PbO和Bi_2O_3-Li_2CO_3助烧剂对Pb(Zr_(0.9)Ti_(0.1))O_3厚膜热释电性能的影响

采用丝网印刷工艺制备了Pb(Zr0.9T0.1)O3(PZT)厚膜,研究了过量PbO和Bi2O3-Li2CO3共同助烧对PZT厚膜低温烧结特性、微观结构、相构成以及介电和热释电性能的影响。结果表明:随着过量PbO及Bi2O3-Li2CO3添加量的增加,PZT厚膜的烧结温度和晶粒尺寸均逐渐降低。当PbO过量6.4%(质量分数)、Bi2O3-Li2CO3添加量为5.4%(质量分数)时,PZT厚膜可在900℃低温下致密成瓷,且其热释电系数和探测率优值均得到大幅提高;所得样品在30℃时的热释电系数为10.6×10–8C.cm–2.K–1,探测率优值为8.2×10–5Pa–1/2。     

磁控溅射法制备Bi2Te3热电薄膜的研究

Bi2Te3薄膜是室温下热电性能最好的热电材料,利用磁控溅射在长有一薄层SiO2的n型硅样品上制备Bi/Te多层复合薄膜,经后续退火处理生成Bi2Te3。通过分析Bi2Te3薄膜的生长和退火工艺,探讨Bi/Te中Te的原子数分数对薄膜热电性能的影响。采用XRD和SEM对薄膜的结构、形貌和成分进行分析,并测量不同条件下的Seebeck系数。薄膜Seebeck系数均为负数,表明所制备样品是n型半导体薄膜,且最大值达到-76.81μV.K-1;电阻率ρ随Te的原子数分数增大而增大,其趋势先缓慢后迅速。Bi2Te3薄膜的热电性能良好,Te的原子数分数是60.52%时,功率因子最大,为1.765×10-4W.K-2.m-1。     

Bi_(3.5)Yb_(0.5)Ti_3O_(12)铁电薄膜的制备及性能

采用溶胶-凝胶(Sol-Gel)法在Pt(111)/Ti/SiO2/Si(100)基片上淀积了Bi3.5Yb0.5Ti3O12(BYT)铁电薄膜,研究了在不同退火温度下形成的BYT薄膜的微观结构以及铁电性能方面的区别。结果发现,在610,660,710和760℃不同温度下退火的BYT薄膜的结晶度不同,退火温度越高的BYT薄膜,其结晶度越高。并且发现,BYT薄膜的剩余极化值(2Pr)在710℃以下随退火温度增高而增大,在710℃达到最大;在外加400kV/cm电场时2Pr为36.7μC/cm2,然后随退火温度上升又有所下降。     

二氧化锡覆盖层对ITO透明导电薄膜热稳定性的改良

采用射频磁控溅射法在ITO玻璃表面沉积了一层15 nm左右的SnO2薄膜。利用霍尔效应测试仪、四探针电阻测试仪、场发射电子显微镜及紫外–可见–近红外光谱仪分析了所制薄膜的电学性质、表面形貌和光学性质。结果表明,在300~600℃退火后镀有SnO2覆盖层的ITO(SnO2/ITO)薄膜具有相对好的热学稳定性。在600℃退火后,ITO薄膜的方阻和电阻率分别为88.3Ω/□和2.5×10–3.cm,而此时,SnO2/ITO薄膜的方阻和电阻率仅为43.8Ω/□和1.2×10–3Ω.cm。最后,阐述了SnO2覆盖层提高ITO薄膜热稳定性的机制。     

Zn0.8Na0.1Co0.1O薄膜的制备及衬底温度对其影响

采用脉冲激光沉积(PLD)技术.在温度为400、500和600℃的SiO2衬底上成功制备出Zn0.8Nao.1Co0.1O薄膜.用x射线衍射(XRD)、原子力显微镜(AFM)、荧光光谱仪、四探针电阻率测试台等对薄膜的结构、表面形貌和光电性质进行了表征,讨论了不同衬底温度对薄膜结构、光学和电学性质的影响.结果表明:掺杂没...     

