Epitaxial growth of InP nanowires on germanium

The growth of III-V semiconductors on silicon would allow the integration of their superior (opto-)electronic properties with silicon technology. But fundamental issues such as lattice and thermal expansion mismatch and the formation of antiphase domains have prevented the epitaxial integration of III-V with group IV semiconductors. Here we demonstrate the principle of epitaxial growth of III-V nanowires on a group IV substrate. We have grown InP nanowires on germanium substrates by a vapour-liquid-solid method. Although the crystal lattice mismatch is large (3.7%), the as-grown wires are monocrystalline and virtually free of dislocations. X-ray diffraction unambiguously demonstrates the heteroepitaxial growth of the nanowires. In addition, we show that a low-resistance electrical contact can be obtained between the wires and the substrate.     

硅基沉积氮化镓,碳化硅,III –V 族及其合金材料研究进展

硅基沉积氮化镓, 碳化硅, III-V 族及其合金材料是近年来的研究热点. 氮化镓, 碳化硅及其III-V 材料在光电子和电子元件领域有着广泛的应用.例如大功率, 高速器件, 大型激光器, 紫外探测器等等. 尽管硅基片具有低成本, 大的尺寸,和极好的电热导性能等优点, 硅基片仍没有成为氮化镓, 碳化硅及III – V 的主要沉积基片, 其原因在于硅基片与氮化镓, 碳化硅及III-V 材料之间的热膨胀系数和晶格常数之间的失配. 自从1998年, IBM 的课题组用分子外延方法在硅基片上沉积氮化镓, 并且成功地制备了氮化镓激光器之后, 硅基氮化镓的研究开始备受关注. 近年来的研究发现, 使用氧化铝和氮化铝镓作为过渡层. 硅基氮化镓的热应力及与硅基片之间的晶格失配可以明显降低.在 6英寸的(111) 取向的硅基片上用化学气相方法可以成功地沉积超过一个微米厚的无裂纹的单晶氮化镓. 德国的AZZURRO 公司成功地制备硅基片氮化镓的大功率的蓝色激光器. 美国的NITRINEX公司也生产了硅基氮化镓大功率电子元件. 超大功率的硅基氮化镓电子元件仍在研究中. 在2007年, 英国政府设立了一个固体照明器件的研究项目. 主要着手研究6英寸的硅基氮化镓激光器. 另一方面, 在过去的40年, 超大规模硅基CMOS 技术已有了长足的发展, 下一代低功耗高速逻辑电路要求低的驱动电流, 小的活门尺寸低于 30 nm 和快速反应性能. 这就要求器件通道材料具有很高的电子(或空穴)迁移率. III-V 材料, 例如InSb, InAs, 和InGaAs 具有电子迁移率高达 80000 cm2/VS. 它们将是下一代低于 30 nm 硅基CMOS 器件最好的候选材料. 在 2007 年美国DARPA/MTO 设立了一个研究项目来发展硅基 III-V材料器件, 着重于发展高速硅基III-V材料CMOS 器件. 第一届”硅基氮化镓,碳化硅,III-V及其合金材料研究进展 ”国际会议也将于3月 24日-28日在旧金山MRS 2008年初春季会议上召开.     

Recent progress on cooled avalanche photodiodes for single photon detection

Abstract

Recent results on the properties of cooled avalanche photodiodes for single photon detection are presented. Results from Hamamatsu silicon photodiodes, originally developed as radiation-hard photodetectors for high energy physics experiments, are extremely encouraging. Gains of approximately 10,000 can be achieved with the APD operating in proportional mode. Together with a low noise amplifier they allow photon counting with extremely high efficiency and very low noise making cold APDs almost ideal single photon detectors. Operation of APDs in Geiger mode is also reported, together with measurements of detection efficiency and noise as function of operating voltage. Prospects and hopes for future work are briefly summarized.     

