WC和Si衬底生长金刚石薄膜的研究

采用ＳＥＭ,Ｒａｍａｎ光谱等手段,较全面系统地研究了ＨＦＣＶＤ法在ＷＣ和Ｓｉ衬底上生长金刚石薄膜时,衬底预处理、碳源深度、热丝及衬底温度等对金刚石形核、生长的影响。并对两种衬底进行了对比与分析,最后总结出影响金刚石形核密度、形核速率、晶形结构及晶形完善性的关键因素。     

对Ag/Cu薄膜退火应力的模拟

采用基片曲率法测量并研究了Ag／Cu薄膜的应力与温度的关系．初始应力为-250MPa压应力，退火后为370MPa拉应力．采用基于形变机制图的模型模拟了应力与温度关系的实验曲线，结果表明，温度和应力不同，在薄膜内起作用的主要形变机制也不同．可能的形变机制包括位错滑移、幂律蠕变以及扩散蠕变机制．薄膜比块体材料的应变速率低，在同样的应力下应变更加困难．在退火过程中，薄膜内先使应力松弛的是Ag，将Ag各蠕变机制中的激活能提高到块体材料的1.25～1.35倍，模拟曲线与实验曲线符合得很好。     

Si(111)衬底上多层石墨烯薄膜的外延生长

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上沉积碳原子外延生长石墨烯薄膜, 通过反射式高能电子衍射(RHEED)、红外吸收谱(FTIR)、拉曼光谱(RAMAN)和X射线吸收精细结构谱(NEXAFS)等手段对不同衬底温度(400、600、700、800℃)生长的薄膜进行结构表征. RAMAN和NEXAFS结果表明: 在800℃下制备的薄膜具有石墨烯的特征, 而 400、600和700℃生长的样品为非晶或多晶碳薄膜. RHEED和FTIR结果表明, 沉积温度在600℃以下时C原子和衬底Si原子没有成键, 而衬底温度提升到700℃以上, 沉积的C原子会先和衬底Si原子反应形成SiC缓冲层, 且在800℃沉积时缓冲层质量较好. 因此在Si衬底上制备石墨烯薄膜需要较高的衬底温度和高质量的SiC缓冲层.     

退火对ZnO/Cu/ZnO透明导电薄膜性能的影响

室温下利用磁控溅射制备了ZnO/Cu/ZnO透明导电薄膜,采用X射线衍射(XRD)、原子力显微镜(AFM)、扫描电子显微镜(SEM)、霍尔效应测量仪和紫外-可见分光光度计研究了薄膜的结构、形貌、电学及光学等性能与退火温度之间的关系。结果表明:退火前后薄膜均具有ZnO(002)择优取向,随着退火温度的升高,薄膜的晶化程度、晶粒粒径及粗糙度增加,薄膜电阻率先降低后升高,光学透过率和禁带宽度先升高后降低。150℃下真空退火的ZnO/Cu/ZnO薄膜的性能最佳,最高可见光透光率为90.5%,电阻率为1.28×10-4Ω·cm,载流子浓度为4.10×1021cm-3。     

热循环退火对InAs/Si(211)薄膜结构和电学性能的影响

InAs作为III-V族化合物半导体材料,可以应用于磁阻和霍尔元器件、量子点激光器元件、太阳能电池和红外探测器元件等方面,具有广泛的研究和应用前景.本文以Si(211)为衬底,采用热壁外延(hot wall epitaxy,HWE)技术制备了InAs薄膜,研究热循环退火(thermal cycle annealing,TCA)次数对InAs/Si(211)薄膜结构及电学性能的影响.热壁外延制备InAs薄膜的衬底温度为400℃,生长时间为4 h,不同的热循环退火次数为2、4、6、8、10.X射线衍射(XRD)测试表明:利用HWE技术在Si(211)衬底表面成功制备了闪锌矿结构的InAs薄膜,且沿(111)取向择优生长;TCA能够明显增强Si(211)衬底表面生长的InAs薄膜的择优取向.扫描电子显微镜(SEM)及原子力显微镜(AFM)测试分析表明:随着TCA次数增加到6次,InAs/Si(211)薄膜表面由于晶粒细化作用变得均匀平整,表面粗糙度从69.63 nm降低到56.43 nm,此时霍尔迁移率达到2.67×10~3cm~2/(V·s);过多的退火次数(≥8次)又会使薄膜表面的晶粒过大、缺陷增多,导致薄膜性能下降.     

