A D-band frequency doubler MMIC based on a 100-nm metamorphic HEMT technology

A coplanar single-ended frequency doubler based on a 100 nm metamorphic HEMT technology is presented. For an input power of 4.8 dBm, this doubler demonstrates an output power between 2.6 and -0.3 dBm over the bandwidth from 105 to 145 GHz, that is, a 3-dB bandwidth of 32% has been achieved. To the knowledge of the authors, this is the first reported multiplier based on MHEMT technology at D-band or higher frequencies.     

A minaturized broad-band MMIC frequency doubler

A miniaturized broadband balanced MMIC (monolithic microwave integrated circuit) frequency double, composed of a common-gate FET and a common-source FET directly connected to each drain electrode, has been proposed and demonstrated. The doubler is designed and fabricated as a miniaturized function module using a conventional two-gate FET configuration, active trapping, and active impedance matching. The doubler design has been performed through phase error estimation, gate width optimization, and gate-source voltage optimization. The phase error estimation in a nonlinear condition has eliminated phase error compensation circuits. The fabricated chip size is only 0.5 mm×0.5 mm, which is about 1/10 the area of previously reported doublers. A conversion loss of 8-10 dB, a fundamental frequency suppression better than 17 dB, and an input return loss better than 8 dB are obtained in the output frequency range from 6 to 16 GHz. The broadband doubler as a miniaturized MMIC function module can be applicable to small-size oscillator MMICs and multifunction MMICs     

80 GHz MMIC HEMT VCO

In this letter a monolithic voltage-controlled oscillator (VCO) operating in the 77.5-83.5 GHz range is presented. InP HEMTs are used for both the active device and varactor. The VCO demonstrated a tuning range of 6 GHz and an output power better than 12.5 dBm in the entire tuning range     

具有HEMT和MMIC的Ku波段低噪声放大器

本文介绍了由HEMT和MMIC组成的一种新颖的Ku波段低噪声放大器,放大器第一级采用了HEMT和反馈技术以同时获得噪声和增益的最佳化,讨论了这种放大器的设计,MMIC采用了二次混合微波集成,放大嚣输入和输出端均为BJ-120波导。在11.7—12.2GHz频率下,放大器噪声系数小于1.9dB,增益大于27±0.25dB,输入和输出驻波比小于1.4。     

毫米波GaN基HEMT功率MMIC

基于标准的SiC衬底AlGaN/GaN高电子迁移率晶体管(HEMT)工艺研制了毫米波段单片微波集成电路(MMIC)芯片.首先采用插入隔离层的方式得到复合沟道AlxGa1-xN/AlN/AlyGa1-yN/GaN HEMT结构.以EEHEMT模型作为粗糙模型,采用神经空间路线图的方法建立了人工神经网络模型,更好地表征了器件特性,提高了模型在毫米波下的精度.基于器件模型,进行了毫米波MMIC的设计,运用网络综合设计出简洁的电路拓扑和最优的宽带性能.芯片工艺采用0.2 μm介质栅场板结构提高器件的微波性能.研制的2级功率MMIC在27～ 30 GHz频段,工作电压25 V时,输出功率大于2.6W,功率附加效率大于15％,功率增益大于9 dB.     

An ultra-wideband MMIC balanced frequency doubler usingline-unified HEMTs

A very small, ultrawideband, MMIC balanced frequency doubler that uses line-unified HEMT configurations is proposed. A chip size of 1.0 mm×0.9 mm is achieved with a conversion loss of 8-10 dB in the 4-40-GHz output harmonics frequency range and fundamental frequency signal isolation of better than 21 dB above the input fundamental frequency of 7 GHz. Circuit parameters are optimized in a novel and simple prediction using an equation derived from the HEMT's DC characteristic and a linear-state CAD software package. The doubler has promise for realizing miniaturized, wideband MMIC transmitters/receivers     

Design of 20-44 GHz broadband doubler MMIC

This paper presents the design and performance of a broadband millimeter-wave frequency doubler MMIC using active 0.15μm GaAs PHEMT and operating at output frequencies from 20 to 44 GHz.This chip is composed of a single ended-into differential-out active Balun,balanced FETs in push-push configuration,and a distributed amplifier. The MMIC doubler exhibits more than 4 dB conversion gain with 12 dBm of output power,and the fundamental frequency suppression is typically -20 dBc up to 44 GHz.The MMIC works at...     

