Ba(Zn_(1/3)Nb_(2/3))O_3微波介质陶瓷的研究进展

3G移动通信事业的迅速发展对应用于基站的微波介质谐振器陶瓷材料的Q值提出了更高的要求。Ba(Zn1/3Nb2/3)O3微波介质陶瓷材料因为具有很高的Q值、接近于零的τf和适宜的εr而备受关注。介绍了Ba(Zn1/3Nb2/3)O3系列微波介质陶瓷的结构和性能、改性研究、纳米化制备工艺及Ba(Zn1/3Nb2/3)O3-Ba(Co1/3Nb2/3)O3复合技术,以期对该领域其他研究者有所帮助。     

(Na_(1/2)Nd_(1/2))TiO_3陶瓷的晶体结构及微波介电性能

通过固相烧结法制备了具有高介电常数的(Na1/2Nd1/2)TiO3微波介质陶瓷,研究了烧结温度对该陶瓷微观结构及微波介电性能的影响。结果表明,在烧结温度低于或等于1 350℃时,所制陶瓷样品的主晶相为立方相的(Na1/2Nd1/2)TiO3;当烧结温度高于1 350℃时,所制陶瓷样品的主晶相变为四方相的Nd0.667TiO3。陶瓷样品的相对介电常数和品质因数随着烧结温度的升高均先增大后减小,在烧结温度为1 300℃时所制陶瓷样品最为致密,并具有最佳的微波介电性能,εr=110.06,Q×f=8 147 GHz,τf=244.6×10–6/℃。     

First investigation of metal–insulator–metal (MIM) capacitor using Pr2O3 dielectrics

Metal–insulator–metal (MIM) capacitors with Pr₂O₃ as high-k material have been investigated for the first time. We varied the thickness of the Pr₂O₃ layers as well as the bottom electrode material. The layers are characterised using X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), transmission electron microscopy (TEM) and secondary ion mass spectroscopy (SIMS). Preliminary information on the interaction of water with the films was obtained from XPS and ab initio pseudopotential calculations. The electrical characterisation shows that Pr₂O₃ MIM capacitors can provide higher capacitance densities than Si₃N₄ MIM capacitors while still maintaining comparable voltage coefficients of capacitance. The Pr₂O₃ dielectric material seems to be suitable for use in silicon RF applications.     

Analysis of interface trap density of metal-oxide-semiconductor devices with Pr2O3 gate dielectric using conductance method

In this study, the interface trap density of metal-oxide-semiconductor (MOS) devices with Pr₂O₃ gate dielectric deposited on Si is determined by using a conductance method. In order to determine the exact value of the interface trap density, the series resistance is estimated directly from the impedance spectra of the MOS devices. Subsequently, the dispersion characteristics are numerically analyzed on the basis of a statistical model. Lastly, the process-dependent interface trap density of Pr₂O₃ is evaluated. It is concluded that high-pressure annealing and a superior quality interfacial SiO₂ layer are of crucial importance for achieving a sufficiently low interface trap density.     

Excellent performance of gas sensor based on In2O3-Fe2O3 nanotubes

In₂O₃-Fe₂O₃ nanotubes are synthesized by an electrospinning method. The as-synthesized materials are characterized by scanning electron microscope and X-ray powder diffraction. The gas sensing results show that In₂O₃-Fe₂O₃ nanotubes exhibit excellent sensing properties to acetone and formaldehyde at different operating temperatures. The responses of gas sensors based on In₂O₃-Fe₂O₃ nanotubes to 100 ppm acetone and 100 ppm formaldehyde are 25 (240℃) and 15 (260℃), and the response/recovery times are 3/7 s and 4/7 s, respectively. The responses of In₂O₃-Fe₂O₃ nanotubes to 1 ppm acetone (240℃) and formaldehyde (260℃) are 3.5 and 1.8, respectively. Moreover, the gas sensor based on In₂O₃-Fe₂O₃ nanotubes also possesses an excellent selectivity to acetone and formaldehyde.     

