空心玻璃微珠对硅橡胶泡沫隔热材料微观形态及性能的影响

以水为发泡剂、空心玻璃微珠(HGB)为填料,采用物理发泡法制备了开孔加成型甲基乙烯基硅橡胶(MVQ)泡沫隔热材料,考察了HGB用量及粒径对泡沫材料表观密度及孔隙率、隔热性能、微观形态、拉伸性能的影响。结果表明,HGB用量的增加或其粒径的增大可使MVQ泡沫材料的表观密度降低、孔隙率增大,隔热性能提高,但拉伸强度降低;添加的HGB一部分填充到MVQ泡沫材料中,一部分黏结在MVQ基体中。     

空心玻璃微珠填充硅橡胶材料的性能研究

在硅橡胶中添加空心玻璃微珠,研究了空心微珠的规格、用量等对加成型硅橡胶材料性能和加工性能的影响。为了获得较佳的综合性能,应当选用密度大、粒径小的空心玻璃微珠与硅橡胶配合,也可选用密度和粒径都小的空心玻璃微珠,但须适当降低微珠用量。     

改性空心玻璃微珠/环氧树脂复合材料力学性能研究

采用偶联剂对玻璃微珠表面进行改性处理,借助超声波振动,使改性空心玻璃微珠在环氧树脂中均匀、稳定分散,增强了玻璃微珠与环氧树脂之间的相容并探讨了改性空心玻璃微珠对环氧树脂力学性能的影响。结果表明,复合材料中改性空心玻璃微珠添加质量分数为3%时,其拉伸强度达到最大值68.54 MPa,与空白样相比提高了20.3%;冲击强度达到最大值24.42 kJ/m2,比纯环氧树脂提高了166%;KIC(断裂韧性)达到最大值2.338 MPa/m2,是空白试样的2.27倍,增韧效果较为明显。     

空心玻璃微珠增强聚丙烯材料的性能研究

研究了空心玻璃微珠填充改性聚丙烯的力学性能和热性能.结果表明,空心玻璃微珠的加入,可使聚丙烯的密度、拉伸强度、冲击强度等力学性能下降,弯曲强度、维卡软化温度呈上升趋势.     

苯基含量对甲基乙烯基苯基硅橡胶性能的影响

试验研究苯基含量对甲基乙烯基苯基硅橡胶（MVPQ）物理性能、结晶性和动态力学性能的影响。结果表明,随着苯基含量的增大,MVPQ邵尔A型硬度、拉伸强度、拉断伸长率和压缩永久变形增大;结晶度降低乃至不能结晶;玻璃化温度和损耗因子大幅提高,有效阻尼温域拓宽。     

玻璃微珠填充聚丙烯复合材料的动态力学性能

应用动态力学分析仪,于-150～100℃的范围内,考察了玻璃微珠填充聚丙烯中微珠含量及其表面处理对复合材料动态力学性能的影响 结果表明,当微珠的体积分数φ_f高于5％后,室温下的贮能模量E'_c和损耗模量E'明显地随着φ_f的增加而增大,而内耗Tanδ和玻璃化转变温度T_g则呈不规则变化。在较高的微珠含量下,经硅烷偶联利处理的微珠填充体系的E'_c稍高于未经表面处理的填充体系,而E'_c则相反。     

空心玻璃微珠和PP-g-MAH对PP力学性能及结晶性能的影响

通过熔融共混挤出的方法,制备了聚丙烯(PP)/空心玻璃微珠(HGB)和PP/聚丙烯接枝马来酸酐(PP-g-MAH)/HGB复合材料。研究了HGB和PP-g-MAH对复合材料微观结构、力学性能和结晶性的影响。结果表明,PP-g-MAH可提高HGB与PP的相容性;复合材料的拉伸强度和弯曲强度随HGB的增加表现出先增大后减小的趋势,断裂伸长率和冲击韧性逐步下降;PP-g-MAH可进一步提高拉伸强度、弯曲强度和冲击强度。PP-g-MAH的加入促使产生少量β晶,HGB和PP-g-MAH都降低了PP的结晶度和结晶速率。     

空心玻璃微珠填充环氧/氰酸酯复合材料的力学性能与耐热性能

以空心玻璃微珠为填充剂,环氧/氰酸酯共固化物为基体,制备出一种新型高性能复合材料,借助热失重分析仪(TGA)、动态热机械分析仪(DMA)、万能材料试验机、冲击试验机、扫描电子显微镜(SEM)等现代分析测试技术对复合材料的力学性能和耐热性进行研究。结果表明:随着玻璃微珠用量的增加,复合材料的弯曲模量变化不大,基本保持在2.5 GPa左右,而压缩和冲击强度则呈现先升高后下降的变化趋势;结合冲击断面的SEM照片对材料的力学性能进行分析,从整体结果来看,当玻璃微珠用量为3%时,复合材料的综合性能最佳。     

