulation.Design challenges and considerations for high speed SAR A/D converters are presented.Moreover,an R–C combination based method is also addressed and a 10-bit SAR A/D converter with this approach is implemented in SMIC 90 nm CMOS process.The DNL and INL are measured to be less than 0.31 LSB and 0.59 LSB respectively.With an input frequency of 420 kHz at 1 MS/s sampling rate, the SFDR and ENOB are measured to be 67.6 dB and 9.46 bits respectively,and the power dissipation is measured to be just 3.17 mW.     

一种超宽带光电混合结构A/D转换器

现代宽带数字接收机对高性能模数转换器(ADC)的需求逐渐增大,而电子学ADC因载流子迁移速率限制无法实现超宽带直接数字采样.基于光子技术超宽带、超高速的特性,文章提出了一种光电混合结构的ADC技术.通过采用基于超短光脉冲的光学采样代替基于电子学半导体技术的采样/保持(S/H)电路来大幅提高采样带宽.采用时分复用及多通道...     

一种10位50MS/s两级逐次逼近流水线混合型A/D转换器

本文在0.18μm CMOS工艺下,实现了一款10位50MS/s两级逐次逼近流水线混合型模数转换器（pipeline SAR ADC）。其由基于逐次逼近的增益模数单元和逐次逼近ADC组成,并采用1位冗余位放宽了子模数转换器的比较误差。通过采用逐次逼近结构,增益减半MDAC技术,动态比较器及动态逐次逼近控制逻辑,降低了模数转换器的功耗和面积。流片测试结果表明,在1.8V电源电压,50MS/s采样速率下,信噪失真比(SFDR)和功耗分别为56.04dB和5mV。     

10位逐次逼近型A/D转换器的芯片设计

介绍了一种10位、3M sample/s逐次逼近型A/D转换器的设计,描述了具有可变时钟电路结构的有效工作方式.该模数转换器在0.6 μ m双多晶硅、双金属层CMOS工艺上实现,芯片总面积为3.2mm2.转换器采用单5V电源供电,功耗仅为3 5mW.     

一种非校正14位CMOS A/D转换器

设计了一种高精度A/D转换器电路.为了提高匹配精度,内部DAC采用一种电容DAC的新型分段结构;通过版图设计优化,可在不进行数字校正的情况下达到14位的分辨率,最大程度地减小了设计复杂性和功耗.整体电路采用0.6 μm标准CMOS工艺线进行投片验证,实现了14位转换,转换时间达到2.5 μs.     

一种10位100-MS/s CMOS流水折叠式A/D转换器

采用流水折叠结构设计了一种10位100-MSample/s A/D转换器。失调取消技术和电阻平均插值网络提高了转换器的线性度。级联结构放宽了折叠放大器的带宽要求,采用分布式级间跟踪保持放大器实现流水线技术来获得更高的转换精度。基于SMIC 0.18 μm CMOS工艺的测试结果如下：INL和DNL的峰值分别为0.48 LSB and 0.33 LSB。输入电压范围VP-P为1.0 V,芯片面积2.29 mm2。100 MHz采样,20 MHz输入信号下,ENOB为9.59位,SNDR为59.5 dB,SFDR为82.49 dB。1.8V电源电压下功耗仅为95 mW。     

一种串行逐次逼近10位 D/A转换器

首先对几种形式的D/A转换器进行了比较,设计了一种电容型D/A转换器。这些电容在逐次逼近结构中构成二进制权阵列。这种结构的D/A转换器动态范围大、建立时间短,精度易于保证;且它的温度系数、电压系数、功耗及面积均优于电阻型D/A转换器。在Cadence SpectreS环境下进行仿真验证,该转换器信噪比为49 dB,积分非线性为±0.5 LSB。     

一种基于电流输出DAC的逐次逼近A/D转换器

设计了一种12位逐次逼近A/D转换器.该A/D转换器具有四种信号输入范围,利用电阻网络使不同量程的模拟输入与内部DAC输出范围保持一致,从而使用相同的比较器和基准实现对不同范围输入信号的A/D转换;采用一种新型分段电流源结构,利用电流信号实现内部DAC及逐次比较功能.该电路采用2 μm LC2MOS工艺实现,其积分线性误差(INL)和微分线性误差(DNL)均为±1/2 LSB,最大转换时间为12 μs.     