ZnO-B_2O_3玻璃对Mg_2TiO_4微波介质陶瓷结构和性能的影响

利用传统固相烧结法制备了ZnO-B2O3玻璃掺杂的Mg2TiO4微波介质陶瓷,研究了ZnO-B2O3玻璃掺杂对所制陶瓷相成分、微观形貌和微波介电性能的影响。结果表明:ZnO-B2O3玻璃掺杂能使Mg2TiO4陶瓷的致密化温度降低200℃左右。当Mg2TiO4中掺杂质量分数2%的ZnO-B2O3玻璃时,经1 300℃烧结所得陶瓷微波性能较好:εr=13.62、Q.f=101 275 GHz、τf=–51×10–6/℃。     

Atomic-layer-deposited Al2O3 and HfO2 on GaN: A comparative study on interfaces and electrical characteristics

Al₂O₃, HfO₂, and composite HfO₂/Al₂O₃ films were deposited on n-type GaN using atomic layer deposition (ALD). The interfacial layer of GaON and HfON was observed between HfO₂ and GaN, whereas the absence of an interfacial layer at Al₂O₃/GaN was confirmed using X-ray photoelectron spectroscopy and transmission electron microscopy. The dielectric constants of Al₂O₃, HfO₂, and composite HfO₂/Al₂O₃ calculated from the C-V measurement are 9, 16.5, and 13.8, respectively. The Al₂O₃ employed as a template in the composite structure has suppressed the interfacial layer formation during the subsequent ALD-HfO₂ and effectively reduced the gate leakage current. While the dielectric constant of the composite HfO₂/Al₂O₃ film is lower than that of HfO₂, the composite structure provides sharp oxide/GaN interface without interfacial layer, leading to better electrical properties.     

New TIT capacitor with ZrO2/Al2O3/ZrO2 dielectrics for 60 nm and below DRAMs

New ZrO₂/Al₂O₃/ZrO₂ (ZAZ) dielectric film was successfully developed for DRAM capacitor dielectrics of 60 nm and below technologies. ZAZ dielectric film grown by ALD has a mixture structure of crystalline phase ZrO₂ and amorphous phase Al₂O₃ in order to optimize dielectric properties. ZAZ TIT capacitor showed small Tox.eq of 8.5 Å and a low leakage current density of 0.35 fA/cell, which meet leakage current criteria of 0.5 fA/cell for mass production. ZAZ TIT capacitor showed a smaller cap leak fail bit than HAH capacitor and stable leakage current up to 550 °C anneal. TDDB (time dependent dielectric breakdown) behavior reliably satisfied the 10-year lifetime criteria within operation voltage range.     

High electric-field-induced strain beahvior of single-crystal Pb(Mg<Subscript>1/3</Subscript>Nb<Subscript>2/3</Subscript>)O<Subscript>3</Subscript>-xPbTiO<Subscript>3</Subscript> multilayer piezoelectric actuators

Two 10-mm-long multilayer prototype actuators were fabricated by a stack method using 55 pieces of 5 mm×5 mm×0.15 mm Pb(Mg_1/3Nb_2/3)O₃-xPbTiO₃ (PMNT) single crystals and PZT-5A ceramics, respectively. The strain values for PMNT multilayer piezoelectric actuators are twice those of PZT-5A multilayer actuators, and 20.8-μm displacements can be achieved at the same E-field of 15 kV/cm. Although thermal and electrical history markedly impact dielectric and piezoelectric performance of PMNT crystals, the PMNT multilayer actuator can still achieve large displacements with approximately linear behavior below 60°C. Broad stable dynamic displacement characteristic and fast displacement response make the new-type actuators promising candidates for the application in new-generation high-performance solid-state actuators.     

MOS devices with tetragonal ZrO2 as gate dielectric formed by annealing ZrO2/Ge/ZrO2 laminate

A Ge-stabilized tetragonal ZrO₂ (t-ZrO₂) film with permittivity (κ) of 36.2 was formed by depositing a ZrO₂/Ge/ZrO₂ laminate and a subsequent annealing at 600 °C, which is a more reliable approach to control the incorporated amount of Ge in ZrO₂. On Si substrates, with thin SiON as an interfacial layer, the SiON/t-ZrO₂ gate stack with equivalent oxide thickness (EOT) of 1.75 nm shows tiny amount of hysteresis and negligible frequency dispersion in capacitance-voltage (C-V) characteristics. By passivating leaky channels derived from grain boundaries with NH₃ plasma, good leakage current of 4.8 × 10⁻⁸ A/cm² at V_g = V_fb − 1 V is achieved and desirable reliability confirmed by positive bias temperature instability (PBTI) test is also obtained.     

