集成低功耗CMOS压控振荡器及其二分频器

实现了应用于无线局域网收发机的集成低功耗CMOS压控振荡器及其二分频器.压控振荡器是由在片对称螺旋型电感和差分容抗管组成的LC负阻型振荡器,而二分频器采用了ILFD结构.由于采用了差分LC元件和ILFD技术,整个电路的功耗很低.该电路已经用0.18μm CMOS工艺实现.测试结果表明该电路能产生低相位噪声的3.6/1.8GHz双带本振信号,并具有很宽的可控频率范围.当电源电压为1.5V时,该电路消耗了5mA的电流.芯片面积为1.0mm×1.0mm.     

集成低功耗CMOS压控振荡器及其二分频器

实现了应用于无线局域网收发机的集成低功耗CMOS压控振荡器及其二分频器.压控振荡器是由在片对称螺旋型电感和差分容抗管组成的LC负阻型振荡器,而二分频器采用了ILFD结构.由于采用了差分LC元件和ILFD技术,整个电路的功耗很低.该电路已经用0.18μm CMOS工艺实现.测试结果表明该电路能产生低相位噪声的3.6/1.8GHz双带本振信号,并具有很宽的可控频率范围.当电源电压为1.5V时,该电路消耗了5mA的电流.芯片面积为1.0mm×1.0mm.     

Highly integrated 60 GHz transmitter and receiver MMICs in a GaAs pHEMT technology

Highly integrated transmitter and receiver MMICs have been designed in a commercial 0.15 /spl mu/m, 88 GHz f/sub T//183 GHz f/sub MAX/ GaAs pHEMT MMIC process and characterized on both chip and system level. These chips show the highest level of integration yet presented in the 60 GHz band and are true multipurpose front-end designs. The system operates with an LO signal in the range 7-8 GHz. This LO signal is multiplied in an integrated multiply-by-eight (X8) LO chain, resulting in an IF center frequency of 2.5 GHz. Although the chips are inherently multipurpose designs, they are especially suitable for high-speed wireless data transmission due to their very broadband IF characteristics. The single-chip transmitter MMIC consists of a balanced resistive mixer with an integrated ultra-wideband IF balun, a three-stage power amplifier, and the X8 LO chain. The X8 is a multifunction design by itself consisting of a quadrupler, a feedback amplifier, a doubler, and a buffer amplifier. The transmitter chip delivers 3.7/spl plusmn/1.5 dBm over the RF frequency range of 54-61 GHz with a peak output power of 5.2 dBm at 57 GHz. The single-chip receiver MMIC contains a three-stage low-noise amplifier, an image reject mixer with an integrated ultra-wideband IF hybrid and the same X8 as used in the transmitter chip. The receiver chip has 7.1/spl plusmn/1.5 dB gain between 55 and 63 GHz, more than 20 dB of image rejection ratio between 59.5 and 64.5 GHz, 10.5 dB of noise figure, and -11 dBm of input-referred third-order intercept point (IIP3).     

0.18-/spl mu/m CMOS push-pull power amplifier with antenna in IC package

A novel architecture of power amplifier with antenna implemented in a ceramic ball grid array (CBGA) package is presented. The monolithic power amplifier designed in a standard 0.18- /spl mu/m CMOS technology offers 19.5 dBm maximum output power at 5.2 GHz to the antenna with the PAE of 32%. The antenna integrated in the CBGA package achieves impedance bandwidth of 3.86% and gain of 2 dBi at 5.2 GHz. Results demonstrate the feasibility of using this innovative configuration to the design of single-chip 5 GHz transmitter front-end.     

A 24-GHz, +14.5-dBm fully integrated power amplifier in 0.18-/spl mu/m CMOS

A 24-GHz +14.5-dBm fully integrated power amplifier with on-chip 50-/spl Omega/ input and output matching is demonstrated in 0.18-/spl mu/m CMOS. The use of substrate-shielded coplanar waveguide structures for matching networks results in low passive loss and small die size. Simple circuit techniques based on stability criteria derived result in an unconditionally stable amplifier. The power amplifier achieves a power gain of 7 dB and a maximum single-ended output power of +14.5-dBm with a 3-dB bandwidth of 3.1 GHz, while drawing 100 mA from a 2.8-V supply. The chip area is 1.26 mm/sup 2/.     

Multichip optical transmitter module for chip-to-chip interconnection on optical PCBs

A multichip module of an optical transmitter, which consists of flip-chip bonded 1/spl times/4 VCSELs on a CMOS driver array IC, is fabricated and demonstrated. The -3 dB bandwidth and adjacent crosstalk of the hybrid integration multichip module are about 4.5 GHz and less than -30 dB, respectively. The whole integrated multichip volume is 1.1/spl times/1.2/spl times/0.52 mm/sup 3/ for four channels.     