一种CMOS视频D/A转换器的设计与应用

提出了一种10位200 MHz CMOS电流舵视频D/A转换器(DAC)实现电路。权衡线性度、功耗、面积以及弱化毛刺等因素,该DAC的高6位采用单位译码矩阵,低4位采用二进制加权阵列。采用新型开关策略,进一步提高单位译码矩阵的线性度;设计带平滑电路的电流源与差分开关电路,以提高动态性能。整个芯片采用新加坡特许半导体公司3.3 V工作电压、0.35μm2P2M CMOS工艺制造。DAC的面积为1.26 mm×0.78 mm,其积分非线性误差和微分非线性误差均小于±0.2 LSB。     

一种基于新型寄存器结构的逐次逼近A/D转换器

介绍了一种10位CMOS逐次逼近型A/D转换器。在25 kSPS采样频率以下,根据模拟输入端输入的0~10 V模拟信号,通过逐次逼近逻辑,将其转化为10位无极性数字码。转换器的SAR寄存器结构采用了一种新的结构来实现D触发器。该转换器采用3μm CMOS工艺制作,信噪比为49 dB,积分非线性为±0.5 LSB。     

A high performance 90 nm CMOS SAR ADC with hybrid architecture

A 10-bit 2.5 MS/s SAR A/D converter is presented. In the circuit design, an R-C hybrid architecture D/A converter, pseudo-differential comparison architecture and low power voltage level shifters are utilized. Design chal-lenges and considerations are also discussed. In the layout design, each unit resistor is sided by dummies for good matching performance, and the capacitors are routed with a common-central symmetry method to reduce the nonlin-earity error. This proposed converter is implemented based on 90 nm CMOS logic process. With a 3.3 V analog supply and a 1.0 V digital supply, the differential and integral nonlinearity are measured to be less than 0.36 LSB and 0.69 LSB respectively. With an input frequency of 1.2 MHz at 2.5 MS/s sampling rate, the SFDR and ENOB are measured to be 72.86 dB and 9.43 bits respectively, and the power dissipation is measured to be 6.62 mW including the output drivers. This SAR A/D converter occupies an area of 238×214 μm~2. The design results of this converter show that it is suitable for multi-supply embedded SoC applications.     

A 10-bit low power SAR A/D converter based on 90 nm CMOS

Traditional and some recently reported low power, high speed and high resolution approaches for SAR A/D converters are discussed. Based on SMIC 65 nm CMOS technology, two typical low power methods reported in previous works are validated by circuit design and simulation. Design challenges and considerations for high speed SAR A/D converters are presented. Moreover, an R-C combination based method is also addressed and a 10-bit SAR A/D converter with this approach is implemented in SMIC 90 nm CMOS process. The DNL and INL are measured to be less than 0.31 LSB and 0.59 LSB respectively. With an input frequency of 420 kHz at 1 MS/s sampling rate, the SFDR and ENOB are measured to be 67.6 dB and 9.46 bits respectively, and the power dissipation is measured to be just 3.17 mW.     

一种用于触摸屏SoC的10位200kS/s SAR ADC IP核

采用“5MSBs (Most-Significant-Bits) + 5LSBs (Least-Significant-Bits)”C-R混合式D/A转换方式以及低失调伪差分比较技术,结合电容阵列对称布局以及电阻梯低失配版图设计方法,基于0.18µm 1P5M CMOS Logic工艺,设计实现了一种用于触摸屏SoC (System-on-Chip)的8通道10位200kS/s逐次逼近型A/D转换器IP核。在1.8V电源电压下,测得的微分非线性误差和积分非线性误差分别为0.32LSB和0.81LSB。在采样频率为200kS/s,输入频率为91kHz时,测得的无杂散动态范围(SFDR: Spurious-Free Dynamic Range)和有效位数(ENOB: Effective-Number-of-Bits)分别为63.2dB和9.15bits,功耗仅为136µW。整个A/D转换器IP核的面积约为0.08mm2。设计结果显示该转换器满足触摸屏SoC的应用要求。     

