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Design of a highly reliable SPARC-V8 processor for space applications requires consideration single-event effects including single event upsets, single event transients, single event latch-up, as well as cumulative effects such as the total ionizing dose (TID). In this paper, the fault tolerance of the SPARC-V8 processor to radiation effects is discussed in detail. The SPARC-V8 processor, fabricated in the 65 nm CMOS process, achieves a frequency of 300 MHz with a core area of 9.78×9.78 mm2, and it is demonstrated that its radiation hardened performance is suitable for operating in a space environment through the key elements' experiments, which show TID resistance to 300 krad(Si), SEL immunity to greater than 92.5 MeV·cm2/mg, and an SEU error rate of 2.51×10-4 per day. 相似文献
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锗硅异质结双极晶体管(SiGe Heterojunction Bipolar Transistor,SiGe HBT)由于其优异的温度和频率特性,在航空航天等极端环境中具有良好的使用前景,其辐射效应得到了广泛关注。针对KT9041 SiGe HBT进行了瞬时γ射线及脉冲激光辐照实验,获得其瞬时剂量率效应(Transient Dose Rate Effect,TDRE)响应。实验结果表明,SiGe HBT收集极在辐照下会产生明显的光电流脉冲,并且存在着饱和阈值的现象。此外,在脉冲激光辐照实验中还进行了SiGe HBT总剂量效应与瞬时剂量率效应的协同效应研究。发现SiGe HBT在经过总剂量辐照后其产生的光电流幅值会变大。为了分析实验中观察到的现象,应用TCAD建立了KT9041 SiGe HBT的仿真模型,并进行了瞬时γ射线辐照以及总剂量效应仿真研究。仿真发现,SiGe HBT收集极光电流出现的饱和现象是由示波器端口50 Ω匹配电阻所造成的。而总剂量效应导致的光电流幅值变大则是由于总剂量效应会在SiGe HBT收集极电极处的Si/SiO2界面引入正电荷缺陷,正电荷缺陷产生的局部电场会对自由电子产生吸引作用,导致更多的自由电子被收集极收集,从而产生幅值更大的光电流。 相似文献
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A digital-to-analog converter (DAC) in CBCMOS technology was irradiated by 60Co F-rays at various dose rates and biases for investigating the ionizing radiation response of the DAC. The radiation responses show that the function curve and the key electrical parameters of the DAC in CBCMOS technology are sensitive to total dose and dose rates. Under different bias conditions, the radiation failure levels were different, and the radiation damage under operation bias conditions was more severe. Finally, test results were preliminarily analyzed by relating the failure mode to DAC architecture and process technology. 相似文献
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Evidence is presented that two competing failure mechanisms exist in the Si-SiO2 system with one mechanism dominating at low dose rates and the other at high. Much lower dose failures than expected were
discovered at low dose rates (<0.1 rad(Si)/s) and very low dose rates (∼0.001 rad(Si)/s) in commercial SGS 4007 CMOS devices.
These failure doses plotted versus dose rate have a bell-shaped curve, rather than the expected straight line (decreasing
with increasing dose rate), indicating that a different failure mechanism is dominant at low dose rates than at high. 相似文献
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电快速瞬变脉冲群的短偶极子辐射发射模型 总被引:3,自引:0,他引:3
煤矿井下动力主要由电缆供电,开关操作产生的电快速瞬变脉冲群将通过电缆对井下电磁环境产生影响。以电快速瞬变脉冲群脉冲电流作为短偶极子的激励源,运用电磁场理论建立短偶极子的瞬态辐射发射模型,并进行数值分析,仿真结果表明:在近场区,电场和磁场都与距离r密切相关,电场随着1/r3变化,磁场随着1/r2变化,近场波阻抗随着r的增大而减小;在远场区,电场和磁场都随着r的增大而减小,远场波阻抗不随r变化;瞬态辐射发射能量集中在脉冲的上升时间,说明高频部分在瞬态骚扰中起主要作用。井下实验研究表明:通过电缆辐射发射的瞬态场覆盖频段较宽,对井下电磁环境的影响较大。 相似文献
