Planar, Al0.3Ga0.7As-passivated-base, heterojunction bipolar phototransistors

New planar GaAs heterojunction bipolar phototransistors have been designed and demonstrated. The devices use a GaAs/Al(0.3) Ga(0.7) As molecular-beam-epitaxy materials system with an Al(0.3) Ga(0.7) As passivated, 10-nm-thick base; a depleted, high-low emitter; and a low emitter-base capacitance. Electrical contact to the emitter is made by a set of parallel, ohmic fingers and to the collector by an ohmic contact formed in a large, approximately 1.48-mum deep via. Rise times in response to impulse optical excitation at 810 nm were 747-891 ps except at the two lowest optical excitation powers measured. Photocurrent gains measured at 810 and 850 nm were 0.67-19, depending on experimental conditions. These devices are promising for use in heterodyne photodetector arrays for coherent optical processing channelizers requiring a 100-MHz bandwidth.     

Highly Sensitive Broadband Phototransistors Based on Gradient Tin/Lead Mixed Perovskites

Highly sensitive broadband photodetectors are critical to numerous cutting-edge technologies such as biomedical imaging, environment monitoring, and night vision. Here, phototransistors based on mixed Sn/Pb perovskites are reported, which demonstrate ultrahigh responsivity, gain and specific detectivity in a broadband from ultraviolet to near-infrared region. The interface properties of the perovskite phototransistors are optimized by a special three-step cleaning-healing-cleaning treatment, leading to a high hole mobility in the channel. The highly sensitive performance of the mixed Sn/Pb perovskite phototransistors can be attributed to the vertical compositional heterojunction automatically formed during the film deposition, which is helpful for the separation of photocarriers thereby enhancing a photogating effect in the perovskite channel. This work demonstrates a convenient approach to achieving high-performance phototransistors through tuning compositional gradient in mixed-metal perovskite channels.     

Non-selective growth of SiGe heterojunction bipolar trasistor layers at 700 °C with dual control of n- and p-type dopant profiles

This paper describes the growth of the collector, base, and emitter layers of a SiGe HBT in a single epitaxy process. A non-selective SiGe heterojunction bipolar transistor growth process at 700 °C has been developed, which combines n-type doping for the Si collector, p-type doping for the SiGe base and n-type doping for the Si emitter cap. Control of the collector doping concentration by varying the growth conditions is shown. The boron tailing edge from the SiGe base into the Si emitter layer was removed by interrupting the growth process with a hydrogen flow after the SiGe base growth but before the Si emitter growth to remove the dopant gas from the chamber. The layer thicknesses are compared using three different analytical techniques–secondary ion mass spectroscopy (SIMS), transmission electron microscopy (TEM), and spectroellipsometry. A good agreement was obtained for the three different methods.     

Amorphous/crystalline silicon heterojunction solar cells with varying i-layer thickness

We study the effect on various properties of varying the intrinsic layer (i-layer) thickness of amorphous/crystalline silicon heterojunction (SHJ) solar cells. Double-side monocrystalline silicon (c-Si) heterojunction solar cells are made using hot-wire chemical vapor deposition on high-lifetime n-type Czochralski wafers. We fabricate a series of SHJ solar cells with the amorphous silicon (a-Si:H) i-layer thickness at the front emitter varying from 3.2 nm (0.8xi) to ~ 96 nm (24xi). Our optimized i-layer thickness is about 4 nm (1xi). Our reference cell (1xi) performance has an efficiency of 17.1% with open-circuit voltage (V_oc) of 684 mV, fill factor (FF) of 76%, and short-circuit current density (J_sc) of 33.1 mA/cm². With an increase of i-layer thickness, V_oc changes little, whereas the FF falls significantly after 12 nm (3xi) of i-layer. Transient capacitance measurements are used to probe the effect of the potential barrier at the n-type c-Si/a-Si interface on minority-carrier collection. We show that hole transport through the i-layer is field-driven transport rather than tunneling.     

