Distortion in RF CMOS short-channel low-noise amplifiers

An approach to estimate the distortion in CMOS short-channel (e.g. 0.18-/spl mu/m gate length) RF low-noise amplifiers (LNAs), based on Volterra's series, is presented. Compact and accurate frequency-dependent closed-form expressions describing the effects of the different transistor parameters on harmonic distortion are derived. For the first time, the second-order distortion (HD2), in CMOS short-channel based LNAs, is studied. This is crucial for systems such as homodyne receivers. Equations describing third-order intermodulation distortion in RF LNAs are reported. The analytical analysis is verified through simulations and measured results of an 0.18-/spl mu/m CMOS 5.8-GHz folded-cascode LNA prototype chip geared toward sub-1-V operation. It is shown that the distortion is independent of the gate-source capacitance C/sub gs/ of the MOS transistors, allowing an extra degree of freedom in the design of LNA circuits. Distortion-aware design guidelines for RF CMOS LNAs are provided throughout the paper.     

High-performance NMOS operational amplifier

A high performance operational amplifier 300 mil/SUP 2/ in area has been designed and fabricated in a standard n-channel silicon-gate enhancement/depletion MOS process. Specifications achieved include open-loop gain, 1000; power consumption, 10 mW; common-mode range within 1.5 V of either supply rail; unity-gain bandwidth, 3.0 MHz with 80/spl deg/ phase margin; RMS input noise (2.5 Hz-46 kHz), 25 /spl mu/V; C-message weighted noise -5 dBrnC; and 0.1-percent settling time, 2.5 /spl mu/s.     

A 0.7-V MOSFET-only switched-opamp /spl Sigma//spl Delta/ modulator in standard digital CMOS technology

A 0.7-V MOSFET-only /spl Sigma//spl Delta/ modulator for voice band applications is presented. The second-order modulator is realized using a switched-opamp technique. All capacitors are realized using compensated MOS devices operated in the depletion region. A combination of parallel and series compensated depletion-mode MOSCAPs is used to obtain high area efficiency. The circuit is fabricated in a 0.18-/spl mu/m CMOS process. The only components used are standard n-MOS and p-MOS transistors with threshold voltages of approximately 400 mV. All transistors are operated within the supply voltage window of 0.7 V; voltage boosting techniques are not used. The active area is 0.082 mm/sup 2/. The modulator achieves 67-dB signal-to-noise-and-distortion ratio, 70-dB signal-to-noise ratio, and 75-dB dynamic range at 8-kHz signal bandwidth and consumes 80 /spl mu/W of power.     

A true-1-V 300-/spl mu/W CMOS-subthreshold log-domain hearing-aid-on-chip

This paper presents a true very low-voltage low-power complete analog hearing-aid system-on-chip as a demonstrator of novel analog CMOS circuit techniques based on log companding processing and using MOS transistors operating in subthreshold. Low-voltage circuit implementations are given for all of the required functions including amplification and automatic gain control filtering, generation, and pulse-duration modulation. Based on these blocks, a single 1-V 300-/spl mu/A application specific integrated circuit integrating a complete hearing aid in a standard 1.2-/spl mu/m CMOS technology is presented along with exhaustive experimental data. To the authors' knowledge, the presented system is the only CMOS hearing aid with true internal operation at the battery supply voltage and with one of the lowest current consumptions reported in literature. The resulting low-voltage CMOS circuit techniques may also be applied to the design of A/D converters for digital hearing aids.     

A fully implanted NMOS, CMOS, bipolar technology for VLSI of analog-digital systems

A fully ion-implanted process allows high-density integration of NMOS, CMOS, and bipolar transistors for VLSI of analog-digital systems. Supply voltage can be 20 V. Thresholds are /spl plusmn/1.5 V for p- and n-channel enhancement transistors, respectively. Standard deviation per wafer is 15 mV for the NMOS threshold, while the NMOS gain constant is 30 /spl mu/AV/SUP -2/. The bipolar transistors have a low-resistance base contact. Current gain can be set independently. For current gain=90, the Early voltage if V/SUB A/=110 V. No epi layer, isolation diffusions, or channel stoppers are required. The mask count is 6 for structure definition plus 2 for the masking of implants. The process can be scaled along the learning curve of digital MOS VLSI.     