MPCVD法在Si衬底上生成β—C3N4晶态薄膜的研究

以Ｎ２,ＣＨ４作为反应气体,采用微波等离子体化学气相沉积法（ＭＰＣＶＤ）进行碳氮膜的合成研究。通过控制反应温度、气体流量、微波功率、反应气压,在Ｓｉ（１１１）和Ｓｉ（１００）基底上气相合成β－Ｃ３Ｎ４晶态薄膜。扫描电子显微镜（ＳＥＲＭ）下观察到生长在Ｓｉ基底上的薄膜具有六角晶棒的密结构。ＥＤＸ分析胡沉积条件的不同,六角晶棒中Ｎ／Ｃ在１．０～２．０之间。Ｘ射线衍射分析（ＸＲＤ）发现薄膜中含有β－Ｃ３     

Si衬底上横向外延GaN材料的微结构和光学性质的研究

用氢化物气相外延 (HVPE)方法在Si(III)衬底上成功横向外延生长出晶体质量较好的GaN薄膜材料。透射电子显微镜 (TEM )的研究结果表明 ,横向外延区域GaN的位错密度明显减小。由于SiO2 掩膜腐蚀角的不同 (分别为 90°和 6 6°) ,导致了横向外延GaN材料一些独特的微观形貌。微区拉曼光谱由数百条拉曼散射曲线组成 ,每一条曲线有三个振动模 ,分别对应Si振动模式 (5 2 0cm- 1) ,E2 模式 (5 6 6cm- 1)和E1(LO)模式(732cm- 1)。在垂直条纹方向 ,峰位和峰宽没有明显的变化 ,而峰强约 5 μm会发生周期性变化     

nc—Si／a—SiOx：H复合薄膜的结构及光吸收特性

采用PECVD技术制备的a－SiO     

衬底温度对Si(111)衬底上MBE异质外延3C-SiC薄膜的影响

利用固源分子束外延(SSMBE)技术, 在Si(111)衬底上异质外延生长3C-SiC单晶薄膜, 通过RHEED、XRD、AFM、XPS等实验方法研究了衬底温度对薄膜结构、形貌和化学组分的影响. 研究结果表明, 1000℃生长的样品具有好的结晶质量和单晶性. 在更高的衬底温度下生长, 会导致大的孔洞形成, 衬底和薄膜间大的热失配使降温过程中薄膜内形成更多位错, 从而使晶体质量变差. 在低衬底温度下生长, 由于偏离理想的化学配比也会导致薄膜的晶体质量降低.     

PI衬底上电沉积Cu薄膜的晶面择优取向

采用硫酸盐电沉积法,利用X射线衍射仪(XRD)、扫描电镜(SEM)等手段研究了不同电沉积条件下在PI膜表面制备的Cu薄膜的品而择优取向、平均晶粒尺寸及表面形貌.结果表明,沉积层的晶面择优取向受Cu薄膜厚度和电流密度影响,电流密度较小(0.2 A/dm2)和较大(3.5～5.5 A/dm2)时,电沉积Cu膜分别容易得到(111)和(220)晶面择优取向,较大电流密度有利于晶核的形成,薄膜表面平均颗粒尺寸较小.     

The structure and photoluminescence properties of ZnO/SiC multilayer film on Si substrate

ZnO/SiC multilayer film has been fabricated on a Si (111) substrate with a silicon carbide (SiC) buffer layer using the RF (radio frequency)-magnetron technique with targets of a ceramic polycrystalline zinc oxide (ZnO) and a composite target of pure C plate with attached Si chips on the surface. The as-deposited films were annealed at a temperature range of 600–1000°C under nitrogen atmosphere. The structure and photoluminescence (PL) properties of the samples were measured using X-ray diffractometry (XRD), Fourier transform infrared (FTIR) spectroscopy and PL spectrophotometry. By increasing the annealing temperature to 800°C, it is found that all the ZnO peaks have the strongest intensities, and the crystallinity of ZnO is more consistent on the SiC buffer layer. Further increase of the annealing temperature allows the ZnO and SiC layers to penetrate one another, which makes the interface between ZnO and SiC layer become more and more complicated, thus reduces the crystallinities of ZnO and SiC. The PL properties of a ZnO/SiC multilayer are investigated in detail. It is discovered that the PL intensities of these bands reach their maximum after being annealed at 800°C. The PL peaks shift with an increase in the annealing temperature, which is due to the ZnO and SiC layers penetrating reciprocally. This makes the interface more impacted and complicated, which induces band structure deformation resulting from lattice deformation.     

铜与硅之间W/Mo-N薄膜的扩散阻挡层性能

研究了铜与硅之间W／Mo-N薄膜的扩散阻挡性能。在Si(100)基片上利用反应溅射沉积一层Mo-N薄膜,然后再利用直流溅射在Mo-N上面沉积Cu／W薄膜。样品在真空下退火,并利用四点探针、X射线衍射分析、扫描电镜分析、俄歇电子能谱原子深度剖析等测试方法研究了Cu／W／Mo-N／Si的热稳定性及W／Mo-N薄膜对铜与硅的扩散阻挡性能。实验分析表明,Cu／W／Mo-N／Si结构具有非常好的热稳定性,在600℃退火30min仍未发生相变,并能有效的阻挡铜与硅之间的扩散。     

Cu／SiO2/Si（100）体系中Cu和Si的扩散和界面反应

室温下,利用磁控溅射方法在P型Si(100)衬底上沉积了铜(Cu)膜.采用X射线衍射(XRD)和卢瑟福背散射(RBS)分析了未退火以及在不同温度点退火后的样品,研究了Cu/SiO3/Si(100)体系的扩散和界面反应.RBS分析得出对于Cu/SiO2/Si(100)体系,当退火温度高于350℃时,才产生明显的扩散,并且随着温度的升高,体系扩散越明显;当退火温度在450℃以下时,XRD没有测得铜硅化合物生成;当温度到500℃时才有铜硅化合物生成.这比已有文献报道的温度低.     

