基于修整力的树脂结合剂金刚石砂轮机械修整

研究了树脂结合剂金刚石砂轮修整过程中修整力与修整效果的关系,基于修整力的变化表征了砂轮的表面形貌及磨削性能。首先,对碳化硼、碳化硅、白刚玉3种砂轮修整工具进行实验,并采集了修整过程中修整力的变化;然后,利用白光干涉仪观测修整后砂轮的表面形貌;最后,对修整后砂轮进行磨削验证实验,得到不同修整工具修整后砂轮的磨削性能。基于上述实验,分析并验证了修整力的变化与砂轮表面形貌和砂轮磨削性能的关系。结果表明,法向力Fn能够表征砂轮的磨粒切削刃密度以及磨粒突出高度;修整比率β反映了砂轮的锋锐程度,当β稳定时,砂轮达到充分修整。因此修整力反映了砂轮表面形貌和磨削性能,根据修整力的变化可以把握砂轮的修整进程。     

基于新型金刚石砂轮的Al2O3陶瓷磨削性能

利用粉末注射成形和真空钎焊技术制备了一种新型金刚石砂轮,制备的新型金刚石砂轮具有金刚石把持力大、金刚石微刃有序排布等特点。进行了基于新型金刚石砂轮的Al2O3陶瓷磨削性能研究。实验结果表明：相对于普通树脂结合剂金刚石砂轮,新型金刚石砂轮磨削Al2O3陶瓷的加工表面形貌完整性较好,宏观裂纹和表面损伤相对较少;表面粗糙度较小,当进给速度为40mm/s、磨削深度为40μm时,加工表面粗糙度Ra在0.68μm左右;在相同实验条件下,新型金刚石砂轮的磨削力减小了12%~17%,磨削温度降低了80~120℃。     

超微粒金刚石和富勒烯研具创建超平滑表面的研究

制备了超微粒金刚石和富勒烯研磨工具,并分别进行了硅片研磨试验,详细分析了两种材料的研磨特性如表面粗糙度的稳定性、磨料粒度对研磨效果的影响以及研磨材料的显微结构等。试验结果表明,使用0~1/8μm粒度的金刚石研具获得的表面粗糙度值大于使用0~1/4μm粒度金刚石研具的表面粗糙度值,这是因为磨粒被粘结剂覆盖所致。研究结果表明,采用富勒烯研具研磨硅片可获得Ra5nm的超平滑镜面。     

树脂结合剂含量对单晶硅片减薄加工用砂轮性能的影响规律研究

通过磨削实验,研究了树脂结合剂含量对用于单晶硅片减薄加工的金刚石砂轮的力学特性和磨削性能的影响,对砂轮的硬度、抗压强度、气孔率、磨削比、堵塞现象等进行了对比分析.结果表明,随着树脂结合剂含量增加,砂轮的硬度、抗压强度逐渐增大,气孔率变化不大.在单晶硅片的磨削实验中,随着树脂结合剂含量增加,砂轮的磨削比逐渐增大;树脂结合...     

Wear of the blade diamond tools in truing vitreous bond grinding wheels: Part I. Wear measurement and results

The wear of stationary blade diamond tools used to generate a precise and intricate form on the vitreous bond grinding wheel is presented. Two types of blade tools made of rod and particle diamond were used. A method to measure the wear of the blade diamond tool in the μm-scale range using the size difference of two parts ground before and after truing was introduced. Two sets of experiments with four truing feeds and four tool traverse speeds across the grinding wheel were conducted on the rod and particle blade diamond tools, respectively. Experimental results showed the wear rate of blade diamond tools was improved at higher truing feeds and traverse speeds due to the brittle fracture of the abrasive and vitreous bond.     

超高速磨削砂轮技术发展

高速超高速磨削加工是先进制造方法的重要组成部分,集粗精加工于一身,达到可与车、铣和刨削等切削加工方法相媲美的金属磨除率,而且能实现对难磨材料的高性能加工。本文主要论述了高速超高速磨削工艺技术的特点;分析了超高速砂轮用电镀或涂层超硬磨料(CBN、金刚石)的特点以及修整方法,介绍了广泛应用于高速及超高速磨床的德国Hofmann公司砂轮液体式自动平衡装置。     

超高速陶瓷结合剂CBN砂轮制造及应用

介绍了超高速陶瓷结合剂CBN砂轮的制造技术,从基体设计、CBN磨料选择、陶瓷结合剂制备、砂轮配方及尺寸的确定、砂轮制备等方面进行了详细分析。最后对超高速陶瓷CBN砂轮的应用前景进行了展望。     

