氰酸酯树脂/纳米γ-Al2O3复合材料的制备及性能

将纳米γ-Al_2O_3粒子加入氰酸酯树脂(CE)及环氧树脂(E-54)中,由二月桂酸二丁基锡(DBTDL)引发体系发生自由基聚合反应,制得CE/γ-Al_2O_3系列复合材料。采用示差扫描量热分析、电镜分析及力学、导热性、介电性和耐酸碱腐蚀性测试研究了纳米γ-Al_2O_3粒子用量对复合材料性能的影响。结果表明,无机纳米γ-Al_2O_3粒子的引入有利于CE基体树脂的聚合,其质量分数为10.0%时,复合材料DSC峰顶温度由280.9℃降至218.9℃,导热系数增大8.19倍,电绝缘性良好。其质量分数为6.0%时,复合材料弯曲强度、冲击强度分别达到165.36MPa,14.18 k J/m~2,较纯CE树脂提高了95.34%和62.24%,强酸腐蚀率为0.078%,较纯CE树脂下降42.8%。其质量分数为7.0%时,复合材料强碱腐蚀率为0.162%,较纯CE树脂下降64.8%。综合考虑,无机纳米γ-Al_2O_3粒子的最佳添加质量分数为6.0%。     

氰酸酯树脂/纳米六方氮化硼复合材料研究

将纳米六方氮化硼(HBN)粒子加入氰酸酯树脂(CE)基体中,以二月桂酸二丁基锡和环氧树脂EP-54为引发剂,制得CE/HBN系列浇铸体复合材料.测试了浇铸体型材的力学性能、玻璃化温度、介电性能和耐酸碱腐蚀性能,并通过浇铸体型材微观形貌变化分析了复合材料型材力学性能得以提高的原因.结果表明,当纳米HBN粒子的质量分数为3...     

偶联剂对SiO_2/CE复合材料热学及摩擦性能的影响

利用纳米SiO2对氰酸酯树脂(CE)进行改性,通过热失重分析(TGA)、摩擦磨损性能测试及扫描电镜(SEM)分析研究了纳米SiO2及其表面处理(分别选用小分子偶联剂KH-560和大分子偶联剂SEA-171)对纳米SiO2/CE复合材料热学及摩擦性能的影响,并初步探讨了其作用机理。结果表明,经SEA-171表面处理的纳米SiO2质量分数为3.0%时,其CE复合材料的热分解温度比纯CE树脂提高了将近75℃,摩擦系数降低了约25%,磨损率降低了77%。偶联剂的加入增加了纳米SiO2与CE树脂之间的界面粘结作用,因而复合材料的耐热性能和摩擦性能等得以提高。     

CE／TiO2复合材料的固化及摩擦磨损性能

采用纳米二氧化钛(TiO2)粒子改性氰酸酯树脂(CE),研究了复合材料的固化性能及摩擦磨损性能,分析微观形貌与性能变化之间的关联,总结出复合材料性能得以改善的微观机理。结果表明,少量TiO2粒子(质量分数≤4%)引入,可改善CE的固化性能及摩擦性能。纳米TiO2粒子经偶联剂处理并表面乳液接枝后,其质量分数为4%时,复合材料的摩擦系数降低约43.5%,磨损降低68.1%,耐磨性得到提高。     

二维纳米材料改性氰酸酯树脂研究进展

综述了二维纳米材料对氰酸酯树脂(CE)改性的研究成果。介绍了目前应用于CE树脂上的二维纳米材料，包括石墨烯及其衍生物、氮化硼、层状双金属氢氧化物、二硫化钼、蒙脱土等，介绍了二维纳米粒子的结构与性质特点。介绍了CE/二维纳米粒子复合材料制备时粒子的预处理、混入与复合材料固化成型的方法。梳理了这些二维纳米材料在改善CE树脂力学、导电、介电、导热、吸波、耐摩擦、热膨胀和阻燃等性能的作用机理和效果。     

CE/Nd_2O_3纳米复合材料的制备及其性能研究

将纳米Nd_2O_3粒子引入氰酸酯树脂(CE)基体,制得CE/Nd_2O_3基复合材料。当纳米Nd_2O_3的加入量为0.3%时,复合材料的冲击强度比CE纯板增加35.40%,弯曲强度也比原来增加57.58%,酸腐蚀率达到最低,达到了CE材料韧性和强度同步增大的目的。     