Phase Transformation and Optimized Growth of TFA-MOD REBa2Cu3O7-x Films for Coated Conductors

Several types of REBa2Cu3O7-x (REBCO, RE=Y, Ho etc.) films are prepared on single crystal substrate LaAlO3 by TFA-MOD method. The phase transformation and optimized growth conditions in the crystallization are studied. Compared with SmBCO and GdBCO, high quality YBCO and HoBCO films are relatively easy to produce. It is revealed that the YBCO grains can form at low temperatures such as 730℃ during the initial heating ramp. With a high heating rate of 20 K/min and a low oxygen pressure of 100 ppm, the optimum growth temperature is around 780℃, at which the films show a Jc value of 2.88 MA/cm2. Further decrease of the heating rate may produce the highquality YBCO film with a higher Jc of 3.65 MA/cm2. The temperature dependence of resistances in various magnetic fields up to 9 T shows that the present TFAMOD YBCO and HoBCO films have similar superonducting transition temperature and magnetotransport properties.     

沉积温度对BiFeO3薄膜的微观结构与化学计量比的影响

采用高分辨透射电子显微镜并结合选区电子衍射、X射线能谱仪技术研究沉积温度对BiFeO3薄膜的微观结构与化学计量比的影响。与600℃和700℃沉积的BiFeO3薄膜相比,在500℃沉积的BiFeO3薄膜表面出现了许多岛状的二次相,即Bi2O3。当沉积温度提高到600℃和700℃时,外延BiFeO3薄膜是单晶,并且与SrRuO3缓冲层匹配良好,而且没有出现位错和二次相。通过大量的EDS数据统计分析,在500℃、600℃和700℃生长的BiFeO3薄膜,它们的Bi/Fe摩尔比分别为0.798、0.906和0.870,其中,Bi元素的缺乏可能是由于500℃时析出物Bi2O3的形成和700℃时Bi的挥发所致。     

钛酸铋薄膜的室温脉冲激光沉积研究

在室温下,采用脉冲激光沉积（ＰＬＤ）技术在７．６２ｃｍＰｔ／Ｔｉ／ＳｉＯ２／Ｓｉ（１００）衬底上制备了钛酸铋（Ｂｉ４Ｔｉ３Ｏ１２）薄膜。Ｂｉ４Ｔｉ３Ｏ１２薄膜的厚度和组分均匀性采用卢瑟福背散射（ＲＢＳ）和扩展电阻技术（ＳＲＰ）来分析、表征;采用Ｘ射线衍射（ＸＲＤ）技术研究了薄膜的退火特性。研究发现单独用常规退火或快速退火热处理的Ｂｉ４Ｔｉ３Ｏ１２薄膜中较容易出现Ｂｉ２Ｔｉ２Ｏ７杂相;而采用常规退火和快速退火相结合的方法,较好地解决了杂相出现的问题,得到相结构和结晶性完好的Ｂｉ４Ｔｉ３Ｏ１２薄膜。透射电子显微镜实验和扩展电阻实验表明,室温下制备的Ｂｉ４Ｔｉ３Ｏ１２薄膜具有良好的表面和界面特性。     

Determination of the Origin of Crystal Orientation for Nanocrystalline Bismuth Telluride-Based Thin Films Prepared by Use of the Flash Evaporation Method

We have investigated the origin of crystal orientation for nanocrystalline bismuth telluride-based thin films. Thin films of p-type bismuth telluride antimony (Bi–Te–Sb) and n-type bismuth telluride selenide (Bi–Te–Se) were fabricated by a flash evaporation method, with exactly the same deposition conditions except for the elemental composition of the starting powders. For p-type Bi–Te–Sb thin films the main x-ray diffraction (XRD) peaks were from the c-axis (Σ{00l}/Σ{hkl} = 0.88) whereas n-type Bi–Te–Se thin films were randomly oriented (Σ{00l}/Σ{hkl} = 0.40). Crystal orientation, crystallinity, and crystallite size were improved for both types of thin film by sintering. For p-type Bi–Te–Sb thin films, especially, high-quality structures were obtained compared with those of n-type Bi–Te–Se thin films. We also estimated the thermoelectric properties of the as-grown and sintered thin films. The power factor was enhanced by sintering; maximum values were 34.9 μW/cm K² for p-type Bi–Te–Sb thin films at a sintering temperature of 300°C and 23.9 μW/cm K² for n-type Bi–Te–Se thin films at a sintering temperature of 350°C. The exact mechanisms of film growth are not yet clear but we deduce the crystal orientation originates from the size of nano-clusters generated on the tungsten boat during flash evaporation.     