Hybrid silicon integration

An overview is presented of the hybrid AlGaInAs-silicon platform that enables wafer level integration of III-V optoelectronic devices with silicon photonic devices based on silicon-on-insulator (SOI). Wafer bonding AlGaInAs quantum wells to an SOI wafer allows large scale hybrid integration without any critical alignment steps. Discrete hybrid silicon optical amplifiers, lasers and photodetectors are described, and the integration of a ring laser with on-chip and photo-detector and amplified spontaneous emission (ASE) seed to enable unidirectional lasing.     

Some limits on donor and acceptor concentrations in silicon and III-V compounds

Various ‘clustering’ effects or precipitates are encountered when the limiting solubility of donors or acceptors in silicon or III-V compounds is exceeded, but little information is available about the phases involved or the mechanism of their nucleation. For Group VI donors in III-V compounds and Group V donors in silicon a particularly simple model is suggested based on the formation of a precursor of a 4-sheet layer lattice (SiAs, GaSe). For Group II acceptors in III-V compounds a self-compensation mechanism is suggested which also eventually leads to precipitation as well as lack of acceptor behaviour. The latter for example can lead to n-type Zn-doped GaAs!     

New nanocrystalline powder substrates for nitrides layer epitaxy

GaN and related III-V nitride materials have been applied for fabrication of electronic and optical devices. The most important factor limiting the mass production of devices based on III-V nitride materials is the high cost of substrates and the elaborate growth techniques. The lack of large, bulk GaN substrates causes that the epitaxial layer of nitrides must be grown on heteroepitaxial substrates. The most widely applied are monocrystalline sapphire, SiC and silicon substrates; but the question of cheap and available substrates for nitrides growth is still open.In this paper, authors present some results of the growth of nitrides layer by the metal-organic vapor-phase epitaxy (MOVPE) technique on new nanocrystalline powder substrates (compressed Al₂O₃+SiC). The influence of substrate composition (the amount of SiC powder) on the properties of the GaN layer are presented. Also the impact of the conditions of epitaxial process on properties of the nitride layers are discussed.     

High efficiency single photon detection via frequency up-conversion

Abstract

We propose a method of single photon detection of infrared (IR) photons at potentially higher efficiencies and lower noise than allowed by traditional IR band avalanche photodiodes (APDs). By up-converting the photon from the IR, e.g. 1550 nm, to a visible wavelength in a nonlinear crystal, we can utilize the much higher efficiency of silicon APDs at these wavelengths. We have used a periodically poled lithium niobate (PPLN) crystal and a pulsed 1064 nm Nd:YAG laser to perform the up-conversion to a 631 nm photon. We observed conversion efficiencies as high as ～ 80%, and demonstrated scaling down to the single photon level while maintaining a background of 3 ×s; 10^?4 dark counts per count. We also propose a 2-crystal extension of this scheme, whereby orthogonal polarizations may be up-converted coherently, thus enabling complete quantum state transduction of arbitrary states.     

Characterization of novel active area silicon avalanche photodiodes operating in the geiger mode

Abstract

We present a method for characterizing avalanche photodiode (APD) photon-counting detector efficiency as a function of active area. Various shallow-junction silicon APDs having a novel active area were manufactured and tested. We show that cylindrical and checkquerboard-shaped active areas have dark counts two orders of magnitude lower than standard circular devices with an equivalent active area. A parallel implementation of small active areas creates gettering sites for defects to migrate to, which is believed to create relatively defect-free active areas as the perimeter-to-area ratio is increased. However, a compromise between a large perimeter-to-area ratio and a structure useful for practical applications must be considered to optimize the detector.     

Electroluminescence from silicon nanoparticles fabricated from the gas phase

Electroluminescence from as-prepared silicon nanoparticles, fabricated by gas phase synthesis, is demonstrated. The particles are embedded between an n-doped GaAs substrate and a semitransparent indium tin oxide top electrode. The total electroluminescence intensity of the Si nanoparticles is more than a factor of three higher than the corresponding signal from the epitaxial III-V semiconductor. This, together with the low threshold voltage for electroluminescence, shows the good optical properties of these untreated particles and the efficient electrical injection into the device. Impact ionization by electrons emitted from the top electrode is identified as the origin of the electrically driven light emission.     