CE/Nd_2O_3纳米复合材料的制备及其性能研究

将纳米Nd_2O_3粒子引入氰酸酯树脂(CE)基体,制得CE/Nd_2O_3基复合材料。当纳米Nd_2O_3的加入量为0.3%时,复合材料的冲击强度比CE纯板增加35.40%,弯曲强度也比原来增加57.58%,酸腐蚀率达到最低,达到了CE材料韧性和强度同步增大的目的。     

氰酸酯树脂/纳米三氧化二镧复合材料研究

将纳米三氧化二镧(La_2O_3)粒子加入氰酸酯树脂(CE)基体中,以二月桂酸二丁基锡(BDTL)为引发剂,制得CE/La_2O_3系列复合材料。通过力学性能及耐腐蚀性测试研究了纳米La_2O_3用量对材料性能的影响。结果表明,当纳米La_2O_3添加质量分数为0.3%时,材料弯曲强度达到155.45 MPa,较纯CE提高了83.8%,耐酸腐蚀性最佳,腐蚀率仅为0.09%。纳米La_2O_3添加质量分数为0.4%时,材料冲击强度达13.05 kJ/m2,较纯浇铸体板材提高了48%,耐碱腐蚀性最佳,腐蚀率仅为0.08%。将纳米La_2O_3粒子引入CE基体后,优化了CE树脂的性能。     

多步接枝改性锐钛矿型TiO_2的制备及其在CE中分散性

采用溶胶–凝胶法制备了锐钛矿型二氧化钛(Ti O2)粒子(M粒子),以锚固接枝的方式,将偶联剂SEA–171锚固于Ti O2粒子表面(M1粒子),再以乳液接枝的方式,将聚甲基丙烯酸甲酯(PMMA)二次接枝改性纳米Ti O2粒子(M2粒子),制备了M系列粒子改性氰酸酯树脂(CE)基复合材料。通过表面分析、元素分析、红外光谱、X射线衍射、X射线光电子能谱、透射电子显微镜、扫描电子显微镜等技术,研究了多步接枝的机理以及相应复合粒子的结构。测试结果显示,锚固接枝过程中,硅烷偶联剂SEA–171实现了在Ti O2粒子表面的锚固。乳液接枝过程中PMMA通过化学键的形式接枝到Ti O2的表面,实现了无机粒子表面的有机化,促使其在CE基体中得到较好的分散,而且存在无机粒子表面的PMMA与CE以化学键键合、分子缠结形成网络结构,有效增加了Ti O2粒子与CE界面的相容性,减弱了相分离,提高了改性粒子在复合材料中的分散能力,有望改善复合材料的综合性能。     

无机材料改性氰酸酯树脂的研究进展

氰酸酯树脂因其优异的理化性能而被成功地应用于高速数字、高频用印刷电路板、高性能透波结构材料、导弹壳体材料和航空航天高性能结构复合材料等领域,但因具有脆性相对较大、冲击性不足等缺点决定了其改性研究的必然性。笔者重点论述了无机材料改性氰酸酯的研究现状。深入论述了晶须、无机纳米粒子改性CE的原理、方法及效果,并得出:无机纳米粒子在氰酸酯改性研究中具有巨大的优势和潜力。     

聚偏氟乙烯/类基体基团修饰石墨烯导热复合材料研究

采用含类基体基团的乙烯基三甲氧基硅烷修饰氧化石墨烯(GO),再用"一锅法"将其还原得到功能化石墨烯(F-GE),通过溶剂浇注法制备出界面性能优良的聚偏氟乙烯导热复合材料(PVDF/F-GE).利用红外光谱仪(FTIR)、扫描电子显微镜(SEM)、热导率测试仪、电子拉力试验机对复合材料的改性状态、微观形貌、导热性能和力学...     

纳米Fe3O4/环氧树脂基复合材料制备及导热性研究

选用水热法制备Fe3O4纳米粒子为填料,通过直接混合分散法制备了纳米Fe3O4/环氧树脂基复合材料。测试分析了Fe3O4纳米粒子的形貌、结构和磁性能。并且复合材料的导热系数也被测定,结果表明,随着粒子填充体积增加,复合材料导热系数增大。当添加28.47%的纳米Fe3O4粒子时,复合材料导热系数达到0.409 W/（m.k）,是纯环氧树脂E-44的2.54倍。通过对Y.Agari导热模型分析计算,得到了能对该复合材料导热系数进行较好预测的方程。     

Preparation and heat resistance of hollow glass microbead/silicone rubber composite coating