Amorphous silicon carbide heterojunction solar cells on p-type substrates

The performance of silicon heterojunction (SHJ) solar cells is discussed in this paper in regard to their dependence on the applied amorphous silicon layers, their thicknesses and surface morphology. The emitter system investigated in this work consists of an n-doped, hydrogenized, amorphous silicon carbide a-SiC:H(n) layer with or without a pure, hydrogenized, intrinsic, amorphous silicon a-Si:H(i) intermediate layer. All solar cells were fabricated on p-type FZ-silicon and feature a high-efficiency backside consisting of a SiO₂ passivation layer and a diffused local boron back surface field, allowing us to focus only on the effects of the front side emitter system. The highest solar cell efficiency achieved within this work is 18.5%, which is one of the highest values for SHJ-solar cells using p-type substrates. A dependence of the passivation quality on the surface morphology was only observed for solar cells including an a-Si:H(i) layer. It could be shown that the fill factor suffers from a reduction due to a reduced pseudo fill factor for emitter thicknesses below 11 nm due to a lower passivation quality and/or a higher potential for shunting thorough the a-Si emitter to the crystalline wafer with the conductive indium tin oxide layer. Furthermore, the influence of a variation of the doping gas flow (PH₃) during the plasma enhanced chemical vapor deposition of the doped amorphous silicon carbide a-SiC:H(n) on the solar cell current-voltage characteristic-parameter has been investigated. We could demonstrate that a-SiC:H(n) shows in principle the same dependence on PH₃-flow as pure a-Si:H(n).     

Recent advances in hot-wire CVD R&D at NREL: From 18% silicon heterojunction cells to silicon epitaxy at glass-compatible temperatures

Our research aiming to improve silicon photovoltaic materials and devices extensively utilizes hot-wire chemical vapor deposition (HWCVD). We have recently achieved 18.2% heterojunction silicon solar cells by applying HWCVD a-Si:H front and back contacts to textured p-type silicon wafers. This is the best reported p-wafer heterojunction solar cell by any technique. We have also dramatically improved the quality of HWCVD silicon epitaxy and recently achieved 11 μm of epitaxial growth at a rate of 110 nm/min.     

Analysis of single junction a-Si:H solar cells grown on different TCO’s

In consequence of previous investigation of individual transparent conductive oxide (TCO) and absorber layers a study was carried out on hydrogenated amorphous silicon (a-Si:H) solar cells with diluted intrinsic a-Si:H absorber layers deposited on glass substrates covered with different TCO films. The TCO film forms the front contact of the super-strata solar cell and has to exhibit good electrical (high conductivity) and optical (high transmittance) properties. In this paper we focused our attention on the influence of using different TCO’s as a front contact in solar cells with structure as follows: Corning glass substrate/TCO (800, 950 nm)/p-type μc-Si:H (∼5 nm)/p-type a-Si:H (10 nm)/a-SiC:H buffer layer (∼5 nm)/intrinsic a-Si:H absorber layer with dilution R = [H₂]/[SiH₄] = 20 (300 nm)/n-type a-Si:H layer (20 nm)/Ag + Al back contact (100 + 200 nm). Diode sputtered ZnO:Ga, textured and non-textured ZnO:Al [3] and commercially fabricated ASAHI (SnO₂:F) U-type TCO’s have been used. The morphology and structure of ZnO films were altered by reactive ion etching (RIE) and post-deposition annealing.It can be concluded that the single junction a-Si:H solar cells with ZnO:Al films achieved comparable parameters as those prepared with commercially fabricated ASAHI U-type TCO’s.     

Physical aspects of a-Si:H/c-Si hetero-junction solar cells

We report on the basic properties of amorphous/crystalline hetero-junctions (a-Si:H/c-Si), their effects on the recombination of excess carriers and its influence on the a-Si:H/c-Si hetero-junction solar cells. For that purpose we measured the gap state density distribution of thin a-Si:H layers and determined its dependence on deposition temperature and doping by an improved version of near-UV-photoelectron spectroscopy. Furthermore, the Fermi level position in the a-Si:H and the valence band offset were directly measured. In combination with interface sensitive methods such as surface photovoltage analysis and our numerical simulation program AFORS-HET, we found an optimum in wafer pretreatment, doping and deposition temperature for efficient a-Si:H/c-Si solar cells without an i-type a-Si:H buffer layer. We reached at maximum 19.8% certified efficiency by a deposition at 210 °C with an emitter doping of 2000 ppm of B₂H₆ on a well cleaned pyramidally structured c-Si(n) wafer.     