湿式机械化学磨削单晶硅的软磨料砂轮及其磨削性能

针对干式机械化学磨削(Mechanical chemical grinding, MCG)单晶硅过程中易产生磨削烧伤、粉尘多、加工环境差等问题,研制一种可用于湿式MCG单晶硅的新型软磨料砂轮,并对砂轮的磨削性能及其磨削单晶硅的材料去除机理进行研究。根据湿式机械化学磨削单晶硅的加工原理和要求,制备出以二氧化硅为磨料、改性耐水树脂为结合剂的新型软磨料砂轮。采用研制的软磨料砂轮对单晶硅进行磨削试验,通过检测加工硅片的表面/亚表面质量对湿式MCG软磨料砂轮的磨削性能进行分析,并与传统金刚石砂轮、干式MCG软磨料砂轮的磨削性能进行对比。采用X射线光电子能谱仪对磨削前后硅片的表面成分进行检测,分析湿式MCG加工硅片过程中发生的化学反应。结果表明,采用湿式MCG软磨料砂轮加工硅片的表面粗糙度Ra值为0.98 nm,亚表面损伤层深度为15 nm,湿式MCG软磨料砂轮磨削硅片的表面/亚表面质量远优于传统金刚石砂轮,达到干式MCG软磨料砂轮的加工效果,可实现湿磨工况下硅片的低损伤磨削加工。在湿式MCG过程中,单晶硅、二氧化硅磨粒与水发生了化学反应,在硅片表面生成易于去除的硅酸化合物,硅酸化合物进一步通过砂...     

电镀金刚石砂轮高效精密修整及熔融石英磨削试验研究

大尺寸光学玻璃元件主要采用细磨粒金刚石砂轮进行精密/超精密磨削加工,但存在砂轮修整频繁、工件表面面形精度难以保证、加工效率低等缺点。采用大磨粒金刚石砂轮进行加工则具有磨削比大、工件面形精度高等优点,然而高效精密的修整是其实现精密磨削的关键技术。采用Cr12钢对电镀金刚石砂轮(磨粒粒径151 μm)进行粗修整,借助修整区域聚集的热量加快金刚石的磨损,可使砂轮的回转误差快速降至10 μm以内。结合在线电解修锐技术,采用杯形金刚石修整滚轮对粗修整后的电镀砂轮进行精修整,砂轮的回转误差可达6 μm以内,轴向梯度误差由6 μm降至2.5 μm。通过对修整前后的金刚石砂轮表面磨损形貌成像及其拉曼光谱曲线分析了修整的机理。对应于不同的砂轮修整阶段进行熔融石英光学玻璃磨削试验,结果表明,砂轮回转误差较大时,工件材料表面以脆性断裂去除为主;随着砂轮回转误差和轴向梯度误差的减小,工件表面材料以塑性去除为主,磨削表面粗糙度为Ra19.6 nm,亚表层损伤深度低至2 μm。可见,经过精密修整的大磨粒电镀金刚石砂轮可以实现对光学玻璃的精密磨削。     

免修整柔性金刚石砂轮的磨削性能研究

针对现有超大规模集成电路基板加工中存在的效率低问题,提出一种免除砂带张紧装置,消除砂带横向振动影响,达到柔性砂轮磨削效果的新型砂轮,新型砂结合了砂带磨削加工效率高,发热低的优点及砂轮磨削精度高和设备简单的条件,解决了集成电路基板高效磨削的问题,通过和树脂砂轮的对比实验表明,柔性砂轮对石英基板上仍良好的磨削性能。     

纳米结构陶瓷涂层磨削力的研究

对纳米陶瓷涂层材料在金刚石砂轮精密磨削过程中的磨削力(包括单位磨削面积磨削力和砂轮单颗磨粒磨削力)进行了研究,分析了砂轮磨削深度、工件进给速度、金刚石砂轮磨粒尺寸以及粘结剂类型等磨削参数对磨削力的影响规律.     

Slotted-electrical discharge diamond cut-off grinding of Al/SiC/B4C hybrid metal matrix composite

Advanced manufacturing industries need materials with high strength and low weight in the fields of advanced engineering, such as automobiles and aeronautics. Metal matrix composites (MMCs) are one of the advanced engineering materials that meet the above requirements. To enhance the properties of MMCs, researchers added an additional phase of reinforcements into single reinforced MMCs; such developed MMCs are known as hybrid MMCs. The additional phase of reinforcements enhances the properties of MMCs, but simultaneously leads to rapid tool wear and poor machinability. This study developed an innovative hybrid machining process (HMP) consisting of electrical discharge grinding and diamond grinding in such a way that both the processes occur alternately with equal intervals due to the rotation of a slotted abrasive grinding wheel. The performance of the hybrid process was tested on an Al/SiC_p/B₄C_p work-piece in cut-off grinding mode. The experiments were conducted on an electrical discharge machining machine, which consists of a separate attachment on a vertical column to rotate the wheel. Pulse current, pulse on-time, pulse off-time, wheel RPM, and abrasive grit number were taken as input parameters while material removal rate (MRR) and average surface roughness were taken as output parameters. Result were shown that the HMP gives higher MRR with better surface finish as compared to the constituent processes. Pulse current ranging from 3 A to 21 A, pulse on-time ranging from 30 μs to 200 μs, and pulse off-time ranging from 15 μs to 90 μs were also found to be more suitable for higher MRR, and a wheel RPM at 1300 RPM was more suitable for higher MRR with better surface finish.     