60-GHz pseudomorphic-MODFET low-noise MMIC amplifiers

The development of V-band low-noise monolithic microwave integrated circuits (MMICs) based on pseudomorphic modulation-doped FETs (P-MODFETs) is presented. These dual-stage MMICs incorporate P-MODFETs, with 0.35-μm×60-μm gates, as the active elements, electron-beam-written tuning elements, and DC-blocking and bias networks. The dual-stage chips exhibited a maximum gain of 10.2 dB at 59.5 GHz and a minimum noise figure of 5.3 dB, with an associated gain of 8.2 dB at 58.2 GHz. A cascaded four-stage amplifier using two MMIC modules exhibited 5.8-dB minimum noise figure with an associated gain of 18.3 dB at 58 GHz and up to 21.1 dB of maximum gain     

DC-110-GHz MMIC traveling-wave switch

This paper presents the broadest band monolithic-microwave integrated-circuit traveling-wave switch ever reported for millimeter-wave applications. The developed switch with the novel structure of a 400-μm-gate finger field-effect transistor (FET) indicated an insertion loss of less than 2.55 dB and an isolation of better than 22.2 dB from dc to 110 GHz. Also, the switch indicated no degradation of insertion loss and an ON/OFF ratio of more than 22.7 dB up to an input power of 26.5 dBm at 40 GHz. Circuit analytical results based on a lossy transmission-line model for small-signal performance and circuit simulation results using the two-terminal nonlinear FET model for large-signal operation successfully showed good agreement with the experimental results     

Wideband HEMT MMIC low-noise amplifier with temperaturecompensation

A wideband low-noise pseudomorphic HEMT MMIC variable-gain amplifier has been designed and fabricated. The amplifier has a nominal gain of 13 dB across the band 2-20 GHz, with gain flatness better than ±0.4 dB. The noise figure is less than 3 dB across the band 6-16 GHz. An on-chip temperature-sensing diode is used to provide a linear temperature correction which has been used to reduce the gain variation of the amplifier by a factor of 2 across the temperature range -50°C to +95°C     

Design of 20-44 GHz broadband doubler MMIC

This paper presents the design and performance of a broadband millimeter-wave frequency doubler MMIC using active 0.15 μm GaAs PHEMT and operating at output frequencies from 20 to 44 GHz. This chip is composed of a single ended-into differential-out active Balun, balanced FETs in push-push configuration, and a distributed amplifier. The MMIC doubler exhibits more than 4 dB conversion gain with 12 dBm of output power, and the fundamental frequency suppression is typically -20 dBc up to 44 GHz. The MMIC works at VDD = 3.5 V, VSS = -3.5 V, Id = 200 mA and the chip size is 1.5 ×1.8 mm2.     

100-GHz high-gain InP MMIC cascode amplifier

A high-gain InP monolithic millimeter-wave integrated circuit (MMIC) cascode amplifier has been developed which has 8.0 dB of average gain from 75 to 100 GHz when biased for maximum bandwidth, and more than 12 dB of gain at 80 GHz at the maximum-gain bias point, representing the highest gains reported to date, obtained from MMICs at W band (75-100 GHz). Lattice-matched InGaAs-InAlAs high-electron-mobility-transistors (HEMTs) with 0.1-μm gates were the active devices. A coplanar waveguide (CPW) was the transmission medium for this MMIC with an overall chip dimension of 600×500 μm     

Noise parameters for design of MMIC HEMT LNA

The letter gives the noise parameters of MOVPE HEMTs or the design of MMIC HEMT low-noise amplifiers. An example of the design of an HEMT LNA is given using these parameters. The MMIC LNA has been fabricated and exhibits a 2.3+or-0.2 dB noise figure with an associated gain of 12+or-2 dB in the 12-16 GHz frequency range. The measured performance is within 0.5 dB of the simulation.<>     

多阳极220GHz倍频器单片设计

介绍了一款基于GaAs肖特基二极管单片工艺的220 GHz倍频器的设计过程以及测试结果。为提高输出功率,倍频器采用多阳极结构,8个二极管在波导呈镜像对称排列,形成平衡式倍频器结构。采用差异式结电容设计解决了多阳极结构端口散射参数不一致问题,提高了倍频器的转换效率和工作带宽。对设计的倍频器进行流片、装配和测试,测试结果显示：倍频器在204～234 GHz频率范围内,转化效率大于15%;226 GHz峰值频率下实现最大输出功率为90.5 mW,转换效率为22.6%。设计的220 GHz倍频器输出功率高,转化效率高,工作带宽大。     