Solid-phase epitaxy of undoped amorphous silicon by in-situ postannealing

The solid phase epitaxy (SPE) of undoped amorphous Si (a-Si) deposited on SiO₂ patterned Si(001) wafers by reduced pressure chemical vapor deposition (RPCVD) using a H₂-Si₂H₆ gas system was investigated. The SPE was performed by applying in-situ postannealing directly after deposition process. By transmission electron microscopy (TEM) and scanning electron microscopy, we studied the lateral SPE (L-SPE) length on sidewall and mask for various postannealing times, temperatures and a-Si thicknesses. We observed an increase in L-SPE growth for longer postannealing times, temperatures and larger Si thicknesses on mask. TEM defect studies revealed that by SPE crystallized epi-Si exhibits a higher defect density on the mask than at the inside of the mask window. By introducing SiO₂-cap on the sample with 180 nm Si thickness following postannealing at 570 °C for 5 h, the crystallization of up to 450 nm epi-Si from a-Si is achieved. We demonstrated the possibility to use this technique for SiGe:C heterojunction bipolar transistor (HBT) base layer stack to crystallize Si-buffer layer to widen the monocrystalline region around the bipolar window and to improve base link resistivity of the HBT.     

1D hierarchical CdS NPs/NiO NFs heterostructures with enhanced photocatalytic activity under visible light irradiation

One-dimensional (1D) hierarchically structured CdS nanoparticles (NPs)/NiO nanofibers (NFs) heterostructures with remarkable removal efficiency for diazo dye Congo red (CR) were fabricated by a stepwise synthesis process, which was involved a chemical bathing deposition combined with calcination, and a microwave-assisted wet chemical reaction. The crystal phases, morphologies, optical absorption properties, and adsorption/photocatalytic activity of as-prepared products were investigated by XRD, FESEM, TEM, high-resolution TEM (HRTEM), N₂ adsorption/desorption isotherms, UV–Vis diffuse reflectance spectroscopy (DRS) and photoluminescence (PL) spectrum respectively. The experimental results indicated that binary satellite- core CdS NPs/NiO NFs heterojunctions are comprised of n-type CdS NPs with size of 10–30 nm decorated onto 1D p-type NiO NFs with diameter of 60–180 nm and length up to microns, which are self-assembled by nanoparticles with 30–100 nm in size. The possible formation mechanism for satellite-core structured CdS/NiO heterojunction is proposed. Interestingly, the decolorization efficiency over CdS/NiO heterostructures reached up to 91.2% in removal of aqueous CR at high concentration within 40 min under visible light irradiation, which was approximately 5.2 and 3.8 times as high as that of pure CdS nanocrystals (NCs) and the mixture of NiO NFs and CdS NCs. Furthermore, the possible photocatalytic mechanism was also investigated. The as-designed hybrid CdS NPs/NiO NFs heterostructures exhibited improved photocatalytic activity, which is attributed to the enhancement of the visible light adsorption, the efficient separation of photogenerated electrons and holes, and the high adsorption capacity towards CR molecules, thereby displaying superior visible- light-driven photodegradation of CR in high concentration. This work may provide a green engineering heterojunction technology to develop the advanced multifunctional nanocomposites for their applications in wastewater purification.     

Monitoring explosive crystallization phenomenon of amorphous silicon thin films during short pulse duration XeF excimer laser annealing using real-time optical diagnostic measurements

Melting and crystallization scenario of amorphous silicon (a-Si) thin films have been investigated using in situ time-resolved optical reflection and transmission measurements. The explosive crystallization phenomenon is observed using a single-mode continuous wave He-Ne probe laser for thickness of 50 nm and 90 nm a-Si thin films upon 25 ns pulse duration of XeF excimer laser irradiation, respectively. The explosive crystallization phenomenon is easier to observe in the large thickness of a-Si thin films, a sample with pure a-Si microstructure and under longer pulse duration of excimer laser irradiation by time-resolved optical reflection and transmission measurements.     

Nano-structural properties of ZnO films for Si based heterojunction solar cells

Properties and structure of ZnO and ZnO:Al films deposited on c-Si, a-Si:H/Si and glass substrates are studied by various methods. The transmittance of the ZnO:Al was found to be higher when compared to ZnO, and the refractive index lower. X-ray photoelectron spectroscopy (XPS) shows that the screening efficiency in the presence of core holes is enhanced in the Al doped ZnO. The roughness of the ZnO:Al surfaces is strongly substrate dependent. With transmission electron microscopy (TEM) a 2-3 nm thick amorphous interfacial layer was observed independently of substrate and doping. Deposition of ZnO on a-Si:H substrate results in crystallization of the a-Si:H layer independently of Al doping.     

