放电等离子烧结温度对W-30Re合金组织性能的影响

利用放电等离子烧结技术制备W-30Re合金,研究烧结温度对合金致密度、显微硬度、显微组织和断裂方式的影响。结果表明,利用放电等离子烧结技术可以在较短时间内制备出晶粒细小,组织均匀的高密度W-30Re合金。随着烧结温度的升高,合金的致密度与硬度不断增大,合金中粘结相的数量不断增加;合金的断裂方式由沿晶断裂转变为以沿晶断裂为主,以粘结相的延性撕裂为辅的断裂方式。     

基于SPS工艺制备的W-25 mass%Cu复合材料的组织与性能

采用放电等离子烧结(SPS)制备了W-25 mass%Cu复合材料，研究了烧结温度(900、950、1000、1050℃)对W-25 mass%Cu复合材料微观组织和性能的影响规律，重点研究了其耐电弧烧蚀行为。结果表明：采用SPS工艺制备的W-25 mass%Cu复合材料的组织分布均匀；随着烧结温度的升高，复合材料的致密度、导电率和硬度呈现出先增加后减小的趋势。当烧结温度为1000℃时，W-25 mass%Cu复合材料的综合性能最佳，其致密度、导电率和硬度最高，分别为96.7%、42.86%IACS和205.5 HB;压缩强度和断裂应变取得最大值，分别是875 MPa和26%。W颗粒的动力学生长行为研究结果表明晶格扩散是W颗粒长大的主导机制。在电弧烧蚀过程中，随着烧结温度的升高，W-25 mass%Cu复合材料表面的侵蚀区域先变小后增大、烧蚀坑逐渐变浅、烧蚀坑直径变宽。与900℃烧结制备的W-25 mass%Cu复合材料相比，1000℃烧结制备的W-25 mass%Cu复合材料的烧蚀坑直径扩大了47.3%,烧蚀坑深度降低了50%。     

溶胶-喷雾干燥超细/纳米晶W-20Cu复合粉末的烧结行为

采用喷雾干燥-氢气还原法制备超细/纳米晶W-20Cu(质量分数,%)复合粉末,粉末压坯直接从室温推入高温区烧结不同时间后直接取出水淬,研究其烧结致密化和显微组织的变化。结果表明,超细/纳米晶W-20Cu粉末在1000～1200℃烧结时发生迅速致密化。粉末压坯在1200℃烧结60min,其材料致密度已达到96.4%。1420℃烧结90min时致密度达到99%以上。1100～1420℃烧结时其烧结致密化活化能不断减小,从1100℃时的276.3kJ/mol减小到1420℃时的29.1kJ/mol。当温度低于1200℃时,W晶粒长大不明显,当温度超过1300℃时,W晶粒开始有明显长大。随温度的升高W晶粒发生显著球形化,1420℃烧结时发现其晶粒长大符合G3=kt的Ostwald机制,此时晶粒长大动力学系数K仅为0.024μm3/min。     

烧结工艺对ZrO2/Cu纳米复合材料性能及组织的影响

采用原位化学工艺制备了ZrO2/Cu纳米复合粉末,并用粉末冶金法制备了ZrO2/Cu纳米复合材料。研究了烧结温度、烧结时间对纳米复合材料性能的影响。结果表明,随着烧结温度的升高,复合材料的体积收缩率增大,同时电导率、显微硬度也增大;随着烧结时间的延长,体积收缩率增大,显微硬度增大到一定程度后减小。当烧结温度为975℃,时间为90min时,得到的ZrO2/Cu纳米复合材料性能较佳(122HV,93.4IASC%)。     

烧结方式对TiB2/Cu复合材料组织和性能的影响

采用微波烧结和真空烧结制备了Cu及不同TiB2含量的TiB2/Cu复合材料。测试了试样的密度、硬度、电导率,并对不同烧结法方式制备的Cu及TiB2/Cu复合材料的组织和性能进行了分析。结果表明,微波烧结技术可以在较短的时间和较低的能耗下完成烧结,且烧结体的性能要明显优于真空烧结的。但微波烧结试样的组织比较粗大,有孪晶存在,并且孪晶数量随TiB2含量的增加而减少。     