Pseudomorphic HEMT manufacturing technology for multifunctionalKa-band MMIC applications

We have demonstrated very good performance, high yield Ka-band multifunctional MMIC results using our recently developed 0.25-μm gate length pseudomorphic HEMT (PHEMT) manufacturing technology. Four types of MMIC transceiver components-low noise amplifiers, power amplifiers, mixers, and voltage controlled oscillators-were processed on the same PHEMT wafer, and all were fabricated using a common gate recess process. High performance and high producibility for all four MMIC components was achieved through the optimization of the device epitaxial structure, a process with wide margins for critical process steps and circuit designs that allow for anticipated process variations, resulting in significant performance margins. We obtained excellent results for the Ka-band power amplifier: greater than 26 dBm output power at center frequency with 4.0% standard deviation over the 3-in. wafer, 2-GHz bandwidth, greater than 20 pet-cent power-added efficiency, over 8 dB associated gain, and over 10 dB linear gain. The best performance for the Ka-band LNA was over 17 dB gain and 3.5 dB noise figure at Ka-band. In this paper, we report our device, process, and circuit approach to achieve the state-of-the-art performance and producibility of our MMIC chips     

A 30-GHz 1-W power HEMT

Millimeter-wave power high electron mobility transistors (HEMT's) employing a multiple-channel structure have been fabricated and evaluated in the R-band frequency range. An output power of 1.0 W (a saturated output power of 1.2 W) with 3.1-dB gain and 15.6-percent efficiency was achieved at 30 GHz with a 0.5-µm gate-length and 2.4-mm gate-periphery device. At 35 GHz, a 2.4-mm device delivered 0.8 W with 2.0-dB gain and 10.7-percent efficiency. These are the highest output power figures reported to date for single-chip power FET's in the 30-GHz frequency range.     

32-GHz cryogenically cooled HEMT low-noise amplifiers

The cryogenic noise temperature performances of a two-stage and a three-stage 32-GHz HEMT (high-electron-mobility transistor) amplifier were evaluated. The amplifiers utilize quarter-micrometer conventional AlGaAs/GaAs HEMT devices, hybrid matching input and output microstrip circuits, and a cryogenically stable DC biasing network. The noise temperature measurements were performed in the frequency range of 31 to 33 GHz over a physical temperature range of 300 to 12 K. Across the measurement band, the amplifiers displayed a broadband response, and the noise temperature was observed to decrease by a factor of ten in cooling from 300 to 15 K. The lowest noise temperature measured for the two-stage amplifier at 32 GHz was 35 K with an associated gain of 16.5 dB, while for the three-stage amplifier it was 39 K with an associated gain of 26 dB. It was further observed that both amplifiers were insensitive to light     

一种基于MMIC技术的宽带左手非线性传输线二次倍频器

本文首次报道了基于MMIC技术的左手非线性传输线宽带二次倍频器。理论上分析了左手非线性传输线的二次谐波产生原理。在GaAs半绝缘衬底上制作了4节左手非线性传输线,面积为5.4mm*0.8mm。当输入信号为20dBm时,该倍频器在26.4GHz处获得最大二次谐波输出功率为6.33dBm,对应的-6dB带宽为24GHz~43GHz。实验结果与仿真结果吻合良好。以低频放大器作为激励,该倍频器可用于低成本,有效的毫米波甚至THz信号源系统。     

A broadband PHEMT MMIC distributed doubler using high-pass drain line topology

A broadband frequency doubler, based on distributed amplifier techniques, has been designed to operate from 11 to 21 GHz. In order to reject the fundamental signal over a broadband frequency range, the conventional low-pass drain line structure was replaced with the high-pass structure. This topology can suppress fundamental signals over broadband without any balanced structure so that the chip size can be more compact. Measured conversion losses of better than 10 dB from 11 to 21 GHz input frequencies are achieved with fundamental signal rejection better than 12 dB. To the best of our knowledge, this is the first demonstration of distributed doubler using the high-pass drain line topology.