Thickness effect on the formation of SiC nanoparticles in sandwiched Si/C/Si and C/Si multilayers

The effect of carbon (C) and amorphous silicon (a-Si) thicknesses on the formation of SiC nanoparticles (np-SiC) in sandwiched Si/C/Si and C/Si multilayers on Si(100) substrates were investigated using ultra-high-vacuum ion beam sputtering system and vacuum thermal annealing at 500, 700, 900 °C for 1.0 h. Three-layer a-Si/C/a-Si structures with thicknesses of 50/200/50 nm and 75/150/75 nm and a two-layer C/a-Si structure of 200/50 nm were examined in this study. The size and density of np-SiC were strongly influenced by the annealing temperature, a-Si thickness and layer number. Many np-SiC appeared at 900 °C at a density order about 10⁸ cm^− 2 in both three-layer structures while no particles formed in the two-layer structure. The thick a-Si structure (75/150/75 nm) produces a particle density approximately 1.8 times higher than thin structure (50/200/50 nm). This implies that thick a-Si structure had a lower activation energy of SiC formation compared to the thin a-Si structure. Few particles were found at 700 °C and no particles at 500 °C in both three-layer structures. The np-SiC formation is a thermally activated reaction. The higher temperature leads to higher particle density. A mechanism of np-SiC formation in thermodynamic and kinetic viewpoints is proposed.     

The behavior of Ti silicidation on Si/SiGe/Si base and its effect on base resistance and fmax in SiGe hetero-junction bipolar transistors

The relation between Ti silicidation and base resistance in SiGe hetero-junction bipolar transistors (HBT) was investigated. The Ti layer deposited on the Si/SiGe/Si base converted to Ti silicide during two-step annealing. The thickness of the Ti silicide, which was identified as the Ti(Si_1-xGe_x) phase of uniform composition, abruptly increased over the annealing temperature of 650/850 °C, and as a result it accomplished a very low extrinsic base resistance. The Ti silicidation affected the base resistance of real devices (R_B), which was extracted from simulating the electrical data of SiGe HBTs such as I –V curves, forward Gummel plots, forward current gain curves, and s-parameter plots. It was shown that the R_B was compatible with the theoretical relation which included the small-signal unity-gain frequency (f_T), the maximum oscillation frequency (f_max) and R_B. f_max varied more sensitively with R_B than f_T, which was due to the inherent property of f_max being inversely proportional to R_B. The f_max of the SiGe HBT reached 47.4 GHz when Ti silicidation was performed at the annealing temperature of 650/850 °C. This silicidation condition is thought to be an appropriate temperature for Ti silicidation applicable to SiGe HBT fabrication. © 2001 Kluwer Academic Publishers     

a-Si:H/SiO2 multilayer films fabricated by radio-frequency magnetron sputtering for optical filters

We examined the optical properties of a-Si:H/SiO2 multilayer films fabricated by radio-frequency magnetron sputtering for optical bandpass filters (BPFs). Because of the high refractive-index contrast between a-Si:H and SiO2, the total number of layers of an a-Si:H/SiO2 multilayer can be relatively small. We obtained an a-Si:H refractive index of 3.6 at lambda = 1550 nm and its extinction coefficient k < 1 x 10(-4) and confirmed by Fourier-transform infrared spectroscopy that such small k is influenced by the Si-H bonding in the film. We fabricated a-Si:H/SiO2 BPFs by using in situ optical monitoring. Thermal tuning of a-Si:H/SiO2 BPF upon a silica substrate was also performed, and a thermal tunability coefficient of 0.07 nm/degree C was obtained.     

a-Si:H p–i–n structures with extreme i-layer thickness

We present measurements and numerical simulation of a-Si:H p–i–n detectors with a wide range of intrinsic layer thickness between 2 and 10 µm. Such a large active layer thickness is required in applications like elementary particle detectors or X-ray detectors. For large thickness and depending on the applied bias, we observe a sharp peak in the spectral response in the red region near 700 nm. Simulation results obtained with the program ASCA are in agreement with the measurement and permit the explanation of the experimental data. In thick samples holes recombine or are trapped before reaching the contacts, and the conduction mechanism is fully electron dominated. As a consequence, the peak position in the spectral response is located near the optical band gap of the a-Si:H i-layer.     

