近红外波段Ge光电探测器的研究进展

随着光通信技术的发展,如何制备能与Si基电路单片集成的响应波长在1.3和1.55 μm的高性能光电探测器成为研究热点.总结了SiGe组分变化的缓冲层技术、低温缓冲层技术以及选区外延这三种主流的Ge材料外延技术,介绍了pin结构、金属-半导体-金属(MSM)结构、雪崩光电二极管(APD)结构以及pin结构和MSM结构与光波导集成这四种不同结构的Ge光电探测器,并从这些不同结构的器件制备技术方面阐述了近红外波段Ge光电探测器的研究进展及其应用.     

GaAs基RTD与MSM光电集成

报道了GaAs基共振隧穿二极管(RTD)与金属-半导体-金属光电探测器(MSM PD)单片集成的两种光电集成电路,并在室温条件下分别测试了RTD器件、MSM器件和集成电路的电学特性.测试表明:RTD器件的峰谷电流比为4;由于改进了在半绝缘GaAs衬底上制作MSM的方法,5V偏压下的电流由原来的2μA增加到了18μA,基本实现了两种电路的逻辑功能.     

Monolithically Fabricated OEICs Using RTD and MSM

报道了GaAs基共振隧穿二极管(RTD)与金属-半导体-金属光电探测器(MSM PD)单片集成的两种光电集成电路,并在室温条件下分别测试了RTD器件、MSM器件和集成电路的电学特性.测试表明:RTD器件的峰谷电流比为4;由于改进了在半绝缘GaAs衬底上制作MSM的方法,5V偏压下的电流由原来的2μA增加到了18μA,基本实现了两种电路的逻辑功能.     

ZnO薄膜紫外探测器的光电性质

采用直流反应磁控溅射的方法制备ZnO薄膜, 用X射线衍射仪(XRD)、扫描电镜(SEM)和紫外-可见光谱仪(UV-Vis)分别表征ZnO薄膜的晶体结构和表面形貌等特征。并用此材料制备Au/ZnO/Au金属-半导体-金属(MSM)结构光电导型ZnO薄膜紫外光探测器。实验结果表明, ZnO探测器在360 nm出现明显光响应,其光电流为2.5 mA, 在5 V偏置电压下暗电流为250 μA; ZnO紫外探测器在250～380 nm的紫外波段, 探测器有很明显的光响应, 且光电流响应比较平坦; 在380～430 nm区域, 光响应明显下降; 其光响应的上升与下降弛豫时间分别为20 s与80 s。从光谱响应图中可以看出紫外(360 nm)比可见区(450 nm)的光响应高出3个数量级, 薄膜表面存在的缺陷(如氧空位)在ZnO紫外探测器的光电效应中有重要作用。     

MSM光电探测器特性二维数值模拟

为了解释在InGaAs金属-半导体-金属光电探测器(MSM—PD)内光产生载流子的行为及器件内电场分布,本文用有限元法数值求解了含复合项的二维泊松方程、电流连续方程及电荷俘获速率方程。得到了InGaAs MSM光电探测器的电流—电压特性及器件内电场和载流子分布。模拟结果解释了实验观察到的雪崩击穿现象,并表明电子电流比空穴电流提前饱和。     

势垒层对黑硅光电探测器性能影响的研究

讨论势垒层Si3N4的引入对黑硅光电探测器光电性能的影响。探测器采用金属一半导体一金属（MSM）器件结构在黑硅层和电极间增加一层势垒层以提高肖特基势垒,从而减低器件的暗电流。实验表明,在相同的光照情况下,有势垒层的探测器暗电流比无势垒层的探测器暗电流至少低1个数量级,且势垒层厚度增加30nm其暗电流降低约1个数量级,而...     