Avalanche photodiodes and quenching circuits for single-photon detection

Avalanche photodiodes, which operate above the breakdown voltage in Geiger mode connected with avalanche-quenching circuits, can be used to detect single photons and are therefore called singlephoton avalanche diodes SPAD's. Circuit configurations suitable for this operation mode are critically analyzed and their relative merits in photon counting and timing applications are assessed. Simple passive-quenching circuits (PQC's), which are useful for SPAD device testing and selection, have fairly limited application. Suitably designed active-quenching circuits (AQC's) make it possible to exploit the best performance of SPAD's. Thick silicon SPAD's that operate at high voltages (250-450 V) have photon detection efficiency higher than 50% from 540- to 850-nm wavelength and still ~3% at 1064 nm. Thin silicon SPAD's that operate at low voltages (10-50 V) have 45% efficiency at 500 nm, declining to 10% at 830 nm and to as little as 0.1% at 1064 nm. The time resolution achieved in photon timing is 20 ps FWHM with thin SPAD's; it ranges from 350 to 150 ps FWHM with thick SPAD's. The achieved minimum counting dead time and maximum counting rate are 40 ns and 10 Mcps with thick silicon SPAD's, 10 ns and 40 Mcps with thin SPAD's. Germanium and III-V compound semiconductor SPAD's extend the range of photon-counting techniques in the near-infrared region to at least 1600-nm wavelength.     

Enhancing near-infrared avalanche photodiode performance by femtosecond laser microstructuring

A processing technique using femtosecond laser pulses to microstructure the surface of a silicon avalanche photodiode (APD) has been used to enhance its near-infrared (near-IR) response. Experiments were performed on a series of APDs and APD arrays using various structuring parameters and poststructuring annealing sequences. Following thermal annealing, we were able to fabricate APD arrays with quantum efficiencies as high as 58% at 1064 nm without degradation of their noise or gain performance. Experimental results provided evidence to suggest that the improvement in charge collection is a result of increased absorption in the near-IR.     

Single-photon emission from electrically driven InP quantum dots epitaxially grown on CMOS-compatible Si(001)

The heteroepitaxy of III-V semiconductors on silicon is a promising approach for making silicon a photonic platform. Mismatches in material properties, however, present a major challenge, leading to high defect densities in the epitaxial layers and adversely affecting radiative recombination processes. However, nanostructures, such as quantum dots, have been found to grow defect-free even in a suboptimal environment. Here we present the first realization of indium phosphide quantum dots on exactly oriented Si(001), grown by metal-organic vapour-phase epitaxy. We report electrically driven single-photon emission in the red spectral region, meeting the wavelength range of silicon avalanche photodiodes' highest detection efficiency.     

Monte Carlo simulation of III-V material-based MOSFET for high frequency and ultra-low consumption applications

High-mobility III-V heterostructures are emerging and very promising materials likely to fulfil high-speed and low-power specifications for ambient intelligent applications. The main objective of this work is to theoretically explore the potentialities of MOSFET based on III-V materials with low bandgap and high electron mobility. First, the charge control is studied in III-V MOS structures using a Schr?dinger-Poisson solver. Electronic transport in III-V devices is then analyzed using a particle Monte Carlo device simulator. The external access resistances used in the calculations are carefully calibrated on experimental results. The performance of different structures of nanoscale MOS transistor based on III-V materials is evaluated and the quasi-ballistic character of electron transport is compared to that in Si transistors of same gate length.     

