Ce掺杂Ba0.6Sr0.4TiO3薄膜表面结构XPS研究

用改进的溶胶-凝胶法制备铈(Ce)掺杂和非掺杂2种钛酸铝钡(Ba_(0.6)Sr_(0.4)TiO_3,BST)薄膜,用X射线光电子能谱(XPS)研究薄膜的表面结构.XPS结果表明,BST薄膜的表面结构由钙钛矿结构和非钙钛矿结构组成,铈掺杂显著地减少了非钙钛矿结构.扫描电镜及原子力显微镜观察表明,掺杂BST薄膜光滑致密无裂纹.电压-电容曲线表明,掺杂BST薄膜的介电性能大幅度提高,在40V外加电压下介电调谐率达60.8%,零偏压下的介电损耗为0.0265.同时,就非钙钛矿结构的成因及Ce掺杂BST薄膜的有关改善机制进行了讨论.     

Y掺杂BST薄膜介电性能研究

用改进溶胶-凝胶法在Pt/Ti/SiO_2/Si上制备了钇(Y)掺杂Ba_0.6Sr_0.4TiO_3 (BST)薄膜,研究了Y掺杂对BST薄膜表面结构和介电性能的影响.XPS结果表明,Y掺杂有利于薄膜钙钛矿结构的形成,但对氧空位没有明显的抑制作用.SEM和AFM结果表明,Y掺杂能缓解薄膜应力、减少薄膜裂纹、细化晶粒,进而改善薄膜的表面结构.在进行Y掺杂后,薄膜的介电性能得到明显提高,40 V外加电压下的介电调谐率大于40%及零偏压下介电损耗为0.0210,优化因子大于20.     

退火温度对Ba_(0.6)Sr_(0.4)TiO_3薄膜晶化及介电性能的影响

用改善的溶胶凝胶(Sol-Gel)法制备了钛酸锶钡(Ba_0.6Sr_0.4TiO_3, BST)薄膜,研究了退火温度对薄膜晶化及介电性能的影响.X射线衍射表明,由于薄膜较薄,各温度下衍射峰强度均微弱,但呈(110)择优取向,随温度的升高峰强度逐渐增加,也出现其他晶向的衍射峰.扫描电镜和原子力显微镜表明,改善的BST薄膜表面形貌光滑致密、无裂纹、无缩孔,随温度的升高薄膜晶化增强、晶粒逐渐长大、粗糙度增加.40 V外加电压下的介电性能大幅度提高,介电调谐率大于30%,介电损耗约0.02,其中,650 ℃对应介电调谐率45.1%和介电损耗0.0187.同时,就有关结构、介电性能及退火温度的关系进行了讨论.     

铈钇共掺钛酸锶钡薄膜的结构及介电性能

用改进的溶胶-凝胶法(sol-gel)制备了铈(Ce)钇(Y)共掺Ba0.6Sr0.4TiO3(BST)薄膜,研究了薄膜的结构和介电性能。扫描电镜(SEM)显示,共掺使薄膜致密、缩孔减少、晶粒大小均匀,随着共掺浓度的增加薄膜表面更平整光滑。原子力显微镜(AFM)表明,共掺薄膜表面致密、晶粒呈球状生长、晶界更明显,随共掺浓度的增加晶粒变小、表面粗糙度减小。V-C曲线表明,相对于铈或钇掺杂,共掺使薄膜的综合介电性能提高,2%Ce和2%Y共掺BST薄膜显示最佳的综合介电性能:零偏压下的电容为7.6×10-11F、介电损耗为0.0126,40V偏压下调谐率为41%,优质因子为32.5,可满足微波调谐器件的需要。     