Hollow glass microbead/silicone rubber composite coatings were prepared to improve the heat-resistance and mechanical properties of silicone rubber-based composites, using CE modified SR as the matrix and HGM as the filler. The microscopic morphology and thermal stability of the composites were characterized by scanning electron microscopy (SEM) and thermogravimetric analyzer (TGA), respectively. The results showed that the thermal stability of the composites increases with the increase of filler content. For the composite sample with a HGM mass content of 16.7%, the initial decomposition temperature (T₅) is 408°C, which is 84°C higher than that of silicone rubber. The low density and high sphericity of HGM make it easier to uniformly disperse in the polymer matrix. In addition, compared to silica, which is commonly used as an inorganic filler, the lower thermal conductivity of HGM is also beneficial for achieving better thermal shielding effect. It is confirmed that the insufficient thermal stability of the polymer matrix above 400°C can be compensated for by the properly dispersed inorganic fillers. Therefore, the thermal stability of the composite is improved by the synergistic effect of modified heat-resistant matrix and inorganic filler.     

Synthesis,mechanical property,and thermal stability of reduced graphene oxide–zinc oxide/cyanate ester/bismaleimide resin composites

Reduced graphene oxide–zinc oxide/cyanate ester/bismaleimide resin (RGO–ZnO/CE/BMI) composites were synthesized via a blending method. The RGO–ZnO composite was incorporated into the CE/BMI copolymer to improve the properties of RGO–ZnO/CE/BMI composites. The structure, elements, and morphology of the RGO–ZnO composite were studied with XPS, FTIR, XRD, and SEM analyses. It indicated that the ZnO micro-sphere was attached to RGO by electrostatic attraction and the RGO–ZnO composite was prepared successfully. The mechanical properties and thermal stability of RGO–ZnO/CE/BMI composites were investigated. When RGO–ZnO composite was 1 wt.%, the flexural and impact strengths of RGO–ZnO/CE/BMI composites were 1.07 and 1.35 times of the CE/BMI copolymer, respectively. However, the RGO–ZnO composite tended to aggregate in the CE/BMI matrix with high loading. According to the SEM analysis, appropriate RGO–ZnO composite was evenly dispersed in the CE/BMI copolymer. Compared to the CE/BMI copolymer, the thermal stability of the RGO–ZnO/CE/BMI composites was good. Thus, the RGO–ZnO composite was successfully filled in the CE/BMI matrix; the mechanical properties and thermal stability of the RGO–ZnO/CE/BMI composites were enhanced.     

Effect of N–Ni coordination bond on the electrical and thermal conductivity of epoxy resin/nickel-coated graphite

The agglomeration of nickel-coated graphite (NCG) in epoxy resin (EP) composites leads to low electrical conductivity of EP composites, which limits their development in electronic devices and multilayer circuits. In order to improve the electrical and thermal conductivity of NCG/EP composites, ethylenediamine (EDA) was used to modify NCG and compared with pure NCG-filled EP composites. It was found that the conductive effect of modified composites with 20 wt% filler is better than that of unmodified composites with 40 wt% filler. The results of Fourier transform infrared spectroscopy and thermogravimetric analysis of EDA-modified NCG (ENCG) showed that a coordination adsorption reaction occurred between EDA and NCG, forming N–Ni coordination bonds. When the filling amount of ENCG was 40 wt%, the conductivity and thermal conductivity of the composite are improved most significantly. The volume resistivity was reduced from 2.636 to 0.109 Ω cm, a decrease of 95.85%, and the thermal conductivity was improved from 0.517 to 0.968 W/(m K), an increase of 87.23%, respectively. Meanwhile, ENCG has better dispersion in the EP matrix than NCG.     

Investigation on thermal stability and tribological properties of ZrB2 particles filling cyanate ester resin composites by experiments and numerical simulation

The thermal stability and tribological properties of cyanate ester (CE) composites filled with Zirconium boride (ZrB₂) particles were investigated by experimental and numerical simulation. The results of thermogravimetric analysis and differential scanning calorimetry showed that the thermal stability of composites was improved by introduction of ZrB₂ particles. The tribological properties of composites including friction coefficient and wear rate measured by pin‐on‐disk friction and wear tester were enhanced. Friction coefficient and wear rate of composites were decreased significantly with an increase of ZrB₂ particles content under dry and oil sliding conditions. The 5 wt% ZrB₂ particles reinforced CE resin composite presented optimal thermal stability and tribological performance due to good dispersion of ZrB₂ particles. The worn surfaces of composites were observed by scanning electron microscopy to explore wear mechanism, indicating that the dominant wear mechanism of composites was transformed from adhesive wear to abrasive wear after incorporation of ZrB₂ particles. Finite element model was established to study the distribution of friction stress. The results revealed that filling ZrB₂ particles in the friction process of composites could bear more friction stress than CE resin matrix, which further illustrated that abrasive wear is main wear mechanism of ZrB₂/CE resin composites. POLYM. ENG. SCI., 59:602–607, 2019. © 2018 Society of Plastics Engineers     