SPS烧结制备高性能超细晶钼合金

采用平均粒度为1.03 μm的超细钼粉和La2O3颗粒的混合粉末作为原材料,应用SPS粉末冶金法制备出粒度为3.74 μm、致密度为98.71％的力学性能优异的钼合金烧结坯.探究了SPS制备超细晶高强度高硬度钼合金烧结坯的最佳烧结温度、保温时间以及温度制度对烧结坯致密度、晶粒大小、显微硬度的影响,并进一步对比了SPS烧...     

碳纤维增强Cu-Ti3SiC2复合材料的性能与烧结温度的关系

研究了在Cu-Ti3SiC2复合材料中添加2%体积含量碳纤维的致密度、电导率和硬度同烧结温度的关系。实验结果表明,加入碳纤维的Cu-Ti3SiC2复合材料较未加入碳纤维的Cu-Ti3SiC2复合材料的致密度和电导有少许下降,但布氏硬度有大幅度提高。随着烧结温度的上升,碳纤维增强Cu-Ti3SiC2复合材料的相对密度上升较快,在1000℃时达到99.21%。电阻率随烧结温度的上升而下降;布氏硬度随着烧结温度的上升而提高,但增幅较缓。     

真空热压烧结W(50)/Cu-Al_2O_3复合材料的性能研究

采用真空热压烧结工艺制备W(50)/Cu-Al2O3复合材料,观察了其显微组织,测试了其致密度、硬度、抗弯强度和导电率。结果表明:W(50)/Cu-Al2O3复合材料组织致密;致密度和硬度优于Cu-50%W,致密度可达99.8%,显微硬度达135 HV。而导电率为46%IACS,略低于W-50%Cu复合材料。抗弯强度为291.3 MPa,弥散铜钨合金室温弯曲断裂主要以弥散Cu相的撕裂为主,伴随有W-Cu界面的分离和部分W晶粒的解理断裂。     

W-30Cu纳米复合粉末液相烧结致密化与晶粒长大机制

采用喷雾干燥-煅烧、还原工艺制备超细W-30Cu复合粉末,将粉末模压成形,在1340～1420℃液相烧结15～120min,研究其致密化行为及晶粒长大机制。结果表明:W-30Cu复合粉末在液相烧结早期发生了显著的致密化,1340℃烧结15 min致密度可达到90%以上;随烧结时间的延长致密度增加,1380℃烧结90 min相对密度达到99.1%。液相烧结过程中,W晶粒不断长大并逐渐球化,且其晶粒大小G与烧结时间t符合G3∝kt关系,服从液相烧结溶解-析出机制。烧结温度对W晶粒长大影响显著,当温度从1340℃上升到1420℃时,其晶粒长大动力学系数从1.61×10-2μm3/min增大到4.65×10-2μm3/min,液相的形成、颗粒重排、溶解-析出及W晶粒长大使细晶W-Cu获得近全致密。     

烧结工艺对Cu-Cr复合材料性能的影响

研究了烧结温度和保温时间对Cu-1．5wt％Cr复合材料相对密度、电导率、硬度和抗弯强度的影响。结果表明,提高烧结温度和延长保温时间可提高Cu—1．5wt％Cr复合材料的相对密度（可达到96％）,降低电阻率,改善导电性,但同时会降低其硬度和抗弯强度。对上述性能变化的原因进行了分析。     