薄膜厚度对Y掺杂Ba0.6Sr0.4TiO3薄膜结构及介电性能的影响

采用溶胶-凝胶法(Sol-gel)在Si/SiO2/Ti/Pt基片上制备了不同厚度(正比于薄膜层数)的钇(Y)掺杂Ba0.6Sr0.4TiO3(BST)薄膜,研究了膜厚度对薄膜结构和介电性能的影响。原子力显微镜(AFM)表明,Y掺杂BST薄膜可显著改善表面形貌,且强烈依赖于薄膜厚度。当薄膜厚度适中(即当层数为8)时,表面晶粒细小、致密、均匀,晶界分明。X射线衍射(XRD)表明,Y掺杂BST薄膜显示钙钛矿结构,主要沿(110)晶面生长。随着薄膜厚度的增加,BST(110)峰的衍射强度先增后减,表明薄膜的相结构与薄膜厚度直接相关。Y掺杂BST薄膜显示优异的综合介电性能,且随着膜厚的增加,电容或介电常数减小。8层薄膜的综合介电性能最优,零偏压时的电容为17.8pF(介电常数130)、介电损耗为0.0057,调谐率为32%,优值因子为56,可满足微波调谐器件的需要。同时,就有关机理进行了分析。     

掺杂浓度对钾镁交替掺杂BST薄膜介电性能的影响

用溶胶-凝胶法(sol-gel)制备掺杂浓度(1~15)mol%的钾和镁交替掺杂钛酸锶钡(BST)薄膜,研究掺杂浓度对薄膜结构和介电性能的影响。X射线衍射(XRD)表明,薄膜为钙钛矿结构。扫描电镜(SEM)显示,薄膜致密、晶粒大小均匀、低浓度下薄膜表面更平整光滑。随着浓度的增加,晶化逐渐减弱,平均晶粒大小和介电损耗呈减小趋势。交替掺杂结合了钾掺杂高调谐率和镁掺杂低介电损耗的优点,明显提高了优质因子。5 mol%对应最佳综合介电性能,在–20~20V范围内,介电损耗小于1.63%,调谐率为40.9%,可满足微波调谐需要。同时,就有关机理进行了讨论。     

Y掺杂(Ba0.6Sr0.4)0.8TiO3薄膜的结构及介电性能

通过钇(Y)掺杂、适当增加钛(Ti)含量和调节薄膜厚度等优化设计,用改善的溶胶-凝胶(Sol-Gel)法制备了光滑致密的Y掺杂多层钛酸锶钡(Ba0.6Sr0.4)0.8TiO3,BST)薄膜,研究了该薄膜的结构及介电性能。X射线衍射(XRD)表明,该薄膜为钙钛矿结构,但其衍射峰强度很弱,主要与Y掺杂和微过量Ti有效减弱其铁电性有关。原子力显微镜(AFM)表明,该薄膜晶化较弱,且随厚度的增加晶化减弱,和XRD结果一致。该薄膜比Y掺杂的Ba0.6Sr0.4TiO3薄膜显示更优异的综合介电性能,但与薄膜的厚度有关。随膜厚的增加,薄膜的电容和调谐率减小,但介电损耗大幅减小,其中,4层薄膜零偏压的介电常数为161、电损耗约为0.006,40V的调谐率为45.5%、优质因子大于75,可满足微波调谐器件的需要。     

优异Y-BST薄膜的设计、制备及介电性能

就(Ba+Sr)/Ti的原子摩尔比例、掺杂浓度、薄膜厚度等优化设计钇掺杂Ba0.6Sr0.4TiO3(Y-BST)薄膜,用改进的溶胶-凝胶(sol-gel)法在Pt/Ti/SiO2/Si基片上制备Y-BST薄膜,研究该薄膜的结构及介电性能。X射线衍射(XRD)表明,薄膜均为立方钙钛矿多晶结构,主要沿(110)晶面生长。随(Ba+Sr)/Ti比值的增加,BST薄膜衍射峰强度增加,晶化增强;Y-BST薄膜随掺杂浓度(>1%摩尔比)的增加,衍射强度减弱,晶化减弱,但随薄膜层数的增加,衍射强度增强,晶化增强。40V和100kHz的电压-电容测试表明,(Ba+Sr)/Ti比值为0.9及掺杂浓度为2%摩尔比的8层Y-BST薄膜具有最优综合介电性能:零偏压下的电容为18pF(介电常数137)、介电损耗小于1%,40V偏压下调谐率约为46%,优质因子约为77,能满足微波调谐需要。同时,就有关机理进行了分析。     