基于超宽β-Ga2O3微米带的日盲光电探测器研究

氧化镓的禁带宽度接近5 eV,是一种极具前景的日盲紫外探测半导体材料。基于碳热还原法生长高质量β-Ga₂O₃微米带制备出MSM(Metal-Semiconductor-Metal)结构光电导紫外探测器,研究了不同的结构对光电器件性能的影响。结果表明等间距叉指电极光电探测器相较于两端电阻型光电探测器有更优异的性能。在10 V/254 nm紫外光照下,其响应度、外部量子效率、比探测率和光响应时间等性能提高明显,其中光电流(I_photo)有接近2个数量级的提升,且-2 V附近光暗电流比值增大至2.29×10⁵。随着叉指电极间距从50μm缩减至20μm,器件I_photo变大,其物理机制归因于阳极附近的耗尽层占据电极间微米带的比例增大引发了更高的光生载流子输运效率。     

基于新型半圆形电极金属-半导体-金属紫外光探测器的光电耦合优化

本文使用数值仿真器ISE-TCAD建立了新型半圆形电极金属-半导体-金属紫外探测器器件模型并研究了该探测器的器件特性。通过对新型半圆形电极结构探测器,传统结构探测器以及实验数据的全面对比验证了模型的正确性。其结果表明了该探测器的性能提升并说明了建立的物理模型对预测这种新型结构探测器性能增强而言是合适的。此外,通过调节该器件的结构参数实现优化目的,优化结果表明半圆形电极半径为2 μm, 电极间距为3 μm的探测器在290 nm具有峰值响应度0.177 A/W ,相应的外量子效率超过75%, 同时在0.3 V 偏压条件下归一化光暗电流对比度达到1.192E11 1/W。这些特性表明半圆电极金属-半导体-金属紫外光电探测器具有优异的光电集成应用前景。     

光二极管不再孤独

1　前言许多用户现在要求集成器件 ,包括新形状和包装、放大和处理电子元件及众多的光学元件。从医学诊断和条码读出器到军事制导系统和通信的许多应用中 ,光二极管和二极管列阵仍是最通用的光探测器。它们具有尺寸紧凑、牢固耐用、固态可靠、低噪声和价廉的优点。现今 ,许多新装置客户列出的清单都是某些集成组合或光电混合器件 ,而不是单独的光电探测器。这些组合包括从简单的组件到具有高级信号放大和处理的完全集成的光电探测系统。光电探测器组件具有预装配、准直和完全测试过的所有部件 ,使它们具有像自动光度测定和高性能粒子计数系…     

AlxZn1-xO合金MSM光电探测器的研究

在Si衬底上磁控溅射制备AlxZn1-xO(AZO)合金薄膜,在其上真空蒸发Ni/Au叉指电极获得金属-半导体-金属(MSM)结构光电探测器.采用UV-Vis-Nir分光光度计测量AZO系列薄膜的光吸收特性,观察到AZO 合金薄膜的光学吸收带边随Al含量增加明显蓝移.测试AZO探测器的电流电压特性、时间特性和响应光谱发...     

Board-level optical interconnection and signal distribution using embedded thin-film optoelectronic devices

Optical interconnection and signal distribution at the backplane, board, and substrate level can be implemented using thin-film active optoelectronic devices embedded in polymer waveguide structures. These active embedded devices eliminate the need for optical beam turning to and from photodetectors and emitters, respectively, for inputs and outputs to the substrate waveguides. In this paper, optical interconnections using fully embedded thin-film metal-semiconductor-metal (MSM) photodetectors in polymer optical waveguides are demonstrated, and the experimental characterization of these thin-film MSMs embedded in polymer waveguides is reported. To illustrate the potential for high-level signal distribution at the backplane, board, and substrate levels, a 1/spl times/4 balanced multimode interference (MMI) coupler has also been demonstrated in a photoimageable polymer for the first time. Finally, a 1/spl times/4 thin-film MSM photodetector array has been embedded in the output arms of the a photoimageable polymer MMI for the first time, and the MSM array photocurrent outputs from the 4 arms show that highly balanced optical signal distribution has been achieved.     