聚合物/新型导热填料复合电介质的研究进展

综述了非常规新型导热粒子如纳米金刚石、碳化物、铁电陶瓷及其他无机功能粒子及其填充聚合物电介质的最新研究进展,重点探讨了新型导热粒子的含量、表面改性、加工方式等对聚合物复合材料的导热及介电性能的影响。介绍和分析了基于有机分子晶体为连续声子传递通路改性聚合物导热性能的研究及机理;在基体树脂内利用无机导热粒子及有机分子晶体可构筑连续的声子导热通路,从而达到降低界面热阻、提高体系热导率的目的。相比传统导热粒子,新型导热粒子在提高绝缘聚合物热导率的同时,还赋予体系其他物理性能如磁性、优良介电性能及储能等性能。     

EP/GNs/MWCNTs复合材料的导热性能

以多壁碳纳米管(MWCNTs)和石墨烯纳米微片(GNs)为导热填料,环氧树脂(EP)为基体采用溶剂和超声分散法,制备了EP/GNs/MWCNTs导热复合材料,并与EP/MWCNTs及EP/GNs复合材料的导热性能进行了对比。采用透射电子显微镜观察其微观结构,采用Hot Disk热导率测试仪测试其导热性能,采用差示扫描量热法和热重分析仪测试其耐热性及热稳定性。结果表明,MWCNTs和GNs共同作为EP导热填料时,相比于单组分填料(MWCNTs或GNs)更易形成导热网络;EP的热导率、玻璃化转变温度(Tg)和热分解温度均随着MWCNTs或GNs含量的增加而提高,其中,GNs更有利于提高EP的热导率和热分解温度,MWCNTs更有利于提高EP的Tg。在相同的导热填料含量下,相对于其中的任一单一填料,MWCNTs/GNs共同作用时,对热导率的提高有更显著的效果,且随着其中GNs比例的增加,热导率逐渐增大。当GNs和MWCNTs的体积分数分别为0.6%和0.4%时,EP/GNs/MWCNTs复合材料的热导率、Tg和起始分解温度分别为0.565 W/(m·K),152℃和316℃,分别比纯EP提高了132.5%,34.5%和8.2%。     

PP/滑石粉导热绝缘复合材料的制备与性能研究

采用聚丙烯(PP)为基体,不同粒径滑石粉为填料,通过双螺杆挤出机挤出制备导热绝缘的PP滑石粉复合材料。在滑石粉用量为3O%的条件下,探讨了粒径分别为3.6,6,12,30,50 μm的滑石粉对PP猾石粉复合材料的热导率、体积电阻率、力学性能和结晶性能的影响。结果表明,随着滑石粉粒径的减小,复合材料的拉伸强度和弯曲强度呈先增大后减小的变化趋势,而其热导率则呈先减小后增大的变化趋势。填充粒径为12μm的滑石粉时,复合材料的拉伸强度和弯曲强度达到最大值,分别为29.92MPa和52.58MPa,比纯PP分别提高了5.5%和12.8%。填充粒径为50μm的滑石粉时,复合材料的热导率最大,达到0.3237W/(m*K),比纯PP提高了32.7%。填充1:l的粒径为12μm和30μm滑石粉混合物时,PP复合材料的热导率为0.3184W/(m*K),高于相应的填充单一粒径滑石粉的PP复合材料。此外,所制备的PP滑石粉复合材料的体积电阻率均大于10^8Ω*cm     

New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

Three composites based on cyanate (CE) resin, aluminum nitride (AlN), surface‐treated aluminum nitride [AlN(KH560)], and silicon dioxide (SiO₂) for microelectronic packaging, coded as AlN/CE, AlN(KH560)‐SiO₂(KH560)/CE, and AlN‐SiO₂/CE composite, respectively, were developed for the first time. The thermal conductivity and dielectric constant of all composites were investigated in detail. Results show that properties of fillers in composites have great influence on the thermal conductivity and dielectric constant of composites. Surface treatment of fillers is beneficial to increase the thermal conductivity or reduce dielectric constant of the composites. Comparing with binary composite, when the filler content is high, ternary composites possess lower thermal conductivity and dielectric constant. The reasons leading to these outcomes are discussed intensively. POLYM. COMPOS., 2010. © 2009 Society of Plastics Engineers