Mg掺杂Pb0.3Sr0.7(Ti1-xMgxO)3-x陶瓷薄膜的制备及介电性能研究

利用固相烧结法制备的Mg掺杂Pb0.3Sr0.7(Ti1-xMgx)O3-x(PST)陶瓷为靶材,采用射频磁控溅射法在ITO玻璃基板上成功制备了Mg掺杂PST薄膜.用X射线衍射仪、扫描电子显微镜和阻抗分析仪分别测定PST薄膜的物相结构、表面形貌及介电性能.结果显示,薄膜具有良好的钙钛矿结构,无明显的择优取向生成,薄膜表面均匀致密.Mg的掺杂改善了PST薄膜电容值的频率特性,使其更加稳定.薄膜电容值随着掺杂含量的增加而降低,在Mg掺杂量x=0.05左右时达到相对最低值,随后略有升高,介电损耗也有类似现象.薄膜可调性受Mg掺杂量的增加而不断下降,总体下降约3倍,但介电损耗总体下降约达5倍.材料的优值在Mg掺杂量x=0.05时反而有所升高.     

柠檬酸络合铈掺杂BST纳米粉体的制备及介电性能

以柠檬酸为络合剂、乙二醇为交联剂、无水乙醇替代去离子水作为助溶剂,通过柠檬酸对有关金属离子的络合作用以及柠檬酸盐与乙二醇的酯化聚合作用,避免了常规柠檬酸法制备铈掺杂BST溶胶因水解而出现沉淀的现象,制备了稳定的铈掺杂BST溶胶及凝胶,经850℃煅烧后得到掺杂浓度为0%~5%、平均晶粒尺寸约为100 nm的高质量粉体。低浓度铈掺杂可获得均匀细小的晶粒,降低损耗,掺杂浓度为2 mol%对应0.003的介电损耗。与纯粉体相比,掺杂粉体的结构及形貌明显改善,综合介电性能显著提高,尤其介电损耗大幅降低,可满足铁电存储器、红外探测器、微波器件等应用需要。     

铈掺杂对钴草酸盐结构和形貌的影响

用化学方法使体均匀掺入草酸钴中。测量了试样的FSSS粒度。用X－ray衍射仪、SEM等分析了样品的结构和形貌。结果表明：铈掺杂使草酸钴的粒度增加；流动性变好；较大的Ce掺杂量使钴草酸盐的结构由α－晶型转变为β－晶型。     

Electrical breakdown characteristic of a Ce-doped W-Cu contact material

W-Cu composite powder doped with Ce (1.5 wt.%) was prepared by mechanical alloying (MA), and the W-Cu contact material was fabri-cated by hot pressing sintering in an electrical vacuum furnace. The microstructure, electric conductivity, hardness, and breakdown voltage of the Ce-doped W-Cu alloy were measured and compared with a conventional W-Cu alloy prepared by powder metallurgy. The results show that microstructural refinement and uniformity can improve the breakdown behavior and the electric arc stability of the Ce-doped W-Cu contact material. Also, the Ce-doped W-Cu contact material shows the characteristic of spreading electric arc, which is beneficial to electric arc erosion.     

Tunable characteristics of (Ba0.5Sr0.5) TiO3 (BST) capacitors using (Ba0.5Sr0.5) RuO3 (BSR) interfacial layers onto Pt/Ti/SiO2/Si substrates