Bi_(1.5)Mg_(1.0)Nb_(1.5)O_7薄膜的介电损耗机理研究

采用射频磁控溅射法在Al2O3基片上沉积了铌酸铋镁(Bi1.5Mg1.0Nb1.5O7,BMN)薄膜,研究了不同退火条件下BMN薄膜的介电损耗机理。结果表明,充分的退火能够减小氧空位缺陷密度,并降低介电损耗。氧气气氛下退火能够有效补偿BMN薄膜中的氧空位,使得介电损耗进一步降低。这说明氧空位导致的带电缺陷损耗是BMN薄膜材料主要的介电损耗机制。此外,BMN薄膜中也存在晶界损耗机制。     

The TCR of Ni24.9Cr72.5Si2.6 thin films deposited by DC and RF magnetronsputtering

The temperature coefficient of resistance (abbreviated as TCR) of thin film resistors on some sensor chips,such as thermal converters,should be less than several ppm/℃.However,the TCR of reported thin films is larger than 5 ppm/℃.In this paper,Ni_24.9Cr_72.5Si_2.6 films are deposited on silicon dioxide film by DC and RF magnetron sputtering.Then as-deposited films are annealed at 450℃ under different durations in N₂ atmosphere. The sheet resistance of thin films with various thickness and annealing time are measured by the four probe resistivity test system at temperature of 20,50,100,150,and 200℃ and then the TCR of thin films are calculated. Experimental results show that the film with the TCR of only-0.86 ppm/℃ can be achieved by RF magnetron sputtering and appropriate annealing conditions.     

飞秒脉冲激光沉积Si基a轴择优取向的钛酸铋铁电薄膜

在钛酸铋(Bi4Ti3O12)薄膜的制备过程中容易获得晶粒c轴垂直于基片表面的薄膜,而压电和铁电存储器主要利用a轴的自发极化分量,因而制备a轴择优取向的Bi4Ti3O12铁电薄膜具有特别的意义。采用飞秒脉冲激光作用在钛酸铋陶瓷靶上,采用Si(111)作为衬底,制备了a轴择优取向的钛酸铋薄膜。采用X射线衍射(XRD)的薄膜附件和场发射扫描电镜(FSEM)研究了薄膜的结构和形貌;采用傅里叶红外光谱仪测量了室温(20℃)下在石英基片上沉积的样品的光学特性;室温下沉积的钛酸铋薄膜呈c轴择优取向,晶粒的平均大小为20 nm,其光学禁带宽度约为1.0 eV。在500℃沉积的钛酸铋薄膜呈a轴择优取向,晶粒大小在30~300 nm之间,薄膜的剩余极化强度Pr为15μC/cm2,矫顽力Er为48 kV/cm。     

低维Bi_2Te_3热电材料的制备与性能研究

用溶剂热法制备了直径在100nm以内的一维针状及厚20～30nm、长几微米的二维花朵状Bi2Te3热电材料,分析了不同形貌产物的生长机理,并对其热电性能进行了比较。结果表明,添加剂的分子结构对产物形貌起决定性作用。不同形貌产物的热电性能随温度变化的机制不同,一维纳米结构Bi2Te3产物的功率因子随温度升高而增加,最大值为143.1μΩ·m–1K–2。而二维纳米结构的Bi2Te3产物虽然在室温附近有较大的Seebeck系数,约100μV/K,但由于其电导率较低,功率因子在较宽的温度范围内保持在23μΩ·m–1K–2左右。     

衬底对钛酸铋铁电薄膜生长及性能的影响

采用溶胶–凝胶工艺在Si和Pt/Ti/SiO2/Si两种衬底上制备了Bi4Ti3O12铁电薄膜,研究了衬底对Bi4Ti3O12铁电薄膜生长及性能的影响。研究表明:Pt/Ti/SiO2/Si基Bi4Ti3O12薄膜的剩余极化较高但易出现焦绿石相,而Si基Bi4Ti3O12薄膜易于沿c轴取向生长,有利于改善铁电薄膜与硅衬底之间的界面特性,但8mC/cm2的剩余极化却比前者有所降低。     

真空退火温度对GZO/Ag/GZO三层膜性能的影响

室温下在玻璃衬底上,采用射频磁控溅射GZO(Ga掺杂ZnO)膜和离子束溅射Ag膜的方法,制备了GZO/Ag/GZO三层膜,分析了真空退火温度对样品结构、光学、电学性能的影响。结果显示:随着退火温度的升高,Ag层的结构得到明显改善,但GZO层结晶度受到了Ag扩散的影响。经过350℃退火后,样品在可见光区平均透射率达92.63%,电阻率由8.0×10–5Ω·cm降至4.0×10–5Ω·cm。     

