稀土氧化物对Al2O3-ZrO2激光熔覆层组织与性能影响研究

为了解决在钛合金表面通过激光熔覆技术制备得到的Al₂O₃-ZrO₂陶瓷涂层脆性大、易开裂的问题,有效提升钛合金性能,扩大其使用范围,采取在熔覆层材料中添加稀土氧化物CeO2的方法,对Al₂O₃-ZrO₂陶瓷熔覆层的裂纹敏感性进行了改善。通过分析熔覆层宏观、微观组织,测试熔覆层性能,研究CeO2含量对熔覆层裂纹敏感性的影响规律,探究CeO₂调控辅助激光熔覆制备Al₂O₃-ZrO₂陶瓷涂层最佳含量,揭示稀土氧化物对熔覆层裂纹敏感性影响的作用机理。结果表明：通过添加稀土氧化物调控,熔覆层裂纹数量明显减少,熔覆层裂纹控制主要归功于稀土元素对熔覆层组织的细晶强化效应;当CeO₂质量分数为0.8%时,熔覆层微观组织最为致密,对裂纹抑制作用最为明显;熔覆层断裂韧性相较未添加稀土调控辅助时有明显提高,从4.1 MPa·m^1/2提高至7.3 M...     

脉冲激光对石英基底Ta2O5/SiO2滤光膜的损伤效应研究

随着高能激光系统的发展,对光学薄膜抵抗激光损伤能力的要求越来越高,而激光脉宽是脉冲激光对薄膜损伤行为的重要影响因素。针对Ta₂O₅/SiO₂多层膜,基于1-on-1测试方法,分析其在飞秒、皮秒、纳秒激光作用下的损伤特性。测得800 nm飞秒激光作用下的损伤阈值为1.67 J/cm₂;532 nm和1 064 nm皮秒激光作用下的损伤阈值分别为1.08 J/cm²和1.98 J/cm²;532 nm和1 064 nm纳秒激光作用下的损伤阈值分别为9.39 J/cm₂和21.57 J/cm₂,并使用金相显微镜观察了滤光膜的损伤形貌。实验结果表明：飞秒激光对滤光膜的损伤机理主要是多光子电离效应,而皮秒和纳秒激光对滤光膜的损伤机制主要是热效应。滤光膜在飞秒激光作用下的损伤阈值与皮秒激光作用下的损伤阈值相当,纳秒激光作用下的损伤阈值要高一个数量级,透射通带外损伤阈值约为通带内损伤阈值的2倍。     

95%Al2O3陶瓷的MoO3体系低温金属化机理研究

本文采用由MoO₃加活化剂组成的配方对氧化铝陶瓷进行低温金属化,通过对氧化铝陶瓷、金属化层的显微结构及元素的分布情况来探索氧化铝陶瓷的低温金属化机理。研究发现金属化层中大部分MoO₃还原成活性较好的Mo颗粒,Mo颗粒间相互烧结连通为主体金属海绵骨架,同时少量的Mo氧化物与MnO、Al₂O₃、SiO 2、CaO等形成玻璃熔体,MnO、Al₂O₃、SiO 2、CaO之间也会形成MnO-Al₂O₃-SiO₂-CaO系玻璃熔体,从而获得致密、Mo金属与玻璃熔体相互缠绕、包裹的金属化层。金属化层中的两种玻璃熔体先后渗透、扩散进入氧化铝陶瓷晶界从而实现陶瓷与金属化层之间的连接。金属化层中还原的Mo金属与Ni层之间形成Mo-Ni合金,从而实现Ni层与金属化层之间的结合。     

h-BN/Al2O3栅介质氢终端金刚石场效应晶体管

金刚石是实现高频大功率器件的理想候选材料,但是其较低的载流子迁移率制约了器件的性能,六方氮化硼(h-BN)作为氢终端金刚石场效应晶体管(FET)的栅介质材料有望提升金刚石材料的载流子迁移率。利用商业化大面积h-BN材料,制备了h-BN/Al₂O₃栅介质的氢终端金刚石FET,h-BN/Al₂O₃/氢终端金刚石材料的载流子迁移率得到提升,达到186 cm²/(V·s)。相较于Al₂O₃栅介质的金刚石FET,h-BN/Al₂O₃栅介质的金刚石FET最大饱和电流密度和最大跨导均得到提升,分别为141 mA/mm和9.7 mS/mm。通过电容-电压(C-V)测试计算了栅介质和金刚石间界面固定电荷密度和陷阱密度,h-BN/Al₂O₃栅介质的金刚石FET界面负固定电荷密度为5.4×10¹² cm^-2·eV^-1...     