A 10-bit 200-kS/s SAR ADC IP core for a touch screen SoC

Based on a 5 MSBs(most-significant-bits)-plus-5 LSBs(least-significant-bits) C-R hybrid D/A conversion and low-offset pseudo-differential comparison approach,with capacitor array axially symmetric layout topology and resistor string low gradient mismatch placement method,an 8-channel 10-bit 200-kS/s SAR ADC(successive-approximation -register analog-to-digital converter) IP core for a touch screen SoC(system-on-chip) is implemented in a 0.18μm 1P5M CMOS logic process.Design considerations for the touch sc...     

A 45 nm CMOS miniature phase shifter with constant amplitude response

We present analysis, optimization, design and characterization of an integrated passive analog phase shifter at 24 GHz in a commercially available 45 nm RF-CMOS process. The design is based on a well-known RC bridge topology, which was optimized for maximum phase shift and minimal amplitude response variation versus phase and frequency. Phase is controlled by varying DC voltage on a varactor, resulting in 60° maximum phase shift with 0.1 dB amplitude variation at 24 GHz. The size of the phase shifter circuit excluding pads and input/output buffers is 40×50 μm².     

一种CMOS折叠结构ADC中的失调抵消技术

CMOS折叠预放电路的失调是限制CMOS折叠结构A/ D转换器实现高分辨率应用的主要原因之一.文中提出差分对的动态匹配技术改善了折叠预放电路的失调,从而为研制CMOS工艺中的高分辨率折叠结构A/ D转换器提供了一种可行方案,并给出了MATL AB和电路仿真的实验结果.     

200Ms/s 177mW 8位折叠内插结构的CMOS模数转换器

介绍了一个采用折叠内插结构的CMOS模数转换器,适合于嵌入式应用.该电路与标准的数字工艺完全兼容,经过改进的无需电阻就能实现的折叠模块有助于减小芯片面积.在输入级,失调平均技术降低了输入电容,而分布式采样保持电路的运用则提高了信号与噪声的失真比.该200MHz采样频率8位折叠内插结构的CMOS模数转换器在3.3V电源电压下,总功耗为177mW,用0.18μm 3.3V标准数字工艺实现.     

200Ms/s 177mW 8位折叠内插结构的CMOS模数转换器

介绍了一个采用折叠内插结构的CMOS模数转换器,适合于嵌入式应用.该电路与标准的数字工艺完全兼容,经过改进的无需电阻就能实现的折叠模块有助于减小芯片面积.在输入级,失调平均技术降低了输入电容,而分布式采样保持电路的运用则提高了信号与噪声的失真比.该200MHz采样频率8位折叠内插结构的CMOS模数转换器在3.3V电源电压下,总功耗为177mW,用0.18μm3.3V标准数字工艺实现     

An 8-bit 200-MSample/s Folding and Interpolating ADC in 0.25 mm2

This article is presented to describe an area-efficient CMOS folding and interpolating analog-to-digital converter (ADC) for embedded application, which is fully compatible with standard digital CMOS technology. A modified MOS-transistor-only folding block contributes to a small chip area. At the input stage, offset averaging reduces the input capacitance and the distributed track-and-hold circuits are proposed to improve signal-to-noise-plus-distortion ratio (SNDR). An INL/DNL of 0.77 LSB/0.6 LSB was measured. An SNDR figure of 43.7 dB is achieved at 4 MHz input frequencies when operated at full speed of 200 MHz. The chip is realized in a standard digital 0.18 μm CMOS technology and consumes a total power of 181 mW from 3.3 V power supply. The active area is 0.25 mm².