超硬合金剪刀片的研磨工艺研究

通过深入研究和大量的试验,对金刚石砂轮研磨超硬合金刀片方法做了新的尝试,指出了用树脂结合剂金刚石砂轮代替电镀金刚石砂轮对超硬合金剪刀片刃部曲面精研磨的可行性,并从磨床本身的精度、砂轮的轮廓形状、砂轮的静平衡、磨削深度、砂轮速度等影响加工面光洁度的诸多因素进行分析,找出了一套成熟的超硬合金剪刀片的研磨工艺,生产实践证明完全能够满足使用。     

结合在线电解修锐高效磨削陶瓷密封件研究

本文通过设计制作金属结合剂金刚石磨具，结合电解修锐技术对Al2O3陶瓷密封进行了研磨式磨削实验在实验过程中通过检测磨具表面的磨粒出露高度及陶瓷材料的去除量，评价该磨削工艺在陶瓷材料密封件加工中的应用效果。结果表明，电解修锐可有效地修锐金属结合剂金刚石磨具，在加工过程中使磨具保持良好的切削能力，因此材料去除量较大，加大工时短，陶瓷密封件的加工成本得到控制。     

The experiment of high-speed grinding of a gemstone: cubic zirconia

Grinding is one of the major machining processes of gem manufacturing. The largest gemstone in the jewelry market is the cubic zirconia (CZ) which is ground in the same fashion as diamonds. This study was interested to investigate the influence of parameters on grinding CZ gemstone. The parameters were grinding speed, depth of grinding, and abrasive grit size of diamond electroplated disc. The results could conclude that the surface finish was improved when increasing grinding speeds and abrasive grit size. The grinding time was decreased with an increase in grinding speeds. Examination of the surface texture of the ground surface on CZ was analyzed and reported.     

多颗粒金刚石小砂轮磨削仿真及实验

建立了多颗粒金刚石小砂轮轴向进给磨削工程陶瓷的磨粒运动轨迹模型,通过改变砂轮转速、陶瓷件转速、轴向进给速度,揭示加工参数变化和磨粒运动规律的关系。通过不同加工参数下实际的陶瓷加工实验,分析了进给速度对边缘碎裂、磨削力、金刚石磨粒耗损的影响规律,得到的实验分析结果和仿真结果一致。实验运用了合适的实验方案和测力系统,并利用边缘检测和轮廓曲线拟合的方法实时追踪检测金刚石顶尖曲率半径变化来定性分析金刚石磨粒的磨损情况。研究结果为如何利用合理的进给速度控制陶瓷材料的边缘碎裂,减少工件和砂轮磨具的损伤提供了借鉴。     

Methodology of 3D simulation of processes in technology of diamond-composite materials

In the present paper, the problem of increased effectiveness in manufacturing when using diamond abrasive tools is addressed. For this reason, a three-dimensional (3D) methodology is proposed. The aforementioned methodology consists of several parts containing 3D simulation that covers all the basic stages of the life cycle of the tools, from the sintering of diamond composite materials, grinding, and dressing of grinding wheels, to sharpening of single point tools and machining. Furthermore, the creation of expert systems for assignment of rational characteristics of diamond wheels and grinding modes is investigated. The results of these investigations allow reducing the volume of experimental work, offering optimum grinding conditions and allowing the development of new technologies, tools, and equipment.     

数控加工特种回转面刀具时工艺参数的自动检测建模

为了确保数控加工硬质合金特种回转面刀具的刀刃形状和零刃带宽度 ,需要对砂轮相对于工件的位置等相关工艺参数进行检测。提出了有关工艺参数的自动检测建模方法 ,认为运用此方法可显著提高工件的加工精度。     

金刚石与金属基体钎焊机理的研究

通过在低熔点合金中添加Ti、Cr、V、Mo等强碳化物形成元素 ,在液相下与金刚石表面界面反应生成碳化物膜 ,可改善合金钎料对金刚石表面的浸润性 ,实现钎料对金刚石的牢固粘结。分析了影响钎焊质量的主要因素 ,为高性能金属基金刚石工具的制造提供了理论和实践依据。作为应用实例之一 ,介绍了单层钎焊金刚石砂轮的工艺优势。     

Wear mechanism of metal bond diamond wheels trued by wire electrical discharge machining

The stereographic scanning electron microscopy (SEM) imaging was used to investigate the wear mechanism in wire electrical discharge machining (EDM) truing of metal bond diamond wheels for ceramic grinding. A piece of the grinding wheel was removed after truing and grinding to enable the examination of wheel surface and measurement of diamond protrusion heights using a SEM and stereographic imaging software. The stereographic SEM imaging method was calibrated by comparing with the profilometer measurement results. On the wheel surface after wire EDM truing and before grinding, some diamond grain protruding heights were measured in the 32 μm level. Comparing to the 54 μm average size of the diamond grain, this indicated that over half of the diamond was exposed. During the wire EDM process, electrical sparks occur between the metal bond and EDM wire, which leaves the diamond protruded in the gap between the wire electrode and wheel. These protruding diamond grains with weak bond to the wheel were fractured under a light grinding condition. After heavy grinding, the diamond protrusion heights were estimated in the 5–15 μm range above the wear flat. A cavity created by grinding debris erosion wear of the wheel bond could be identified around the diamond grain.