镍基单晶高温合金水导激光钻孔工艺特性研究

为了探究不同激光功率及扫描速度下水导激光加工技术对镍基单晶高温合金加工微孔的影响规律及规律形成机理。使用自主研发的水导激光加工平台对镍基单晶高温合金CMSX-4在不同激光功率及扫描速度下进行1 mm微孔的加工。然后采用白光干涉仪、扫描电子显微镜和Vision64软件获得微孔加工时间、孔径、圆度、锥度及重铸层厚度随不同激光功率及扫描速度的变化规律,并研究变化规律的形成机理。结果表明,加工时间、锥度及重铸层厚度与激光能量强度有关。随着激光能量强度的增大,加工时间缩短,锥度变小,重铸层厚度变小。孔径和圆度受激光能量强度及其在材料表面分布的影响。仅当激光能量作用范围控制在水束直径范围下时,孔径及圆度相应获得较好的加工质量。     

不同介电层对HfxZr1-xO2薄膜铁电性能影响的研究进展

近年来,铁电Hf_xZr_1-xO₂(HZO)薄膜受到越来越多的关注,但是铁电层与电极材料层以及铁电层与半导体衬底层之间的界面问题并没有得到解决,阻碍了HZO薄膜的进一步应用。总结了通过引入不同介电层材料,如Al₂O₃、ZrO₂、HfO₂、Ta₂O₅等,调节HZO薄膜铁电性能的方法及其机理;详细介绍了各种介电层材料作为封盖层对HZO薄膜铁电性能的影响,如对HZO薄膜提供平面内应力、控制铁电层的晶粒尺寸及作为铁电层形核核心的作用;最后,总结并展望了利用介电层调控HZO薄膜铁电性能的一般规律,为后续相关研究的开展提供了指导。     

Al2O3-SiO2/纤维素复合气凝胶的制备及其阻燃性能

针对纤维素气凝胶隔热性能差、易燃烧等问题,基于液氮定向冷冻及真空冷冻干燥技术,以低成本、环境友好的微晶纤维素为原材料,Al₂O₃-SiO₂溶胶为阻燃剂,去离子水为溶剂,加入硼酸作为催化剂控制共水解进程,制备出隔热阻燃性能良好的Al₂O₃-SiO₂/纤维素复合气凝胶。采用扫描电子显微镜、傅里叶变换红外光谱仪、热重分析仪、锥形量热仪等研究了Al₂O₃-SiO₂溶胶含量对材料结构与性能的影响,并分析了复合气凝胶的阻燃机制。结果表明,随着Al₂O₃-SiO₂溶胶含量的增加,Al₂O₃-SiO₂/纤维素复合气凝胶从蜂窝状结构向多孔三维网络结构转变,孔径减小。Al₂O₃-SiO₂溶胶与微晶纤维素溶液体积比为2...     

微波辅助烧结Al掺杂ZnO陶瓷的缺陷和光学性能研究

采用微波辅助烧结法在空气气氛中以1100℃烧结20 min制备出不同Al₂O₃掺杂量（摩尔分数0%～6%）的ZnO陶瓷。通过XRD、SEM、霍尔实验、UV-Vis光谱、Raman光谱、PL光谱的表征,研究了Al₂O₃掺杂量的变化对微波辅助烧结ZnO陶瓷的物相结构、微观组织、电学性能、光学性能的影响。实验结果表明,Al₂O₃掺杂并没有改变ZnO陶瓷的六方纤锌矿结构,随着Al₂O₃掺杂量的增加,在ZnO晶界处逐渐形成ZnAl₂O₄尖晶石相,ZnO晶粒尺寸逐渐减小;微波辅助烧结所制备ZnO陶瓷的室温电阻率和光学带隙随Al₂O₃掺杂量的增加呈先减小后增加的趋势;当Al₂O₃掺杂量为摩尔分数4%时,所制备ZnO陶瓷的综合性能最好,样品的室温电阻率为1783Ω·cm,光学带隙为3.04 eV;随...     

