共查询到19条相似文献,搜索用时 78 毫秒
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美国AD公司的单片加速度传感器集成电路ADXL05,可通过调整外接电阻、电容来设置传感器的满量程范围及频率响应特性,特别适合于要求传感器小、巧、廉的应用场合,本文对其特点及应用作了详细的介绍。 相似文献
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加速度传感器QMA5981产品具有小尺寸、低功耗、高精度的优异特点,并内置智能体感算法,更适用于智能可穿戴领域。矽睿科技和华虹宏力共同创导的中国创造与中国制造逐渐显现其技术和资本优势,满足客户对于低成本和高性能MEMS传感器日益增长的需求。 相似文献
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采用开关电容技术的Boxcar积分原理设计的,为测量电容式压力传感器微电容的接口电路已提出,它由Boxcar积分器,锁存器,脉冲宽度调制器和控制信号电路组成。 这个接口电路,采用3μmP-阱CMOS双层多晶硅栅工艺研制,管芯面积为2.5×3.5mm~2。测试结果表明,接口电路具有较好的灵敏度,它完全适用于与硅集成电容式压力传感器集成在同一芯片上。 相似文献
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介绍了一种具有高精度的差动式电容传感顺的信号处理电路,该电路是基于张弛振荡器的,由积分器、微分器和比较器组成,最后对该接口电路的性能进行了分析。 相似文献
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以检测线圈作为磁导航智能车的赛道检测传感器,估算出检测线圈输出的感应电动势约为毫伏级,而智能车控制电路要求的信号是0-5 V的直流电压.以此为出发点,以宽带集成放大器MAX4451为核心,设计了可在单电源条件下工作、具有放大和正半周包络检波功能的信号调理电路,通过降低电路的直流偏置电压增大电路的输出摆幅.对于多个竖直放置的检测线圈及信号调理电路.通过比较输出电压的相对最大值作为判断赛道位置的依据,而不受赛道激磁频率、激磁电流变化的影响. 相似文献
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Abelson L.A. Kerber G.L. 《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》2004,92(10):1517-1533
Today's superconductor integrated circuit processes are capable of fabricating large digital logic chips with more than 10 K gates/cm/sup 2/. Recent advances in process technology have come from a variety of industrial foundries and university research efforts. These advances in processing have reduced critical current spreads and increased circuit speed, density, and yield. On-chip clock speeds of 60 GHz for complex digital logic and 750 GHz for a static divider (toggle flip-flop) have been demonstrated. Large digital logic circuits, with Josephson junction counts greater than 60 k, have also been fabricated using advanced foundry processes. Circuit yield is limited by defect density, not by parameter spreads. The present level of integration is limited largely by wiring and interconnect density and not by junction density. The addition of more wiring layers is key to the future development of this technology. We describe the process technologies and fabrication methodologies for digital superconductor integrated circuits and discuss the key developments required for the next generation of 100-GHz logic circuits. 相似文献
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Rao S. Strojwas A.J. Lehoczky J.P. Schervish M.J. 《Semiconductor Manufacturing, IEEE Transactions on》1996,9(4):495-505
This paper presents a process monitoring system, which is designed to be used for monitoring VLSIC and other multistage manufacturing processes. The proposed process monitor can 1) simultaneously detect a variety of out-of-control conditions, 2) quantify the magnitude of process change, and 3) be used to compute the probability of meeting specifications. Average run length simulations show that for a single-stage process, the monitor is at least as good as the Shewhart-CUSUM charts for detecting changes in the distribution of the monitored characteristics. For a multistage process, however, the Bayesian monitor can significantly reduce the detection time by using in-line correlation information from earlier stages. The monitor has been applied to data from a state-of-the-art fabrication facility, and the results are promising 相似文献
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The authors describe the Berkeley intelligent processing system (BIPS), part of an effort to integrate expert system technology into IC manufacturing. The current effort of BIPS is to automate the furnace and low-pressure chemical vapor deposition (LPCVD) processing fully. Four different modules that compose BIPS (the process recipe generation module, the editor, compiler, and translator module, the monitor and diagnostic module, and the communication module) have been developed, and the results obtained using each module are discussed. Process results predicted by BIPS are in reasonable agreement with experimental results 相似文献
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为使CCD相机系统能够捕获到高信噪比的图像,介绍了一种视频处理器TDA9965的应用电路设计,简述了其内部组成框图及工作原理。利用某型号TDI CCD作为系统传感器,成功实现了对CCD输出模拟视频信号的量化处理,能够使相机系统完成实时采集图像等任务。同时分析了视频处理器电路设计对相机系统图像信噪比的影响,以电源噪声为干扰源,具体计算了在电路设计不合理和改进设计后两种情况下,CCD相机图像信噪比的变化,并通过试验测试验证,合理的电路设计可以使图像的信噪比提高20 dB以上,从而说明了视频处理电路合理设计的重要性,为高速高信噪比CCD相机的研制提供了技术基础。 相似文献