近紫外基白光LEDs用NaY(MoO4)2:Eu3+材料的发光特性

采用固相法于550℃灼烧4h,合成了Eu³⁺ 单掺杂的NaY(MoO₄)₂材料,研究了材料的 发光特性。X射线衍射(XRD)结果显示,掺杂少量杂质的材料仍为纯相的NaY(MoO₄)₂。以 393nm波长 近紫外光作为激发源时,NaY(MoO₄)₂:Eu³⁺可以发射主峰位于616nm波长的红色光,对应Eu³⁺的 ⁵D₀-⁷F₂跃迁发射。研究发现,增大Eu³⁺掺杂量 时,对应材料的发射强度会逐渐增大,但是 未发现浓度猝灭现象,通过相应的衰减曲线解释了此结果。测量不同Eu³⁺掺杂量下 , NaY(MoO₄)₂:Eu³⁺的色坐标结果显示,色坐标基本不变,位于红色区域。上述 结果表明, NaY(MoO₄)₂:Eu³⁺在白光LEDs领域有一定的应用潜力。     

Preparation and electrical properties of SrTiO3 ceramics doped with M2O3–PbO–CuO

SrTiO₃ dielectric ceramics were fabricated in air by using M₂O₃–CuO–PbO as dopants (M=Sm,Nd,La,Yb). The obtained ceramics exhibited a high dielectric constant (₂₅>4880) with stable temperature characteristics. With doping the rare-earth ions from Sm → Nd → La → Yb, the corresponding dielectric constant regularly decreased. The investigation of microstructure showed that Yb additives benefited to the grain growth and CuO additives mainly segregated at the grain boundaries to form the insulation layers. According to the results, the conduction mechanism of SrTiO₃–M₂O₃–CuO–PbO system was discussed.     

Co3O4/Fe2O3异质结复合材料的制备及其紫外光光电探测性能

分别采用旋涂法和水热法在FTO衬底上制备Co₃O₄种子层和Co₃O₄薄膜,再在Co₃O₄薄膜上水热生长Fe₂O₃纳米棒,获得了高质量的Co₃O₄/Fe₂O₃异质结复合材料。通过改变Fe₂O₃前驱体溶液浓度来改变异质结复合材料中Fe₂O₃组分的含量。结果表明,Fe₂O₃纳米棒覆盖在呈网状结构的Co₃O₄薄膜上,随着Fe₂O₃前驱体溶液浓度即Fe₂O₃组分含量的增加,Co₃O₄/Fe₂O₃异质结复合材料对紫外光的响应逐渐增强,当Fe₂O₃前驱体溶液浓度为0.015mol/L时,异质结复合材料有着很好的光电稳定性,并表现出较高的响应率(12.5mA/W)和探测率(4.4×10¹⁰Jones)。     

Effects of annealing schedule on orientations of Bi3.2Nd0.8Ti3O12 ferroelectric films prepared by metalorganic solution deposition

Fatigue-free Bi_3.2Nd_0.8Ti₃O₁₂ ferroelectric thin films were successfully prepared on p-Si(1 1 1) substrate using metalorganic solution deposition process. The orientation and formation of thin film under different annealing schedules were studied using XRD and AFM. XRD analysis indicated that (2 0 0)-oriented films with degree of orientation of I₍₂₀₀₎/I₍₁₁₇₎ = 2.097 and 0.466 were obtained by preannealing the film at 400 °C for 10 min followed by rapid thermal annealing at 700 °C for 3 min, 10 min and 20 min, respectively, (0 0 8)-oriented film with degree of orientation of I₍₀₀₈₎/I₍₁₁₇₎ = 1.706 were obtained by rapid thermal annealing the film at 700 °C for 3 min without preannealing, and (0 0 8)-oriented film with degree of orientation of I₍₀₀₈₎/I₍₁₁₇₎ = 0.719 were obtained by preheating the film from room temperature to 700 °C at 20 °C/min followed by annealing for 10 min. The a-axis and c-axis orientation decreased as increase in annealing time due to effects of (1 1 1)-oriented substrate. AFM analysis further indicated that preannealing at 400 °C for 10 min followed by rapid thermal annealing at 700 °C for 3 min resulted in formation of platelike crystallite parallel to substrate surface, however rapid thermal annealing at 700 °C for 3 min without preannealing resulted in columnar crystallite perpendicular to substrate surface.     