基于MIS电容器的Al2O3与In0.74Al0.26As的界面特性

采用In_0.74Al_0.26As/In_0.74Ga_0.26As/In_xAl_1-xAs异质结构多层半导体作为半导体层,制备了金属-绝缘体-半导体（MIS）电容器。其中,SiN_x和SiN_x/Al₂O₃分别作为MIS电容器的绝缘层。高分辨率透射电子显微镜和X射线光电子能谱的测试结果表明,与通过电感耦合等离子体化学气相沉积生长的SiN_x相比,通过原子层沉积生长的Al2_O3可以有效地抑制Al₂O₃和In_0.74Al_0.26As界面的In₂O₃的含量。根据MIS电容器的电容-电压测量结果,计算得到SiN_x/Al₂O₃/In...     

海量微孔水辅助法皮秒激光加工技术的研究及应用

针对激光加工具有海量微孔的金属滤网时基板热变形严重,且所加工微孔锥度大、孔形一致性差等问题,提出了背面水辅助的激光微孔加工法。该方法利用水进入微孔的毛细现象,光在气液界面的反射、折射现象,激光辐照到水中产生的力效应、空泡效应,以及水的冷却作用,实现了提高微孔加工质量的目的。采用皮秒脉冲激光分别在无水和有水辅助情况下对不同厚度的304不锈钢板进行打孔试验,验证了背面水辅助激光加工法的可行性。试验结果表明:在相同的加工参数下,相对于无水激光直接加工法,采用背面水辅助法加工得到的微孔锥度降低了2°～6°,再铸层减少,热影响区减小,所加工滤网的变形量减小,微孔的一致性得到提高。最后采用正交试验优化的工艺参数,在60μm厚板材上实现了出口孔径为55μm的具有海量微孔的滤网的加工。     

原子层沉积方法制备低温多层Al2O3/TiO2复合封装薄膜的研究

原子层沉积(ALD)方法可以制备出高质量薄膜,被认为是可应用于柔性有机电致发光器件(OLED)最有发展前景的薄膜封装技术之一。本文采用原子层沉积(ALD)技术,在低温(80℃)下,研究了Al₂O₃及TiO₂薄膜的生长规律,通过钙膜水汽透过率(WVTR)、薄膜接触角测试等手段,研究了不同堆叠结构的多层Al₂O₃/TiO₂复合封装薄膜的水汽阻隔特性,其中5 nm/5 nm×8 dyads(重复堆叠次数)的Al₂O₃/TiO₂叠层结构薄膜的WVTR达到2.1×10^-5 g/m²/day。采用优化后的Al₂O₃/TiO₂叠层结构薄膜对OLED器件进行封装,实验发现封装后的OLED器件在高温高湿条件下展现了较好的寿命特性。     

Low-frequency noise in Si0.7Ge0.3 surface channel pMOSFETs with ALD HfO2/Al2O3 gate dielectrics

Low-frequency noise was characterized in Si_0.7Ge_0.3 surface channel pMOSFETs with ALD Al₂O₃/HfO₂/Al₂O₃ stacks as gate dielectrics. The influences of surface treatment prior to ALD processing and thickness of the Al₂O₃ layer at the channel interface were investigated. The noise was of the 1/f type and could be modeled as a sum of a Hooge mobility fluctuation noise component and a number fluctuation noise component. Mobility fluctuation noise dominated the 1/f noise in strong inversion, but the number fluctuation noise component, mainly originating from traps in HfO₂, also contributed closer to threshold and in weak inversion. The number fluctuation noise component was negligibly small in a device with a 2 nm thick Al₂O₃ layer at the SiGe channel interface, which reduced the average 1/f noise by a factor of two and decreased the device-to-device variations.     