Monolithic millimeter wave optical receivers

A single stage monolithic millimeter wave optical receiver circuit was designed and fabricated using a metal-semiconductor-metal (MSM) photodetector and a pSeudomorphic Modulation Doped Field Effect Transistors (SMODFET) on a GaAs substrate for possible applications in chip-to-chip and free space communications. The MSM photodetector and the SMODFET epitaxial material were grown by molecular beam epitaxy (MBE). Device isolation was achieved using an epitaxially grown buffer between the MSM detector layers and SMODFET. The photodetector was designed for maximum absorption at optical wavelength of 770 nm light and the SMODFET impedance matching network was optimized for 44 GHz. The monolithic millimeter wave optical receiver circuit achieved 3 dB gain over a photodetector at 39 GHz, which was the limit of the measurement system. TOUCHSTONE model of the circuit indicated 6.6 dB gain over the photodetector and 5.7 dB total gain including the insertion loss of the photodetector at 44 GHz     

The heterogenous integration of GaN thin-filmmetal-semiconductor-metal photodetectors onto silicon

The heterogeneous integration of GaN thin-film metal-semiconductor-metal (MSM) photodetectors onto a host substrate of SiO₂-Si is reported. Thin-film GaN photodetectors were separated from the lithium gallate (LiGaO₂) growth substrate using selective etching, and contact bonded onto a SiO₂-Si host substrate. The thin-film MSMs exhibited a dark current of 13.36 pA and an UV photoresponse at 308 nm of 0.11 A/W at a reverse bias voltage of 20 V. This first demonstration of GaN thin-film device integration onto SiO₂-Si using a low-temperature integration process, combined with the advances in GaN material quality on LiGaO₂ substrates, enables the integration of GaN devices with Si circuitry for heterogeneously integrated systems     

Theory and design of a tapered line distributed photodetector

We present the theory and design of a tapered line distributed photodetector (TLDP). In the previously demonstrated velocity-matched distributed photodetector (VMDP), high electrical bandwidth is achieved by proper termination in the input end to absorb reverse traveling waves, sacrificing one-half of the quantum efficiency. By utilizing the tapered line structure and phase matching between optical waves and microwaves in our analyzed structure, a traveling-wave photodetector is more realizable and ultrahigh bandwidth can be attained due to removal of the extra input dummy load that sacrifices one-half of the total quantum efficiency. To investigate the advantages of TLDP over VMDP, we calculate their electrical bandwidth performances by using an analytic photodistributed current model. We adopted low-temperature-grown (LTG) GaAs-based metal-semiconductor-metal (MSM) traveling-wave photodetectors as example unit active devices in the analytic bandwidth calculation for their high-speed and high-power performances. Both VMDP and TLDP in our simulation are assumed to be transferred onto glass substrates, which would achieve high microwave velocity/impedance and make radiation loss negligible. The simulated bandwidth of a properly designed LTG GaAs MSM TLDP is /spl sim/325 GHz, which is higher than the simulated bandwidth of the LTG GaAs MSM VMDP with an open-circuit input end (/spl sim/240 GHz) and is almost comparable to the simulated bandwidth of an input-terminated LTG GaAs MSM VMDP (/spl sim/330 GHz). This proposed method can be applied to the design of high-bandwidth distributed photodetectors for radio-frequency photonic systems and optoelectronic generation of high-power microwaves and millimeter waves.     

Optical signal distribution to MSM photodetector arrays viaintegrated polyimide waveguides

The integration of metal-semiconductor-metal (MSM) photodetector arrays with polyimide ridge waveguides is demonstrated. MSM detectors were fabricated using transparent indium tin oxide (ITO) interdigitated electrodes on semi-insulating GaAs substrates. An optical buffer layer of SiO₂ was deposited and patterned, and then polyimide ridge waveguides were fabricated on top by spin coating and photolithography. The guides were multimode with widths from 10 to 50 μm. Light at 830 nm was coupled efficiently from the waveguides through gaps in the SiO ₂ buffer layer into the underlying detector structures. Absolute responsivities of the integrated MSM devices were around 0.5 A/W and the 3 dB bandwidths of 5-6 GHz were measured. Division of the input signal between sets of two and four detectors under a single waveguide has been achieved, highlighting the potential for the fabrication of integrated optoelectronic switches     