A compact tunable CMOS transconductor with high linearity

A novel CMOS linear transconductor is presented. The use of simple and accurate voltage buffers to drive two MOS transistors operating in the triode region leads to a highly linear voltage-to-current conversion. Transconductance gain can be continuously and precisely adjusted using dc level shifters. Measurement results of a balanced transconductor fabricated in a 0.5-/spl mu/m CMOS technology show a total harmonic distortion of -54 dB at 100 kHz for an 80-/spl mu/A peak-to-peak output, using a supply voltage of 2 V. It requires 0.07-mm/sup 2/ of silicon (Si) area and features 0.96 mW of static power consumption.     

A technique to improve the drive current of high-voltage I/O transistors in digital CMOS technologies

By combining a 0.12-/spl mu/m-long 1.2-V thin-oxide transistor with a 0.22-/spl mu/m-long 3.3-V thick-oxide transistor in a 0.13-/spl mu/m CMOS process, a composite MOS transistor structure with a drawn gate length of 0.34 /spl mu/m is realized. Measurements show that at V/sub GS/=1.2 V and V/sub DS/=3.3 V, the composite transistor has more than two times the drain current of the minimum channel length (0.34 /spl mu/m) 3.3-V thick-oxide transistor, while having the same breakdown voltage (V/sub BK/) as the thick-oxide transistor. Exploiting these, it should be possible to implement 3.3-V I/O transistors with better combination of drive current, threshold voltage (V/sub T/) and breakdown voltage in conventional CMOS technologies without adding any process modifications.     

A matrix amplifier in 0.18-/spl mu/m SOI CMOS

A fully integrated matrix amplifier with two rows and four columns (2-by-4) fabricated in a three-layer metal 0.18-/spl mu/m silicon-on-insulator (SOI) CMOS process is presented. It exhibits an average pass-band gain of 15 dB and a unity-gain bandwidth of 12.5 GHz. The input and output ports are matched to 50 /spl Omega/ using m-derived half sections; the measured S/sub 11/ and S/sub 22/ values exceed -7 and -12 dB, respectively. Integrated in 2.0/spl times/2.9mm/sup 2/, it dissipates 233.4 mW total from 2.4- and 1.8-V power supplies.     

A 0.5-8.5 GHz fully differential CMOS distributed amplifier

A fully integrated fully differential distributed amplifier with 5.5 dB pass-band gain and 8.5 GHz unity-gain bandwidth is described. The fully differential CMOS circuit topology yields wider bandwidth than its single-ended counterpart, by eliminating the source degeneration effects of parasitic interconnect, bond wire, and package inductors. A simulated annealing CAD tool underpins the parasitic-aware methodology used to optimize the design including all on-chip active and passive device and off-chip package parasitics. Mixed-mode S-parameter measurement techniques used for fully differential circuit testing are reviewed. Integrated in 1.3/spl times/2.2 mm/sup 2/ in a standard 0.6 /spl mu/m CMOS process, the distributed amplifier dissipates 216 mW from a single 3 V supply.     

The Formation of Shallow Low-Resistance Source-Drain Regions for VLSI CMOS Technologies

As a result of MOS device scaling, very shallow source-drain structures are needed to minimize short-channel effects in 1-/spl mu/m transistors. This can be readily achieved with highly doped arsenic regions for NMOS devices but is more difficult using boron for PMOS devices. In addition, shallow junctions suffer from inherently high sheet resistances due to dopant solid solubility limitations. This paper proposes an improved CMOS source-drain technology to overcome both these problems. The technique employs amorphizing silicon implants prior to dopant implantation to eliminate ion channeling and platinum silicidation to substantially reduce sheet resistance. Counterdoping of the p/sup +/ regions by high-concentration arsenic implantation is used to enable both NMOS and PMOS devices to be manufactured with only one photolithographic masking operation. Using this technique, n/sup +/ and p/sup +/ junction depths are 0.22 /spl mu/ and of 8 /spl Omega/sq. sheet resistance. By creating oxide sidewalls on gate conductors, polysilicon can be silicided simultaneously with diffusions. Results of extensive materials analysis are discussed in detail. The technique has been incorporated into a VLSI CMOS process schedule at our laboratories.     