溶胶—凝胶法制备BST铁电薄膜及性能研究

研究了一种以水为溶剂的(Ba     

Effects of excess Bi concentration, buffered Bi2O3 layer, and Ta doping on the orientation and ferroelectricity of chemical-solution-deposited Bi3.25La0.75Ti3O12 films

Effects of excess Bi concentration, buffered Bi₂O₃ layer, and Ta doping on the orientation and ferroelectricity of chemical-solution-deposited (CSD) Bi_3.25La_0.75Ti₃O₁₂ (BLT) films on Pt/SiO₂/Si(100) were studied. The optimum concentration of excess Bi added to the BLT films to achieve a larger remanent polarization (2Pr) was 10 mol.%. The buffered Bi₂O₃ layers could reduce the temperature for c-axis-oriented growth of BLT films from 850°C to 700°C. However, two-step annealing, i.e., first annealed at 650°C and then annealed at a temperature of 700–850°C, could effectively suppress the c-axis-oriented growth and thus improve the 2Pr of BLT films. The improvement of the 2Pr of BLT films can be explained in terms of the large polarization along the a-axis orientation and buffered Bi₂O₃ layers, which compensate the BLT films for Bi evaporation during annealing. The Ta doping can induce two contrary effects on the 2Pr of BLT films. For the (Bi_3.25La_0.75)(Ti_3−xTa_x)O₁₂ (BLTTx) films with x=0.005, the effect of a decrease of oxygen vacancies would be dominant, resulting in the improvement of 2Pr. Because the Ta concentration (x) in the BLTTx films exceeds 0.01, the effect of a decrease of grain size would become dominant, resulting in the degradation of 2Pr.     

Dielectric Characteristics of Ba0.65Sr0.35TiO3 Thin Films by Sol-Gel Method

Ferroelectric Ba0.65Sr0.35TiO3 (BST) thin films on the Pt/Ti/SiO2/Si substrate have been successfully prepared by sol-gel. Such films have approximately 300 nm thicknesses with a remnant polarization of about 2.95 C/cm2 and a coercive field of about 21.5 kV/cm. The investigations of X-ray diffraction and atomic force microscopy show that the BST films annealed at 650 ℃ exhibit a tetragonal structure and that the films dominantly consist of large column or grains of about 89 nm in diameter. The curves of the temperature dependence of dielectric coefficient in different frequencies display the curie transition at the temperature around 23 ℃. The dielectric loss tangent of BST thin films at 100 kHz is less than 0.04. As a result, the BST thin films are more applicable for fabrication of infrared detector compared with the BST thin films reported previously.     

溶胶—凝胶法制备掺镧钛酸铋铁电薄膜

利用溶胶-凝胶法在Si（100）及Pt/Ti/Si（100）衬底上制备了Bi3.5La0.5Ti3O12(BLT-5）铁电薄膜,研究了在不同退火条件下BLT-5薄膜的结晶性能。经650℃、30min退火处理的BLT-5铁电薄膜的矫顽场Et=67kV/cm,剩余极化强度Pt=11.2μC/cm∧2,BLT-5铁电薄膜呈现较好的抗疲劳特性,可望用于制备高容量铁电随机存取存储器。     

Post-annealing Effect on Microstructures and Thermoelectric Properties of Bi0.45Sb1.55Te3 Thin Films Deposited by Co-sputtering

p-Type Bi_0.45Sb_1.55Te₃ thermoelectric (TE) thin films have been prepared at room temperature by a magnetron cosputtering process. The effect of postannealing on the microstructure and TE properties of Bi_0.45Sb_1.55Te₃ films has been investigated in the temperature range from room temperature to 350°C. x-Ray diffraction analysis shows that the annealed films have polycrystalline rhombohedral crystal structure, and the average grain size increases from 36?nm to 64?nm with increasing annealing temperature from room temperature to 350°C. Electron probe microanalysis shows that annealing above 250°C can cause Te reevaporation, which induces porous thin films and dramatically affects electrical transport properties of the thin films. TE properties of the films have been investigated at room temperature. The hole concentration shows a trend from descent to ascent and has a minimum value at the annealing temperature of 200°C, while the Seebeck coefficient shows an opposite trend and a maximum value of 245?μV?K^?1. The electrical resistivity monotonically decreases from 19.8?mΩ?cm to 1.4?mΩ?cm with increasing annealing temperature. Correspondingly, a maximum value of power factor, 27.4?μW?K^?2?cm^?1, was obtained at the annealing temperature of 250°C.