A frequency-controlled beam-steering array with mixing frequency compensation for multichannel applications

A frequency-controlled beam-steering planar array with mixing frequency compensation is presented for cost-effective multichannel phased array applications. The new feed networks for frequency compensation not only operate in wide band but also ensure radio-frequency (RF) amplitude imbalance cancellation and progressive phase distribution. The parallel equal power dividers installed in both LO and intermediate-frequency (IF) feed networks provide uniform amplitude and phase distribution, while the fixed delay lines installed in the LO feed network exhibit precise phase progression, compared to a series feed structure. The LO power imbalance caused by the unequal delay line loss between elements is corrected by pumping each mixer into the LO saturation region, leading to linear IF-RF response. Thus, sidelobe degradation and pattern distortion caused by the RF amplitude imbalance, as well as the beam-steering error and beam squint caused by the phase errors of the delay lines, are removed. The proposed feed networks combined with quasi-Yagi antenna arrays and microwave monolithic integrated circuit mixers realize a broad bandwidth of more than 3 GHz in K band for multichannel wireless applications. The K band transmitter/receiver pair proposed in this paper successfully demonstrates two-channel simultaneous RF transmission and single channel 50-Mb/s data communication with 40/spl deg/ scanning. This simple, compact, yet cost-effective planar array ensures multichannel broadband wireless communications with beam-steering capability.     

30-40-GHz drain-pumped passive-mixer MMIC fabricated on VLSI SOI CMOS technology

In this paper, a passive down mixer is proposed, which is well suited for short-channel field-effect transistor technologies. The authors believe that this is the first drain-pumped transconductance mixer that requires no dc supply power. The monolithic microwave integrated circuit (MMIC) is fabricated using digital 90-nm silicon-on-insulator CMOS technology. All impedance matching, bias, and filter elements are implemented on the chip, which has a compact size of 0.5 mm/spl times/0.47 mm. The circuit covers a radio frequency range from 30 to 40 GHz. At a RF frequency of 35 GHz, an intermediate frequency of 2.5 GHz and a local-oscillator (LO) power of 7.5 dBm, a conversion loss of 4.6 dB, a single-sideband (SSB) noise figure (NF) of 7.9 dB, an 1-dB input compression point of -6 dBm, and a third-order intercept point at the input of 2 dBm were measured. At lower LO power of 0 dBm, a conversion loss of 6.3 dBm and an SSB NF of 9.7 dB were measured, making the mixer an excellent candidate for low power-consuming wireless local-area networks. All results include the pad parasitics. To the knowledge of the authors, this is the first CMOS mixer operating at millimeter-wave frequencies. The achieved conversion loss is even lower than for passive MMIC mixers using leading edge III/V technologies, showing the excellent suitability of digital CMOS technology for analog circuits at millimeter-wave frequencies.     

A low-power high-performance SiGe BiCMOS 802.11a/b/g transceiver IC for cellular and bluetooth Co-existence applications

This paper describes a high-performance WLAN 802.11a/b/g radio transceiver, optimized for low-power in mobile applications, and for co-existence with cellular and Bluetooth systems in the same terminal. The direct-conversion transceiver architecture is optimized in each mode for low-power operation without compromising the challenging RF performance targets. A key transceiver requirement is a sensitivity of -77 dBm (at the LNA input) in 54 Mb/s OFDM mode while in the presence of a GSM1900 transmitter interferer. The receiver chain achieves an overall noise figure of 2.8/3.2 dB, consuming 168/185 mW at 2.8 V for the 2.4/5GHz bands, respectively. Signal loopback and transmit power detection techniques are used in conjunction with the baseband modem processor to calibrate the transmitter LO leakage and the transceiver I/Q imbalances. Fabricated in a 70 GHz f/sub T/ 0.25-/spl mu/m SiGe BiCMOS technology for system-in-package (SiP) use, the dual-band, tri-mode transceiver occupies only 4.6 mm/sup 2/.     

A single-chip dual-band tri-mode CMOS transceiver for IEEE 802.11a/b/g wireless LAN

A single-chip dual-band tri-mode CMOS transceiver that implements the RF and analog front-end for an IEEE 802.11a/b/g wireless LAN is described. The chip is implemented in a 0.25-/spl mu/m CMOS technology and occupies a total silicon area of 23 mm/sup 2/. The IC transmits 9 dBm/8 dBm error vector magnitude (EVM)-compliant output power for a 64-QAM OFDM signal. The overall receiver noise figure is 5.5/4.5 dB at 5 GHz/2.4 GHz. The phase noise is -105 dBc/Hz at a 10-kHz offset and the spurs are below -64 dBc when measured at the 5-GHz transmitter output.     