An Advanced Bipolar-MOS-I/sub 2/L Technology with a Thin Epitaxial Layer for Analog-Digital VLSI

A novel Bi-MOS technology, Advanced Bipolar CMOS (ABC), is proposed. Bipolar transistors (n-p-n, p-n-p, I/sup 2/L)and MOS transistors (both n- and p-channel) have been successfully fabricated on the same chip with no decrease in performance by using a 3-/spl mu/m design rule. Thin epitaxial layer (<= 2 /spl mu/m) is used in order to obtain small-size high-performance (3-GHz) bipolar devices. Device size is reduced by using a shallow junction and self-aligning technique. n-channel MOS transistors are formed in p-well regions designed to reach p-type substrate, and p-channel MOS transistors are formed in epitaxial layer with an n/sup +/ buried layer. This technology has the potential for monolithic multifunctional analog-digital VLSI.     

Design of a low-power 3.5-GHz broad-band CMOS transimpedance amplifier for optical transceivers

This paper describes a novel low-power low-noise CMOS voltage-current feedback transimpedance amplifier design using a low-cost Agilent 0.5-/spl mu/m 3M1P CMOS process technology. Theoretical foundations for this transimpedance amplifier by way of gain, bandwidth and noise analysis are developed. The bandwidth of the amplifier was extended using the inductive peaking technique, and, simulation results indicated a -3-dB bandwidth of 3.5 GHz with a transimpedance gain of /spl ap/60 dBohms. The dynamic range of the amplifier was wide enough to enable an output peak-to-peak voltage swing of around 400 mV for a test input current swing of 100 /spl mu/A. The output noise voltage spectral density was 12 nV//spl radic/Hz (with a peak of /spl ap/25 nV//spl radic/Hz), while the input-referred noise current spectral density was below 20 pA//spl radic/Hz within the amplifier frequency band. The amplifier consumes only around 5 mA from a 3.3-V power supply. A test chip implementing the transimpedance amplifier was also fabricated using the low-cost CMOS process.     

Microwave CMOS traveling wave amplifiers: performance and temperature effects

A monolithically integrated five-stage traveling wave amplifier (TWA) with a single n-MOSFET in each gain cell was designed, fabricated and tested in low-cost, standard 0.18 /spl mu/m CMOS technology. Coplanar waveguides (CPW) replace the large area spiral inductors or coplanar strip-lines. A gain of 10 dB at 1 GHz and a unity-gain bandwidth of 12 GHz was measured for the TWA at a gate bias of V/sub GS/=1.2 V and a drain bias of V/sub DS/=1.8 V. The effects of temperature on its gain, phase and stability have been investigated, and are reported for the first time for a CMOS TWA.     

Microwave CMOS traveling wave amplifiers: performance and temperature effects

A monolithically integrated five-stage traveling wave amplifier (TWA) with a single n-MOSFET in each gain cell was designed, fabricated and tested in low-cost, standard 0.18 /spl mu/m CMOS technology. Coplanar waveguides (CPW) replace the large area spiral inductors or coplanar strip-lines. A gain of 10 dB at 1 GHz and a unity-gain bandwidth of 12 GHz was measured for the TWA at a gate bias of V/sub GS/=1.2 V and a drain bias of V/sub DS/=1.8 V. The effects of temperature on its gain, phase and stability have been investigated, and are reported for the first time for a CMOS TWA.     

Self-biased cross-coupled low-cost fully-differential CMOS operational amplifier

A low-cost fully-differential operational amplifier (opamp) using a novel self-biased cascode output stage and cross-coupled input stage is proposed. Fabricated in only an 84/spl times/67 /spl mu/m/sup 2/ area with TSMC 0.35 /spl mu/m technology, and loaded with more than 100 pF capacitance, the opamp possesses 60 dB DC gain, 3 V//spl mu/s slew rate, 7.8 MHz unity-gain bandwidth, and -48 dB total harmonic distortion.     