High rate deposition of a-Si:H and a-SiNx:H by VHF PECVD

Very High Frequency (VHF) plasma enhanced chemical vapour deposition (PECVD) has been applied to hydrogenated amorphous silicon (a-Si:H) and hydrogenated amorphous silicon nitride (a-SiN_x:H) films for thin film transistors (TFTs) fabrication. The effect of the excitation frequency on the deposition rate and the film quality of both films has been investigated. The films were prepared by VHF (30 MHz∼50 MHz) and HF (13.56 MHz) plasma enhanced CVD.High deposition rates were achieved in the low pressure region for both a-Si:H and a-SiN_x:H depositions by the use of VHF plasma. The maximum deposition rates were 180 nm/min for a-Si:H at 50 MHz and 340 nm/min for a-SiN_x:H at 40 MHz. For a-SiN_x:H films deposited in VHF plasma, the optical bandgap, the hydrogen content and the [Si–H]/[N–H] ratio remain almost constant regardless of an increase in deposition rate. The increase of film stress could be limited to a lower value even at a high deposition rate. The TFTs fabricated with VHF PECVD a-Si:H and a-SiN_x:H films showed applicable field effect mobility. It is concluded that VHF plasma is useful for high rate deposition of a-Si:H and a-SiN_x:H films for TFT LCD application.     

Progress in a-Si:H/c-Si heterojunction emitters obtained by Hot-Wire CVD at 200 °C

In this work, we investigate heterojunction emitters deposited by Hot-Wire CVD on p-type crystalline silicon. The emitter structure consists of an n-doped film (20 nm) combined with a thin intrinsic hydrogenated amorphous silicon buffer layer (5 nm). The microstructure of these films has been studied by spectroscopic ellipsometry in the UV-visible range. These measurements reveal that the microstructure of the n-doped film is strongly influenced by the amorphous silicon buffer. The Quasy-Steady-State Photoconductance (QSS-PC) technique allows us to estimate implicit open-circuit voltages near 700 mV for heterojunction emitters on p-type (0.8 Ω·cm) FZ silicon wafers. Finally, 1 cm² heterojunction solar cells with 15.4% conversion efficiencies (total area) have been fabricated on flat p-type (14 Ω·cm) CZ silicon wafers with aluminum back-surface-field contact.     

Defect analysis of thin film Si-based alloys deposited by hot-wire CVD using junction capacitance methods

We evaluate and compare the electronic properties of hot-wire CVD deposited a-Si:H and a-Si,Ge:H films with those produced by the glow discharge (PECVD) method. A good indicator of film quality with respect to solar cell applications is the narrowness of the band tail widths determined by transient photocapacitance (TPC) spectroscopy. We focus on the excellent electronic properties of hot-wire CVD a-Si,Ge:H alloys that have recently been produced by a 1800  °C filament temperature process. These alloy samples were compared to a-Si,Ge:H films of the same optical gaps deposited by PECVD. Light-induced degradation was examined in a few samples and compared to the behavior PECVD a-Si,Ge:H alloys of similar optical gap. The effects of intentional oxygen contamination were also studied on a series of HWCVD a-Si,Ge:H samples containing 29at.% Ge.     

Surface Plasmon‐Enhanced Photodetection in Few Layer MoS2 Phototransistors with Au Nanostructure Arrays

2D Molybdenum disulfide (MoS₂) is a promising candidate material for high‐speed and flexible optoelectronic devices, but only with low photoresponsivity. Here, a large enhancement of photocurrent response is obtained by coupling few‐layer MoS₂ with Au plasmonic nanostructure arrays. Au nanoparticles or nanoplates placed onto few‐layer MoS₂ surface can enhance the local optical field in the MoS₂ layer, due to the localized surface plasmon (LSP) resonance. After depositing 4 nm thick Au nanoparticles sparsely onto few‐layer MoS₂ phototransistors, a doubled increase in the photocurrent response is observed. The photocurrent of few‐layer MoS₂ phototransistors exhibits a threefold enhancement with periodic Au nanoarrays. The simulated optical field distribution confirms that light can be trapped and enhanced near the Au nanoplates. These findings offer an avenue for practical applications of high performance MoS₂‐based optoelectronic devices or systems in the future.