A 1.8-GHz CMOS fractional-N frequency synthesizer with randomized multiphase VCO

A 1.8 GHz fractional-N frequency synthesizer implemented in 0.6 /spl mu/m CMOS with an on-chip multiphase voltage-controlled oscillator (VCO) exhibits no spurs resulting from phase interpolation. The proposed architecture randomly selects output phases of a multiphase VCO for fractional frequency division to eliminate spurious tones. Measured phase noise at 1.715 GHz is lower than -80 dBc/Hz within a 20 kHz loop bandwidth and -118 dBc/Hz at 1 MHz offset with no fractional spurs above -70 dBc/Hz. The synthesizer has a frequency resolution step smaller than 10 Hz. The chip consumes 52 mW at 3.3 V and occupies 3.7 mm/spl times/2.9 mm.     

On the feasibility of CMOS multiband phase shifters for multiple-antenna transmitters

We present the design of an integrated multiband phase shifter in RF CMOS technology for phased array transmitters. The phase shifter has an embedded classical distributed amplifier for loss compensation. The phase shifter achieves a more than 180/spl deg/ phase tuning range in a 2.4-GHz band and a measured more than 360/spl deg/ phase tuning range in both 3.5-GHz and 5.8-GHz bands. The return loss is less than -10dB at all conditions. The feasibility for transmitter applications is verified through measurements. The output power at a 1-dB compression point (P/sub 1 dB/) is as high as 0.4dBmat 2.4GHz. The relative phase deviation around P/sub 1 dB/ is less than 3/spl deg/. The design is implemented in 0.18-/spl mu/mRF CMOS technology, and the chip size is 1200/spl mu/m /spl times/ 2300 /spl mu/m including pads.     

CMOS wireless phase-shifted transmitter

A fully integrated phase-shifted (PS) transmitter is presented in this paper. The PS transmitter employs switching power amplifiers, operates without mixers, and provides an intermodulation distortion-free output spectrum, making it a suitable choice for mobile communication systems. The RF blocks of the PS transmitter include a local oscillator, phase shifters, and switching class-F power amplifiers with wide-band matching networks. The PS transmitter is implemented in a standard single-polysilicon, six-metal 0.18-/spl mu/m CMOS technology and occupies an area of 3 mm/sup 2/. It operates from a 1-V supply and provides better than 42 dBc adjacent channel power ratio with an output bandwidth of 50 MHz at 8 GHz. The PS transmitter RF front-end provides 22 dBm of average output power with a 38% average power added efficiency.     

26-34 GHz CMOS mixer

A 26-34 GHz fully integrated CMOS down mixer is presented. At 30 GHz RF frequency and 2.5 GHz IF frequency, 50 /spl Omega/ terminations, 5 dBm LO and 1.2 V/spl times/17 mA supply power, the circuit yields a conversion loss of 2.6 dB, an SSB NF of 13.5 dB and an IIP3 of 0.5 dBm.     

A 0.25-/spl mu/m CMOS quad-band GSM RF transceiver using an efficient LO frequency plan

This paper describes a single-chip CMOS quad-band (850/900/1800/1900 MHz) RF transceiver for GSM/GPRS applications. It is the most important design issue to maximize resource sharing and reuse in designing the multiband transceivers. In particular, reducing the number of voltage-controlled oscillators (VCOs) required for local oscillator (LO) frequency generation is very important because the VCO and phase-locked loop (PLL) circuits occupy a relatively large area. We propose a quad-band GSM transceiver architecture that employs a direct conversion receiver and an offset PLL transmitter, which requires only one VCO/PLL to generate LO signals by using an efficient LO frequency plan. In the receive path, four separate LNAs are used for each band, and two down-conversion mixers are used, one for the low bands (850/900 MHz) and the other for the high bands (1800/1900 MHz). A receiver baseband circuit is shared for all four bands because all of their channel spaces are the same. In the transmit path, most of the building blocks of the offset PLL, including a TX VCO and IF filters, are integrated. The quad-band GSM transceiver that was implemented in 0.25-/spl mu/m CMOS technology has a size of 3.3/spl times/3.2 mm/sup 2/, including its pad area. From the experimental results, we found that the receiver provides a maximum noise figure of 2.9 dB and a minimum IIP3 of -13.2dBm for the EGSM 900 band. The transmitter shows an rms phase error of 1.4/spl deg/ and meets the GSM spectral mask specification. The prototype chip consumes 56 and 58 mA at 2.8 V in the RX and TX modes, respectively.     