The conducting oxide electrodes (Ba, Sr) RuO₃ (BSR) similar in structure and chemical composition to (Ba, Sr) TiO₃ (BST) were deposited by metalorganic chemical vapor deposition (MOCVD) onto Pt/Ti/SiO₂/Si substrates to improve the structural and dielectric properties of BST films. The BSR interfacial layers between the BST and Pt bottom electrode influenced the preferred orientation, surface morphologies, and dielectric properties of BST films. The structural and dielectric properties of BST films depended on the thickness of the BSR layers. BST films with (100) texturing up to 150 Å thickness of BSR showed a smoother and smaller grain size than those without interfacial layers, and a tunability and dielectric constant of about 70% and 1300 at an interfacial layer of 150 Å, respectively. On the other hand, BST films with above 300 Å thickness in BSR layers showed a (110) texturing similar to those without BSR layers and a slight decrease of tunability and dielectric constant compared with those of (100) texturing BST films. The increase of the dielectric loss of BST films with BSR layers was attributed to the carbon contamination diffused from MOCVD-BSR layers.     

Effects of growth temperature on structure and electrical properties of dielectric (Ba,Sr)TiO3 capacitors with transparent conducting oxide electrodes

200 nm-thick BST thin films were grown on Zr-doped In₂O₃/SrTiO₃ (1 0 0) substrates at 550-750 °C. X-ray diffraction results show that the as-deposited BST films were polycrystalline with random crystallographic orientations. X-ray diffraction patterns reveal that the BST film grown at 650 °C had the best crystalline quality of all the deposition temperatures. Atomic force microscopy and secondary ion mass spectrometry showed that the surface and interface structures of the BST films became rough as the growth temperature increased. The BST film grown at 650 °C showed the best electrical properties, with a dielectric constant of 420 at 1 MHz, dielectric tunability of 32.1%, dielectric loss of 0.015 at 300 kV/cm, and a mean optical transmittance in visible wavelength of 71.3%.     

中频反应磁控溅射制备Al2O3:CeCl3薄膜及其光致发光特性

应用中频反应磁控溅射技术制备了Al2O3:CeCl3的非晶薄膜.Ce3+含量和薄膜的化学成分通过X射线散射能谱(EDS)测量.薄膜试样的晶体结构用x射线衍射分析.俄歇电子谱用于对薄膜材料的化学组分进行定性分析.薄膜的光致发光峰是在370 nm到405 nm范围内,它们来自于Ce3+离子的5d1激发态向基态4f1的两个劈裂能级的跃迁.发光强度强烈地依赖于薄膜中的掺杂浓度和沉积时的基片温度.薄膜发光来自于氯化铈分子中的发光中心,而不是其他的掺杂Ce3+离子.随铈含量增加,光致发光峰向低能方向移动,可能与薄膜中存在氯元素有关.     

High tunability of pulsed laser deposited Ba0.7Sr0.3TiO3 thin films on perovskite oxide electrode

Ferroelectric thin films such as BST, PZT and PLZT are extensively being studied for the fabrication of DRAMS since they have high dielectric constant. The large and reversible remnant polarization of these materials makes it attractive for nonvolatile ferroelectric RAM application. In this paper we report the characterization of Ba_0.7Sr_0.3TiO₃ (BST) thin films grown by pulsed laser ablation on oxide electrodes. The structural and electrical properties of the fabricated devices were studied. Growth of crystalline BST films was observed on La_0.5Sr_0.5CoO₃ (LSCO) thin film electrodes at relatively low substrate temperature compared to BST grown on PtSi substrates. Electrical characterization was carried out by fabricating PtSi/LSCO/BST/LSCO heterostructures. The leakage current of the heterostructure is studied and a band structure is modeled based on the transport properties of the heterostructure. The dielectric constant of the BST film is found to be 630 at 100 kHz with a loss tangent of 0.04. The capacitance voltage characteristics show high tunability for BST thin films.     

退火温度对Al(Ce)诱导Si薄膜晶化过程的影响研究

基于铝诱导晶化方法,通过直流磁控溅射离子镀技术利用纯Al、纯Si和Al(Ce)靶材,制备了Al-Si和Al(Ce)-Si薄膜.采用真空退火炉和X射线衍射仪在不同温度下,对样品进行了退火实验并分析了Al-Si和Al(Ce)-Si薄膜的晶化和生长过程;结合Si薄膜的生长机理,研究了Al和稀土Ce在对Si薄膜退火晶化过程中的...