新型橡胶填料--空心玻璃微珠

空心玻璃微珠对我国橡胶工业而言，还是一种新填料。研究空心玻璃微珠的表面特性和表面处理效果，探讨了空心微珠在炭黑增强橡胶中的应用。结果表明：空心玻璃微珠表面的羟基含量很低，含水量很小，不利于进行改性程度高的表面处理。空心玻璃微珠的粒径有一定的分布。使用硅烷偶联剂进行表面处理后，能够使微珠的表面由亲水变为亲油，并在一定程度上提高其补强性能。空心微珠可以在完全不改变原有配方的基础上，进行较大量填充。单独使用不如与炭黑、白炭黑并用，复合材料的主要优势在于：成本较大幅度地下降，各项力学性能保持较好，随微珠用量的增加，加工性能和产品的外观进一步改善。     

Effect of hollow glass beads on density and mechanical properties of silicone rubber composites

In this work, low density hollow glass beads (HGB)/silicon rubber (SR) composites were prepared by solution method and flocculation process. The prepared samples were characterized by scanning electron microscopy, Fourier transform infrared spectroscopy, tensile test, and friction test. The results show that the densities of SR composites decrease from 1.140 to 0.792 g/cm³ with the addition of HGB. By comparing theoretical density with true density, it can be estimated that the ratio of shattered HGB increase from 8.79% to 24.76%. Especially, the mechanical properties of SR composites were improved by surface modification of HGB. By adding surface-modified HGB at 5 and 10 wt%, the tensile strengths of SR composites were enhanced by 17.8% and 28.2%, respectively. In addition, tear strength, shore A hardness, compression set, and friction property were significantly ameliorated. Furthermore, the mechanism of surface-modified HGB in mechanical properties was analyzed.     

Effect of hybrid hollow microspheres on thermal insulation performance and mechanical properties of silicone rubber composites

Hollow microspheres (HM) of ceramic, silica, and glass‐filled silicone rubber (SR) composites were prepared, and the effects of hybrid HM on thermal and mechanical properties of composites were investigated. The results indicate that hybrid HM can effectively improve the thermal insulation property of HM/SR composites. Especially, for sample 15S, the thermal conductivity and thermal degradation temperature reached 0.1273 W/m K and 521 °C (45 °C higher than that of neat SR), respectively. Besides, thermal insulation performance was improved, showing as a temperature of 103.2 °C after 15 min heating, which is 37.8 °C lower than that of SR. The tensile strength of composites was enhanced from 1.92 MPa at 11.56 vol % hollow silica microspheres (HSM) loading to 3.08 MPa at 21.88 vol % HSM loading. Moreover, the compressive strength was improved from 3.33 to 5.68 MPa by introducing more hollow ceramic microspheres into the matrix, in this case, from 7.79 to 15.33 vol %. Furthermore, the failure mechanism was analyzed. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46025.     

质子辐照对MQ硅树脂增强加成型硅橡胶力学性能的影响

采用空间综合辐照模拟设备研究了100keV和150keV能量的质子辐照对MQ硅树脂增强加成型硅橡胶力学性能的影响。结果表明,辐照后材料表面产生老化裂纹,随辐照能量、粒子注量的增加,裂纹的数量增多,裂纹增大;质子辐照对硅橡胶的力学性能影响较大,邵尔A硬度、拉伸强度和扯断伸长率随辐照粒子注量的增大先增加而后下降;小粒子注量的辐照对硅橡胶的损伤较小,以交联为主,而大粒子注量的辐照则以降解为主;高辐照能量对硅橡胶的损伤更为严重。     

空心玻璃微珠/环氧复合材料的制备及性能研究

制备了空心玻璃微珠/环氧复合材料。通过力学性能、固化收缩率、热性能等测试考察了空心玻璃微珠粒径、填充量、硅烷偶联剂处理对树脂及固化物性能的影响。结果表明,硅烷偶联剂改善了空心玻璃微珠与树脂基体的相容性。复合材料的力学性能随着空心微珠粒径减小而增大。随着空心微珠填充量的加大,固化物拉伸强度有所降低,冲击强度和弯曲强度在空心玻璃微珠质量分数为2%时达到最大值,比纯树脂分别提高了30%和34.2%,同时材料的固化收缩率和密度降低,玻璃化转变温度升高。     