An efficient CMOS line driver for 1.544-Mb/s T1 and 2.048-Mb/s E1 applications

A CMOS operational amplifier (OPAMP) for use as a line driver for high-speed T1/E1 data communication link is described. The differential output swing, using a single 3.3-V power supply, is 5.2-V peak-to-peak on a 20-/spl Omega/ load. Novel circuits are used to control the closed-loop output impedance, quiescent bias current, and frequency compensation to ensure stable operation over varying temperature and load conditions. A special circuitry tristates the output in case of power-supply failure. The OPAMP achieves a unity-gain bandwidth of 35 MHz with only 10 mA of quiescent current. A new output-current-sense circuitry is used to provide a current feedback to adjust the output impedance for proper line termination as well as to provide short-circuit protection from excessive output currents. Using 0.35-/spl mu/m n-well CMOS technology, the amplifier occupies 0.69 mm/sup 2/ of area.     

An isolated vertical n-p-n transistor in an n-well CMOS process

Isolated vertical n-p-n transistors were fabricated by a modified 5-/spl mu/m n-well CMOS process. The modification included a decrease in the p/SUP +/ source and drain implant dose and an increase in the final anneal time, but no extra processing steps of masks were required. The n-p-n transistors had generally good characteristics, with H/SUB FE//spl ap/600 and BV/SUB CEO//spl ap/40 V, while the MOS characteristics were unchanged.     

A low-power low-noise CMOS amplifier for neural recording applications

There is a need among scientists and clinicians for low-noise low-power biosignal amplifiers capable of amplifying signals in the millihertz-to-kilohertz range while rejecting large dc offsets generated at the electrode-tissue interface. The advent of fully implantable multielectrode arrays has created the need for fully integrated micropower amplifiers. We designed and tested a novel bioamplifier that uses a MOS-bipolar pseudoresistor element to amplify low-frequency signals down to the millihertz range while rejecting large dc offsets. We derive the theoretical noise-power tradeoff limit - the noise efficiency factor - for this amplifier and demonstrate that our VLSI implementation approaches this limit by selectively operating MOS transistors in either weak or strong inversion. The resulting amplifier, built in a standard 1.5-/spl mu/m CMOS process, passes signals from 0.025Hz to 7.2 kHz with an input-referred noise of 2.2 /spl mu/Vrms and a power dissipation of 80 /spl mu/W while consuming 0.16 mm/sup 2/ of chip area. Our design technique was also used to develop an electroencephalogram amplifier having a bandwidth of 30 Hz and a power dissipation of 0.9 /spl mu/W while maintaining a similar noise-power tradeoff.     

A CMOS magnetic field sensor

The authors present a novel, fully integrated magnetic field sensor made in the standard, polysilicon-gate CMOS technology. The circuit shows a sensitivity of 1.2 V/T with 10 V supply voltage and 100 /spl mu/A current consumption. The circuit consists of a pair of split-drain MOS transistors in a CMOS-differential amplifier-like configuration.     

Low-power programmable gain CMOS distributed LNA

A design methodology for low power MOS distributed amplifiers (DAs) is presented. The bias point of the MOS devices is optimized so that the DA can be used as a low-noise amplifier (LNA) in broadband applications. A prototype 9-mW LNA with programmable gain was implemented in a 0.18-/spl mu/m CMOS process. The LNA provides a flat gain, S/sub 21/, of 8 /spl plusmn/ 0.6dB from DC to 6.2 GHz, with an input impedance match, S/sub 11/, of -16 dB and an output impedance match, S/sub 22/, of -10 dB over the entire band. The 3-dB bandwidth of the distributed amplifier is 7GHz, the IIP3 is +3 dBm, and the noise figure ranges from 4.2 to 6.2 dB. The gain is programmable from -10 dB to +8 dB while gain flatness and matching are maintained.