Ca-B-Si掺杂对Ba(Mg_(1/3)Nb_(2/3))O_3陶瓷介电性能的影响

采用传统电子陶瓷工艺合成了Ca-B-Si(CBS)玻璃掺杂的Ba(Mgl/3Nb2/3)O3微波介质陶瓷,研究了CBS掺杂量对陶瓷微波介电性能的影响。结果表明:CBS掺杂可促进陶瓷烧结并提高B位1:2有序度,进而降低微波介质损耗。当w(CBS)=3%时,陶瓷烧结温度由纯相时的1 500℃以上降至1 250℃,表观密度提高到6.32 g/cm3以上,陶瓷的微波介电性能达到最佳值:εr=26,Q.f=67 800 GHz(8 GHz),τf=25×10–6/℃。该陶瓷有望成为用于高频段微波器件的材料。     

Ag(Ta,Nb)O3 thin-film interdigital capacitors for microwave applications

Epitaxial silver tantalate-niobate Ag(Ta,Nb)O₃ (ATN) films have been grown on LaAlO₃(0 0 1) single crystals by pulsed laser ablation of stoichiometric AgTa_0.38Nb_0.62O₃ ceramic target. Extensive X-ray diffraction analysis reveals epitaxial relationship between the ATN film and LaAlO₃(0 0 1) substrate. Micrometer size interdigital capacitor structures have been defined photolithographically on the top surface of ATN films. ATN/LaAlO₃ thin-film capacitors exhibit superior overall performance: loss tangent as low as 0.0033 at 1 MHz, dielectric permittivity 224 at 1 kHz, weak frequency dispersion of 5.8% in 1 kHz to 1 MHz range. Dielectric permittivity and loss tangent were also measured at the microwave range. Conformal mapping techniques were employed to extract dielectric properties of ATN film on substrate at the microwave frequency range. Theoretical properties of conformal mapping techniques for interdigital capacitors and CPW microstrip lines were discussed.     

电子束辐照下的石墨烯上的原子层沉积Al2O3介质层

为了研究石墨烯与高k介质的结合,使用原子层沉积氧化铝在石墨衬底上。沉积前使用电子束辐照,观测到了氧化铝明显改善的形貌。归因于电子束辐照过程中的石墨层的无定形变化过程。     

Effect of gas mixing ratio on etch behaviors of Ba2Ti9O20 (BTO) and Pt thin films in Cl2/Ar inductively coupled plasma

An investigation of the Ba₂Ti₉O₂₀ (BTO) and Pt thin films etch mechanism in the Cl₂/Ar inductively coupled plasma was carried out. It was found that an increase in Ar mixing ratio at fixed gas pressure and input power causes a fast decrease in the BTO etch rate (26.9-1.2 nm/min for 0-100% Ar) while the Pt etch rate increases slightly from 17.4-23.0 nm/min. Langmuir probe diagnostics and zero-dimensional plasma modeling provided the data on plasma parameters, steady-state composition and fluxes of active species on the etched surface. From the model-based analysis of etch kinetics, it was shown that the behavior of the BTO etch rate corresponds to the reaction-rate-limited etch regime, where the etch rate is limited neither by physical sputtering of the main material nor by the ion-stimulated desorption of low-volatile reaction products. The etch process of Pt appears in the transitional regime and is controlled by the neutral and ion fluxes together.     

Comparative study of AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors with Al2O3 and HfO2 gate oxide

AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with Al₂O₃ gate oxide which was deposited by atomic layer deposition (ALD) were fabricated and their performance was then compared with that of AlGaN/GaN MOSHFETs with HfO₂ gate oxide. The capacitance (C)-voltage (V) curve of the Al₂O₃/GaN MOS diodes showed a lower hysteresis and lower interface state density than the C-V curve of the HfO₂/GaN diodes, indicating better quality of the Al₂O₃/GaN interface. The saturation of drain current in the I_D-V_GS relation of the Al₂O₃ AlGaN/GaN MOSHFETs was not as pronounced as that of the HfO₂ AlGaN/GaN MOSHFETs. The gate leakage current of the Al₂O₃ MOSHFET was five to eight orders of magnitude smaller than that of the HfO₂ MOSHFETs.     

具有界面依赖光致发光的双层WS2/Ga2O3异质结的能带工程(英文)

利用垂直WS₂/Ga₂O₃异质结构中异质界面诱导了反常的光致发光(PL)发射。垂直堆栈的WS₂/Ga₂O₃异质界面使其形成了II型能带结构,导致与Ga₂O₃层接触的底层WS₂的PL强度下降。而异质界面的强耦合作用也影响了双层WS₂中的同质层间相互作用,使得上层WS₂出现反常的PL增强。这种堆栈新型二维异质结构为定制目标能带结构并控制其光子和电子行为提供一种新的手段。