Room-temperature terahertz detectors based on semiconductor nanowire field-effect transistors

The growth of semiconductor nanowires (NWs) has recently opened new paths to silicon integration of device families such as light-emitting diodes, high-efficiency photovoltaics, or high-responsivity photodetectors. It is also offering a wealth of new approaches for the development of a future generation of nanoelectronic devices. Here we demonstrate that semiconductor nanowires can also be used as building blocks for the realization of high-sensitivity terahertz detectors based on a 1D field-effect transistor configuration. In order to take advantage of the low effective mass and high mobilities achievable in III-V compounds, we have used InAs nanowires, grown by vapor-phase epitaxy, and properly doped with selenium to control the charge density and to optimize source-drain and contact resistance. The detection mechanism exploits the nonlinearity of the transfer characteristics: the terahertz radiation field is fed at the gate-source electrodes with wide band antennas, and the rectified signal is then read at the output in the form of a DC drain voltage. Significant responsivity values (>1 V/W) at 0.3 THz have been obtained with noise equivalent powers (NEP) < 2 × 10(-9) W/(Hz)(1/2) at room temperature. The large existing margins for technology improvements, the scalability to higher frequencies, and the possibility of realizing multipixel arrays, make these devices highly competitive as a future solution for terahertz detection.     

What can molecular beam epitaxy do for silicon devices?

Molecular beam epitaxy offers three important advantages to the silicon device industry. The first is the capability of growing new structures which cannot otherwise be fabricated. Examples of these are planar barrier diodes with barrier widths of tens of ångströms, solar cells with built-in front and back surface fields, cascade solar cells and n-i-p-i layered structures with layer widths down to tens of ångströms. The second advantage is improved dopant control and profile resolution in a single growth process to replace the multiple processes needed for complex devices. Examples are millimeter wave diodes, four-layer semiconductor-controlled rectifiers, buried layer metal/oxide/semiconductor field effect transistors and charge-coupled devices, and precise profile varactors. The third advantage is new materials combinations possible with a low growth temperature and a high purity ultrahigh vacuum environment. Examples are metal silicides, silicon on insulators, Si-Ge alloy superlattices and silicon heterojunctions with III-V alloys such as AlP and GaP.Molecular beam epitaxial systems in use, the new technique of evaporative doping with solid phase epitaxial re-growth and the resulting crystal quality will be discussed.     

Structure of sputtered Ni2P films

Crystalline and amorphous nickel phosphide (Ni₂P) films are grown by d.c. magnetron sputtering onto various substrate materials, including silicon, III-V compound semiconductors, glass and metals (copper and aluminum). X-ray diffraction and transmission electron microscopy studies showed that the film structure changes most sensitively with the thermal conductivity of the substrates.     

Performance and approval procedures for active personal dosemeters

Active personal dosemeters (APDs) are well accepted as useful and reliable instruments for individual dosimetry measurements. The increasing concern about studying the behaviour of APDs in pulsed fields is illustrated through revision of the results of the most representative studies on the performance of APDs in the last 5 y. The deficiencies of APDs in pulsed fields are discussed together with proposals to overcome them. Although there are no legal constraints or technical limitations for recognising APDs for legal dosimetry in facilities with continuous radiation fields, APDs continue to be mainly used as operational dosemeters. The approval procedures applicable to APDs, especially the approach undertaken by Germany, are presented. Finally, some trends in the developments and use of APDs are summarised.     

Si versus Ge for future microelectronics

The quest for higher performance of scaled down technologies resulted in the use of high-mobility substrates and strain engineering approaches. The development of advanced processing modules, based on low temperature processing and deposited (MBE, ALD, epitaxially grown, etc.) gate stacks, has triggered the interest of exploring Ge for sub 32 nm technology nodes. A comparison between Si and Ge for future microelectronics has to take into account a variety of materials, processing and performance aspects. Here special attention will be given to passivation and gate stack formation in relation to device performance, including leakage current and reliability aspects. The potential of Ge-based device structures and the monolithic integration of Ge and III-V devices on silicon are highlighted.