高导电镀银玻璃微珠/硅橡胶复合材料的结构与性能

探讨了镀银玻璃微珠(SGB)的表面改性、粒径和用量对SGB甲/基乙烯基硅橡胶(VMQ)复合材料的导电性能、力学性能及相态结构的影响,考察了SGB/VMQ复合材料导电网络的影响因素。结果表明,采用硅烷偶联剂改性SGB,可以改善SGB/VMQ复合材料的力学性能和加工性能,其中使用乙烯基三乙酰氧基硅烷(牌号为A-151)还能使其导电性能保持不变。SGB的粒径越大,用量越多,SGB/VMQ复合材料的导电性能越好,当其粒径为41μm、用量300份时,填充的VMQ具有优良的力学性能和导电性能。在满足形成导电通路的前提下,应尽可能地减少SGB的用量,以改善材料的力学性能。     

聚丙烯酸酯接枝硅橡胶的制备与动态力学性能研究

采用溶液聚合法制备聚丙烯酸酯接枝硅橡胶,并对其动态力学性能进行研究。结果表明,聚丙烯酸酯可拓宽硅橡胶的有效阻尼温域,改善其高低温阻尼性能;复合聚丙烯酸酯(聚丙烯酸乙酯与聚丙烯酸丁酯的混合物)接枝硅橡胶的有效阻尼温域宽广,高低温阻尼性能均很好。     

Recycling of silicone rubber waste: Effect of ground silicone rubber vulcanizate powder on the properties of silicone rubber

The silicone rubber vulcanizate powder (SVP) obtained from silicone rubber by mechanical grinding exists in a highly aggregated state. The particle size distribution of SVP is broad, ranging from 2 µm to 110 µm with an average particle size of 33 µm. X‐ray Photoelectron Spectroscopy (XPS) and Infrared (IR) Spectroscopy studies show that there is no chemical change on the rubber surface following mechanical grinding of the heat‐aged (200°C/10 days) silicone rubber vulcanizate. Addition of SVP in silicone rubber increases the Mooney viscosity, Mooney scorch time, shear viscosity and activation energy for viscous flow. Measurement of curing characteristics reveals that incorporation of SVP into the virgin silicone rubber causes an increase in minimum torque, but marginal decrease in maximum torque and rate constant of curing. However, the activation energy of curing shows an increasing trend with increasing loading of SVP. Expectedly, incorporation of SVP does not alter the glass‐rubber transition and cold crystallization temperatures of silicone rubber, as observed in the dynamic mechanical spectra. It is further observed that on incorporation of even a high loading of SVP (i.e., 60 phr), the tensile and tear strength of the silicone rubber are decreased by only about 20%, and modulus dropped by 15%, while the hardness, tension set and hysteresis loss undergo marginal changes and compression stress‐relaxation is not significantly changed. Atomic Force Microscopy studies reveal that incorporation of SVP into silicone rubber does not cause significant changes in the surface morphology.     

Preparation and heat resistance of hollow glass microbead/silicone rubber composite coating

Hollow glass microbead/silicone rubber composite coatings were prepared to improve the heat-resistance and mechanical properties of silicone rubber-based composites, using CE modified SR as the matrix and HGM as the filler. The microscopic morphology and thermal stability of the composites were characterized by scanning electron microscopy (SEM) and thermogravimetric analyzer (TGA), respectively. The results showed that the thermal stability of the composites increases with the increase of filler content. For the composite sample with a HGM mass content of 16.7%, the initial decomposition temperature (T₅) is 408°C, which is 84°C higher than that of silicone rubber. The low density and high sphericity of HGM make it easier to uniformly disperse in the polymer matrix. In addition, compared to silica, which is commonly used as an inorganic filler, the lower thermal conductivity of HGM is also beneficial for achieving better thermal shielding effect. It is confirmed that the insufficient thermal stability of the polymer matrix above 400°C can be compensated for by the properly dispersed inorganic fillers. Therefore, the thermal stability of the composite is improved by the synergistic effect of modified heat-resistant matrix and inorganic filler.     

胶料预处理对补强硅橡胶性能的影响

本文研究了胶料预处理的不同方式对硅橡胶补强的影响。结果表明：无论含羟基硅油与否,170℃预处理硅橡胶的拉伸强度最高,放置处理试样的拉伸强度介于未处理和170℃预处理之间;胶料预处理与否对不含羟基硅油的硅橡胶硬度没有影响。含羟基硅油的硅橡胶中,170℃预处理的试样硬度最低,未处理的试样硬度最高。含羟基硅油的硅橡胶断裂伸长率变化不大。不含羟基硅油的硅橡胶断裂伸长率为170℃预处理的试样最低。