The effect of sintering temperature on some properties of Cu-SiC composite

Copper matrix composites reinforced with 1 wt.%, 2 wt.%, 3 wt.% and 5 wt.% SiC particles were fabricated by powder metallurgy method. Cu and Cu-SiC powder mixtures were compacted with a compressive force of 280 MPa and sintered in an open atmospheric furnace at 900-950 °C for 2 h. Within the furnace compacted samples were embedding into the graphite powder. The presence of Cu and SiC components in composites was verified by XRD analysis. Optical and SEM studies showed that Cu-SiC composites have a uniform microstructure in which silicon carbide particles are distributed uniformly in the copper matrix. The results of the study on mechanical and electrical conductivity properties of Cu-SiC composites indicated that with increasing SiC content (wt.%), hardness increased, but relative density and electrical conductivity decreased. The highest electrical conductivity of 98.8% IACS and relative density of 98.2% were obtained for the Cu-1 wt.%SiC composite sintered at 900 °C and this temperature was defined as the optimum sintering temperature.     

Investigation on the characteristics of micro- and nano-structured W-15 wt.%Cu composites prepared by powder metallurgy route

The properties of W-15 wt.%Cu composites were investigated by preparing two distinct composites of micrometer and nanoscale structures. Micrometer composite was produced by mixing elemental W and Cu powders and nanometer one was synthesized through a mechanochemical reaction between WO₃ and CuO powders. Subsequent compaction and sintering process was performed to ensure maximum possible densification at 1000-1200 °C temperatures. Finally, the behavior of produced samples including relative density, hardness, compressive strength, electrical conductivity, coefficient of thermal expansion (CTE) and room temperature corrosion resistance were examined. Among the composites, nano-structured sample sintered at 1200 °C exhibited better homogeneity, the highest relative density (94%) and mechanical properties. Furthermore, this composite showed superior electrical conductivity (31.58 IACS) and CTE (9.95384 × 10^- 6) in comparison with micrometer type. This appropriate properties may be mainly attributed to liquid phase sintering with particle rearrangement which induced by higher capillary forces of finer structures.     

复合稀土氧化物掺杂W-20Cu复合材料的制备及组织性能研究

以偏钨酸铵和硝酸铜为原料,采用EDTA-柠檬酸法制备了含有0~0.8wt.%稀土氧化物( Ce_0.8Sm_0.2O_1.9, SDC)的W-20Cu复合粉体,所制备的复合粉体经压制成型、1250°C烧结2h后获得SDC/W-20Cu复合材料烧结体。对所制备复合粉体进行物相、形貌的表征;研究稀土氧化物的添加对SDC/W-20Cu烧结体的密度、组织结构和物理力学性能的影响。实验结果表明：所制备的W-Cu复合粉体平均粒度为100~200nm;同时,SDC的添加对烧结体的密度和电导率会有轻微的影响,但能够抑制晶粒的长大并明显改善烧结体的力学性能。经1250°C烧结后,SDC/W-20Cu烧结体的相对密度均高于97%;当SDC的添加量为0.6%时,具有最大的抗弯强度和显微硬度,分别是1128MPa和258HV;此外,在室温和600°C的测试条件下,其最大的抗拉强度可以达到580MPa和258MPa。     

Preparation and Properties of W-15Cu Composite by Electroless Plating and Powder Metallurgy

用化学镀和粉末冶金的方法制备出W-15Cu复合材料。首先用化学方法对W粉表面预处理,然后在其表面化学镀铜。得到的复合粉末用图谱进行表征。发现用化学镀的方法制备出的W-15Cu复合粉末纯度非常高,且W颗粒均匀、被Cu致密的包覆着。呈现出包状结构。这种复合粉末表现出优异的压制性能,压坯分别在300, 400, 500, 600 MPa的压制压力下成形。压坯在1250 ℃温度下保温90 min烧结后,从其断口形貌可以发现W颗粒没有明显的长大,且W颗粒表面特征并没有发生改变,仍然表现出预处理后的表面特征。对烧结体的相对密度、硬度、抗弯强度和电导率同样进行了表征     