硅衬底上高增透金刚石膜的制备研究

采用甲烷和氢气作为工作气体,在热丝化学气相沉积(HFCVD)设备上采用五段式沉积法制备了金刚石薄膜,用扫描电子显微镜(SEM)、激光拉曼光谱仪、X射线衍射仪(XRD)、原子力显微镜(AFM)以及傅立叶红外光谱仪研究了金刚石膜的结构和性质.结果表明,采用五段式沉积法可以得到晶粒大小达到纳米级的、表面粗糙度较小、金刚石纯度较高的金刚石膜,其最大增透率超过70%,能满足作为光学窗口增透膜的应用要求.     

Dielectric properties of AlN film on Si substrate

AlN films were deposited on p-Si(1 1 1) substrates by a low-pressure metal–organic chemical vapor deposition (MOCVD) system and an Al–AlN–Si (MIS) capacitor was then prepared with the AlN layer as the insulator. With the capacitance–voltage (C–V) curves of Al–AlN–Si capacitors measured at 50 Hz–10 MHz, we found the frequency dependence of the capacitance of the accumulation region, that is, the capacitance of the AlN layer. It is observed that the relative dielectric constant (_r) of AlN declined from 20.7 to 1.2 with increasing frequency. The peak of dielectric loss tangent (tan ) was observed at a frequency of 1.5 MHz. With the Debye equation and the Cole–Cole empirical formula, the relaxation time () was fitted to be about 10^–7 s. From these results and works of others, it was concluded that this dielectric behavior was caused by dipolar relaxation relating to N vacancies in the AlN layer.     

Influences of Ti film thickness on electrochemical properties of Si/Ti/Cu film electrodes

Si and Si/Ti films were fabricated on a Cu current collector (substrate) using the DC sputtering system. The Ti film as a buffer layer was inserted between the Si film and the Cu current collector. Their structural and electrochemical properties were investigated with various Ti film thicknesses of 20-90 nm. The Si and Ti films deposited on a polycrystalline Cu substrate were amorphous. The Si/Ti/Cu film electrode exhibited better electrochemical properties than the Si/Cu electrode in terms of capacity, charge-discharge efficiency, and cycleability. In the Si/Ti/Cu electrode, the film electrode with a 55 nm Ti film thickness showed the best electrochemical properties: 367 microA h/cm2 initial capacity, 91% efficiency, and 50% capacity retention after 100 cycles. These good electrochemical properties are attributed to the enhanced adhesion between the Si and Ti films. Additionally, the modified surface morphology of Si film with a cluster structure could withstand the lateral volume change during the charge-discharge process.     

退火温度对硅基溅射银膜微结构和应力的影响

用直流溅射法在硅(111)基底上制备银膜，膜厚为380nm。用BGS6341型电子薄膜应力分布测试仪对膜应力随退火温度的变化进行了研究，结果表明：膜应力随着退火温度的升高而增大，在400℃退火温度下膜应力变化明显。用MXP18AHF型X射线衍射仪测量了膜的衍射谱，对膜微结构随退火温度的变化进行了讨论。制备的Ag膜仍为面心立方结构，呈多晶状态，平均晶粒尺寸为23．63nm，薄膜晶格常数(0．40805nm)比标准样品晶格常数(0．40862nm)稍小。     

Estimation of thermophysical properties of a film coated on a substrate using pulsed transient analysis

The thermophysical properties (thermal diffusivity, effusivity) of a film coated on a substrate have been measured by a pulsed transient analysis. The experimental approach is to utilize the film surface temperature decay following a heating pulse from a Q-switched Nd:glass laser. The temperature decay was measured using a HgCdTe infrared detector. Following the collection of data, a nonlinear least-squares regression was performed to estimate the optimal values of three separate thermal parameters by fitting the data to the semiinfinite substrate model solution. The model was checked systematically by analysis of the sensitivity and correlation of the three parameters, and the thermal diffusivity and effusivity ratio of the film and substrate were obtained from the optimal values of the estimated parameters.     

Determination of diffusion coefficients in film systems on the basis of Fe/Cr and Cu/Cr

This paper presents the results of investigation of condensation stimulated (CSD) and thermal stimulated (TSD) diffusion in nanoscale film systems on the basis of Fe/Cr and Cu/Cr by Auger-electron spectroscopy method. The film systems were built in ultrahigh vacuum. Auger spectrum was traced during condensation after each increase in thickness of 0.5-1 nm or during film systems annealing from 300 to 683 K over 5 h. According to experimental data the concentration profiles were built and the effective coefficients of CSD and TSD were computed by several mathematical methods. The efficiency of these techniques in different cases was analyzed. The most accurate results were obtained with Weeple and Gauss error methods that take into account the thickness of the diffusant source.