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The elevated and room temperature annealing behavior of radiation damage in JFET-input operational amplifiers (op-amps) were investigated. High-and low-dose-rate irradiation results show that one of the JFET-input op-amps studied in this paper exhibits enhanced low-dose-rate sensitivity and the other shows time-dependent effect. The offset voltage of both op-amps increases during long-term annealing at room temperature. However, the offset voltage decreases at elevated temperature. The dramatic difference in annealing behavior at room and elevated temperatures indicates the migration behavior of radiation-induced species at elevated and room temperatures. This provides useful information to understand the degradation and annealing mechanisms in JFET-input op-amps under total ionizing radiation. Moreover, the annealing of oxide trapped charges should be taken into consideration, when using elevated temperature methods to evaluate low-dose-rate damage. 相似文献
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The elevated and room temperature annealing behavior of radiation damage in JFET-input operational amplifiers (op-amps) were investigated. High- and low-dose-rate irradiation results show that one of the JFET-input op-amps studied in this paper exhibits enhanced low-dose-rate sensitivity and the other shows time-dependent effect. The offset voltage of both op-amps increases during long-term annealing at room temperature. However, the offset voltage decreases at elevated temperature. The dramatic difference in annealing behavior at room and elevated temperatures indicates the migration behavior of radiation-induced species at elevated and room temperatures. This provides useful information to understand the degradation and annealing mechanisms in JFET-input op-amps under total ionizing radiation. Moreover, the annealing of oxide trapped charges should be taken into consideration, when using elevated temperature methods to evaluate low-dose-rate damage. 相似文献
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不同剂量率LC54HC04RH电路的电离辐射效应 总被引:2,自引:0,他引:2
对 L C54HC0 4 RH电路在不同辐射剂量率进行了电离辐射实验。分析了该电路的阈值电压随辐射剂量率的变化关系。实验结果表明 :在辐射剂量率处于 3× 10 -4 Gy(Si) / s到 1.98×10 -1Gy(Si) / s范围内 ,辐射感生界面陷阱电荷随辐射剂量率的减少而增加。辐射感生界面陷阱电荷是导致该电路在空间辐射环境下失效的主要原因。 相似文献
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大气程辐射是影响目标红外辐射特性测量精度的重要因素之一。本文利用大气程辐射修正因子修正大气程辐射值以提高其测量精度。首先,给出目标红外辐射特性测量模型,然后,提出利用大气程辐射修正因子的目标红外辐射特性测量方法。该方法将一定距离下实际测量的大气程辐射和MODTRAN计算的大气程辐射之比定义为大气程辐射修正因子,最后利用该修正因子对其他距离的MODTRAN计算的大气程辐射进行修正并进行目标的辐射反演,获得目标辐射特性。本文利用中波红外摄像机和小面源黑体开展目标红外辐射特性测量实验。实验结果表明,本文方法较传统方法可以在一定程度上提高目标辐射特性测量精度,将精度提高2%左右。 相似文献
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异质结带隙渐变使锗硅异质结双极晶体管(SiGe HBT)具有良好的温度特性,可承受-180~+200 ℃的极端温度,在空间极端环境领域具有诱人的应用前景。然而,SiGe HBT器件由于材料和工艺结构的新特征,其空间辐射效应表现出不同于体硅器件的复杂特征。本文详述了SiGe HBT的空间辐射效应研究现状,重点介绍了国产工艺SiGe HBT的单粒子效应、总剂量效应、低剂量率辐射损伤增强效应以及辐射协同效应的研究进展。研究表明,SiGe HBT作为双极晶体管的重要类型,普遍具有较好的抗总剂量和位移损伤效应的能力,但单粒子效应是制约其空间应用的瓶颈问题。由于工艺的不同,国产SiGe HBT还表现出显著的低剂量率辐射损伤增强效应响应和辐射协同效应。 相似文献
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自由电子与周围电磁环境互作用时可以通过不同的形式辐射电磁波.超材料是一种人工复合材料,可实现传统自然材料所不具备的电磁特性.基于超材料与自由电子之间的相互作用可以打破传统电磁辐射系统的限制,实现对辐射电磁波的极化、相位、波前等特性的灵活操控,这为发展新型的自由电子辐射器件提供了新思路.本文简单介绍了切伦科夫辐射、史密斯... 相似文献
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Zhiyuan Hu Zhangli Liu Hua Shao Bingxu Ning Ming Chen Dawei Bi Shichang Zou 《Microelectronics Journal》2011,42(6):883-888
The impact of sample-to-sample variability on total ionizing dose (TID) response within-wafer for a 180-nm CMOS technology has been studied. Large variations in leakage current and threshold voltage shift after irradiation are observed. These variations are mainly contributed to the process variability. The process steps which cause TID response variation are preliminarily discussed. 相似文献