A monolithic GaAs-on-Si receiver front end for optical interconnectsystems

The authors describe a monolithic technology for integrating GaAs with Si bipolar devices and demonstrate that such integration can provide improved system performance without degrading individual devices. The technology has been used to implement a 1-GHz GaAs/Si optical receiver with an equivalent input noise current density of less than 3 pA/√Hz for midband operation, and less than 4.5 pA/√Hz at 1 GHz. In this receiver an interdigitated GaAs metal-semiconductor-metal (MSM) photodetector is combined with a transimpedance preamplifier fabricated in silicon bipolar technology. The measured dark current of the GaAs/Si photodetector is 7 nA. The measured pulse response of an experimental integrated receiver is less than 550 ps FWHM. The integrated front end provides a wideband, low-noise optical receiver for use in local optical interconnections and demonstrates the successful application of integrated GaAs-on-Si technology to optoelectronics     

Cryogenic processed metal-semiconductor-metal (MSM) photodetectorson MBE grown ZnSe

Molecular beam epitaxy grown 0.5-μm and 2.0-μm thick undoped ZnSe on semi-insulating (100) GaAs substrates were prepared for metal-semiconductor-metal (MSM) photodetector devices. The MSM photodetectors consisted of interdigitated metal fingers with 2, 3, and 4 μm width/spacing on a wafer. A multilayer resist process was employed using polyimide and SiO₂ thin films before the pattern generation to aid in a special low temperature (LT) lift-off process. Dark current-voltage (I-V), DC photo I-V, high frequency I-V, spectral response, and frequency response techniques were employed for testing the device performance. The cryogenic processed metallization provided an improved interface between metal and semiconductor interface. The breakdown voltage in these devices is dependent on the electrode width/spacing and not on film thickness. Dark current remained at around 1 pA for a bias of ±10 V. The devices exhibited a high spectral responsivity of 0.6 (A/W) at a wavelength of 460 nm at 5 V applied bias. A maximum spectral responsivity of 1 (A/W) at an applied bias of 5 V was obtained in these devices indicating an internal gain mechanism. This internal gain mechanism is attributed to hole accumulation in ZnSe epilayers     

Metal-semiconductor-metal demultiplexing waveguide photodetectors in InGaAs/GaAs quantum well structures by selective bandgap tuning

A two-wavelength demultiplexing metal-semiconductor-metal (MSM) waveguide photodetector has been fabricated using impurity-free vacancy diffusion and partial intermixing of an InGaAs/GaAs strained layer quantum well structure. The importance of growth and process parameters, such as aluminium composition in the cladding layer and the oxygen plasma treatment of the sample during processing, on the related device performance is discussed. This photodetector is a potential candidate for monolithic integration with other optoelectronic devices.<>     

Monolithically integrated InGaAs/InP MSM-FET photoreceiver preparedby chemical beam epitaxy

The first monolithic integration of a metal-semiconductor-metal (MSM) InGaAs photodetector with a field-effect transistor (FET) and resistors into a high-impedance front-end photoreceiver circuit is discussed. The sample was grown in a single step by chemical beam epitaxy, and standard processing steps for making FETs were used to fabricate the receiver circuit. Semi-insulating Fe-doped InP layers were used as the insulating gate of the FET, the barrier enhancement layer in the MSM photodetector, and the electrical isolation layer between the photodetector and the electronic circuit. A bit error rate of less than 10^-9 at 200 Mb/s has been achieved with this preliminary circuit for an optical power of -17 dBm     

Theoretical study of the effect of an AlGaAs double heterostructureon metal-semiconductor-metal photodetector performance

The impulse and square-wave input response of different GaAs metal-semiconductor-metal photodetector (MSM) designs are theoretically examined using a two dimensional drift-diffusion numerical calculation with a thermionic-field emission boundary condition model for the heterojunctions. The rise time and the fall time of the output signal current are calculated for a simple GaAs, epitaxially grown, MSM device as well as for various double-heterostructure barrier devices. The double heterostructure devices consist of an AlGaAs layer sandwiched between the top GaAs active absorption layer and the bottom GaAs substrate. The effect of the depth of the AlGaAs layer on the speed and responsivity of the MSM devices is examined. It is found that there is an optimal depth, at fixed applied bias, of the AlGaAs layer within the structure that provides maximum responsivity at minimal compromise in speed