Good High-Temperature Stability of TiN/ Al2O3/WN/TiN Capacitors

For the first time, good thermal stability up to an annealing temperature of 1000degC has been demonstrated for a new TiN/Al₂O₃/WN/TiN capacitor structure. Good electrical performance has been achieved for the proposed layer structure, including a high dielectric constant of ~ 10, low leakage current of 1.2times10^-7 A/cm² at 1 V, and excellent reliability. A thin WN layer was incorporated into the metal-insulator-metal capacitor between the bottom TiN electrode and the Al₂O₃ dielectric suppressing of interfacial-layer formation at Al₂ O₃/TiN interfaces and resulting in a smoother Al₂O₃/TiN interface. This new layer structure is very attractive for deep-trench capacitor applications in DRAM technologies beyond 50 nm.     

Semiconductor lasers with 2-D-photonic crystal mirrors based on awet-oxidized Al2O3-mask

We have fabricated and investigated AlGaAs-InGaAs-based ridge waveguide (RWG) lasers with two-dimensional (2-D) triangular photonic crystal (PC) mirrors using a wet-oxidized Al₂O₃ mask for the dry etching of the PC at one end of the ridge. The laser structure includes a 60-nm-thick AlAs layer positioned in the upper cladding, which is converted into Al₂O₃ after the definition of the PC by electron beam lithography and shallow etching. Etching of the holes is then continued using the Al₂O₃ mask, to a final depth of 600 nm. The continuous-wave characteristics of the lasers show a clear dependence on the period of the PC including a significant decrease of the threshold current and an increase of the efficiency for properly adjusted crystal parameters     

High-performance polycrystalline SiGe thin-film transistors usingAl2O3 gate insulators

The use of aluminum oxide as the gate insulator for low temperature (600°C) polycrystalline SiGe thin-film transistors (TFTs) has been studied. The aluminum oxide was sputtered from a pure aluminum target using a reactive N₂O plasma. The composition of the deposited aluminum oxide was found to be almost stoichiometric (i.e., Al₂O₃), with a very small fraction of nitrogen incorporation. Even without any hydrogen passivation, good TFT performance was measured an devices with 50-nm-thick Al₂O₃ gate dielectric layers. Typically, a field effect mobility of 47 cm²/Vs, a threshold voltage of 3 V, a subthreshold slope of 0.44 V/decade, and an on/off ratio above 3×10⁵ at a drain voltage of 0.1 V can be obtained. These results indicate that the direct interface between the Al₂ O₃ and the SiGe channel layer is sufficiently passivated to make Al₂O₃ a better alternative to grown or deposited SiO₂ for SiGe field effect devices     

基于陶瓷焊接的半导体激光器合束及聚焦研究

为了解决石油输送管道Al₂O₃陶瓷内衬管的连接问题,研制了专用的半导体激光光源用于陶瓷激光焊接。实验研究了陶瓷激光焊接所需要的半导体激光工艺参量及光束要求,采用单管空间合束、偏振合束、波长合束以及菲涅耳聚焦系统输出等方式,研制了光场分布均匀的半导体激光陶瓷焊接系统。结果表明,所设计半导体激光器偏振合束输出功率为384W,合束效率达到96.62%,经波长合束后输出功率可以超过800W,聚焦系统输出光斑均匀度为93.85%。该系统可以成功应用于不同场合的陶瓷焊接生产中,满足2mm厚度Al₂O₃陶瓷激光焊接要求。     

退火处理对锑化铟MIS器件C-V特性的影响

采用原子层沉积技术制备Al2O3薄膜作为InSb材料介电层,制备了MIS器件,研究了金属化后不同退火温度对界面特性的影响.利用C-V测试表征了MIS(metal-insulator-semiconductor)器件的界面特性,结果表明Al2O3介电层引入了表面固定正电荷,200℃和300℃退火处理可有效减小慢界面态密度...     

High-density MIM capacitors using Al2O3 andAlTiOx dielectrics

We have investigated the electrical characteristics of Al₂ O₃ and AlTiO_x MIM capacitors from the IF (100 KHz) to RF (20 GHz) frequency range. Record high capacitance density of 0.5 and 1.0 μF/cm² are obtained for Al₂ O₃ and AlTiO_x MIM capacitors, respectively, and the fabrication process is compatible to existing VLSI backend integration. However, the AlTiO_x MIM capacitor has very large capacitance reduction at increasing frequencies. In contrast, good device integrity has been obtained for the Al₂O₃ MIM capacitor as evidenced from the small frequency dependence, low leakage current, good reliability, small temperature coefficient, and low loss tangent