放电等离子烧结法制备Cu/金刚石复合材料的性能与显微组织

由于具备较高的热导率,铜/金刚石复合材料已成为应用于电子封装领域的新一代热管理材料。采用放电等离子烧结工艺（SPS）成功制备含不同金刚石体积分数的Cu/金刚石复合材料,研究复合材料的相对密度、微观结构均匀性和热导率（TC）随金刚石体积分数（50%、60%和70%）和烧结温度的变化规律。结果表明：随着金刚石体积分数的降低,复合材料的相对密度、微观结构均匀性和热导率均升高;随着烧结温度的提高,复合材料的相对密度和热导率不断提高。复合材料的热导率受到金刚石体积分数、微观结构均匀性和复合材料相对密度的综合影响。     

等离子烧结Al35Ti15Cr20Mn20Cu10/6061Al复合材料的组织与性能

采用机械合金化与放电等离子烧结工艺制备了体积分数为5%的Al35Ti15Cr20Mn20Cu10增强6061Al复合材料,重点研究了烧结温度对轻质高熵合金增强铝基复合材料微观组织及力学性能的影响。当烧结温度为540℃时,复合材料的致密度最大为98.6%。此时复合材料基体与增强体之间产生明显过渡层,界面结合以扩散结合为主。随着烧结温度升高,复合材料的屈服强度出现先上升后下降的趋势。当烧结温度为540℃时,复合材料的屈服强度达到186MPa,相比基体的屈服强度提升了约75%,复合材料的屈服强度接近Iso-strain模型的计算值。     

机械合金化对W-20Cu复合材料的显微组织与性能的影响

采用机械合金化结合粉末冶金技术制备W-20Cu（vo1％）复合材料。利用扫描电镜和金相显微镜对不同球磨时间的W-20Cu复合材料显微组织进行表征，并对材料的各项物理性能进行测试。结果表明，随着球磨时间的延长，W-20Cu烧结体的组织越来越均匀，Cu相分布也越来越均匀。W-20Cu烧结体密度、收缩率、硬度、抗弯强度随球磨时间的延长而增大；球磨20h的W-20Cu复合粉烧结体热导率达到峰值（130．61Wm^-1K^-1），继续球磨，热导率减小。综合考虑所有研究结果，通过机械合金化所制备的W-Cu复合粉体可以获得具有优异综合物理性能的W-20Cu复合材料。     

Thermal conductivity behavior of SPS consolidated AIN/Al composites for thermal management applications

AIN/Al composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications.The spark plasma sintering(SPS)technique was used for the first time to prepare the AIN/Al composites,and attention was focused on the effects of sintering parameters on the relative density,microstructure and,in particular,thermal conductivity behavior of the composites.The results showed that the relative density and thermal conductivity of the composites increased with increasing sintering temperature and pressure.The composites sintered at 1550℃ for 5 min under 70 Mpa showed the maximum relative density and thermal conductivity,corresponding to 99% and 97.5 W·m-1·K-1,respectively.However,the thermal conductivity of present AIN/Al composites is still far below the theoretical value.Possible reasons for this deviation were discussed.     

Fabrication of nano-crystalline W-Ni-Fe alloy with Mo and rare earth element additives

Three kinds of nano-crystalline high density alloys (86W-7Ni-3Fe-4Mo, 90W-4Ni-2Fe-4Mo and 90W4Ni-2Fe-3.8Mo-0.2RE) were fabricated by a technique combining lower temperature vacuum sintering with highenergy ball milling mechanical alloying. The crystalline size and microstructures of the specimens sintered at different sintering temperatures were examined by X-ray diffraction(XRD) and scanning electron microscope(SEM). The results show that the optimal sintering temperature of 86W-7Ni-3Fe-4Mo, 90W-4Ni-2Fe-4Mo and 90W-4Ni-2Fe-3.8Mo-0.2RE alloys are 1 300 - 1 350℃. When they are sintered at 1 300℃ for 75 min， the hardness of three kinds of specimens can reach above HRC30, the relative density can reach above 96%, and 90W-4Ni-2Fe-3.8Mo-0.2RE alloy possesses the best integrated properties, its hardness is HRC35 and its relative density is 98%.