A low-power 2.4-GHz transmitter/receiver CMOS IC

A 2.4-GHz CMOS receiver/transmitter incorporates circuit stacking and noninvasive baseband filtering to achieve a high sensitivity with low power dissipation. Using a single 1.6-GHz local oscillator, the transceiver employs two upconversion and downconversion stages while providing on-chip image rejection filtering. Realized in a 0.25-/spl mu/m digital CMOS technology, the receiver exhibits a noise figure of 6 dB and consumes 17.5 mW from a 2.5-V supply, and the transmitter delivers an output power of 0 dBm with a power consumption of 16 mW.     

A novel bidirectional CMOS transceiver for chip-to-chip optical interconnects

A novel bidirectional complementary metal-oxide-semiconductor (CMOS) transceiver for chip-to-chip optical interconnects operating at 2.5 Gb/s is proposed, which shares the common block of a receiver and a transmitter on a single chip. The share of the common block of two circuits makes it possible to save 55% or 20% of power dissipation, depending on the operating mode. The chip in 0.18-/spl mu/m CMOS technology occupies an area of 0.82/spl times/0.82 mm/sup 2/, 70% of the total area of a typical unshared transceiver chip. The transmitting and receiving modes of operation show -3-dB bandwidths of 2.2 and 2.4 GHz and electrical isolations of -28 and -40 dB, respectively.     

Shielded passive devices for silicon-based monolithic microwave and millimeter-wave integrated circuits

This paper introduces floating shields for on-chip transmission lines, inductors, and transformers implemented in production silicon CMOS or BiCMOS technologies. The shield minimizes losses without requiring an explicit on-chip ground connection. Experimental measurements demonstrate Q-factor ranging from 25 to 35 between 15 and 40 GHz for shielded coplanar waveguide fabricated on 10 /spl Omega//spl middot/cm silicon. This is more than a factor of 2 improvement over conventional on-chip transmission lines (e.g., microstrip, CPW). A floating-shielded, differentially driven 7.4-nH inductor demonstrates a peak Q of 32, which is 35% higher than an unshielded example. Similar results are realizable for on-chip transformers. Floating-shielded bond-pads with 15% less parasitic capacitance and over 60% higher shunt equivalent resistance compared to conventional shielded bondpads are also described. Implementation of floating shields is compatible with current and projected design constraints for production deep-submicron silicon technologies without process modifications. Application examples of floating-shielded passives implemented in a 0.18-/spl mu/m SiGe-BiCMOS are presented, including a 21-26-GHz power amplifier with 23-dBm output at 20% PAE (at 22 GHz), and a 17-GHz WLAN image-reject receiver MMIC which dissipates less than 65 mW from a 2-V supply.     

A 21-26-GHz SiGe bipolar power amplifier MMIC

A three-stage 21-26-GHz medium-power amplifier fabricated in f/sub T/=120 GHz 0.2 /spl mu/m SiGe HBT technology has 19 dB small-signal gain and 15 dB gain at maximum output power. It delivers 23 dBm, 19.75% PAE at 22 GHz, and 21 dBm, 13% PAE at 24 GHz. The differential common-base topology extends the supply to BV/sub CEO/ of the transistors (1.8 V). New on-chip components, such as onchip interconnects with floating differential shields, and self-shielding four-way power combining/dividing baluns provide inter-stage coupling and single-ended I/O interfaces at the input and output. The 2.45/spl times/2.45 mm/sup 2/ MMIC was mounted as a flipchip and tested without a heatsink.     

OC-192 transmitter and receiver in standard 0.18-/spl mu/m CMOS

This paper presents the first fully integrated SONET OC-192 transmitter and receiver fabricated in a standard 0.18-/spl mu/m CMOS process. The transmitter consists of an input data register, 16-b-wide first-in-first-out (FIFO) circuit, clock multiplier unit (CMU), and 16:1 multiplexer to give a 10-Gb/s serial output. The receiver integrates an input amplifier for 10-Gb/s data, clock and data recovery circuit (CDR), 1:16 demultiplexer, and drivers for low-voltage differential signal (LVDS) outputs. An on-chip LC-type voltage-controlled oscillator (VCO) is employed by both the transmitter and receiver. The chipset operates at multiple data rates (9.95-10.71 Gb/s) with functionality compatible with the multisource agreement (MSA) for 10-Gb transponders. Both chips demonstrate SONET-compliant jitter characteristics. The transmitter 10.66-GHz output clock jitter is 0.065 UI/sub pp/ (unit interval, peak-to-peak) over a 50-kHz-80-MHz bandwidth. The receiver jitter tolerance is more than 0.4 UI/sub pp/ at high frequencies (4-80 MHz). A high level of integration and low-power consumption is achieved by using a standard CMOS process. The transmitter and receiver dissipate a total power of 1.32 W at 1.8 V and are packaged in a plastic ball grid array with a footprint of 11/spl times/11 mm/sup 2/.